DSPIC33CH512MP206-E/MR - Dual-Core DSC, 512KB Flash | Microchip
部品番号: DSPIC33CH512MP206-E/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.45 | $9.45 |
| 10 | $8.62 | $86.20 |
| 100 | $7.78 | $778.00 |
| 500 | $7.1 | $3,550.00 |
| 1,000 | $6.55 | $6,550.00 |
DSPIC33CH512MP206-E/MR 概要
A Digital Signal Controller is a hybrid microcontroller/DSP class device — in taxonomy it sits between a microcontroller (MCU) and a digital signal processor (DSP), combining deterministic interrupt-driven control loops with hardware multiplier/accumulator-based signal processing. The dsPIC33CH sub-family extends this with a dual-core architecture that physically separates the application control plane (master) from the time-critical peripheral control plane (slave), giving embedded designers the benefits of two processors in one die without an external interconnect.
Key features include up to 8 DMA channels, high-resolution PWM (1 ns duty-cycle resolution when paired with the on-chip DAC), up to four 16-bit/24-bit timer/counters, four UART, three SPI, two I2C, and two CAN FD peripherals. Functional-safety (FuSa) diagnostic libraries, ECC on Flash and RAM, and a dedicated slave debugging port are also integrated. The AEC-Q100 grade-1 qualified variant operates from −40 °C to +125 °C.
Architecturally, the slave core owns the high-resolution PWM, ADCs and time-critical peripherals, offloading torque-loop or power-loop control in motor-control and digital-power applications; the master core runs the application state machine and communications stacks. The two cores communicate over a mailbox register scheme with deterministic latency.
Typical applications include sensorless field-oriented control (FOC) motor drives, on-board EV chargers and DC/DC converters, photovoltaic micro-inverters, audio Class-D amplifiers, and industrial drives requiring functional-safety diagnostics. The wide 3.0 V–3.6 V supply and 64-pin QFN footprint also suit compact high-density power modules.
Designers should allocate a 4-layer PCB stack with the exposed pad soldered to a continuous ground copper pour — a properly stitched EP keeps junction temperature well below the 150 °C limit under full peripheral load.
This page synthesizes distributor pricing, AEC-Q100 functional-safety trade-offs, and drop-in dsPIC33CH alternatives not found in the manufacturer datasheet, giving procurement and engineering teams a single decision-ready source.
ドロップイン代替品: DSPIC33CH512MP206-E/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33CH512MP206-E/MR （同一形状・フットプリント） — 相違点: Package, Core Architecture, Operating Temperature, Data RAM, Program Flash.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33CH512MP206-I/MR
✅ ドロップイン✓ 在庫あり
$3.96 / 個
データシートを見る →DSPIC33CH512MP506-E/MR
✅ ドロップイン✓ 在庫あり
$8.25 / 個
データシートを見る →DSPIC33CH512MP208-E/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33CH256MP206-E/MR
✅ ドロップイン✓ 在庫あり
$6.9 / 個
データシートを見る →DSPIC33CH128MP206-E/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33CH512MP206-E/MR 最大定格＆電気的特性
| Product Family | dsPIC33CH Dual-Core Digital Signal Controller |
| Master Core | 16-bit dsPIC33, 180 MHz (90 MIPS) |
| Slave Core | 16-bit dsPIC33, 200 MHz (100 MIPS) |
| Program Flash | 512 KB (584 KB max with PRAM region) |
| PRAM (Program RAM) | 64 KB |
| Data RAM | 16 KB |
| パッケージ | 64-pin QFN with Exposed Pad (9x9 mm) |
| Operating Voltage | 3.0 V to 3.6 V |
| 動作温度 | -40 °C to +125 °C (AEC-Q100 Grade 1) |
| High-Resolution PWM | Yes (up to 16 channels, 1 ns duty-cycle resolution) |
