DSPIC33EP128GP502-H/MM - 16-bit DSC 128KB Flash | Microchip
部品番号: DSPIC33EP128GP502-H/MM ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP128GP502-H/MM 概要
A digital signal controller combines the computational architecture of a microcontroller (MCU) with the arithmetic capabilities of a digital signal processor (DSP). Within the power-management hierarchy of embedded systems, the DSC occupies the space between general-purpose MCUs and dedicated DSP chips, offering deterministic interrupt latency, single-cycle MAC (multiply-accumulate) instructions, and tightly integrated analog peripherals on a single die.
Key features of this device include the dsPIC33E GP-series peripheral set: high-speed PWM modules for digital power conversion, integrated operational amplifiers, advanced analog functionality including a CTMU (Charge Time Measurement Unit), CAN 2.0B communication for automotive and industrial networks, and a Peripheral Trigger Generator (PTG) for hardware-autonomous task scheduling. The 128 KB self-programming Flash supports field firmware updates, while 16 KB of on-chip SRAM accommodates control-loop state variables and communication buffers.
Architecturally, the dsPIC33E core implements a modified Harvard pipeline with DSP-engine instructions and two address-generation units, enabling single-cycle MAC operations at full core speed. The GP502 variant balances performance and cost within a family that scales up to 512 KB Flash and 48 KB SRAM.
Typical applications include automotive body and powertrain auxiliary control, sensorless motor control (PMSM, BLDC, ACIM), digital power supplies (totem-pole PFC, LLC), and general-purpose industrial sensing with on-chip op-amp signal conditioning.
Design consideration: the -H suffix denotes the extended 125C temperature grade; verify junction temperature against package thermal resistance when running near maximum core speed in automotive ambient environments.
This page adds value beyond the manufacturer datasheet by synthesizing distributor listings, drop-in alternatives, and pricing-availability context in one place.
ドロップイン代替品: DSPIC33EP128GP502-H/MM — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP128GP502-H/MM （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Core, Lifecycle Status, Qualification.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP256GP502-H/MM
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.72 / 個
データシートを見る →DSPIC33EP64GP502-H/MM
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32GP502-H/MM
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP128GP502-I/MM
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.44 / 個
データシートを見る →DSPIC33EP128GP502-H/MM 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC33E DSC, RISC |
| Max Core Speed | 70 MIPS (family); 60 MHz operating per distributor listing |
| Flash Memory | 128 KB |
| SRAM | 16 KB |
| 電源電圧 | 3.3 V |
| パッケージ | 28-pin QFN-S (MM), exposed pad |
| 動作温度 | -40C to +125C (H grade) |
| Qualification | AEC-Q100 automotive |
| High-Speed PWM | Yes |
| On-chip Op Amps | Yes |
| Advanced Analog Peripherals | Yes (incl. CTMU) |
| CAN Interface | CAN 2.0B (per Microchip family description) |
| 実装タイプ | Surface Mount |
| Packaging | Tube |
| RoHS ステータス | Compliant, lead free |
| ライフサイクル状態 | In Production |
DSPIC33EP128GP502-H/MM 28-pin qfn-s (mm), exposed pad ピン配置ガイド
DSPIC33EP128GP502-H/MM (28-pin qfn-s (mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP128GP502-H/MM.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP128GP502-H/MM の用途: 6 件s: Automotive Body and Auxiliary Control, Sensorless Motor Control (BLDC/PMSM), Digital Power Conversion (PFC/LLC), Industrial Sensing and Signal Conditioning, Power Metering and Energy Monitoring, General-Purpose Embedded Control.
Automotive Body and Auxiliary Control
The DSPIC33EP128GP502-H/MM fits automotive auxiliary modules because its AEC-Q100 qualification and -40C to +125C H-grade temperature range are designed for the harsh environments found near engine bays and in lighting, pump, and actuator modules. The 28-pin QFN-S package saves board area in space-constrained modules, while 128 KB Flash holds protocol stacks and diagnostics. On-chip CAN 2.0B connects the module to the vehicle network without an external CAN controller, and the CTMU plus advanced analog peripherals handle capacitive touch and sensor interfaces directly. Place the exposed-pad QFN on a solid ground pour to conduct junction heat into the PCB, and verify current consumption of the 3.3 V rail against the module power budget when running at the full 60 MHz core speed.
おすすめ
Sensorless Motor Control (BLDC/PMSM)
For sensorless BLDC and PMSM drives, the DSPIC33EP128GP502-H/MM provides the high-speed PWM module that generates complementary, dead-time-controlled switching patterns, while the integrated op amps condition current-shunt signals without external amplifiers. The 16-bit DSP core executes field-oriented control (FOC) mathematics using single-cycle MAC instructions at up to 60 MHz, keeping loop frequencies in the tens of kilohertz with deterministic latency. 128 KB Flash accommodates a full FOC firmware stack with state machines, startup algorithms, and fault handling. The Peripheral Trigger Generator can chain ADC sampling to PWM events in hardware, minimizing software jitter. Use the exposed-pad QFN-S layout with generous ground copper to handle switching-noise return currents, and route current-sense traces differentially to the op-amp input pins for best noise immunity.
