A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
部品番号: A3PE3000-2FGG324 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $249 | $24,900.00 |
| 500 | $232 | $116,000.00 |
| 1,000 | $216 | $216,000.00 |
A3PE3000-2FGG324 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, memory blocks, and interconnects that designers program after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses flash cells for configuration, meaning it is single-chip, instantly-on at power-up, and inherently secure against configuration bitstream copying because no external configuration flash is required.
Key features of the A3PE3000-2FGG324 include reprogrammable flash fabric supporting live design updates, embedded variable-width SRAM blocks for FIFO and dual-port memory implementations, advanced I/O supporting multiple single-ended and differential standards, and low total cost of ownership through elimination of external boot memory. The ProASIC3E family combines high performance with ultra-low-density-class cost structure and small-footprint packaging options.
Technically, the device uses Actel's third-generation flash architecture at 130nm, with speed grade 2 delivering up to 310 MHz system performance. The fabric includes PLLs for clock management, multiple embedded memory arrays totaling dedicated SRAM, and I/O banks that support LVDS-class differential signaling for high-speed board-level interfaces.
Typical applications include industrial automation and control, military and aerospace systems requiring secure instant-on logic, communications infrastructure, test and measurement equipment, and medical instrumentation where single-chip reprogrammability, configuration security, and reliable power-up behavior are required.
When designing with this device, plan power sequencing for the 1.5V core and auxiliary I/O rails, and verify I/O bank voltage compatibility with the board interface standards chosen. Because the fabric is flash-based, configuration corruption from cold-boot radiation or bitstream loss does not apply, simplifying system reliability analysis.
This page synthesizes distributor pricing tiers, verified drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet, aiding selection and shortage-risk mitigation.
ドロップイン代替品: A3PE3000-2FGG324 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000-2FGG324 （同一形状・フットプリント） — 相違点: Package, Family, RoHS Status, System Gates, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE3000-FG324
✅ ドロップイン✓ 在庫あり
$112.3 / 個
データシートを見る →A3PE3000-FGG324I
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →A3PE3000-2FGG324I
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →M1A3PE3000-2FGG324I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE3000L-FGG324I
✅ ドロップイン✓ 在庫あり
$62.65 / 個
データシートを見る →A3PE3000-FG324I
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →A3PE3000-2FGG324 最大定格＆電気的特性
| Family | ProASIC3E |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| CLBs | 75264 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) |
| User I/O | 221 |
| パッケージ | 324-ball FBGA (FGG324) |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height |
| 実装タイプ | Surface Mount |
| Speed Grade | 2 |
| Packaging Type | Tray |
| RoHS ステータス | Green (RoHS compliant) |
| Automotive Qualification | Not qualified (standard grade) |
A3PE3000-2FGG324 19 x 19 mm, 1 mm pitch, 1.63 mm height ピン配置ガイド
A3PE3000-2FGG324 (19 x 19 mm, 1 mm pitch, 1.63 mm height パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000-2FGG324.
詳細は データシート をご参照ください。
主な用途
A3PE3000-2FGG324 の用途: 6 件s: Industrial Automation and Control, Military and Aerospace Secure Logic, Communications Infrastructure, Test and Measurement Equipment, Medical Instrumentation, Embedded System Prototyping and NPI.
Industrial Automation and Control
The A3PE3000-2FGG324 fits industrial automation controllers that need reprogrammable glue logic, motor-control sequencing, and fieldbus interface bridging. Its 3 million gates and 75,264 logic cells accommodate protocol state machines plus deterministic I/O handling, while flash configuration means the controller is operational within microseconds of power-up, eliminating boot delays that PLCs cannot tolerate. The 221 user I/O in a 19 x 19 mm FBGA connect encoders, sensors, and actuators over a compact footprint. Live firmware-style updates are possible through reprogramming without external boot memory, improving field serviceability. Compared with an MCU + CPLD combo, the single-chip ProASIC3E reduces BOM count and total cost of ownership.
おすすめ
Military and Aerospace Secure Logic
Flash-based FPGAs are the architecture of choice for defense electronics because the configuration resides in nonvolatile on-chip flash cells, immune to bitstream readback attacks and requiring no external configuration device that could be intercepted or corrupted. The A3PE3000-2FGG324 provides 3 million gates of secure, instantly-on logic for sensor preprocessing, bus bridging (MIL-STD-class interfaces), and payload control. The 310 MHz speed grade 2 rating supports real-time signal formatting, and the 1.5V core limits dynamic power in constrained platforms. FindIC cross-reference data confirms industrial and alternate-grade variants in the identical 324-ball FBGA, easing long-term supply for multi-year programs.