| DMA Channels | Up to 8 |
| CAN FD | 2 modules |
| UART / SPI / I2C | 4 UART / 3 SPI / 2 I2C |
| Functional Safety (FuSa) | Yes — diagnostic libraries included |
| AEC-Q100 | Grade 1 qualified (E suffix) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
DSPIC33CH512MP206-E/MR ピン構成
| ピン 1 | S1RP12/RP12 — Slave remappable peripheral I/O 12 (PWM/IC/OC) |
| ピン 2 | RP13 — Master remappable peripheral I/O 13 |
| ピン 3 | VDD — Digital supply (3.0–3.6 V) |
| ピン 4 | S1RP14/RP14 — Slave remappable peripheral I/O 14 |
| ピン 5 | RP15 — Master remappable peripheral I/O 15 |
| ピン 6 | VSS — Digital ground |
| ピン 7 | OSC1/CLKI — Crystal oscillator input / external clock |
| ピン 8 | OSC2/CLKO — Crystal oscillator output |
| ピン 9 | RP0 — Master remappable peripheral I/O 0 |
| ピン 10 | RP1 — Master remappable peripheral I/O 1 |
| ピン 11 | S1RP2/RP2 — Slave remappable peripheral I/O 2 |
| ピン 12 | RP3 — Master remappable peripheral I/O 3 |
| ピン 13 | S1RP4/RP4 — Slave remappable peripheral I/O 4 |
| ピン 14 | RP5 — Master remappable peripheral I/O 5 |
| ピン 15 | VSS — Digital ground |
| ピン 16 | VDD — Digital supply |
| ピン 17 | AN0/RA0 — Analog input 0 / Port A bit 0 |
| ピン 18 | AN1/RA1 — Analog input 1 / Port A bit 1 |
| ピン 19 | AN2/RA2 — Analog input 2 / Port A bit 2 |
| ピン 20 | AN3/RA3 — Analog input 3 / Port A bit 3 |
| ピン 21 | AVDD — Analog supply |
| ピン 22 | AVSS — Analog ground |
| ピン 23 | AN4/RA4 — Analog input 4 / Port A bit 4 |
| ピン 24 | AN5/RA5 — Analog input 5 / Port A bit 5 |
| ピン 25 | AN6/RA6 — Analog input 6 / Port A bit 6 |
| ピン 26 | AN7/RA7 — Analog input 7 / Port A bit 7 |
| ピン 27 | S1RP6/RP6 — Slave remappable peripheral I/O 6 |
| ピン 28 | S1RP7/RP7 — Slave remappable peripheral I/O 7 |
| ピン 29 | VDD — Digital supply |
| ピン 30 | VSS — Digital ground |
| ピン 31 | S1RP8/RP8 — Slave remappable peripheral I/O 8 |
| ピン 32 | RP9 — Master remappable peripheral I/O 9 |
| ピン 33 | S1RP10/RP10 — Slave remappable peripheral I/O 10 |
| ピン 34 | RP11 — Master remappable peripheral I/O 11 |
| ピン 35 | RB0 — Port B bit 0 |
| ピン 36 | RB1 — Port B bit 1 |
| ピン 37 | RB2 — Port B bit 2 |
| ピン 38 | RB3 — Port B bit 3 |
| ピン 39 | RB4 — Port B bit 4 |
| ピン 40 | RB5 — Port B bit 5 |
| ピン 41 | RB6 — Port B bit 6 |
| ピン 42 | RB7 — Port B bit 7 |
| ピン 43 | RB8 — Port B bit 8 |
| ピン 44 | RB9 — Port B bit 9 |
| ピン 45 | VDD — Digital supply |
| ピン 46 | VSS — Digital ground |
| ピン 47 | S1RP16/RP16 — Slave remappable peripheral I/O 16 |
| ピン 48 | S1RP17/RP17 — Slave remappable peripheral I/O 17 |
| ピン 49 | S1RP18/RP18 — Slave remappable peripheral I/O 18 |
| ピン 50 | S1RP19/RP19 — Slave remappable peripheral I/O 19 |
| ピン 51 | S1RP20/RP20 — Slave remappable peripheral I/O 20 |
| ピン 52 | S1RP21/RP21 — Slave remappable peripheral I/O 21 |
| ピン 53 | S1RP22/RP22 — Slave remappable peripheral I/O 22 |
| ピン 54 | S1RP23/RP23 — Slave remappable peripheral I/O 23 |
| ピン 55 | VDD — Digital supply |
| ピン 56 | VSS — Digital ground |
| ピン 57 | S1MCLR — Slave master clear (reset) input |
| ピン 58 | MCLR — Master master clear (reset) input |
| ピン 59 | RC0 — Port C bit 0 |
| ピン 60 | RC1 — Port C bit 1 |
| ピン 61 | RC2 — Port C bit 2 |
| ピン 62 | RC3 — Port C bit 3 |
| ピン 63 | RC4 — Port C bit 4 |
| ピン 64 | RC5 — Port C bit 5 |
主な用途
DSPIC33CH512MP206-E/MR の用途: 7 件s: Sensorless Field-Oriented Control (FOC) Motor Drive, On-Board EV Charger and DC/DC Converter, Photovoltaic Micro-Inverter, Class-D Audio Amplifier, Industrial Servo Drive, Welding Inverter and Plasma Cutter, Automotive BCM and Body Control Module.
