A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
MPN: A3PE3000-2FGG324 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $249 | $24,900.00 |
| 500 | $232 | $116,000.00 |
| 1,000 | $216 | $216,000.00 |
Drop-in alternatives for A3PE3000-2FGG324 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000-FG324
✅ Drop-In✓ In Stock
$112.3 / Unit
View Datasheet →A3PE3000-FGG324I
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →A3PE3000-2FGG324I
✅ Drop-In📋 Reference alternative (not in catalog)
M1A3PE3000-2FGG324I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-FGG324I
✅ Drop-In✓ In Stock
$62.65 / Unit
View Datasheet →A3PE3000-FG324I
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →A3PE3000-2FGG324 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| CLBs | 75264 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) |
| User I/O | 221 |
| Package | 324-ball FBGA (FGG324) |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height |
| Mounting Type | Surface Mount |
| Speed Grade | 2 |
| Packaging Type | Tray |
| RoHS Status | Green (RoHS compliant) |
| Automotive Qualification | Not qualified (standard grade) |
A3PE3000-2FGG324 19 x 19 mm, 1 mm pitch, 1.63 mm height Pin Configuration Guide
Complete pinout information for A3PE3000-2FGG324 (19 x 19 mm, 1 mm pitch, 1.63 mm height package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-2FGG324.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-2FGG324 is suitable for 6 applications: Industrial Automation and Control, Military and Aerospace Secure Logic, Communications Infrastructure, Test and Measurement Equipment, Medical Instrumentation, Embedded System Prototyping and NPI.
Industrial Automation and Control
The A3PE3000-2FGG324 fits industrial automation controllers that need reprogrammable glue logic, motor-control sequencing, and fieldbus interface bridging. Its 3 million gates and 75,264 logic cells accommodate protocol state machines plus deterministic I/O handling, while flash configuration means the controller is operational within microseconds of power-up, eliminating boot delays that PLCs cannot tolerate. The 221 user I/O in a 19 x 19 mm FBGA connect encoders, sensors, and actuators over a compact footprint. Live firmware-style updates are possible through reprogramming without external boot memory, improving field serviceability. Compared with an MCU + CPLD combo, the single-chip ProASIC3E reduces BOM count and total cost of ownership.
Recommended
Military and Aerospace Secure Logic
Flash-based FPGAs are the architecture of choice for defense electronics because the configuration resides in nonvolatile on-chip flash cells, immune to bitstream readback attacks and requiring no external configuration device that could be intercepted or corrupted. The A3PE3000-2FGG324 provides 3 million gates of secure, instantly-on logic for sensor preprocessing, bus bridging (MIL-STD-class interfaces), and payload control. The 310 MHz speed grade 2 rating supports real-time signal formatting, and the 1.5V core limits dynamic power in constrained platforms. FindIC cross-reference data confirms industrial and alternate-grade variants in the identical 324-ball FBGA, easing long-term supply for multi-year programs.
Recommended
Communications Infrastructure
In telecom and networking line cards, the A3PE3000-2FGG324 implements framing, deskewing, and control-plane bridging between MACs, PHYs, and backplanes. The 310 MHz system performance at speed grade 2 covers common line-rate processing pipelines, and embedded SRAM blocks build FIFOs for clock-domain crossing. The 221 user I/O with differential signaling support handle LVDS-class high-speed links, while the flash fabric reconfigures for protocol updates in the field. Instant-on behavior matters in redundant systems where a failed line card must restore traffic without a multi-second configuration load. The 324-ball FBGA at 1 mm pitch fits standard 19 x 19 mm footprint card layouts.
Recommended
Test and Measurement Equipment
Bench and automated test instruments use the A3PE3000-2FGG324 as a reconfigurable timing, trigger, and acquisition engine. Its 3 million gates implement channel state machines, trigger comparators, and data packaging into a common capture memory, while embedded SRAM buffers sample streams before host transfer. The flash-based fabric loads instantly at power-up, so instruments are ready within the warm-up cycle users expect, and the design can be updated across product revisions without board respins. The 1.5V core keeps internal dynamic power manageable inside sealed instrument enclosures. The 324-ball FBGA's 1 mm pitch allows rework-friendly assembly for low-volume instrument production.
