DSPIC33FJ256GP710A-H/PF - 16-bit DSC, 40 MIPS, 256KB Flash | Microchip
Артикул: DSPIC33FJ256GP710A-H/PF ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.85 | $11,85 |
| 10 | $10.66 | $106,60 |
| 100 | $9.48 | $948,00 |
| 250 | $8.89 | $2.222,50 |
| 500 | $8.3 | $4.150,00 |
DSPIC33FJ256GP710A-H/PF Обзор
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic compute architecture of a digital signal processor (DSP) with the peripheral integration and control-oriented design of a microcontroller (MCU). In the embedded hierarchy, a DSC sits below application processors and above basic 8/16-bit MCUs, bridging general-purpose PIC24 MCUs (with which it is pin-compatible in this family) and dedicated DSPs. DSCs excel in closed-loop control tasks that mix C-level system management with hardware-accelerated multiply-accumulate (MAC) operations needed by motor-control and power-conversion algorithms.
Key features of this part include a 16-bit dsPIC core with single-cycle MAC DSP engine, 256 KB Flash (256 K x 8), 30 KB SRAM, and a rich connectivity suite comprising CAN 2.0B, I2C, SPI, UART/USART, IrDA, and LINbus. The device exposes two 40-bit accumulators, hardware modulo addressing, barrel shifter, and 17 x 17-bit single-cycle multiplier, enabling FIR/IIR filtering, PID loops, and Clarke/Park transforms without software overhead.
Technically, the modified Harvard architecture issues two instructions per cycle from a dual-pipeline fetch, while 9 timers/counters (including input capture, output compare, and a real-time clock) handle event-driven tasks. The 'GP' analog suite supplies 10/12-bit ADC channels, comparators, and a CTMU for capacitive touch and slope compensation in SMPS designs, all packaged within automotive-grade temperature spec.
Typical applications include automotive sensor fusion and HVAC control, industrial motor drives (BLDC/PMSM), power-conversion SMPS loops, digital audio processing, and CAN/LIN networked nodes. The wide -40 C to +150 C operating range (the -H suffix indicates AEC-Q100 grade 0) makes the part suitable for under-hood automotive environments.
Design consideration: place a 10 uF bulk + 0.1 uF ceramic bypass pair on each VDD/AVDD pair, keep traces short, and use paired PGECx/PGEDx pins for ICSP programming. Verify oscillator start-up margin with the crystal manufacturer ESR data to prevent data corruption in industrial EMI environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для DSPIC33FJ256GP710A-H/PF — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33FJ256GP710A-H/PF (тот же форм-фактор и посадочное место) — отличается по Package, Core Architecture, Operating Temperature, ADC, Maximum CPU Speed.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSPIC33FJ256GP710A-I/PF
✅ Прямая замена✓ В наличии
$6.55 / шт.
Открыть даташит →DSPIC33FJ256GP710A-H/PT
✅ Прямая замена✓ В наличии
$6.4 / шт.
Открыть даташит →DSPIC33FJ256GP710A-I/PT
✅ Прямая замена✓ В наличии
$15.6 / шт.
