ADRV9002BBCZ-REEL - Dual RF Transceiver 30MHz-6GHz | Analog Devices
部品番号: ADRV9002BBCZ-REEL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1012.5 | $1,012.50 |
| 10 | $731.25 | $7,312.50 |
| 100 | $646.875 | $64,687.50 |
| 500 | $618.75 | $309,375.00 |
| 1,000 | $590.625 | $590,625.00 |
ADRV9002BBCZ-REEL 概要
An RF transceiver is a device that combines both a transmitter and a receiver in a single package, sharing common circuitry. The ADRV9002 is a system-on-chip (SoC) that integrates the RF front-end, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and digital signal processing (DSP) blocks. This level of integration reduces component count, board space, and design complexity, making it ideal for software-defined radios (SDR) and other advanced wireless systems.
Key features of the ADRV9002 include dual-channel operation, a wide frequency range of 30 MHz to 6 GHz, and support for both narrow-band and wideband signals. The device offers high linearity and dynamic range, ensuring reliable performance in demanding environments. It also includes integrated synthesizers, reducing the need for external PLLs and VCOs. The power output is 7.8 dBm, and the device operates from a single 3.3V supply.
The ADRV9002 uses advanced CMOS technology to achieve high performance with low power consumption. The digital signal processing functions include filtering, gain control, and calibration, which are configurable via a serial peripheral interface (SPI). The device supports multiple operating modes, including TDD and FDD, and can be programmed for various bandwidths and sample rates. The integrated synthesizers provide low phase noise, essential for high-quality signal transmission and reception.
Typical applications for the ADRV9002 include 5G NR base stations, small cells, macro cells, and other wireless infrastructure. It is also used in military and aerospace communications, radar systems, and test and measurement equipment. The wide frequency range and dual-channel capability make it a versatile choice for many RF designs.
When designing with the ADRV9002, careful attention must be paid to power supply decoupling and thermal management. The device requires a clean 3.3V supply and adequate grounding to achieve optimal performance. The exposed pad on the package should be soldered to a thermal via array to dissipate heat effectively.
ドロップイン代替品: ADRV9002BBCZ-REEL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ADRV9002BBCZ-REEL （同一形状・フットプリント） — 相違点: Frequency Range, Package, Interface, Supply Voltage, Type.
クイック比較ツール — 並列比較する代替部品を選択:
ADRV9002BBCZ
✓ 在庫あり
$210 / 個
データシートを見る →ADRV9004BBCZ
✓ 在庫あり
$90 / 個
データシートを見る →AD9371BBCZ
✓ 在庫あり
$147 / 個
データシートを見る →AD9361BBCZ
✓ 在庫あり
$62 / 個
データシートを見る →ADRV9001BBCZ
📋 参考代替品（カタログ未掲載）
ADRV9002BBCZ-REEL 仕様
| Type | TxRx Only |
| Frequency Range | 30 MHz ~ 6 GHz |
| Number of Channels | 2 Tx, 2 Rx |
| Power Output | 7.8 dBm |
| パッケージ | 196-TFBGA, CSPBGA |
| 実装タイプ | Surface Mount |
| 動作温度 | -40°C to +85°C |
| 電源電圧 | 3.3 V |
| Data Interface | SPI |
| Modulation | Narrow-band and wideband |
| RoHS ステータス | Compliant |
ADRV9002BBCZ-REEL ピン構成
| ピン A1 | GND — Ground |
| ピン A2 | TX1_P — Transmitter 1 positive output |
| ピン A3 | TX1_N — Transmitter 1 negative output |
| ピン B1 | VDD — Power supply |
| ピン B2 | TX2_P — Transmitter 2 positive output |
| ピン B3 | TX2_N — Transmitter 2 negative output |
| ピン C1 | RX1_P — Receiver 1 positive input |
| ピン C2 | RX1_N — Receiver 1 negative input |
| ピン C3 | RX2_P — Receiver 2 positive input |
| ピン D1 | RX2_N — Receiver 2 negative input |
| ピン D2 | SPI_CLK — SPI clock |
| ピン D3 | SPI_MOSI — SPI master out slave in |
主な用途
ADRV9002BBCZ-REEL の用途: 6 件s: 5G NR Base Stations, Software-Defined Radio (SDR), Military and Aerospace Communications, Test and Measurement Equipment, IoT Gateways and Edge Computing, Radar Systems.
