A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip
MPN: A3P600L-FGG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $61.25 | $61.25 |
| 10 | $55.1 | $551.00 |
| 100 | $48.9 | $4,890.00 |
| 500 | $44.2 | $22,100.00 |
| 1,000 | $41.35 | $41,350.00 |
Drop-in alternatives for A3P600L-FGG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P600-FGG484I
β Drop-Inπ Reference alternative (not in catalog)
M1A3P600L-FGG484I
β Drop-Inπ Reference alternative (not in catalog)
A3P600L-1FGG484I
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$17.1 / Unit
View Datasheet βA3P600L-FGG484
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P600L-FG484I
β Drop-Inβ In Stock
$45.6 / Unit
View Datasheet βA3P600L-FGG484I Maximum Ratings & Electrical Characteristics
| Product Series | ProASIC3L |
| FPGA Family | Flash FPGA |
| Total System Gates | 600000 |
| Logic Elements | 13824 |
| User I/Os | 235 |
| Maximum System Performance | 350 MHz |
| Core Supply Voltage | 1.2 V to 1.5 V |
| Technology Node | 130 nm CMOS |
| Package Type | 484-ball FBGA (PBGA484) |
| Package Dimensions | 23 mm x 23 mm |
| Package Height | 2.23 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (Green) |
| Configuration | Non-volatile flash, instant-on |
| Low Power Mode | Flash*Freeze |
A3P600L-FGG484I 2.23 mm Pin Configuration Guide
Complete pinout information for A3P600L-FGG484I (2.23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-FGG484I is suitable for 6 applications: Industrial Automation and Motor Control, Aerospace and Defense Avionics, Communication Infrastructure, Medical Device Signal Processing, IoT Edge Gateway and Smart Home, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The A3P600L-FGG484I fits industrial automation because its 235 user I/Os can directly interface with incremental encoders, Hall sensors, gate drivers, and industrial transceivers. With 13,824 logic elements, designers can implement high-speed PWM generators, PID control loops, and safe-stop logic in one instant-on FPGA. The flash-based architecture eliminates external boot memory and reduces system startup time, which is valuable in safety-critical machinery. Operating from a 1.2V to 1.5V core, the device can be adapted to low-power fieldbus nodes while maintaining 350 MHz performance for fast current-loop controllers.
Recommended
Aerospace and Defense Avionics
Aerospace and defense systems demand instant-on, non-volatile configuration and high reliability, exactly what the A3P600L-FGG484I provides. The flash-based ProASIC3L FPGA does not require an external configuration PROM, reducing board space and single-point failures. With 600K system gates and 235 I/Os, it can handle avionics data buses, telemetry formatting, discrete I/O consolidation, and safety interlocks. The 484-ball FBGA package with 1 mm pitch is suitable for rugged, density-constrained boards. Its low static power also helps manage thermal budgets in sealed avionics enclosures.
Recommended
Communication Infrastructure
In communication infrastructure, the A3P600L-FGG484I can implement packet parsing, serial backplane interfaces, clock domain crossing, and protocol bridging. Its 235 user I/Os allow many single-ended and differential standards to be assigned dynamically, while the 350 MHz performance supports line-rate processing for moderate-bandwidth links. The low-power L variant is particularly beneficial in remote radio heads and small-cell backhaul equipment where heat dissipation is limited. The secure flash configuration also prevents unauthorized bitstream readback, a key concern for network equipment deployed at the edge.
Recommended
Medical Device Signal Processing
The A3P600L-FGG484I suits medical devices that require deterministic real-time processing and long-term reliability. Its flash-based instant-on behavior ensures immediate response at power-up, which is useful for patient monitoring and infusion pumps. The 13,824 logic elements can implement digital filters, sensor sequencing, and alarm logic without a processor. The low-power ProASIC3L core reduces heat in compact medical enclosures, while the 484-FBGA package supports high channel counts for multi-sensor data acquisition. Designers can combine the FPGA with external ADCs and signal-conditioning front-ends.
Recommended
IoT Edge Gateway and Smart Home
For IoT edge gateways, the A3P600L-FGG484I provides a balance of logic density, low power, and instant-on security. The Flash*Freeze low-power mode enables the FPGA to sit idle with minimal current draw while waiting for sensor events, then wake quickly to process data. With 235 I/Os, it can aggregate various sensor buses, such as SPI, I2C, UART, and custom parallel interfaces. The non-volatile configuration reduces BOM cost and startup time for battery-powered gateways. Its design security features protect IP in distributed edge nodes.
Recommended
Test and Measurement Instrumentation
The A3P600L-FGG484I is well suited for test and measurement equipment because its 235 user I/Os and 350 MHz performance enable high-speed data acquisition, trigger logic, and pattern generation. The 13,824 logic elements can store configuration registers, implement counters and state machines, and interface with ADC/DAC front ends. The flash-based design allows immediate instrument startup and secure field updates. In benchtop instruments, the low-power L variant helps minimize fan noise and heat buildup, while the 484-ball BGA package supports dense multi-channel board layouts.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-FGG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-FGG484I | M1A3P600L-FGG484I | A3P600L-1FGG484I |
|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Supply Voltage | 1.2V to 1.5V | 1.5V | 1.2V to 1.5V | 1.2V to 1.5V |
| Total System Gates | 600K | 600K | 600K | 600K |
| Logic Elements | 13,824 | 13,824 | 13,824 | 13,824 |
| User I/O Count | 235 | 235 | 235 | 235 |
| Maximum Performance | 350 MHz | 231 MHz [DATA_NEEDED: max frequency from datasheet] | 350 MHz | [DATA_NEEDED: speed grade -1 max frequency] |
| Low Power Mode | Flash*Freeze | No | Flash*Freeze | Flash*Freeze |
| ARM Cortex-M1 | No | No | Yes | No |
Key Differentiators
- Low-power ProASIC3L architecture with Flash*Freeze mode (vs A3P600-FGG484I)
- All 13,824 logic elements available for user logic (vs M1A3P600L-FGG484I)
- Instant-on non-volatile flash configuration (vs A3P600L-FG484I)
Design Notes
Estimated: For a 600K-gate FPGA, dynamic power depends on switching activity; at 1.2V core and 50MHz, expect roughly 100-300mW typical. Use the core supply pins with 0.1uF and 1uF decoupling capacitors per bank, and connect all GND balls to a solid low-impedance ground plane. Enable Flash*Freeze for standby to reduce static current.
The 484-ball FBGA package with 1mm pitch requires careful BGA breakout routing. Use via-in-pad only if your assembly process supports it; otherwise route inner rows through dog-bone vias. Keep differential pairs matched and maintain controlled impedance for high-speed I/O. Reference the Microchip layout guidelines for ProASIC3L.
Verify I/O bank supply voltages, programming headers, and JTAG security settings. For flash-based FPGAs, the configuration is non-volatile and instantly live, so design security should be locked after production programming. Leaving JTAG enabled during field operation can expose the design to unauthorized readback. Also confirm the exact industrial temperature range from the datasheet before deployment.
Estimated: The FBGA-484 package thermal resistance is not stated in the verified web data. For high utilization and high ambient temperature, add thermal vias under the package pad and connect to a large copper pour on the opposite side. Maintain the junction temperature below the datasheet maximum by estimating power from switching activity and I/O load.
Compliance Information
Jotrin and other listings describe the package as GREEN/FBGA-484, indicating a RoHS-compliant, lead-free finish. No explicit REACH, halogen-free, or conflict minerals statement was found in the verified web data.
