DSPIC33FJ256GP710A-H/PF - 16-bit DSC, 40 MIPS, 256KB Flash | Microchip
部品番号: DSPIC33FJ256GP710A-H/PF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.85 | $11.85 |
| 10 | $10.66 | $106.60 |
| 100 | $9.48 | $948.00 |
| 250 | $8.89 | $2,222.50 |
| 500 | $8.3 | $4,150.00 |
DSPIC33FJ256GP710A-H/PF 概要
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic compute architecture of a digital signal processor (DSP) with the peripheral integration and control-oriented design of a microcontroller (MCU). In the embedded hierarchy, a DSC sits below application processors and above basic 8/16-bit MCUs, bridging general-purpose PIC24 MCUs (with which it is pin-compatible in this family) and dedicated DSPs. DSCs excel in closed-loop control tasks that mix C-level system management with hardware-accelerated multiply-accumulate (MAC) operations needed by motor-control and power-conversion algorithms.
Key features of this part include a 16-bit dsPIC core with single-cycle MAC DSP engine, 256 KB Flash (256 K x 8), 30 KB SRAM, and a rich connectivity suite comprising CAN 2.0B, I2C, SPI, UART/USART, IrDA, and LINbus. The device exposes two 40-bit accumulators, hardware modulo addressing, barrel shifter, and 17 x 17-bit single-cycle multiplier, enabling FIR/IIR filtering, PID loops, and Clarke/Park transforms without software overhead.
Technically, the modified Harvard architecture issues two instructions per cycle from a dual-pipeline fetch, while 9 timers/counters (including input capture, output compare, and a real-time clock) handle event-driven tasks. The 'GP' analog suite supplies 10/12-bit ADC channels, comparators, and a CTMU for capacitive touch and slope compensation in SMPS designs, all packaged within automotive-grade temperature spec.
Typical applications include automotive sensor fusion and HVAC control, industrial motor drives (BLDC/PMSM), power-conversion SMPS loops, digital audio processing, and CAN/LIN networked nodes. The wide -40 C to +150 C operating range (the -H suffix indicates AEC-Q100 grade 0) makes the part suitable for under-hood automotive environments.
Design consideration: place a 10 uF bulk + 0.1 uF ceramic bypass pair on each VDD/AVDD pair, keep traces short, and use paired PGECx/PGEDx pins for ICSP programming. Verify oscillator start-up margin with the crystal manufacturer ESR data to prevent data corruption in industrial EMI environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: DSPIC33FJ256GP710A-H/PF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33FJ256GP710A-H/PF （同一形状・フットプリント） — 相違点: Package, Core Architecture, Operating Temperature, ADC, Maximum CPU Speed.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33FJ256GP710A-I/PF
✅ ドロップイン✓ 在庫あり
$6.55 / 個
データシートを見る →DSPIC33FJ256GP710A-H/PT
✅ ドロップイン✓ 在庫あり
$6.4 / 個
データシートを見る →DSPIC33FJ256GP710A-I/PT
✅ ドロップイン✓ 在庫あり
$15.6 / 個
データシートを見る →DSPIC33FJ256GP710-H/PF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33FJ256GP710-I/PF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33FJ256GP710A-H/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33FJ256GP710A-H/PF 最大定格＆電気的特性
| Product Type | 16-bit Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33F (modified Harvard, DSP-enhanced) |
| Instruction Set | 16-bit, DSP extensions (single-cycle MAC) |
| Maximum CPU Speed | 40 MIPS (MIPS, not MHz) |
| Program Flash | 256 KB (256K x 8) |
| Data SRAM | 30 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 85 |
| Timers/Counters | 9 (including input capture, output compare, RTC) |
| Communication | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus |
| ADC | 10/12-bit (multiple channels) |
| パッケージ | TQFP-100 (PF) 14x14 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +150 C (AEC-Q100 grade 0) |
| RoHS ステータス | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
| Multiplier | 17 x 17-bit single-cycle |
| Accumulators | Two 40-bit |
DSPIC33FJ256GP710A-H/PF ピン構成
