DSPIC33CK512MP606-I/MR - 100MHz 512KB DSC CAN FD | Microchip
部品番号: DSPIC33CK512MP606-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.1 | $6.10 |
| 10 | $5.6 | $56.00 |
| 100 | $5.05 | $505.00 |
| 500 | $4.6 | $2,300.00 |
| 1,000 | $4.2 | $4,200.00 |
DSPIC33CK512MP606-I/MR 概要
A digital signal controller combines the deterministic control of a microcontroller with the mathematical throughput of a DSP. In the embedded systems hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP, providing single-cycle MAC (multiply-accumulate), barrel shifter, and DSP instruction support alongside rich peripherals. This makes DSCs the preferred choice for closed-loop control systems such as digital power conversion and field-oriented motor control.
Key features include CAN FD for automotive and industrial networking, integrated operational amplifiers that reduce external BOM cost for current-sense front ends, and 12-bit ADCs supporting high-speed sampled control loops. Eight DMA channels offload data movement from the core, and multiple internal bus architecture plus boundary-scan (JTAG) capability support advanced debugging. The dual-panel flash enables live firmware updates without stalling the executing program.
The dsPIC33CK core executes from flash with deterministic interrupt latency, and the enhanced PWM peripherals generate complementary outputs with dead-time insertion, essential for driving half-bridges and three-phase inverters. The 3V to 3.6V supply range and industrial -40C to +85C temperature rating suit harsh environments.
Typical applications include precision motor control (FOC for BLDC/PMSM), digital power supplies (LLC, totem-pole PFC), automotive CAN FD nodes, and industrial automation sensors.
Design consideration: the QFN exposed pad must be soldered to a grounded copper pour for thermal dissipation and signal integrity; apply 0.1uF decoupling at each VDD pin.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: DSPIC33CK512MP606-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33CK512MP606-I/MR （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Core, Core Architecture, Program Flash.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33CK128MP506-E/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.42 / 個
データシートを見る →DSPIC33CK32MP506-E/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.55 / 個
データシートを見る →DSPIC33CK128MC106-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.28 / 個
データシートを見る →DSPIC33CH512MP506-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.45 / 個
データシートを見る →DSPIC33CH512MP206-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.96 / 個
データシートを見る →DSPIC33CK512MP606-I/MR 最大定格＆電気的特性
| Core | dsPIC33C 16-bit DSC |
| 最大クロック周波数 | 100 MHz |
| Program Memory Size | 512 KB Flash (dual panel) |
| RAM Size | 64 KB |
| Supply Voltage Range | 3 V to 3.6 V |
| 動作温度 | -40C to +85C |
| パッケージ | 64-QFN with exposed pad (MR), 9x9 mm, 0.5 mm pitch |
| CAN Interface | CAN FD |
| ADC Resolution | 12-bit |
| Integrated Op-Amps | Yes |
| PWM Peripherals | Enhanced PWM |
| DMA Channels | 8 |
| Architecture Features | Barrel shifter, multiple internal bus, boundary scan |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Core Supply Type | Single |
DSPIC33CK512MP606-I/MR 64-qfn with exposed pad (mr), 9x9 mm, 0.5 mm pitch ピン配置ガイド
DSPIC33CK512MP606-I/MR (64-qfn with exposed pad (mr), 9x9 mm, 0.5 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33CK512MP606-I/MR.
詳細は データシート をご参照ください。
主な用途
DSPIC33CK512MP606-I/MR の用途: 6 件s: Precision Motor Control (FOC), Digital Power Supplies (LLC / Totem-Pole PFC), Automotive CAN FD Nodes, Industrial Automation and PLC I/O, Wireless / IoT Connected Control Nodes, Power Tools and E-Mobility Drives.
