A3PE3000-2FG896 - ProASIC3E FPGA, 3M Gates, 620 I/O | Microchip
MPN: A3PE3000-2FG896 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1819.44 | $1,819.44 |
| 10 | $1728.47 | $17,284.70 |
| 100 | $1637.49 | $163,749.00 |
| 500 | $1546.52 | $773,260.00 |
| 1,000 | $1455.55 | $1,455,550.00 |
A3PE3000-2FG896 Overview
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than volatile SRAM. This places the ProASIC3E family in the power-management-friendly middle of the programmable logic hierarchy: unlike SRAM FPGAs it needs no external configuration PROM, boots instantly at power-up, and offers inherently lower static power and higher SEU immunity, making it a single-chip solution for cost-sensitive and high-reliability designs.
Key features include 516,096 bits of configuration capacity reported alongside 620 usable I/Os per DigiKey listing, reprogrammable flash fabric supporting secure in-system programming, and abundant advanced features noted by Microchip such as low total cost of ownership (TOC) and strong system performance. The non-volatile fabric eliminates the brown-out configuration risks typical of SRAM devices.
Technically, the device is built on a 130 nm flash process with a 1.5 V core. The -2 speed grade balances performance and cost within the ProASIC3E family, which spans densities from 15K to 3M gates. I/O banks support a wide range of voltage-referenced standards, with one VREF pin required per minibank when using voltage-referenced I/O standards, per the ProASIC3E family datasheet (DS0098).
Typical applications include industrial automation controllers, communications and networking line cards, aerospace and defense systems requiring instant-on operation, and medical equipment where configuration data must not be externally readable.
Design consideration: confirm I/O bank voltage assignment early in PCB layout, since the 896-ball FBGA footprint fixes ball assignments and voltage-referenced standards require dedicated VREF pins per minibank.
This page synthesizes distributor pricing, verified cross-references, and drop-in alternatives in the same FG896 footprint - information not consolidated in the manufacturer datasheet.
Drop-in alternatives for A3PE3000-2FG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with A3PE3000-2FG896 (same form factor and footprint) — differing in Package, Configuration Memory, RoHS Status, Family, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000-2FG896I
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →A3PE3000-2FGG896
✅ Drop-In✓ In Stock
$128 / Unit
View Datasheet →A3PE3000-2FGG896I
✅ Drop-In✓ In Stock
$1482.9 / Unit
View Datasheet →A3PE3000-FG896
✅ Drop-In✓ In Stock
$129.8 / Unit
View Datasheet →A3PE3000-FG896I
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →A3PE3000-FGG896
✅ Drop-In✓ In Stock
$340 / Unit
View Datasheet →A3PE3000-FGG896I
✅ Drop-In✓ In Stock
$135.2 / Unit
View Datasheet →A3PE3000L-FG896
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000-2FG896 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 3M (3,000,000) |
| Number of I/Os | 620 |
| Configuration Bits | 516096 |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -2 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm flash |
| Configuration Memory | Non-volatile Flash (single-chip) |
| Package | 896-Ball FBGA (FG896) |
| Mounting Style | SMD/SMT |
| Operating Temperature - Min | 0 C |
| Operating Temperature - Max | +70 C |
| Packaging | Tray |
| Product Series | A3PE3000 |
A3PE3000-2FG896 896-ball fbga (fg896) Pin Configuration Guide
Pin configuration for A3PE3000-2FG896 (896-ball fbga (fg896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-2FG896.
Refer to the datasheet for full pin configuration.
Typical Applications
A3PE3000-2FG896 is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Line Cards, Aerospace and Defense Electronics, Medical Equipment and Diagnostics, Test and Measurement Instrumentation, Secure and Single-Chip Embedded Systems.
Industrial Automation and Control
The A3PE3000-2FG896 fits industrial automation controllers where instant-on flash configuration and 620 I/Os eliminate glue logic and external configuration PROMs. Its 3M gates absorb motor-control sequencers, fieldbus protocol bridges, and safety interlock logic in one device, cutting total cost of ownership - a stated Microchip design goal for ProASIC3E. Used between sensor/actuator banks and an industrial Ethernet MAC, the non-volatile fabric boots within microseconds of 1.5 V core power, avoiding the configuration window vulnerability of SRAM FPGAs. The 0 C to +70 C commercial rating suits conditioned cabinets; specify the -2FG896I industrial grade below 0 C. With no configuration bitstream exposed externally, proprietary control IP is also harder to extract than from SRAM architectures.
Recommended
Communications and Networking Line Cards
Networking line cards benefit from the A3PE3000-2FG896's 310 MHz system performance and 620 I/Os for PHY interfacing, framing, and traffic management glue replacement. The -2 speed grade closes timing for typical Sonet/Ethernet framer bridges at line rate on the 130 nm flash fabric, while the high ball count of the FG896 package provides the I/O banks needed for multi-port designs with mixed I/O voltages - one VREF pin per minibank supports voltage-referenced standards per the DS0098 datasheet. Because configuration is on-chip flash, cards hot-insert into chassis without external boot devices or configuration controllers, reducing BOM cost and improving availability. Pair with Microchip/Micrel PHYs and use Libero SoC timing closure at -2 grade before freezing the design.