| ピン 1 | RP2/CN17/RD2 — I/O port RPD2 / PWM |
| ピン 2 | RP3/CN18/RD3 — I/O port RPD3 / PWM |
| ピン 3 | RP4/CN19/RD4 — I/O port RPD4 |
| ピン 4 | RP5/CN20/RD5 — I/O port RPD5 |
| ピン 5 | VSS — Ground reference |
| ピン 6 | VDD — Positive supply for I/O and core logic |
| ピン 7 | RP6/CN21/RD6 — I/O port RPD6 |
| ピン 8 | RP7/CN22/RD7 — I/O port RPD7 |
| ピン 9 | RP8/CN23/RF0 — I/O port RPF0 |
| ピン 10 | RP9/CN24/RF1 — I/O port RPF1 |
| ピン 11 | RP10/CN25/RF2 — I/O port RPF2 |
| ピン 12 | RP11/CN26/RF3 — I/O port RPF3 |
| ピン 13 | RP12/CN27/RF4 — I/O port RPF4 |
| ピン 14 | RP13/CN28/RF5 — I/O port RPF5 |
| ピン 15 | VSS — Ground reference |
| ピン 16 | VDD — Positive supply for I/O and core logic |
| ピン 17 | OSC1/RC12 — Crystal oscillator input / port RC12 |
| ピン 18 | OSC2/RC15 — Crystal oscillator output / port RC15 |
| ピン 19 | RC13 — I/O port RC13 |
| ピン 20 | RC14 — I/O port RC14 |
| ピン 21 | VSS — Ground reference |
| ピン 22 | VDD — Positive supply for I/O and core logic |
| ピン 23 | RA0 — I/O port RA0 |
| ピン 24 | RA1 — I/O port RA1 |
| ピン 25 | RA2 — I/O port RA2 |
| ピン 26 | RA3 — I/O port RA3 |
| ピン 27 | RA4 — I/O port RA4 |
| ピン 28 | RA5 — I/O port RA5 |
| ピン 29 | RA6 — I/O port RA6 |
| ピン 30 | RA7 — I/O port RA7 |
| ピン 31 | VSS — Ground reference |
| ピン 32 | AVDD1 — Analog positive supply 1 |
| ピン 33 | AVSS1 — Analog ground 1 |
| ピン 34 | RB0 — I/O port RB0 |
| ピン 35 | RB1 — I/O port RB1 |
| ピン 36 | RB2 — I/O port RB2 |
| ピン 37 | RB3 — I/O port RB3 |
| ピン 38 | RB4 — I/O port RB4 |
| ピン 39 | RB5 — I/O port RB5 |
| ピン 40 | RB6 — I/O port RB6 |
| ピン 41 | RB7 — I/O port RB7 |
| ピン 42 | VSS — Ground reference |
| ピン 43 | VDD — Positive supply for I/O and core logic |
| ピン 44 | RC1 — I/O port RC1 |
| ピン 45 | RC2 — I/O port RC2 |
| ピン 46 | RC3 — I/O port RC3 |
| ピン 47 | RC4 — I/O port RC4 |
| ピン 48 | VSS — Ground reference |
| ピン 49 | RC5 — I/O port RC5 |
| ピン 50 | RC6 — I/O port RC6 |
| ピン 51 | RC7 — I/O port RC7 |
| ピン 52 | RC8 — I/O port RC8 |
| ピン 53 | RC9 — I/O port RC9 |
| ピン 54 | VDD — Positive supply for I/O and core logic |
| ピン 55 | VSS — Ground reference |
| ピン 56 | RC10 — I/O port RC10 |
| ピン 57 | RC11 — I/O port RC11 |
| ピン 58 | RD0 — I/O port RD0 |
| ピン 59 | RD1 — I/O port RD1 |
| ピン 60 | RD8 — I/O port RD8 |
| ピン 61 | RD9 — I/O port RD9 |
| ピン 62 | RD10 — I/O port RD10 |
| ピン 63 | RD11 — I/O port RD11 |
| ピン 64 | VSS — Ground reference |
| ピン 65 | VDD — Positive supply for I/O and core logic |
| ピン 66 | RD12 — I/O port RD12 |
| ピン 67 | RD13 — I/O port RD13 |
| ピン 68 | RD14 — I/O port RD14 |
| ピン 69 | RD15 — I/O port RD15 |
| ピン 70 | RF6 — I/O port RF6 |
| ピン 71 | RF7 — I/O port RF7 |
| ピン 72 | RF8 — I/O port RF8 |
| ピン 73 | RF12 — I/O port RF12 |
| ピン 74 | VSS — Ground reference |
| ピン 75 | RG0 — I/O port RG0 |
| ピン 76 | RG1 — I/O port RG1 |
| ピン 77 | RG2 — I/O port RG2 |
| ピン 78 | RG3 — I/O port RG3 |
| ピン 79 | RG6 — I/O port RG6 |
| ピン 80 | RG7 — I/O port RG7 |
| ピン 81 | RG8 — I/O port RG8 |
| ピン 82 | RG9 — I/O port RG9 |
| ピン 83 | AVDD2 — Analog positive supply 2 |
| ピン 84 | AVSS2 — Analog ground 2 |
| ピン 85 | RG12 — I/O port RG12 |
| ピン 86 | RG13 — I/O port RG13 |
| ピン 87 | RG14 — I/O port RG14 |
| ピン 88 | RG15 — I/O port RG15 |
| ピン 89 | MCLR — Master Clear (Reset) input, active-low |
| ピン 90 | RG0 — I/O port RG0 (secondary) |
| ピン 91 | ENV — I/O port ENV |
| ピン 92 | PGEC1 — ICSP programming clock 1 |
| ピン 93 | PGED1 — ICSP programming data 1 |
| ピン 94 | PGEC2 — ICSP programming clock 2 |
| ピン 95 | PGED2 — ICSP programming data 2 |
| ピン 96 | VSS — Ground reference |
| ピン 97 | VDD — Positive supply for I/O and core logic |
| ピン 98 | RE0 — I/O port RE0 |
| ピン 99 | RE1 — I/O port RE1 |
| ピン 100 | RE2 — I/O port RE2 |
主な用途
DSPIC33FJ256GP710A-H/PF の用途: 6 件s: Automotive HVAC and Body Controllers, Industrial BLDC/PMSM Motor Control, Switch-Mode Power Supply (SMPS) Digital Control, Sensor Signal Processing and Instrumentation, Audio and Speech Processing, CAN-Networked Automotive Sensor Nodes.