5G NR Base Stations
The ADRV9002BBCZ-REEL is ideal for 5G NR base stations due to its wide frequency range (30 MHz to 6 GHz) and dual-channel architecture. It supports MIMO and carrier aggregation, enabling high data rates and reliable connectivity. The integrated synthesizers and DSP functions reduce external component count, simplifying design and lowering BOM cost. Its high linearity and dynamic range ensure excellent signal quality even in dense urban environments, making it a preferred choice for macro cells and small cells.
おすすめ
Software-Defined Radio (SDR)
The ADRV9002BBCZ-REEL is a perfect fit for SDR platforms because it covers a broad frequency range from 30 MHz to 6 GHz, allowing a single hardware design to support multiple communication standards. Its dual-channel capability enables simultaneous transmit and receive, essential for full-duplex SDR. The integrated DSP functions handle filtering and gain control, reducing the processing load on the FPGA. This makes it a versatile and cost-effective solution for military, amateur, and commercial SDR applications.
おすすめ
Military and Aerospace Communications
The ADRV9002BBCZ-REEL is well-suited for military and aerospace communications due to its wide frequency coverage and robust performance. It operates from 30 MHz to 6 GHz, covering HF, VHF, UHF, and microwave bands used in tactical radios and satellite communications. The dual-channel architecture supports frequency hopping and diversity reception, enhancing link reliability. Its high dynamic range and linearity ensure clear communication in contested electromagnetic environments, making it a trusted choice for defense applications.
おすすめ
Test and Measurement Equipment
The ADRV9002BBCZ-REEL is an excellent choice for test and measurement equipment such as spectrum analyzers, signal generators, and channel emulators. Its wide frequency range and dual-channel capability allow simultaneous signal generation and analysis. The integrated synthesizers provide low phase noise, essential for accurate measurements. The device's high linearity and dynamic range ensure precise signal reproduction, making it a valuable component for R&D and production test systems.
おすすめ
IoT Gateways and Edge Computing
The ADRV9002BBCZ-REEL is suitable for IoT gateways and edge computing devices that require multi-band, multi-standard connectivity. Its wide frequency range supports various IoT protocols such as LoRa, NB-IoT, and Wi-Fi. The dual-channel architecture enables simultaneous operation on different bands, improving network capacity. The integrated DSP functions reduce the need for external processing, lowering power consumption and cost. This makes it an ideal solution for smart city and industrial IoT applications.
おすすめ
Radar Systems
The ADRV9002BBCZ-REEL is well-suited for radar systems, including automotive radar, weather radar, and surveillance radar. Its wide frequency range and dual-channel capability support FMCW and pulse-Doppler radar architectures. The high linearity and dynamic range ensure accurate target detection and ranging. The integrated synthesizers provide stable frequency generation, essential for coherent radar processing. This makes it a reliable choice for both commercial and defense radar applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ADRV9002BBCZ-REEL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ADRV9002BBCZ | ADRV9004BBCZ | AD9371BBCZ |
|---|---|---|---|---|
| Package | 196-TFBGA, CSPBGA | 196-TFBGA, CSPBGA | 196-TFBGA, CSPBGA | 196-TFBGA, CSPBGA |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Frequency Range | 30 MHz ~ 6 GHz | 30 MHz ~ 6 GHz | 30 MHz ~ 6 GHz | 300 MHz ~ 6 GHz |
| Number of Channels | 2 Tx, 2 Rx | 2 Tx, 2 Rx | 4 Tx, 4 Rx | 2 Tx, 2 Rx |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
主な差別化要因
- Wide frequency range from 30 MHz to 6 GHz （vs AD9361BBCZ)
- Dual-channel architecture （vs AD9361BBCZ)
- Integrated DSP functions （vs AD9371BBCZ)
設計ノート
The ADRV9002BBCZ-REEL requires a clean 3.3V supply. Use low-dropout regulators (LDOs) with high PSRR to minimize noise. Place decoupling capacitors (100nF and 10uF) close to each power pin. For optimal performance, use a dedicated power plane and avoid sharing with digital circuitry.
The device can dissipate significant power, especially during transmit. Ensure adequate thermal management by soldering the exposed pad to a thermal via array and providing a copper pour on the PCB. The thermal resistance values are specified in the datasheet Table 15, based on JEDEC JESD51-12. For high-power operation, consider adding a heatsink or forced air cooling.
For RF performance, use controlled impedance traces for TX and RX lines. Keep RF traces short and shielded to minimize parasitic inductance and crosstalk. Follow the layout guidelines in the datasheet, including grounding and via placement. Use a 4-layer PCB with dedicated ground and power planes for best results.
コンプライアンス情報
RoHS compliant per distributor data. Other compliance info not specified in provided data.
