A3PE3000-1FG896 - 3M Gate ProASIC3E FPGA | Microchip
部品番号: A3PE3000-1FG896 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.9 | $59,900.00 |
A3PE3000-1FG896 概要
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike CPLDs, FPGAs typically contain a large array of programmable logic blocks, embedded memory, and I/O elements, making them suitable for complex, high-density designs. The ProASIC3E family is built on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, providing non-volatile, live-at-power-up operation without the need for external configuration memory.
Key features include 3 million system gates, 504 kbits of true dual-port SRAM, 620 user I/Os, and support for up to 35K logic elements. The flash-based architecture offers instant-on capability, low power consumption, and enhanced security with no bitstream to intercept. The device supports multiple I/O standards and includes PLLs for clock management.
Technically, the A3PE3000-1FG896 integrates a flash switch fabric that retains configuration even when power is removed, eliminating the need for boot PROMs. This single-chip solution reduces board space and total cost of ownership. The 896-ball FBGA package with 1 mm pitch enables high-density routing while maintaining signal integrity.
Typical applications include consumer electronics, networking/communications, computing, and avionics systems where reprogrammability, security, and low power are critical. The device is also suitable for ASIC replacement, offering a cost-effective path for medium-volume production.
When designing with this FPGA, ensure adequate decoupling on the 1.5V core supply and follow the layout guidelines in the ProASIC3E datasheet to minimize noise and ensure reliable operation. The device supports JTAG programming and in-system reprogramming.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-1FG896.
ドロップイン代替品: A3PE3000-1FG896 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000-1FG896 （同一形状・フットプリント） — 相違点: Package, Process Technology, Core Supply Voltage, System Gates, Configuration.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE3000-2FG896
✅ ドロップイン✓ 在庫あり
$1455.55 / 個
データシートを見る →M1A3PE3000-1FG896
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE3000-1FGG896
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A3PE3000-1FG896I
✅ ドロップイン✓ 在庫あり
$330 / 個
データシートを見る →A3PE3000-2FGG896I
✅ ドロップイン✓ 在庫あり
$1482.9 / 個
データシートを見る →A3PE3000-1FG896 最大定格＆電気的特性
| System Gates | 3.00E6 |
| Logic Elements (LEs) | 35K |
| User I/Os | 620 |
| SRAM (True Dual-Port) | 504 kbits |
| Core Supply Voltage | 1.5V |
| 動作温度 | 0°C to 70°C |
| Package Type | FBGA-896, 1 mm pitch |
| Logic Family | CMOS |
| Process Technology | 130-nm, 7-layer metal (6 copper), Flash-based |
| Configuration | Flash-based, live-at-power-up |
| Total RAM Bits | 504 kbits |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
A3PE3000-1FG896 fbga-896, 1 mm pitch ピン配置ガイド
A3PE3000-1FG896 (fbga-896, 1 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000-1FG896.
詳細は データシート をご参照ください。
主な用途
A3PE3000-1FG896 の用途: 6 件s: Networking and Communications, Consumer Electronics, Computing and Storage, Avionics and Defense, Industrial Automation, Medical Electronics.
Networking and Communications
The A3PE3000-1FG896 is ideal for networking and communications equipment such as routers, switches, and base stations. Its 3 million system gates and 620 user I/Os enable implementation of packet processing, protocol handling, and interface bridging. The flash-based architecture provides instant-on operation, reducing boot time in network devices. With 504 kbits of true dual-port SRAM, it can buffer data packets efficiently. The device's low power consumption is critical for line-card designs where thermal budgets are tight. Its reprogrammability allows field upgrades and protocol changes without hardware redesign, making it a cost-effective solution for evolving communication standards.
おすすめ
Consumer Electronics
In consumer electronics, the A3PE3000-1FG896 enables flexible, cost-effective logic integration for devices like smart TVs, set-top boxes, and gaming consoles. Its 3 million gates can implement video processing, user interface control, and peripheral management. The flash-based configuration eliminates the need for external boot memory, reducing BOM cost and board space. The device's low power consumption is essential for battery-powered or energy-efficient products. Its reprogrammability allows manufacturers to update features post-launch, extending product life. The 896-ball FBGA package supports high-density designs while maintaining signal integrity for high-speed interfaces.