Sensorless Field-Oriented Control (FOC) Motor Drive
The DSPIC33CH512MP206-E/MR is engineered for sensorless FOC of PMSM and BLDC motors. The 100 MIPS slave core executes the high-resolution PWM (1 ns duty-cycle resolution) and ADC sampling at fixed cycle time, while the 90 MIPS master core runs the communications stack (CAN FD, UART) and state machine. With 512 KB Flash the device fits motor-control firmware with safety libraries and torque-ripple compensation tables; the slave-core isolation guarantees deterministic interrupt latency for the torque loop, critical for sub-1 % speed ripple. The AEC-Q100 Grade-1 qualification supports under-hood deployment.
おすすめ
On-Board EV Charger and DC/DC Converter
On-board chargers and traction DC/DC converters benefit from the dual-core architecture: the slave core handles the digital-power control loop (peak-current-mode control at 100–500 kHz switching frequency) using the high-resolution PWM, while the master core manages the CAN FD communication with the vehicle BMS and runs the safety state machine. The 200 MHz slave core offers the headroom required for advanced control algorithms such as adaptive-gain peak current control and input-voltage feed-forward, reducing BOM cost by eliminating the analog controller.
おすすめ
Photovoltaic Micro-Inverter
The DSPIC33CH512MP206-E/MR drives single-phase photovoltaic micro-inverters (250 W to 600 W class) where the slave core executes MPPT and grid-synchronization control loops while the master core handles anti-islanding protection, grid-relay sequencing, and Modbus/CAN communication. The 512 KB Flash stores grid-code tables for multiple regional certifications (VDE-AR-N 4105, UL 1741, G98) without external EEPROM. AEC-Q100 Grade-1 qualification supports outdoor enclosures from −40 °C to +125 °C. The 64-pin QFN package keeps PCB area below 35x35 mm for module-integrated designs.
おすすめ
Class-D Audio Amplifier
Class-D amplifiers benefit from the DSPIC33CH512MP206-E/MR's dual-core isolation: the slave core generates the PWM audio output with 1 ns resolution, eliminating the need for an external audio DAC in mid-power (<100 W) designs, while the master core runs volume control, equalization and the I2S/UART input interface. The 64 KB PRAM supports DSP filter tables (biquad coefficients, compressor curves) updated at runtime. AEC-Q100 Grade-1 supports automotive head-unit and external amplifier modules operating in engine-bay-adjacent environments.
おすすめ
Industrial Servo Drive
Industrial servo drives use the DSPIC33CH512MP206-E/MR for closed-loop position control: the slave core generates the high-resolution PWM driving the 3-phase inverter and samples the encoder/multi-turn position feedback at fixed latency, while the master core runs the EtherCAT/Ethernet/IP communication and trajectory planner. Functional-safety libraries (IEC 61800-5-2 STO/SS1) are supported by the dual-core architecture with hardware ECC on Flash/RAM and BIST diagnostics. The 64-pin QFN exposed pad simplifies thermal design for continuous 6 A phase current.
おすすめ
Welding Inverter and Plasma Cutter
Welding inverters and plasma cutters rely on the DSPIC33CH512MP206-E/MR's slave core to execute arc-feedback control loops at microsecond latency while the master core manages the operator UI (TFT display, encoder) and safety interlocks. The 100 MIPS slave headroom accommodates adaptive algorithms such as synergic MIG control and stick-Wave dynamics. With 512 KB Flash the device stores welding process libraries (MIG/TIG/Stick) and supports in-field firmware updates via CAN/UART. The AEC-Q100 Grade-1 rating tolerates the high ambient temperature of welding cabinets.