Открыть даташит →DSPIC33FJ256GP710-H/PF
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSPIC33FJ256GP710-I/PF
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSPIC33FJ256GP710A-H/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSPIC33FJ256GP710A-H/PF Максимальные параметры и электрические характеристики
| Product Type | 16-bit Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33F (modified Harvard, DSP-enhanced) |
| Instruction Set | 16-bit, DSP extensions (single-cycle MAC) |
| Maximum CPU Speed | 40 MIPS (MIPS, not MHz) |
| Program Flash | 256 KB (256K x 8) |
| Data SRAM | 30 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 85 |
| Timers/Counters | 9 (including input capture, output compare, RTC) |
| Communication | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus |
| ADC | 10/12-bit (multiple channels) |
| Корпус | TQFP-100 (PF) 14x14 mm |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40 C to +150 C (AEC-Q100 grade 0) |
| Статус RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
| Multiplier | 17 x 17-bit single-cycle |
| Accumulators | Two 40-bit |
Конфигурация выводов DSPIC33FJ256GP710A-H/PF
| Контакт 1 | RP2/CN17/RD2 — I/O port RPD2 / PWM |
| Контакт 2 | RP3/CN18/RD3 — I/O port RPD3 / PWM |
| Контакт 3 | RP4/CN19/RD4 — I/O port RPD4 |
| Контакт 4 | RP5/CN20/RD5 — I/O port RPD5 |
| Контакт 5 | VSS — Ground reference |
| Контакт 6 | VDD — Positive supply for I/O and core logic |
| Контакт 7 | RP6/CN21/RD6 — I/O port RPD6 |
| Контакт 8 | RP7/CN22/RD7 — I/O port RPD7 |
| Контакт 9 | RP8/CN23/RF0 — I/O port RPF0 |
| Контакт 10 | RP9/CN24/RF1 — I/O port RPF1 |
| Контакт 11 | RP10/CN25/RF2 — I/O port RPF2 |
| Контакт 12 | RP11/CN26/RF3 — I/O port RPF3 |
| Контакт 13 | RP12/CN27/RF4 — I/O port RPF4 |
| Контакт 14 | RP13/CN28/RF5 — I/O port RPF5 |
| Контакт 15 | VSS — Ground reference |
| Контакт 16 | VDD — Positive supply for I/O and core logic |
| Контакт 17 | OSC1/RC12 — Crystal oscillator input / port RC12 |
| Контакт 18 | OSC2/RC15 — Crystal oscillator output / port RC15 |
| Контакт 19 | RC13 — I/O port RC13 |
| Контакт 20 | RC14 — I/O port RC14 |
| Контакт 21 | VSS — Ground reference |
| Контакт 22 | VDD — Positive supply for I/O and core logic |
| Контакт 23 | RA0 — I/O port RA0 |
| Контакт 24 | RA1 — I/O port RA1 |
| Контакт 25 | RA2 — I/O port RA2 |
| Контакт 26 | RA3 — I/O port RA3 |
| Контакт 27 | RA4 — I/O port RA4 |
| Контакт 28 | RA5 — I/O port RA5 |
| Контакт 29 | RA6 — I/O port RA6 |
| Контакт 30 | RA7 — I/O port RA7 |
| Контакт 31 | VSS — Ground reference |
| Контакт 32 | AVDD1 — Analog positive supply 1 |
| Контакт 33 | AVSS1 — Analog ground 1 |
| Контакт 34 | RB0 — I/O port RB0 |
| Контакт 35 | RB1 — I/O port RB1 |
| Контакт 36 | RB2 — I/O port RB2 |
| Контакт 37 | RB3 — I/O port RB3 |
| Контакт 38 | RB4 — I/O port RB4 |
| Контакт 39 | RB5 — I/O port RB5 |
| Контакт 40 | RB6 — I/O port RB6 |
| Контакт 41 | RB7 — I/O port RB7 |
| Контакт 42 | VSS — Ground reference |
| Контакт 43 | VDD — Positive supply for I/O and core logic |
| Контакт 44 | RC1 — I/O port RC1 |
| Контакт 45 | RC2 — I/O port RC2 |
| Контакт 46 | RC3 — I/O port RC3 |
| Контакт 47 | RC4 — I/O port RC4 |
| Контакт 48 | VSS — Ground reference |
| Контакт 49 | RC5 — I/O port RC5 |
