A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
MPN: A3PE3000-1FGG896 ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for A3PE3000-1FGG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-1FGG896
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View Datasheet →A3PE3000-FGG896I
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View Datasheet →A3PE3000L-FGG896M
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View Datasheet →A3PE3000L-FGG896I
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View Datasheet →A3PE3000-1FGG896 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Speed Grade | -1 |
| Package | 896-ball FBGA (FGG896) |
| Technology | Nonvolatile flash, CMOS |
| Configuration | Single-chip, Instant On (on-chip flash) |
| Reprogrammability | Yes (in-system reprogrammable flash fabric) |
| Mounting Type | Surface Mount |
| Lead Free | Yes (LEAD FREE per distributor listing) |
| RoHS Status | Compliant |
| Country of Origin | South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) |
A3PE3000-1FGG896 896-ball fbga (fgg896) Pin Configuration Guide
Complete pinout information for A3PE3000-1FGG896 (896-ball fbga (fgg896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-1FGG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1FGG896 is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Equipment, Aerospace and Defense Systems, Medical Instrumentation, ASIC Prototyping and Low-Volume Production, Security and Surveillance Systems.
Industrial Automation and Control
The A3PE3000-1FGG896 fits industrial control backplanes and machine controllers where its 620 user I/Os bridge wide parallel buses, fieldbus interfaces, and sensor banks in a single chip. Because the flash fabric is Instant On, control logic is live the moment power is applied - no configuration delay that could stall a factory process. The 75,264 logic cells absorb state machines, counters, and protocol cores that previously required several CPLDs or an ASIC. Place the FPGA between a main CPU and distributed I/O modules, using the 896-ball FGG package's I/O banking to mix 3.3V and 2.5V banks on one board. The trade-off versus an SRAM FPGA is the absence of external configuration flash, which improves uptime since there is no bitstream-load failure mode at power-up.
Recommended
Communications and Networking Equipment
Line cards, aggregation switches, and protocol bridges benefit from the A3PE3000-1FGG896's combination of 3,000,000 system gates and up to 620 user I/Os, enough for multiple parallel PHY interfaces plus framing and packet-processing logic. The ProASIC3E fabric with embedded block memory buffers data between asynchronous clock domains, and the flash technology delivers low static power compared with SRAM FPGAs of similar density - relevant in telecom racks where per-card power budgets are tight. Deploy the device as glueless interconnect between processors, traffic managers, and backplane connectors. Because the design is stored on-chip, the bitstream is not exposed during boot, addressing operator security requirements. The -1 speed grade supports moderate clock rates; move to A3PE3000-2FGG896 (same 896-ball footprint) if timing analysis shows paths closing with margin under 10%.
Recommended
Aerospace and Defense Systems
The ProASIC3E flash architecture is a strong fit for defense electronics because configuration data resides in nonvolatile on-chip flash, eliminating the bitstream-fetch window that SRAM FPGAs expose and simplifying anti-tamper discussions. The A3PE3000-1FGG896's 75,264 logic cells implement sensor-interface processing, bus protocol engines (e.g., custom serial links), and system sequencing, while 620 I/Os accommodate dense chassis interconnect. Microchip offers M-suffix military-screened variants in the identical 896-ball package, including A3PE3000L-1FGG896M, allowing a PCB designed around this part to be upgraded to screened supply chains without layout changes. Use the L (low-power) family member where conduction-cooled or battery-backed platforms impose strict static-power limits; the same footprint makes that swap a sourcing decision, not a redesign.
Recommended
Medical Instrumentation
Diagnostic and imaging equipment requires deterministic logic that is functional immediately at power-on; the A3PE3000-1FGG896's flash-based Instant-On operation meets this need without a boot sequence or external configuration device. Its 620 user I/Os interface sensor arrays, acquisition front ends, and display subsystems, while 75,264 logic cells implement real-time filtering and control pipelines in the fabric. Low static power from the flash fabric reduces heat inside enclosed patient-facing equipment, easing thermal design and acoustic (fan-less) requirements. Integrate the device between analog front-end components and a host processor, keeping wide parallel acquisition buses on dedicated I/O banks. For regulatory documentation, cite the Microchip ProASIC3E datasheet (DS0098) for device specifications and use Libero SoC toolchain artifacts as design-control evidence.
