A3PE3000-1FG896 - 3M Gate ProASIC3E FPGA | Microchip
MPN: A3PE3000-1FG896 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.9 | $59,900.00 |
Drop-in alternatives for A3PE3000-1FG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000-2FG896
✅ Drop-In📋 Reference alternative (not in catalog)
M1A3PE3000-1FG896
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-1FGG896
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-1FG896I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-2FGG896I
✅ Drop-In✓ In Stock
$1482.9 / Unit
View Datasheet →A3PE3000-1FG896 Maximum Ratings & Electrical Characteristics
| System Gates | 3.00E6 |
| Logic Elements (LEs) | 35K |
| User I/Os | 620 |
| SRAM (True Dual-Port) | 504 kbits |
| Core Supply Voltage | 1.5V |
| Operating Temperature | 0°C to 70°C |
| Package Type | FBGA-896, 1 mm pitch |
| Logic Family | CMOS |
| Process Technology | 130-nm, 7-layer metal (6 copper), Flash-based |
| Configuration | Flash-based, live-at-power-up |
| Total RAM Bits | 504 kbits |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
A3PE3000-1FG896 fbga-896, 1 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000-1FG896 (fbga-896, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-1FG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1FG896 is suitable for 6 applications: Networking and Communications, Consumer Electronics, Computing and Storage, Avionics and Defense, Industrial Automation, Medical Electronics.
Networking and Communications
The A3PE3000-1FG896 is ideal for networking and communications equipment such as routers, switches, and base stations. Its 3 million system gates and 620 user I/Os enable implementation of packet processing, protocol handling, and interface bridging. The flash-based architecture provides instant-on operation, reducing boot time in network devices. With 504 kbits of true dual-port SRAM, it can buffer data packets efficiently. The device's low power consumption is critical for line-card designs where thermal budgets are tight. Its reprogrammability allows field upgrades and protocol changes without hardware redesign, making it a cost-effective solution for evolving communication standards.
Recommended
Consumer Electronics
In consumer electronics, the A3PE3000-1FG896 enables flexible, cost-effective logic integration for devices like smart TVs, set-top boxes, and gaming consoles. Its 3 million gates can implement video processing, user interface control, and peripheral management. The flash-based configuration eliminates the need for external boot memory, reducing BOM cost and board space. The device's low power consumption is essential for battery-powered or energy-efficient products. Its reprogrammability allows manufacturers to update features post-launch, extending product life. The 896-ball FBGA package supports high-density designs while maintaining signal integrity for high-speed interfaces.
Recommended
Computing and Storage
The A3PE3000-1FG896 is well-suited for computing and storage applications such as RAID controllers, SSD controllers, and server motherboards. Its 3 million system gates can implement custom logic for data path acceleration, error correction, and interface bridging. The 504 kbits of true dual-port SRAM provide high-bandwidth storage for FIFOs and buffers. The device's flash-based architecture offers secure boot and tamper resistance, critical for data integrity. With 620 user I/Os, it can interface with multiple memory and peripheral devices. The low power consumption helps reduce data center energy costs. Its reprogrammability allows firmware updates to add new features or fix bugs without hardware changes.
Recommended
Avionics and Defense
The A3PE3000-1FG896 is suitable for avionics and defense systems where reliability, security, and long-term availability are paramount. Its flash-based architecture provides inherent security against bitstream cloning and tampering, meeting stringent defense requirements. The device operates over the commercial temperature range (0°C to 70°C), but industrial temperature variants are available for harsh environments. With 3 million gates, it can implement complex signal processing, sensor fusion, and communication protocols. The single-chip solution reduces system weight and power, critical for airborne platforms. Its reprogrammability allows in-field updates to adapt to changing mission requirements. The device's long lifecycle support from Microchip ensures availability for defense programs.
Recommended
Industrial Automation
In industrial automation, the A3PE3000-1FG896 provides a flexible platform for motor control, PLCs, and robotics. Its 3 million gates can implement multiple control loops, communication interfaces (EtherCAT, PROFINET), and safety logic. The flash-based architecture ensures deterministic startup without external configuration, critical for safety-critical systems. The device's low power consumption reduces heat in sealed enclosures. With 620 user I/Os, it can interface with sensors, actuators, and encoders. The reprogrammability allows firmware updates to add new features or fix bugs without hardware changes. The device's robustness and long lifecycle support make it suitable for industrial environments where downtime is costly.
Recommended
Medical Electronics
The A3PE3000-1FG896 is used in medical electronics such as patient monitors, imaging systems, and diagnostic equipment. Its 3 million gates can implement signal processing, data acquisition, and display control. The flash-based architecture provides secure, non-volatile configuration, ensuring reliable startup in critical medical devices. The device's low power consumption is beneficial for portable and battery-operated medical equipment. With 504 kbits of SRAM, it can buffer high-resolution sensor data. The reprogrammability allows software updates to improve functionality or comply with new regulations. The device's long lifecycle support is essential for medical devices that require years of availability. Industrial temperature variants are available for demanding environments.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1FG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-2FG896 | M1A3PE3000-1FG896 | A3PE3000-1FGG896 | A3PE3000-1FG896I | A3PE3000-2FGG896I |
|---|---|---|---|---|---|---|
| Package | FBGA-896 (1 mm pitch) | FBGA-896 (1 mm pitch) | FBGA-896 (1 mm pitch) | FBGA-896 (0.8 mm pitch) | FBGA-896 (1 mm pitch) | FBGA-896 (0.8 mm pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 | 3.00E6 |
| User I/Os | 620 | 620 | 620 | 620 | 620 | 620 |
| SRAM (kbits) | 504 | 504 | 504 | 504 | 504 | 504 |
| Speed Grade | -1 (standard) | -2 (faster) | -1 (standard) | -1 (standard) | -1 (standard) | -2 (faster) |
| Temperature Range | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | -40°C to 100°C | -40°C to 100°C |
| Soft ARM Support | No | No | Yes | No | No | No |
Key Differentiators
- Flash-based architecture provides live-at-power-up and security (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- 3 million system gates in a single chip (vs A3PE3000-1FGG896)
- Low power consumption (vs SRAM-based FPGAs)
Design Notes
The A3PE3000-1FG896 requires a 1.5V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Estimated: For a typical design with 50% logic utilization, core current may be around 300-500 mA. Place 0.1uF and 10uF decoupling capacitors close to each VCC and GND pin pair to minimize power supply noise. Refer to the ProASIC3E datasheet for recommended power supply sequencing.
The 896-ball FBGA package with 1 mm pitch requires careful PCB layout. Use a 4-layer or more board with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize trace lengths. Follow the layout guidelines in the ProASIC3E datasheet, including via placement and thermal relief. Ensure adequate thermal vias under the package for heat dissipation.
Do not exceed the absolute maximum ratings for the 1.5V core supply. Ensure proper decoupling to prevent latch-up. The flash-based FPGA retains configuration, but verify JTAG programming connections. For designs requiring industrial temperature, use the -I variant. Avoid using the -1FGG896 as a drop-in replacement for -1FG896 due to different ball pitch.
Compliance Information
RoHS compliance inferred from distributor listings. Other compliance data not explicitly stated in provided data.