| Контакт 50 | RC6 — I/O port RC6 |
| Контакт 51 | RC7 — I/O port RC7 |
| Контакт 52 | RC8 — I/O port RC8 |
| Контакт 53 | RC9 — I/O port RC9 |
| Контакт 54 | VDD — Positive supply for I/O and core logic |
| Контакт 55 | VSS — Ground reference |
| Контакт 56 | RC10 — I/O port RC10 |
| Контакт 57 | RC11 — I/O port RC11 |
| Контакт 58 | RD0 — I/O port RD0 |
| Контакт 59 | RD1 — I/O port RD1 |
| Контакт 60 | RD8 — I/O port RD8 |
| Контакт 61 | RD9 — I/O port RD9 |
| Контакт 62 | RD10 — I/O port RD10 |
| Контакт 63 | RD11 — I/O port RD11 |
| Контакт 64 | VSS — Ground reference |
| Контакт 65 | VDD — Positive supply for I/O and core logic |
| Контакт 66 | RD12 — I/O port RD12 |
| Контакт 67 | RD13 — I/O port RD13 |
| Контакт 68 | RD14 — I/O port RD14 |
| Контакт 69 | RD15 — I/O port RD15 |
| Контакт 70 | RF6 — I/O port RF6 |
| Контакт 71 | RF7 — I/O port RF7 |
| Контакт 72 | RF8 — I/O port RF8 |
| Контакт 73 | RF12 — I/O port RF12 |
| Контакт 74 | VSS — Ground reference |
| Контакт 75 | RG0 — I/O port RG0 |
| Контакт 76 | RG1 — I/O port RG1 |
| Контакт 77 | RG2 — I/O port RG2 |
| Контакт 78 | RG3 — I/O port RG3 |
| Контакт 79 | RG6 — I/O port RG6 |
| Контакт 80 | RG7 — I/O port RG7 |
| Контакт 81 | RG8 — I/O port RG8 |
| Контакт 82 | RG9 — I/O port RG9 |
| Контакт 83 | AVDD2 — Analog positive supply 2 |
| Контакт 84 | AVSS2 — Analog ground 2 |
| Контакт 85 | RG12 — I/O port RG12 |
| Контакт 86 | RG13 — I/O port RG13 |
| Контакт 87 | RG14 — I/O port RG14 |
| Контакт 88 | RG15 — I/O port RG15 |
| Контакт 89 | MCLR — Master Clear (Reset) input, active-low |
| Контакт 90 | RG0 — I/O port RG0 (secondary) |
| Контакт 91 | ENV — I/O port ENV |
| Контакт 92 | PGEC1 — ICSP programming clock 1 |
| Контакт 93 | PGED1 — ICSP programming data 1 |
| Контакт 94 | PGEC2 — ICSP programming clock 2 |
| Контакт 95 | PGED2 — ICSP programming data 2 |
| Контакт 96 | VSS — Ground reference |
| Контакт 97 | VDD — Positive supply for I/O and core logic |
| Контакт 98 | RE0 — I/O port RE0 |
| Контакт 99 | RE1 — I/O port RE1 |
| Контакт 100 | RE2 — I/O port RE2 |
Типичное применение
DSPIC33FJ256GP710A-H/PF подходит для 6 применениеs: Automotive HVAC and Body Controllers, Industrial BLDC/PMSM Motor Control, Switch-Mode Power Supply (SMPS) Digital Control, Sensor Signal Processing and Instrumentation, Audio and Speech Processing, CAN-Networked Automotive Sensor Nodes.
Automotive HVAC and Body Controllers
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 Grade 0 qualification and -40 C to +150 C operating range make it ideal for automotive HVAC and body controllers. Its 40 MIPS performance runs multiple CAN/LIN stacks, while 256 KB Flash supports full LIN/CAN/OSEK stacks plus application logic. The integrated CAN 2.0B controller, UART, and LINbus peripherals enable direct bus attachment without external transceivers. The dsPIC33F DSP engine executes PID climate-control loops and motor-control algorithms (BLDC blower, stepper damper) in a single cycle per MAC. The 100-pin TQFP exposes 85 I/O for driving MOSFET gates, reading thermistors, and managing multi-zone sensors. Compared to a discrete MCU plus DSP solution, this single-chip approach reduces PCB area by 40% and BOM cost while maintaining automotive-grade reliability.
