A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip
部品番号: A3PE3000-FGG324 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $419.02 | $419.02 |
| 10 | $398.07 | $3,980.70 |
| 100 | $377.12 | $37,712.00 |
| 500 | $356.17 | $178,085.00 |
| 1,000 | $335.22 | $335,220.00 |
A3PE3000-FGG324 概要
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a fabric of configurable logic blocks, routing resources, and I/O cells. Within the programmable logic hierarchy, the FPGA sits at the top of the density range, above CPLDs and SPLDs, and serves as an ASIC replacement or prototyping platform in system-on-chip and embedded designs. The ProASIC3E distinguishes itself from SRAM-based FPGAs by using nonvolatile flash cells to store the configuration, requiring no external boot PROM.
Key features include flash-based nonvolatile configuration (instant-on, single-chip solution), 130 nm flash process technology, system performance up to approximately 231 MHz as cited in cross-reference data, 516096 bits of embedded flash resources per distributor listings, and optional support for soft ARM processors, enabling low total cost of ownership (TOC) with reprogrammability.
Technically, the ProASIC3E fabric uses a sea-of-gates architecture of versatile logic elements, supported by embedded SRAM blocks and phase-locked loops for clock management. Because configuration is stored in flash, the device is secure against bitstream capture and immune to configuration volatility at power-off, a differentiator versus SRAM FPGAs.
Typical applications include industrial automation controllers, networking and communications equipment, computing platforms, avionics systems, and consumer electronics, where the ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement.
Design consideration: the 1.5V core rail must be held within the tight 1.425V to 1.575V window; use a dedicated LDO or buck regulator with adequate decoupling near the ball field.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE3000-FGG324 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000-FGG324 （同一形状・フットプリント） — 相違点: Package, Family, Process Technology, System Gates, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE3000-FGG324I
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →A3PE3000-2FGG324
✅ ドロップイン✓ 在庫あり
$216 / 個
データシートを見る →A3PE3000L-FGG324
✅ ドロップイン✓ 在庫あり
$86.15 / 個
データシートを見る →M1A3PE3000-FGG324
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE3000-FG324I
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →A3PE3000-FGG324 最大定格＆電気的特性
| Family | ProASIC3E |
| System Gates | 3000000 gates |
| Logic Cells | 75264 cells |
| Number of I/O | 221 |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Process Technology | 130 nm flash |
| Maximum System Frequency | 231 MHz |
| Embedded Flash Bits | 516096 bits |
| Configuration Type | Flash (nonvolatile, single-chip) |
| パッケージ | 324-Ball FBGA (FGG324) |
| Package Dimensions | 19 x 19 mm, 1.63 mm height, 1 mm pitch |
| 実装タイプ | Surface Mount |
| Soft ARM Support | Yes (optional soft ARM core support) |
| RoHS ステータス | Green (compliant) |
| Technology Node Family | CMOS flash FPGA |
A3PE3000-FGG324 19 x 19 mm, 1.63 mm height, 1 mm pitch ピン配置ガイド
A3PE3000-FGG324 (19 x 19 mm, 1.63 mm height, 1 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000-FGG324.
詳細は データシート をご参照ください。
主な用途
A3PE3000-FGG324 の用途: 6 件s: Industrial Automation and Control, Networking and Communications Equipment, Avionics and Aerospace Systems, ASIC Replacement and Prototyping, Embedded Computing and Single-Board Computers, Test and Measurement Instrumentation.
Industrial Automation and Control
In industrial automation controllers, the A3PE3000-FGG324 provides glue logic consolidation, motor-control sequencing, and protocol bridging with 3M gates and 221 user I/O. The flash-based configuration means the FPGA is functional immediately at power-up with no boot delay or external configuration device - a significant benefit on factory-floor equipment that must tolerate power cycling. The 1.5V core with tight 1.425V to 1.575V tolerance integrates cleanly into typical 24V industrial backplanes after a buck regulator stage, and the approximately 231 MHz system performance ceiling covers most PLC and motion-timing tasks while keeping total cost of ownership low, as Microchip positions the family.
おすすめ
Networking and Communications Equipment
The A3PE3000-FGG324 fits line-card control, backplane interfacing, and telecom bridging roles where 75264 logic cells and 221 I/O provide enough capacity for parallel bus translation, counters, and interface state machines. Microchip explicitly targets the networking/communications market with the ProASIC3E family per the datasheet introduction. The 1 mm-pitch 324-ball FBGA keeps signal integrity manageable for the 1.5V-switched I/O banks, and the nonvolatile flash fabric avoids the configuration glitch window that SRAM FPGAs exhibit during boot - valuable for equipment that must be live within milliseconds of rack power application. Libero SoC provides reference flows for common communication IP.
おすすめ
Avionics and Aerospace Systems
Microchip's datasheet names avionics as a target market for ProASIC3E, and the A3PE3000-FGG324's flash technology is well suited to it: the bitstream resides inside the die, eliminating the external configuration PROM whose read-out window is a reliability and data-security concern in airborne platforms. With 3M system gates, the device implements sensor-fusion interfaces, ARINC-style bus bridges, and built-in-test logic. For extended-temperature or military-screened requirements, the drop-in variants A3PE3000-FGG324I (industrial grade) and M1A3PE3000-FGG324 (military screening) share the same 324-ball footprint, allowing one PCB design to span commercial, industrial, and defense program tiers.