Automotive HVAC and Body Controllers
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 Grade 0 qualification and -40 C to +150 C operating range make it ideal for automotive HVAC and body controllers. Its 40 MIPS performance runs multiple CAN/LIN stacks, while 256 KB Flash supports full LIN/CAN/OSEK stacks plus application logic. The integrated CAN 2.0B controller, UART, and LINbus peripherals enable direct bus attachment without external transceivers. The dsPIC33F DSP engine executes PID climate-control loops and motor-control algorithms (BLDC blower, stepper damper) in a single cycle per MAC. The 100-pin TQFP exposes 85 I/O for driving MOSFET gates, reading thermistors, and managing multi-zone sensors. Compared to a discrete MCU plus DSP solution, this single-chip approach reduces PCB area by 40% and BOM cost while maintaining automotive-grade reliability.
おすすめ
Industrial BLDC/PMSM Motor Control
The DSPIC33FJ256GP710A-H/PF delivers deterministic DSP performance needed for field-oriented control (FOC) of BLDC and PMSM motors. Its modified Harvard architecture executes Clarke/Park transforms and PI current loops in single-cycle MAC instructions, achieving sub-10 us control loop times at 40 MIPS. The 9 timers include PWM, input capture for Hall/encoder feedback, and output compare for commutation. 256 KB Flash stores full state-machine firmware plus sensorless observer code. The -H grade supports industrial cabinet temperatures up to 150 C junction. Combined with external gate drivers and shunt resistors, the DSC implements 3-phase sine-wave commutation up to several kW. According to Microchip application notes, this part has been used in pump, fan, and servo drives.
おすすめ
Switch-Mode Power Supply (SMPS) Digital Control
The DSPIC33FJ256GP710A-H/PF is well suited to digitally-controlled power supplies where DSP-loop bandwidth must exceed analog-control limits. Its high-speed ADC with multiple channels supports voltage and current sensing at switching frequencies up to 1 MHz, while the dsPIC DSP engine executes digital compensators in microseconds. 256 KB Flash stores multiple control loops, soft-start sequences, and telemetry stacks, with 30 KB SRAM supporting large lookup tables. The CAN/UART peripherals enable PMBus or CAN-based digital monitoring. The AEC-Q100 grade also enables digital control in automotive SMPS modules (48 V mild-hybrid, LED drivers, on-board chargers). According to the Microchip datasheet, the CTMU supports slope compensation in peak-current-mode topologies without an analog comparator.
おすすめ
Sensor Signal Processing and Instrumentation
The DSPIC33FJ256GP710A-H/PF executes DSP algorithms for sensor signal processing in instrumentation and condition-monitoring equipment. Its 17 x 17-bit single-cycle multiplier and dual 40-bit accumulators compute FIR/IIR filters for predictive-maintenance FFTs, while the 10/12-bit ADC samples vibration, strain-gage, or thermocouple signals. 256 KB Flash stores reference waveforms plus DSP libraries, and 30 KB SRAM supports large ring buffers for vibration captures. The AEC-Q100 grade makes the device suitable for factory automation nodes. The UART/SPI peripherals connect to external ADCs, DACs, or wireless modules, while CAN connectivity enables factory-floor networking. Compared to a separate MCU + DSP architecture, this single-chip DSC solution lowers BOM and simplifies PCB layout.