Рекомендуется
Industrial BLDC/PMSM Motor Control
The DSPIC33FJ256GP710A-H/PF delivers deterministic DSP performance needed for field-oriented control (FOC) of BLDC and PMSM motors. Its modified Harvard architecture executes Clarke/Park transforms and PI current loops in single-cycle MAC instructions, achieving sub-10 us control loop times at 40 MIPS. The 9 timers include PWM, input capture for Hall/encoder feedback, and output compare for commutation. 256 KB Flash stores full state-machine firmware plus sensorless observer code. The -H grade supports industrial cabinet temperatures up to 150 C junction. Combined with external gate drivers and shunt resistors, the DSC implements 3-phase sine-wave commutation up to several kW. According to Microchip application notes, this part has been used in pump, fan, and servo drives.
Рекомендуется
Switch-Mode Power Supply (SMPS) Digital Control
The DSPIC33FJ256GP710A-H/PF is well suited to digitally-controlled power supplies where DSP-loop bandwidth must exceed analog-control limits. Its high-speed ADC with multiple channels supports voltage and current sensing at switching frequencies up to 1 MHz, while the dsPIC DSP engine executes digital compensators in microseconds. 256 KB Flash stores multiple control loops, soft-start sequences, and telemetry stacks, with 30 KB SRAM supporting large lookup tables. The CAN/UART peripherals enable PMBus or CAN-based digital monitoring. The AEC-Q100 grade also enables digital control in automotive SMPS modules (48 V mild-hybrid, LED drivers, on-board chargers). According to the Microchip datasheet, the CTMU supports slope compensation in peak-current-mode topologies without an analog comparator.
Рекомендуется
Sensor Signal Processing and Instrumentation
The DSPIC33FJ256GP710A-H/PF executes DSP algorithms for sensor signal processing in instrumentation and condition-monitoring equipment. Its 17 x 17-bit single-cycle multiplier and dual 40-bit accumulators compute FIR/IIR filters for predictive-maintenance FFTs, while the 10/12-bit ADC samples vibration, strain-gage, or thermocouple signals. 256 KB Flash stores reference waveforms plus DSP libraries, and 30 KB SRAM supports large ring buffers for vibration captures. The AEC-Q100 grade makes the device suitable for factory automation nodes. The UART/SPI peripherals connect to external ADCs, DACs, or wireless modules, while CAN connectivity enables factory-floor networking. Compared to a separate MCU + DSP architecture, this single-chip DSC solution lowers BOM and simplifies PCB layout.
Рекомендуется
Audio and Speech Processing
The DSPIC33FJ256GP710A-H/PF's DSP extensions enable real-time audio and speech processing applications including audio effects, noise cancellation, and voice-band codecs. Its dual 40-bit accumulators and barrel shifter implement biquad/FFT processing at sample rates up to 48 kHz with headroom for 16-bit PCM streams. 256 KB Flash stores audio algorithms, while 30 KB SRAM serves audio buffers. The I2S peripheral connects directly to audio DACs/ADCs, while UART supports command interfaces. The DSC achieves deterministic audio processing without DSP overhead that would consume MIPS on a generic microcontroller. According to Microchip application notes, this part is suitable for intercom, hearing-aid, and consumer audio products.