Recommended
Aerospace and Defense Electronics
The A3PE3000-2FG896 architecture inherently suits aerospace and defense payloads: flash configuration cells provide higher SEU immunity than SRAM and instant-on behavior required by systems that must be operational at power application. The single-chip solution avoids radiation-sensitive external configuration memories, and the 3M-gate capacity implements bus interfaces (MIL-STD-1553-style protocol wrappers, ARINC glue, custom crypto-adjacent plumbing) alongside payload processing. In avionics and UAV controller boards, the 620 I/Os terminate sensor arrays and redundant communication channels without external transceiver logic. For programs with extended temperature profiles, order the pin-identical A3PE3000-2FG896I. Note this commercial part is not ITAR-screened or space-grade; consult Microchip's RTG4/RT ProASIC3 lines for rad-hard requirements.
Recommended
Medical Equipment and Diagnostics
Medical diagnostic platforms - patient monitors, imaging front ends, lab analyzers - use the A3PE3000-2FG896 where deterministic instant-on boot and secure configuration matter. The 3M-gate flash fabric implements acquisition sequencers, filter pipelines, and display interface bridges; 620 I/Os terminate ADC arrays and touch/display peripherals without companion glue logic. Because the configuration bitstream lives in on-chip flash and is never shifted in from an external device, design IP and algorithm-holding logic are more resistant to extraction - relevant for FDA-cleared proprietary signal chains. The 0 C to +70 C rating covers clinical environments; the 1.5 V core plus flash fabric also lowers static power versus SRAM alternatives in always-on monitoring stations. Use Libero SoC for timing closure and document the device in your design history file.
Recommended
Test and Measurement Instrumentation
Bench and modular instruments (oscilloscope acquisition boards, logic analyzers, signal generators) exploit the A3PE3000-2FG896's 310 MHz fabric speed and large I/O count for timing-critical acquisition state machines and trigger engines. The 3M gates absorb capture FIFOs, trigger comparators, and calibration logic in one reprogrammable device, letting instrument firmware evolve across product generations via Libero SoC reprogramming - no external configuration flash to update. Instant-on flash configuration means the instrument is capture-ready at power-up, important for automated test racks that power-cycle between runs. The 0 C to +70 C commercial range and tray packaging fit standard instrument manufacturing. Reserve the -2 speed grade timing budget early; -1 variants (A3PE3000-FG896) are drop-in cost savers when margin permits.
Recommended
Secure and Single-Chip Embedded Systems
Applications demanding single-chip programmable logic with no external boot image - secure gateways, authentication-adjacent logic, tamper-sensitive controllers - are natural fits for the A3PE3000-2FG896. Flash-based configuration (516096 bits on-chip) means the bitstream is never exposed on a bus at power-up, unlike SRAM FPGAs that stream configuration from external SPI flash. The 3M gates host processor companions, bus bridges, and custom state machines; 620 I/Os handle multi-voltage I/O banks with voltage-referenced standards supported via VREF pins per minibank per DS0098. System performance up to 310 MHz covers real-time protocol processing. Combined with Microchip FlashPro programming tools and Libero SoC security features, this delivers a single-chip solution with low total cost of ownership, exactly the positioning Microchip assigns to ProASIC3E.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-2FG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-2FG896I | A3PE3000-2FGG896 | A3PE3000-FG896 | A3PE3000L-FG896 |
|---|---|---|---|---|---|
| Package | 896-Ball FBGA (FG896) | 896-Ball FBGA - same | 896-Ball FBGA - same | 896-Ball FBGA - same | 896-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| User I/Os | 620 | 620 | 620 | 620 | 620 |
| Speed Grade | -2 | -2 | -2 | -1 | -1 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power L variant) |
| RoHS Compliance | Non-G package (verify lot) | Non-G package | RoHS-compliant (G package) | Non-G package | Non-G package |
| Configuration | On-chip flash (single-chip) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Highest ProASIC3E density and speed grade combination in FG896 footprint (vs A3PE3000-FG896)
- Single-chip flash configuration (vs Xilinx Spartan-class SRAM FPGAs)
- RoHS-compliant drop-in available (vs A3PE3000-2FGG896)
- Trade-off: commercial-only temperature rating (vs A3PE3000-2FG896I)
Design Notes
The A3PE3000-2FG896 runs a 1.5 V core on 130 nm flash fabric. Use Microchip's Libero SoC power calculator with your actual utilization and toggle rates before finalizing the 1.5 V rail regulator sizing - gate-level static power of flash FPGAs is low, but dynamic power at 310 MHz with 620 switching I/Os can dominate. Sequence VDDA/VDDI banks per the ProASIC3E power-up requirements in the datasheet; decouple each I/O bank with bulk plus 0.1 uF ceramics at the ball-side vias.
The 896-ball FBGA requires a controlled-impedance multilayer board with via-in-pad or dog-bone escape routing; plan at least 4 signal layers plus dedicated power/ground planes for the 620 I/O. Follow the ball-out's bank structure: assign each I/O bank a single VCCO and, when using voltage-referenced standards, reserve one VREF pin per minibank per DS0098. Do not swap VCCO domains after layout - ball assignments are fixed.
Do not substitute the commercial A3PE3000-2FG896 (0 C to +70 C) into enclosures that can exceed 70 C ambient - specify the pin-identical industrial A3PE3000-2FG896I instead. Similarly, for new EU-market designs, order the 'G' RoHS package (A3PE3000-2FGG896); the non-G FG896 code is the legacy package. Re-run timing closure in Libero SoC if migrating from speed grade -2 to -1 parts, since -1 fabric performance is lower.
Compliance Information
The base FG896 package code lacks the 'G' RoHS-designation suffix; per the ProASIC3E datasheet ordering information, 'G' indicates RoHS-compliant packages. Use A3PE3000-2FGG896 for guaranteed RoHS compliance; verify the non-G lot certificate with the distributor.