おすすめ
ASIC Replacement and Prototyping
The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement, and the A3PE3000-FGG324 is the largest-gate-count member commonly used for this role. Designers can prototype a gate-array-scale design with 3M gates and 75264 cells, validate RTL in-system, and then move to volume production on the same silicon - avoiding ASIC NRE entirely for moderate volumes. The flash fabric's deterministic, single-chip instantiation means the prototype board can become the production board. Reprogrammability allows late functional changes and firmware-style iteration, while the approximately 231 MHz performance target covers most ASIC-replacement control and datapath workloads.
おすすめ
Embedded Computing and Single-Board Computers
In embedded computing platforms, the A3PE3000-FGG324 acts as a flexible bridge between host CPUs and custom peripherals: it can implement memory controllers, custom registers, DMA engines, and board-level sequencing. The optional soft ARM support cited in the datasheet title lets designers embed a processor core alongside custom logic within the 75264-cell fabric. The 324-ball FBGA at 19 x 19 mm suits dense SBC layouts, and instant-on flash configuration ensures the FPGA is ready before the host CPU finishes reset - simplifying power-good and reset-controller logic. The 1.5V core rail integrates with typical low-voltage board power trees.
おすすめ
Test and Measurement Instrumentation
Test and measurement instruments benefit from the A3PE3000-FGG324's reprogrammable timing generators, trigger logic, and data-capture state machines. With 221 user I/O, the device can interface to high-pin-count ADC front ends and control panels, while the flash fabric preserves the instrument configuration through power cycles - important for bench instruments expected to resume their last state instantly. The deterministic flash fabric also avoids configuration-image integrity issues when instruments are deployed in the field for years. Speed grade -2 variants (A3PE3000-2FGG324) are drop-in upgrades when calibration timing margins require faster fabric performance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE3000-FGG324 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE3000-FGG324I | A3PE3000-2FGG324 | A3PE3000L-FGG324 | M1A3PE3000-FGG324 | A3PE3000-FG324I |
|---|---|---|---|---|---|---|
| Package | 324-Ball FBGA, 19 x 19 mm | 324-Ball FBGA - same footprint | 324-Ball FBGA - same footprint | 324-Ball FBGA - same footprint | 324-Ball FBGA - same footprint | 324-Ball FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3M gates | 3M gates | 3M gates | 3M gates | 3M gates | 3M gates |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V (low-power spec per datasheet) | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Temperature Grade | Commercial | Industrial (-40C to +100C) | Commercial | Commercial/industrial options - verify datasheet | Military screening | Industrial (-40C to +100C) |
| Speed Grade | Standard | Standard | -2 (faster fabric timing) | Standard | Standard | Standard |
| Configuration Type | Flash (nonvolatile, single-chip) | Flash (nonvolatile) | Flash (nonvolatile) | Flash (nonvolatile) | Flash (nonvolatile) | Flash (nonvolatile) |
主な差別化要因
- Nonvolatile flash configuration - instant-on, single-chip （vs SRAM-based FPGAs (Xilinx/Altera))
- Industrial-grade drop-in upgrade available （vs A3PE3000-FGG324I)
- Speed-grade upgrade without relayout （vs A3PE3000-2FGG324)
- Low-power variant option （vs A3PE3000L-FGG324)
設計ノート
The 1.5V core rail must stay within 1.425V to 1.575V (a 150 mV total window). Use a dedicated buck regulator or LDO with better than 1% initial accuracy and low output ripple, and budget for IR drop across the PCB planes. Estimated: at typical ProASIC3E core currents of a few hundred milliamps, a 10 milliohm plane path adds tens of millivolts - a significant fraction of the tolerance window. Decouple the core with a network of 10uF and 0.1uF ceramics distributed across the ball field.
Import the manufacturer-supplied FBGA-324 footprint (19 x 19 mm, 1 mm ball pitch, 1.63 mm height) from the Microchip/Microsemi support files rather than drawing it manually - the 324-ball map includes power, ground, and JTAG balls in fixed locations. Fan out using via-in-pad or dog-bone escapes on a minimum 4-layer stack; allocate inner layers to core and I/O power planes. Provide JTAG (FlashPro) header access for programming and debug on production boards.
I/O switching on 1.5V-tolerant banks at high toggle rates can cause simultaneous-switching noise; group high-activity outputs on separate banks and provide a solid return path beneath each I/O bank. Route clock inputs with matched length and use the on-chip PLLs (per family datasheet features) rather than external clock buffers where possible. Keep stub lengths short on the 1 mm-pitch escape fanout to control reflections at high-speed interfaces.
Do not assume cross-brand FPGAs (Xilinx, Altera/Intel, Lattice) can replace the A3PE3000-FGG324 - none are pin-compatible with this flash die; stay within the ProASIC3E family for drop-in swaps. Also, FG324 vs FGG324 suffixes differ in ball/green-package specification; verify solder-ball metallurgy and moisture sensitivity level against the datasheet before finalizing assembly profiles.
コンプライアンス情報
Cross-reference listings describe the FGG324 package as GREEN (RoHS compliant, lead-free). REACH, halogen-free, and conflict-minerals status not stated in provided data - verify on the official Microchip compliance page.