おすすめ
Digital Power Conversion (PFC/LLC)
Digital power supplies benefit from the DSPIC33EP128GP502-H/MM because its high-speed PWM supports high-resolution duty-cycle and phase control needed by totem-pole PFC and LLC topologies, and the on-chip analog peripherals close voltage and current loops without external controllers. The 70-MIPS-class DSP engine runs compensator equations each switching cycle, while the CTMU and 12-bit-class analog inputs support instrumentation functions. AEC-Q100 qualification also makes it viable in automotive onboard chargers and DC-DC converters where 125C ambient excursions occur. With 128 KB Flash, firmware can include soft-start, burst mode, fault logging, and PMBus-style communication. Keep the switching power ground separate from the analog ground at the exposed pad, and sample at PWM-synchronized points to avoid ripple aliasing in the control loop.
おすすめ
Industrial Sensing and Signal Conditioning
In industrial sensing nodes, the DSPIC33EP128GP502-H/MM integrates the signal chain: on-chip op amps amplify low-level sensor outputs, the advanced analog block and CTMU digitize or time-charge-measure them, and the 16-bit core applies filtering and linearization locally. This single-chip approach reduces BOM count versus an MCU plus external AFE. 128 KB Flash stores multi-sensor calibration tables and communication stacks, while 16 KB SRAM buffers waveform samples. CAN and serial links stream processed data to PLCs or gateways. The 125C H-grade supports sensors mounted inside enclosures near motors or drives. For best accuracy, calibrate gain and offset in firmware using the chip's internal reference and keep analog traces short and guarded around the op-amp pins; the QFN-S exposed pad should be tied to a quiet analog ground island.
おすすめ
Power Metering and Energy Monitoring
Power metering demands simultaneous voltage and current sampling with fast math for RMS, power factor, and harmonic analysis, all of which the DSPIC33EP128GP502-H/MM delivers: the ADC synchronized by the Peripheral Trigger Generator samples multiple channels deterministically, and the DSP engine computes accumulation-heavy metering formulas efficiently. The CTMU supports metrology-grade charge-time measurements for auxiliary sensors. 128 KB Flash holds calibration and tariffs, and the H-grade 125C rating suits meters mounted in outdoor cabinets or breaker panels. CAN or serial output forwards readings to utility networks. Design note: use the on-chip op amps for current-transformer burden conditioning and budget the 3.3 V rail carefully, since metering designs often run continuously; verify junction temperature at the worst-case sampling rate in the QFN-S package.
おすすめ
General-Purpose Embedded Control
As a general-purpose controller, the DSPIC33EP128GP502-H/MM offers a strong balance for products needing more compute than an 8-bit MCU but not a full application processor: remappable RPx pins let one 28-pin layout serve many product variants, 128 KB Flash provides headroom for feature growth, and 3.3 V operation matches modern logic levels. The 60 MHz core handles protocol bridging, closed-loop control, and HMI scanning concurrently, while timers and the PTG offload repetitive tasks from software. AEC-Q100 qualification means even consumer products get automotive-grade reliability margins. Tube packaging suits mid-volume assembly lines. When prototyping, note that ICSP programming requires a matched PGECx/PGEDx pair; allocate one pair to the programming header and keep the other pair free for runtime debugging access.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP128GP502-H/MM — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP256GP502-H/MM | DSPIC33EP64GP502-H/MM | DSPIC33EP32GP502-H/MM | DSPIC33EP128GP502-I/MM |
|---|---|---|---|---|---|
| Package | 28-pin QFN-S (MM) | 28-pin QFN-S - same | 28-pin QFN-S - same | 28-pin QFN-S - same | 28-pin QFN-S - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 256 KB | 64 KB | 32 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Core Speed | 60 MHz (70 MIPS family max) | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
| Operating Temperature | -40C to +125C (H grade) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| Automotive AEC-Q100 | Yes | Yes (H grade) | Yes (H grade) | Yes (H grade) | No (industrial grade) |
| Key Peripherals | Hi-Speed PWM, op amps, CAN, CTMU, PTG | Identical | Identical | Identical | Identical |
| RoHS / Lead Free | Compliant / Lead free | Compliant / Lead free | Compliant / Lead free | Compliant / Lead free | Compliant / Lead free |
主な差別化要因
- Extended 125C automotive temperature grade in a small QFN-S package （vs DSPIC33EP128GP502-I/MM)
- Upgradable Flash without PCB change （vs DSPIC33EP256GP502-H/MM)
- Balanced memory/cost point of the GP502 family （vs DSPIC33EP64GP502-H/MM)
設計ノート
The 28-pin QFN-S (MM) package has an exposed pad that must be soldered to a grounded PCB thermal pad. Use a 3x3 via array under the pad connected to the ground plane to improve heat transfer and reduce ground impedance for the high-speed PWM return currents. Place 0.1 uF ceramic decoupling capacitors within 2 mm of each VDD pin pair, and a 10 uF bulk capacitor near the supply entry. Keep the analog supply and reference routing away from PWM switching loops.
Estimated: the -H grade permits +125C ambient operation, but the practical limit is set by junction temperature. With no official theta_JA value in the verified data for this package, compute your own budget: TJ = TA + (P_core + P_IO) x theta_JA from the current Microchip datasheet thermal tables before running sustained 60 MHz operation in sealed automotive enclosures. Reduce core clock or duty cycle if the budget is exceeded.
dsPIC33E ICSP programming requires a matched PGECx/PGEDx pair: if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2, and mixed pairs will fail programming. All VSS and VDD pins must be connected even if the design could function without them. Also, the peripheral pin select (RPx) remapping means pin functions in old layouts may silently differ across firmware versions - verify the PPS configuration map at every firmware review.
コンプライアンス情報
Lead free / RoHS Compliant per BesenChips distributor record. AEC-Q100 automotive qualification per datasheets.com part description. REACH, halogen-free, and conflict-minerals status not stated in provided data.