Precision Motor Control (FOC)
The DSPIC33CK512MP606-I/MR fits field-oriented control (FOC) of BLDC and PMSM motors because its 100 MHz 16-bit DSP core executes the Clarke/Park transforms and PI current loops with deterministic latency, while the 12-bit ADC samples phase currents synchronized to PWM events. The integrated op-amps amplify low-level shunt-resistor signals directly, eliminating external amplifiers and reducing BOM cost and offset error. Enhanced PWM peripherals generate complementary outputs with programmable dead-time insertion for three-phase inverter bridges. Placed as the main controller of a motor drive, the 512 KB dual-panel flash holds full FOC firmware plus field-weakening and MTPA algorithms, and the dual-panel architecture allows firmware field updates without stopping the running motor. Design consideration: synchronize ADC sampling to the PWM center to avoid switching noise in current measurements, and route shunt signals to the op-amp inputs as short Kelvin pairs.
おすすめ
Digital Power Supplies (LLC / Totem-Pole PFC)
The DSPIC33CK512MP606-I/MR suits digitally controlled power conversion such as LLC resonant converters and totem-pole PFC stages because its 100 MHz core closes voltage and current loops at hundreds of kHz with cycle-by-cycle control granularity. The high-resolution enhanced PWM adjusts phase and frequency with sub-nanosecond effective resolution, essential for ZVS control in LLC stages and for suppressing current distortion in totem-pole PFC. The 12-bit ADC provides fast feedback sampling, and 8 DMA channels stream data without core intervention. In a typical topology the DSC generates interleaved gate-drive signals, handles burst/skip modes at light load, and implements protection (OCP, OVP) in hardware-comparator paths. The dual-panel flash supports firmware upgrades on installed units. Trade-off: digital control adds firmware development effort versus fixed-function analog controllers, but yields programmable adaptivity across product variants.
おすすめ
Automotive CAN FD Nodes
The DSPIC33CK512MP606-I/MR serves as an intelligent CAN FD node in automotive and industrial networks. Its integrated CAN FD controller supports the higher data-phase bit rates of CAN FD (versus classical CAN's 500 kbps limit), enabling faster diagnostics and larger telemetry payloads. The industrial -40C to +85C temperature rating and 3V to 3.6V regulated supply match typical in-vehicle electronic control unit power architectures. The 512 KB flash accommodates full communication stacks plus application logic, while the 64 KB RAM buffers message objects and measurement logs. In a body-control or actuator node, the DSC's PWM and ADC peripherals drive loads and monitor sensors locally while the CAN FD interface reports to a gateway. Note that the standard -I grade part is not AEC-Q100 qualified; for automotive production programs, confirm qualification requirements or select the appropriate automotive-grade variant.
おすすめ
Industrial Automation and PLC I/O
The DSPIC33CK512MP606-I/MR fits industrial automation roles such as smart sensor heads, remote I/O modules, and small motion controllers. The 100 MHz DSP core processes filtering and FFT-based condition-monitoring algorithms locally, reducing traffic to the master controller. Its 12-bit ADCs digitize multiple sensor channels, integrated op-amps condition low-level signals, and 8 DMA channels maintain concurrent acquisition and communication without CPU stalls. The 512 KB flash stores protocol stacks (CAN, UART, SPI, I2C) plus application firmware with room for over-the-air updates via the dual-panel mechanism. The -40C to +85C rating covers panel and floor installations, and boundary-scan (JTAG) support aids production test. Use the exposed-pad QFN soldered to a solid ground plane for noise immunity in electrically noisy factory environments, with filtering on analog inputs near switching power electronics.
おすすめ
Wireless / IoT Connected Control Nodes
The DSPIC33CK512MP606-I/MR works well as the local-control processor in IoT devices that pair a dsPIC33CK DSC with an external wireless module over UART or SPI. The 100 MHz core runs the deterministic real-time control task (motor, power conversion, or sensing) while a radio module handles the protocol stack, and 8 DMA channels keep the serial links saturated without interrupt load. The 512 KB dual-panel flash is large enough to host remote firmware update staging, so the application can receive, verify, and swap images safely in the field - a key reliability feature for deployed IoT hardware. The 64 KB RAM buffers telemetry and OTA payloads. Because the DSC itself draws modest power at 3.3V, sleep and idle modes stretch battery budgets in duty-cycled sensor applications. Route the radio antenna away from the QFN ground pour's switching edges to protect RF sensitivity.