Recommended
ASIC Prototyping and Low-Volume Production
Before committing to an ASIC mask set, engineers use the A3PE3000-1FGG896 to prototype at 3,000,000 system gates; its reprogrammable flash fabric accepts design iterations without new silicon, and the 620-I/O 896-ball FGG package mirrors the high pin count of typical ASIC interface rings. At low production volumes, the ProASIC3E delivers ASIC-like unit economics without NRE, as Microchip highlights on the A3PE3000 product page ('ASIC-level unit cost'). The single-chip configuration also means the prototype PCB matches the production power-up behavior - important when validating reset and sequencing logic. Flow: synthesize in Synplify, place-and-route in Microchip Libero, then program in-system; iteration cycles are hours rather than months. Retain the same footprint in production boards so the A3PE3000L-1FGG896 low-power variant can be dropped in if power targets tighten.
Recommended
Security and Surveillance Systems
Video surveillance concentrators and secure recording appliances use the A3PE3000-1FGG896 to aggregate multiple camera streams: the 620 user I/Os accept numerous parallel sensor or LVDS-style links, and the 75,264-cell fabric performs framing, packetization, and encryption-prep logic. On-chip flash configuration supports secure-boot architectures because the FPGA is functional instantly with no external bitstream exposed on the bus - a recognized advantage of Microsemi/Microchip flash FPGAs cited in the ProASIC3E datasheet. Implement the device as the bridge between camera front ends, storage controllers, and a network processor, reserving I/O banks for the video planes. The -1 speed grade suits streaming clock rates; if post-route timing shows negative slack on the video pipeline, the pin-compatible A3PE3000-2FGG896 raises Fmax without any board change.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1FGG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG896 | A3PE3000-2FGG896 | A3PE3000-FGG896 |
|---|---|---|---|---|
| Package | 896-ball FBGA (FGG) | 896-ball FBGA (FGG) - same | 896-ball FBGA (FGG) - same | 896-ball FBGA (FGG) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 |
| User I/O | 620 | 620 | 620 | 620 |
| Speed Grade | -1 | -1 | -2 (faster) | standard (slower) |
| Power Variant | Standard | Low power (L) | Standard | Standard |
| Configuration Technology | On-chip nonvolatile flash (Instant On) | On-chip nonvolatile flash (Instant On) | On-chip nonvolatile flash (Instant On) | On-chip nonvolatile flash (Instant On) |
| Temperature / Screening Suffix | Standard commercial grade | Standard | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Balanced cost/timing position within the family (vs A3PE3000-FGG896)
- Standard power variant for cost-sensitive designs (vs A3PE3000L-1FGG896)
- Single-chip Instant-On flash configuration (vs SRAM FPGAs (AMD Xilinx / Intel Altera, cross-brand))
Design Notes
The 896-ball FGG package requires a fine-pitch BGA land pattern with via-in-pad or dogbone fanout; plan escape routing for at least the I/O banks you populate, since the device supports up to 620 user I/Os. Follow the manufacturer datasheet DS0098 land-pattern dimensions exactly, and specify a high-Tg laminate if the board will carry many switching I/Os. X-ray inspection is recommended after reflow given the ball count, and rework of an 896-ball BGA is costly - verify footprint and stencil design before the first build.
ProASIC3E devices use separate core and I/O supply rails; decouple each rail bank with bulk capacitance near the ball fanout plus 0.1uF ceramics at each supply ball group per the datasheet power-supply guidance. Because configuration is on-chip flash, there is no configuration-power surge at boot, simplifying supply sizing versus SRAM FPGAs - but verify inrush on I/O banks with many simultaneously switching outputs. If static power dominates your budget, the same-footprint A3PE3000L-1FGG896 low-power variant reduces it without layout change.
The -1 speed grade is the slowest in the ProASIC3E family; run timing analysis in Microchip Libero early. If critical paths fail, the pin-compatible A3PE3000-2FGG896 resolves it without board changes - but confirm availability and cost first. Also verify I/O bank voltage assignments in the Libero I/O checker before locking pins: mixing incompatible I/O standards within a bank is the most common cause of respins on high-pin-count FPGAs. Do not leave unused configuration-related balls floating contrary to datasheet connection guidance.
Compliance Information
Distributor listing (PCB Electronics) identifies the part as LEAD FREE. RoHS compliance per Microchip standard product policy; REACH and conflict-minerals status not stated in provided data.