おすすめ
Automotive BCM and Body Control Module
Body control modules benefit from the DSPIC33CH512MP206-E/MR's deterministic slave core for LIN/CAN FD body-network handling while the master core runs the BCM state machine (door locks, lighting, wipers). The 512 KB Flash stores the complete BCM feature set with functional-safety libraries. AEC-Q100 Grade-1 qualification supports under-dash thermal environments, and the 64-pin QFN footprint fits the BCM PCB area constraints.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33CH512MP206-E/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33CH512MP206-I/MR | DSPIC33CH512MP506-E/MR | DSPIC33CH512MP208-E/MR | DSPIC33CH256MP206-E/MR | DSPIC33CH128MP206-E/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) EP | 64-pin QFN (9x9 mm) EP - same | 64-pin QFN (9x9 mm) EP - same | 64-pin QFN (9x9 mm) EP - same | 64-pin QFN (9x9 mm) EP - same | 64-pin QFN (9x9 mm) EP - same |
| Master Core Speed | 180 MHz (90 MIPS) | 180 MHz (90 MIPS) | 180 MHz (90 MIPS) | 180 MHz (90 MIPS) | 180 MHz (90 MIPS) | 180 MHz (90 MIPS) |
| Slave Core Speed | 200 MHz (100 MIPS) | 200 MHz (100 MIPS) | 200 MHz (100 MIPS) | 200 MHz (100 MIPS) | 200 MHz (100 MIPS) | 200 MHz (100 MIPS) |
| Flash Memory | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 256 KB (-50%) | 128 KB (-75%) |
| PRAM | 64 KB | 64 KB | 32 KB (-50%) | 64 KB | 32 KB (-50%) | 16 KB (-75%) |
| Data RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| AEC-Q100 Grade | Grade 1 (-40 °C to +125 °C) | Industrial (-40 °C to +85 °C) | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
| Functional Safety (FuSa) | Yes — diagnostic libraries included | Yes — diagnostic libraries included | Yes | Yes | Yes | Yes |
| Approx. 1k Price (USD) | 6.55 | 5.95 | 6.10 | 6.85 | 5.80 | 5.20 |
主な差別化要因
- Largest Flash memory variant in the 64-pin dsPIC33CH MP206 family （vs DSPIC33CH512MP206-I/MR)
- Doubled Flash and PRAM vs MP506 variant for functional-safety firmware stacks （vs DSPIC33CH512MP506-E/MR)
- Deterministic slave-core isolation for time-critical control loops （vs DSPIC33CH256MP206-E/MR)
- AEC-Q100 Grade-1 qualification vs industrial-only DSPIC33CH128MP206-E/MR （vs DSPIC33CH128MP206-E/MR)
設計ノート
Estimated: the DSPIC33CH512MP206-E/MR at full peripheral load (180 MHz master + 200 MHz slave + all PWM active) dissipates approximately 0.6 W typical and up to 1.0 W peak. With a 64-pin QFN 9x9 mm exposed pad on a 4-layer PCB with 1 oz copper (θJA ≈ 25 °C/W with 6 thermal vias), the junction temperature rise is approximately 15 °C above ambient at 0.6 W — well within the 150 °C junction limit. For continuous 1.0 W operation the PCB exposed-pad copper area must be ≥ 100 mm² with at least 9 thermal vias to the internal ground plane. Do not use a 2-layer PCB for this QFN without a stitched thermal pour, or the device will exceed the 125 °C ambient AEC-Q100 limit.
Power decoupling requires a 10 µF + 1 µF + 100 nF capacitor stack per VDD pin pair. The AVDD supply must be decoupled with a 10 µF tantalum + 100 nF ceramic combination placed within 5 mm of the AVDD pin, with a ferrite bead separating AVDD from VDD to keep digital switching noise out of the ADC reference. Each slave-core VDD pin (the dsPIC33CH uses split rail for slave/masrer domains) needs its own 100 nF bypass. Per Microchip's family datasheet, neglecting the AVDD ferrite degrades ADC SNR by up to 6 dB.
The 64-pin QFN (9x9 mm) exposed pad must be soldered directly to a continuous ground copper pour on the top layer, stitched with 9 to 25 thermal vias (0.3 mm pitch) to the internal ground plane. Place all bypass capacitors on the top layer within 3 mm of their respective supply pins and route short traces to minimize inductance. The exposed-pad soldering is mandatory — partial soldering reduces thermal performance by 30–40 % and can cause the slave core thermal-monitoring diagnostics to false-trigger under load.
The slave core has dedicated S1MCLR, S1OSC1/S1OSC2 and S1RPx pins that must be routed with the same signal-integrity discipline as the master pins. The slave debug port (PGEC2/PGED2) requires a 4.7 kΩ pull-up on PGED2 to ensure reliable slave-core programming in noisy motor-drive environments. Per Microchip's dsPIC33CH programming manual, the slave core uses alternative S1MCLRx pins for debugging and may require an external pull-up to successfully access the slave during in-circuit serial programming (ICSP).
Common pitfalls with the DSPIC33CH512MP206-E/MR include: (1) failing to solder the exposed thermal pad, which causes overheating and slave-core thermal shutdowns; (2) using only the master core without configuring the slave core's IVT (interrupt vector table), which prevents the slave from booting; (3) leaving unused PWM pins floating rather than configuring them as outputs low to avoid shoot-through; (4) ignoring the FSEC register configuration which can permanently lock the device if Code-Protect bits are mis-set during initial programming.
コンプライアンス情報
AEC-Q100 Grade-1 qualified per Microchip product page. RoHS compliant. Halogen-free per Microchip material declaration. Conflict-minerals compliant per Microchip policy.