おすすめ
Power Tools and E-Mobility Drives
Cordless power tools, e-bikes, and light e-mobility platforms use the DSPIC33CK512MP606-I/MR as the traction/brushless motor controller. Field-oriented control on the 100 MHz core delivers high torque-per-amp efficiency that directly extends battery runtime, and the fast 12-bit ADC plus on-chip op-amps close the phase-current loop with minimal external components - important in cost- and space-constrained handheld products. Enhanced PWM with dead-time insertion safely drives three-phase bridges from lithium-pack voltages through external gate drivers, and hardware comparators implement cycle-by-cycle overcurrent protection independent of firmware latency. The -40C to +85C industrial rating covers cold starts and enclosed motor bays, while 512 KB flash holds efficiency maps, field weakening, and protection logs. The 64-QFN exposed pad conducts heat into the PCB, so allocate copper area near the controller in compact drive housings.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33CK512MP606-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33CK128MP506-E/MR | DSPIC33CK32MP506-E/MR | DSPIC33CK128MC106-I/MR | DSPIC33CH512MP506-I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (MR) 9x9 mm, exposed pad | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB | 128 KB | 32 KB | 128 KB | 512 KB |
| RAM | 64 KB | 32 KB | 16 KB | 32 KB | 64 KB |
| Max Clock Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz (master) |
| Core Architecture | Single-core dsPIC33C | Single-core dsPIC33C | Single-core dsPIC33C | Single-core dsPIC33C | Dual-core (master + slave) |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
主な差別化要因
- Largest flash in the 64-QFN pin-compatible family （vs DSPIC33CK128MP506-E/MR)
- Single-core deterministic control timing （vs DSPIC33CH512MP506-I/MR)
- Motor-control (MP) peripheral set with integrated op-amps （vs DSPIC33CK128MC106-I/MR)
設計ノート
The 64-QFN (MR) package has an exposed thermal pad that must be soldered to a PCB ground pour. Use a grid of thermal vias (e.g., 4x4 array, 0.3 mm drill) connecting the pad to internal ground planes to improve heat spreading and reduce ground bounce for the ADC references. Apply 0.1uF ceramic decoupling capacitors at every VDD pin pair, placed within 2 mm of the pin, plus bulk 10uF near the supply entry. Follow Microchip's QFN layout guidelines in the family reference manual for stencil aperture design on the center pad.
For motor-control or digital-power layouts, keep phase-current sense traces from shunt resistors to the integrated op-amp inputs as short, matched Kelvin connections routed away from PWM gate-drive nets. Synchronize ADC sampling to the PWM period (center-aligned trigger) using the peripheral trigger so that switching transients do not corrupt current measurements. Reserve a dedicated analog ground island under the ADC/op-amp pins if the board carries high dv/dt switching nodes.
Two frequent migration errors in the dsPIC33CK family: (1) assuming pin equivalence across suffixes - the /MR (64-QFN) and /PT (64-TQFP) variants of the same die have different land patterns and are NOT footprints interchangeable without PCB change; (2) overlooking that 'E'-temperature-suffix alternatives are rated to +125C while 'I' parts stop at +85C, which matters when substituting DSPIC33CK128MP506-E/MR for this I-grade part in hot enclosures. Also confirm peripheral parity (op-amps, CAN FD) on any alternative before committing firmware.
コンプライアンス情報
RoHS and lead-free status per standard Microchip volume production for this family. The -I (industrial) grade part is not marketed as AEC-Q100 qualified; consult Microchip for automotive-grade variants.