おすすめ
Computing and Storage
The A3PE3000-1FG896 is well-suited for computing and storage applications such as RAID controllers, SSD controllers, and server motherboards. Its 3 million system gates can implement custom logic for data path acceleration, error correction, and interface bridging. The 504 kbits of true dual-port SRAM provide high-bandwidth storage for FIFOs and buffers. The device's flash-based architecture offers secure boot and tamper resistance, critical for data integrity. With 620 user I/Os, it can interface with multiple memory and peripheral devices. The low power consumption helps reduce data center energy costs. Its reprogrammability allows firmware updates to add new features or fix bugs without hardware changes.
おすすめ
Avionics and Defense
The A3PE3000-1FG896 is suitable for avionics and defense systems where reliability, security, and long-term availability are paramount. Its flash-based architecture provides inherent security against bitstream cloning and tampering, meeting stringent defense requirements. The device operates over the commercial temperature range (0°C to 70°C), but industrial temperature variants are available for harsh environments. With 3 million gates, it can implement complex signal processing, sensor fusion, and communication protocols. The single-chip solution reduces system weight and power, critical for airborne platforms. Its reprogrammability allows in-field updates to adapt to changing mission requirements. The device's long lifecycle support from Microchip ensures availability for defense programs.
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Industrial Automation
In industrial automation, the A3PE3000-1FG896 provides a flexible platform for motor control, PLCs, and robotics. Its 3 million gates can implement multiple control loops, communication interfaces (EtherCAT, PROFINET), and safety logic. The flash-based architecture ensures deterministic startup without external configuration, critical for safety-critical systems. The device's low power consumption reduces heat in sealed enclosures. With 620 user I/Os, it can interface with sensors, actuators, and encoders. The reprogrammability allows firmware updates to add new features or fix bugs without hardware changes. The device's robustness and long lifecycle support make it suitable for industrial environments where downtime is costly.
おすすめ
Medical Electronics
The A3PE3000-1FG896 is used in medical electronics such as patient monitors, imaging systems, and diagnostic equipment. Its 3 million gates can implement signal processing, data acquisition, and display control. The flash-based architecture provides secure, non-volatile configuration, ensuring reliable startup in critical medical devices. The device's low power consumption is beneficial for portable and battery-operated medical equipment. With 504 kbits of SRAM, it can buffer high-resolution sensor data. The reprogrammability allows software updates to improve functionality or comply with new regulations. The device's long lifecycle support is essential for medical devices that require years of availability. Industrial temperature variants are available for demanding environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE3000-1FG896 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE3000-2FG896 | M1A3PE3000-1FG896 | A3PE3000-1FGG896 | A3PE3000-1FG896I | A3PE3000-2FGG896I |
|---|---|---|---|---|---|---|
| Package | FBGA-896 (1 mm pitch) | FBGA-896 (1 mm pitch) | FBGA-896 (1 mm pitch) | FBGA-896 (0.8 mm pitch) | FBGA-896 (1 mm pitch) | FBGA-896 (0.8 mm pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 |
| User I/Os | 620 | 620 | 620 | 620 | 620 | 620 |
| SRAM (kbits) | 504 | 504 | 504 | 504 | 504 | 504 |
| Speed Grade | -1 (standard) | -2 (faster) | -1 (standard) | -1 (standard) | -1 (standard) | -2 (faster) |
| Temperature Range | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | -40°C to 100°C | -40°C to 100°C |
| Soft ARM Support | No | No | Yes | No | No | No |
主な差別化要因
- Flash-based architecture provides live-at-power-up and security （vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- 3 million system gates in a single chip （vs A3PE3000-1FGG896)
- Low power consumption （vs SRAM-based FPGAs)
設計ノート
The A3PE3000-1FG896 requires a 1.5V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Estimated: For a typical design with 50% logic utilization, core current may be around 300-500 mA. Place 0.1uF and 10uF decoupling capacitors close to each VCC and GND pin pair to minimize power supply noise. Refer to the ProASIC3E datasheet for recommended power supply sequencing.
The 896-ball FBGA package with 1 mm pitch requires careful PCB layout. Use a 4-layer or more board with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize trace lengths. Follow the layout guidelines in the ProASIC3E datasheet, including via placement and thermal relief. Ensure adequate thermal vias under the package for heat dissipation.
Do not exceed the absolute maximum ratings for the 1.5V core supply. Ensure proper decoupling to prevent latch-up. The flash-based FPGA retains configuration, but verify JTAG programming connections. For designs requiring industrial temperature, use the -I variant. Avoid using the -1FGG896 as a drop-in replacement for -1FG896 due to different ball pitch.
コンプライアンス情報
RoHS compliance inferred from distributor listings. Other compliance data not explicitly stated in provided data.