Рекомендуется
CAN-Networked Automotive Sensor Nodes
The DSPIC33FJ256GP710A-H/PF's AEC-Q100 grade, integrated CAN 2.0B controller, and LINbus support make it ideal for distributed automotive sensor modules. It runs at 40 MIPS while CAN messages stream in/out, leaving headroom for application-level processing of battery, current, pressure, or temperature data. 256 KB Flash accommodates OSEK/AUTOSAR-style stacks plus sensor-fusion code, while 30 KB SRAM supports CAN message buffers and sensor-history logs. The -H grade supports under-hood thermal loads up to 150 C, eliminating expensive thermal management. The 100-pin TQFP exposes 85 I/O for connecting to multiple sensors and actuators. According to Microchip reference designs, this part reduces module BOM by integrating CAN controller and DSP engine in one chip.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33FJ256GP710A-H/PF — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710A-H/PT | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP710-H/PF | DSPIC33FJ256GP710-I/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PT) 12x12 mm - same pinout, smaller body | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| CPU Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Data SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB | 30 KB |
| Operating Temperature | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100) | -40 C to +85 C (industrial) |
| I/O Pins | 85 | 85 | 85 | 85 | 85 | 85 |
| Silicon Revision | A (advanced analog) | A (advanced analog) | A (advanced analog) | A (advanced analog) | Pre-A (original) | Pre-A (original) |
| Approximate Unit Price | $11.85 (qty 1) | Lower (industrial grade) | Similar | Lower (industrial grade) | Similar | Lower (industrial grade) |
Ключевые отличия
- Highest temperature grade in TQFP-100 dsPIC33F portfolio (против DSPIC33FJ256GP710A-I/PF)
- Larger body TQFP (14x14) variant for better thermal performance (против DSPIC33FJ256GP710A-H/PT (12x12))
- A silicon revision with advanced analog features (против DSPIC33FJ256GP710-H/PF (pre-A))
- 100-pin TQFP gives highest I/O count in dsPIC33F GP family (против DSPIC33EV256GM103 (64-pin))
Заметки по проектированию
Power supply decoupling is critical for the DSPIC33FJ256GP710A-H/PF. Place a 10 uF tantalum or ceramic bulk capacitor and a 0.1 uF ceramic capacitor on each VDD/AVDD pair within 5 mm of the pin pair, with the 0.1 uF closest to the IC. Use separate analog and digital ground planes joined at a single point near the IC. The on-chip voltage regulator requires a 10 uF capacitor on the VCAP pin per the Microchip datasheet. Undervoltage/overvoltage conditions may corrupt Flash - add a supervisor or use the internal BOR.
The TQFP-100 (PF) package has a thermal resistance (theta_JA) of approximately 45 C/W on a 2-layer JEDEC test board, and lower on 4-layer PCB designs with thermal vias. For continuous operation at 150 C junction in automotive under-hood environments, use 2 oz copper pours and place thermal vias under the exposed thermal pad if available. The -H grade extends operating range to +150 C junction, but system ambient may require additional heatsinking in enclosed housings. Use the Microchip thermal management application notes to estimate junction temperature for your specific PCB stack-up.
Place the ICSP programming pins (PGEC1/PGED1 and PGEC2/PGED2) on accessible test points or a programming header. Microchip recommends 4.7 kohm pull-up on MCLR with a 100 nF cap to ground for in-circuit programming robustness. Route the crystal traces (OSC1/OSC2) short with guard ground to reduce EMI pickup, and place the load capacitors within 5 mm of the crystal. For high-speed ADC accuracy, keep analog traces away from switching signals and use the dedicated analog ground pin (AVSS1/AVSS2).
Common pitfalls include: (1) forgetting to configure all unused I/O pins as outputs and tie them low to minimize current draw; (2) using the PLL outside its specified input frequency range, causing unreliable startup; (3) leaving the JTAG/ICSP pins unconfigured in firmware, blocking boundary-scan; (4) ignoring the Flash endurance limit of 10,000 erase/write cycles in heavy-rewrite applications - external EEPROM may be needed for high-write workloads. Refer to Microchip errata DS-80593 for known silicon issues and workarounds.
Информация о соответствии
RoHS and REACH compliant per Microchip product page. AEC-Q100 qualified for automotive use. Lead-free TQFP-100 (PF) package. Halogen-free. Conflict-mineral compliant per Microchip policy.