おすすめ
Communications Infrastructure
In telecom and networking line cards, the A3PE3000-2FGG324 implements framing, deskewing, and control-plane bridging between MACs, PHYs, and backplanes. The 310 MHz system performance at speed grade 2 covers common line-rate processing pipelines, and embedded SRAM blocks build FIFOs for clock-domain crossing. The 221 user I/O with differential signaling support handle LVDS-class high-speed links, while the flash fabric reconfigures for protocol updates in the field. Instant-on behavior matters in redundant systems where a failed line card must restore traffic without a multi-second configuration load. The 324-ball FBGA at 1 mm pitch fits standard 19 x 19 mm footprint card layouts.
おすすめ
Test and Measurement Equipment
Bench and automated test instruments use the A3PE3000-2FGG324 as a reconfigurable timing, trigger, and acquisition engine. Its 3 million gates implement channel state machines, trigger comparators, and data packaging into a common capture memory, while embedded SRAM buffers sample streams before host transfer. The flash-based fabric loads instantly at power-up, so instruments are ready within the warm-up cycle users expect, and the design can be updated across product revisions without board respins. The 1.5V core keeps internal dynamic power manageable inside sealed instrument enclosures. The 324-ball FBGA's 1 mm pitch allows rework-friendly assembly for low-volume instrument production.
おすすめ
Medical Instrumentation
Medical devices such as patient monitors, imaging front ends, and laboratory analyzers benefit from the A3PE3000-2FGG324's deterministic instant-on startup, which ensures the instrument is functional the moment power is applied, a behavior required in safety-conscious designs. The 3 million gate fabric implements acquisition pipelines, filter stages, and interface bridging to host processors, and the flash configuration eliminates an external boot device from the medical BOM, reducing qualification surface. The industrial-temperature drop-in variants in the same 324-ball FBGA support long product lifecycles demanded by regulatory certification timelines, and reprogrammability enables validated field upgrades.
おすすめ
Embedded System Prototyping and NPI
During new product introduction, the A3PE3000-2FGG324 serves as a programmable integration vehicle that absorbs glue logic, bus translation, and interface adaptation while the final ASIC or MCU firmware matures. The flash fabric reprograms in-circuit across design iterations, and single-chip configuration means prototype boards need no JTAG flash or configuration controller. Its 3 million gates cover mid-scale SoC companion logic, and the 310 MHz speed grade supports realistic system-level validation rather than throttled prototyping. When the design freezes, the same 324-ball FBGA footprint accommodates lower-cost alternate speed grades verified as drop-in by FindIC cross-reference data, protecting the PCB investment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE3000-2FGG324 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE3000-FG324 | A3PE3000-FGG324I | A3PE3000-2FGG324I | M1A3PE3000-2FGG324I | A3PE3000L-FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324), 19 x 19 mm | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Temperature Range | Commercial (standard grade) | Standard | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Configuration | Flash, single-chip instant-on | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip |
| Power Profile | Standard ProASIC3E | Standard | Standard | Standard | Standard | Low-power (L) |
主な差別化要因
- Top speed grade in the family （vs A3PE3000-FGG324I)
- Single-chip flash configuration security （vs SRAM-based competitor FPGAs)
- Industrial-temperature drop-in options preserve qualification （vs M1A3PE3000-2FGG324I)
- Trade-off: standard commercial temperature only （vs A3PE3000-2FGG324I)
設計ノート
The A3PE3000-2FGG324 requires a 1.5V core rail plus auxiliary and I/O bank rails; plan a multi-rail power tree and confirm I/O bank voltages match your signaling standards before layout. Estimated: static and dynamic current scale with clock activity and toggle rates, so run Microchip's power calculator (Libero SoC power analysis) with your actual post-route netlist rather than worst-case family numbers. Decouple each supply rail with bulk capacitance at the regulator plus 0.1 uF ceramics distributed across the 324-ball BGA via field; place at least one decoupling pair per rail corner.
The FGG324 package uses a 1 mm ball pitch on a 19 x 19 mm body, requiring a via-in-pad or dog-bone fanout with 0.5 mm via pads and 0.25 mm vias on standard geometry. Keep signal-length matching for differential pairs within the tolerance of the chosen I/O standard, and route core-adjacent balls first. Follow the ProASIC3E family datasheet ball map exactly when generating the footprint; do not derive the map from third-party summaries. Provide thermal relief via array under the package center since FBGA heat exits primarily through the balls.
Do not assume drop-in interchange without re-running timing: while FindIC confirms same terminals and package across A3PE3000 family variants, speed grades differ (310 MHz for -2 vs 231 MHz-class for others), so designs near timing closure must be re-verified with the substitute's timing model in Libero SoC. Also, the standard -2FGG324 is not industrial-temperature rated; if the end environment exceeds commercial range, order the 2FGG324I or M1A3PE3000-2FGG324I instead. Confirm die revision and security requirements before second-sourcing within the family.
コンプライアンス情報
Distributor listings describe the package as GREEN (RoHS compliant) per FindIC data for the FGG324 package. REACH, halogen-free, and conflict-minerals status not stated in provided data.