Recommended
Medical Instrumentation
Medical devices such as patient monitors, imaging front ends, and laboratory analyzers benefit from the A3PE3000-2FGG324's deterministic instant-on startup, which ensures the instrument is functional the moment power is applied, a behavior required in safety-conscious designs. The 3 million gate fabric implements acquisition pipelines, filter stages, and interface bridging to host processors, and the flash configuration eliminates an external boot device from the medical BOM, reducing qualification surface. The industrial-temperature drop-in variants in the same 324-ball FBGA support long product lifecycles demanded by regulatory certification timelines, and reprogrammability enables validated field upgrades.
Recommended
Embedded System Prototyping and NPI
During new product introduction, the A3PE3000-2FGG324 serves as a programmable integration vehicle that absorbs glue logic, bus translation, and interface adaptation while the final ASIC or MCU firmware matures. The flash fabric reprograms in-circuit across design iterations, and single-chip configuration means prototype boards need no JTAG flash or configuration controller. Its 3 million gates cover mid-scale SoC companion logic, and the 310 MHz speed grade supports realistic system-level validation rather than throttled prototyping. When the design freezes, the same 324-ball FBGA footprint accommodates lower-cost alternate speed grades verified as drop-in by FindIC cross-reference data, protecting the PCB investment.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-2FGG324 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-FG324 | A3PE3000-FGG324I | A3PE3000-2FGG324I | M1A3PE3000-2FGG324I | A3PE3000L-FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324), 19 x 19 mm | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade | -2 (up to 310 MHz) | [DATA_NEEDED] | 231 MHz-class | -2 (up to 310 MHz) | -2 | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Temperature Range | Commercial (standard grade) | Standard | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Configuration | Flash, single-chip instant-on | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip |
| Power Profile | Standard ProASIC3E | Standard | Standard | Standard | Standard | Low-power (L) |
Key Differentiators
- Top speed grade in the family (vs A3PE3000-FGG324I)
- Single-chip flash configuration security (vs SRAM-based competitor FPGAs)
- Industrial-temperature drop-in options preserve qualification (vs M1A3PE3000-2FGG324I)
- Trade-off: standard commercial temperature only (vs A3PE3000-2FGG324I)
Design Notes
The A3PE3000-2FGG324 requires a 1.5V core rail plus auxiliary and I/O bank rails; plan a multi-rail power tree and confirm I/O bank voltages match your signaling standards before layout. Estimated: static and dynamic current scale with clock activity and toggle rates, so run Microchip's power calculator (Libero SoC power analysis) with your actual post-route netlist rather than worst-case family numbers. Decouple each supply rail with bulk capacitance at the regulator plus 0.1 uF ceramics distributed across the 324-ball BGA via field; place at least one decoupling pair per rail corner.
The FGG324 package uses a 1 mm ball pitch on a 19 x 19 mm body, requiring a via-in-pad or dog-bone fanout with 0.5 mm via pads and 0.25 mm vias on standard geometry. Keep signal-length matching for differential pairs within the tolerance of the chosen I/O standard, and route core-adjacent balls first. Follow the ProASIC3E family datasheet ball map exactly when generating the footprint; do not derive the map from third-party summaries. Provide thermal relief via array under the package center since FBGA heat exits primarily through the balls.
Do not assume drop-in interchange without re-running timing: while FindIC confirms same terminals and package across A3PE3000 family variants, speed grades differ (310 MHz for -2 vs 231 MHz-class for others), so designs near timing closure must be re-verified with the substitute's timing model in Libero SoC. Also, the standard -2FGG324 is not industrial-temperature rated; if the end environment exceeds commercial range, order the 2FGG324I or M1A3PE3000-2FGG324I instead. Confirm die revision and security requirements before second-sourcing within the family.
Compliance Information
Distributor listings describe the package as GREEN (RoHS compliant) per FindIC data for the FGG324 package. REACH, halogen-free, and conflict-minerals status not stated in provided data.