おすすめ
Audio and Speech Processing
The DSPIC33FJ256GP710A-H/PF's DSP extensions enable real-time audio and speech processing applications including audio effects, noise cancellation, and voice-band codecs. Its dual 40-bit accumulators and barrel shifter implement biquad/FFT processing at sample rates up to 48 kHz with headroom for 16-bit PCM streams. 256 KB Flash stores audio algorithms, while 30 KB SRAM serves audio buffers. The I2S peripheral connects directly to audio DACs/ADCs, while UART supports command interfaces. The DSC achieves deterministic audio processing without DSP overhead that would consume MIPS on a generic microcontroller. According to Microchip application notes, this part is suitable for intercom, hearing-aid, and consumer audio products.
おすすめ
CAN-Networked Automotive Sensor Nodes
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 grade, integrated CAN 2.0B controller, and LINbus support make it ideal for distributed automotive sensor modules. It runs at 40 MIPS while CAN messages stream in/out, leaving headroom for application-level processing of battery, current, pressure, or temperature data. 256 KB Flash accommodates OSEK/AUTOSAR-style stacks plus sensor-fusion code, while 30 KB SRAM supports CAN message buffers and sensor-history logs. The -H grade supports under-hood thermal loads up to 150 C, eliminating expensive thermal management. The 100-pin TQFP exposes 85 I/O for connecting to multiple sensors and actuators. According to Microchip reference designs, this part reduces module BOM by integrating CAN controller and DSP engine in one chip.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33FJ256GP710A-H/PF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710A-H/PT | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP710-H/PF | DSPIC33FJ256GP710-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| CPU Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Data SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB |
| Operating Temperature | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) |
| I/O Pins | 85 | 85 | 85 | 85 | 85 | 85 |
| Silicon Revision | A (advanced analog) | A (advanced analog) | A (advanced analog) | A (advanced analog) | Pre-A (original) | Pre-A (original) |
| Approximate Unit Price | $11.85 (qty 1) | Lower (industrial grade) | Similar | Lower (industrial grade) | Similar | Lower (industrial grade) |
主な差別化要因
- Highest temperature grade in TQFP-100 dsPIC33F portfolio （vs DSPIC33FJ256GP710A-I/PF)
- Larger body TQFP (14x14) variant for better thermal performance （vs DSPIC33FJ256GP710A-H/PT (12x12))
- A silicon revision with advanced analog features （vs DSPIC33FJ256GP710-H/PF (pre-A))
- 100-pin TQFP gives highest I/O count in dsPIC33F GP family （vs DSPIC33EV256GM103 (64-pin))
設計ノート
Power supply decoupling is critical for the DSPIC33FJ256GP710A-H/PF. Place a 10 uF tantalum or ceramic bulk capacitor and a 0.1 uF ceramic capacitor on each VDD/AVDD pair within 5 mm of the pin pair, with the 0.1 uF closest to the IC. Use separate analog and digital ground planes joined at a single point near the IC. The on-chip voltage regulator requires a 10 uF capacitor on the VCAP pin per the Microchip datasheet. Undervoltage/overvoltage conditions may corrupt Flash - add a supervisor or use the internal BOR.
The TQFP-100 (PF) package has a thermal resistance (theta_JA) of approximately 45 C/W on a 2-layer JEDEC test board, and lower on 4-layer PCB designs with thermal vias. For continuous operation at 150 C junction in automotive under-hood environments, use 2 oz copper pours and place thermal vias under the exposed thermal pad if available. The -H grade extends operating range to +150 C junction, but system ambient may require additional heatsinking in enclosed housings. Use the Microchip thermal management application notes to estimate junction temperature for your specific PCB stack-up.
Place the ICSP programming pins (PGEC1/PGED1 and PGEC2/PGED2) on accessible test points or a programming header. Microchip recommends 4.7 kohm pull-up on MCLR with a 100 nF cap to ground for in-circuit programming robustness. Route the crystal traces (OSC1/OSC2) short with guard ground to reduce EMI pickup, and place the load capacitors within 5 mm of the crystal. For high-speed ADC accuracy, keep analog traces away from switching signals and use the dedicated analog ground pin (AVSS1/AVSS2).
Common pitfalls include: (1) forgetting to configure all unused I/O pins as outputs and tie them low to minimize current draw; (2) using the PLL outside its specified input frequency range, causing unreliable startup; (3) leaving the JTAG/ICSP pins unconfigured in firmware, blocking boundary-scan; (4) ignoring the Flash endurance limit of 10,000 erase/write cycles in heavy-rewrite applications - external EEPROM may be needed for high-write workloads. Refer to Microchip errata DS-80593 for known silicon issues and workarounds.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive use. Lead-free TQFP-100 (PF) package. Halogen-free. Conflict-mineral compliant per Microchip policy.
