EP1AGX50CF484C3 - 50K LE Arria GX FPGA, 484-BGA | Intel
부품 번호: EP1AGX50CF484C3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 25 | $245 | $6,125.00 |
| 50 | $232 | $11,600.00 |
| 100 | $218 | $21,800.00 |
EP1AGX50CF484C3 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit in the digital logic hierarchy alongside ASICs and CPLDs, offering hardware-level parallelism and post-fabrication reprogrammability. The Arria GX family specifically targets protocol-rich serial-interface applications bridging between Stratix-class performance and Cyclone-class cost.
Key features include 50,160 logic elements, 2,475,072 RAM bits (4,506 M4K memory blocks plus 252 M-RAM blocks), 12 full-duplex transceiver channels up to 3.125 Gbps supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and XAUI, and 232 user I/O pins. The device also integrates dedicated DSP blocks (variable-precision multipliers), phase-locked loops (PLLs), and 4 phase-rotated transceiver clock pins. The CF484 BGA package provides a compact footprint suitable for high-density PCB designs.
The architecture combines a 1.2V core supply (with 3.3V/2.5V I/O compatibility through banked supplies) with hardened PCIe hard IP and SERDES blocks. The C3 speed grade denotes a commercial temperature rating (0C to +85C) with a -3 speed bin. Compared with the C6 speed grade, C3 is faster but more expensive, and is the highest-performance commercial tier offered for this package.
Typical applications include PCI Express Gen1 endpoint and root-complex designs, XAUI / 10 GbE backplanes, Serial RapidIO bridges, broadcast video processing, and wireless baseband prototyping. The combination of transceiver density and moderate logic capacity suits mid-complexity protocol bridging cards.
When designing with this device, ensure the board provides clean transceiver analog supplies (VCCA_PLL, VCCA_TX, VCCA_RX) per the Arria GX hardware reference. Reference the Quartus II pin planner and the device pin-out file (PDF) to validate pin assignments against the chosen BGA fan-out, since 484-FBGA routing demands a 1.0 mm or 0.8 mm pitch PCB stack-up with microvia technology.
This page synthesizes authorized distributor pricing, drop-in alternatives within the same Arria GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing, replacement, and PCB implementation decisions.
드롭인 대체품: EP1AGX50CF484C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX50CF484C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory, RoHS Status, Logic Elements (LE).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX50CF484C6N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1AGX50CF484I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1AGX50CF484C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1AGX35CF484C6N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1AGX35CF484C6
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →EP1AGX50CF484C3 최대 정격 & 전기적 특성
| Family | Arria GX |
| Logic Elements | 50,160 |
| Total RAM Bits | 2,475,072 bits |
| M4K Memory Blocks | 4,506 |
| M-RAM Blocks | 252 |
| Transceiver Channels | 12 (up to 3.125 Gbps) |
| User I/O Pins | 232 |
| 패키지 | 484-ball FBGA (FineLine BGA) |
| Speed Grade | C3 (commercial, fastest) |
| 동작 온도 | 0C to +85C (commercial) |
| Core Voltage | 1.2 V |
| Configuration Method | Passive serial, Fast passive parallel, JTAG |
| RoHS 상태 | Compliant |
| Process Technology | 90 nm |
EP1AGX50CF484C3 484-ball fbga (fineline bga) 핀 구성 가이드
EP1AGX50CF484C3(484-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX50CF484C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX50CF484C3 적합 용도: 6 애플리케이션s: PCI Express Gen1 Endpoint Card, XAUI / 10 Gigabit Ethernet Bridge, Serial RapidIO Switch Fabric, Broadcast Video Processing Engine, Wireless Baseband Prototyping Platform, Industrial Protocol Bridge / Gateway.
PCI Express Gen1 Endpoint Card
The EP1AGX50CF484C3 is a classic mid-complexity PCI Express Gen1 endpoint solution for add-in cards and embedded host boards. Its 12 integrated 3.125 Gbps transceivers comfortably support x1/x4/x8 Gen1 links with 2.5 Gbps signaling, and the hardened PCIe hard IP block eliminates fabric logic for the PHY/MAC layers. The 50K logic elements are sufficient for a complete DMA engine plus application-layer payload. Designers should use the 484-FBGA package to route PCIe lanes on the top layers with reference-clock and PERST signals properly length-matched per the Arria GX hardware reference design.
추천
XAUI / 10 Gigabit Ethernet Bridge
The EP1AGX50CF484C3 fits well in 10 Gigabit Ethernet bridging and aggregation applications using XAUI (4 x 3.125 Gbps lanes) interfaces. With 12 transceivers, designers can implement two full XAUI ports plus a sideband management channel without fabric SERDES, leaving the 50K logic elements free for bridging logic, MAC framing, and forward-error correction. The 484-FBGA package with 232 user I/O pins exposes ample GPIO for PHY management interfaces, MDIO buses, and LEDs. Industrial-grade variant EP1AGX50CF484I7N extends operation to -40C to +100C for outdoor switch deployments.
추천
Serial RapidIO Switch Fabric
Serial RapidIO (SRIO) at 1.25/2.5/3.125 Gbps per lane is well-served by the EP1AGX50CF484C3, especially for DSP-cluster backplanes and baseband processing cards. The hardened SERDES blocks deliver deterministic low-latency RapidIO physical-layer performance, while the 50K logic elements and 2.4 Mbit embedded RAM are sufficient for a 4-port SRIO switch with non-blocking cut-through forwarding. The 484-FBGA package supports the high-speed SRIO lane routing required for signal integrity at 3.125 Gbps, with reference clocks sourced from dedicated transceiver clock pins.
추천
Broadcast Video Processing Engine
Broadcast video applications such as SDI (Serial Digital Interface) embedders, de-embedders, and format converters leverage the EP1AGX50CF484C3's transceiver density and fabric throughput. The 12 transceivers handle multiple SD/HD/3G-SDI streams at up to 2.97 Gbps, while the 50K logic elements implement pixel-domain processing, audio embedding, and ancillary data extraction. The 484-FBGA package exposes 232 user I/O pins for parallel video interfaces, GPIO for board control, and DDR2 memory controller pins. Designers should reference the Altera video reference design for SDI PHY implementation patterns.
추천
Wireless Baseband Prototyping Platform
The EP1AGX50CF484C3 is widely deployed as a wireless baseband prototyping platform for 3G/4G reference designs, CPRI/OBSAI fronthaul interfaces, and DSP algorithm development. Its 12 transceivers at 3.125 Gbps accommodate multiple CPRI links to remote radio heads, while the embedded DSP blocks accelerate chip-rate and symbol-rate processing. The 50K logic elements host complete PHY-layer implementations plus MAC prototypes. With the 484-FBGA package offering 232 user I/O pins, designers can interface to external ADCs/DACs, DDR2 memory, and backplane connectors without I/O contention.
추천
Industrial Protocol Bridge / Gateway
The EP1AGX50CF484C3 is suitable for industrial protocol bridge designs that convert between Ethernet, Serial RapidIO, CAN, Profibus, and other industrial protocols on a single board. With 12 transceivers supporting multiple Ethernet or RapidIO links simultaneously, plus 232 user I/O pins for CAN controllers, RS-485 transceivers, and GPIO, the device integrates bridge logic, protocol stack offload, and packet buffering on a single chip. The industrial-temperature variant EP1AGX50CF484I7N is preferred for harsh environments such as factory floors with extended temperature ranges from -40C to +100C.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX50CF484C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX50CF484C6N | EP1AGX50CF484I7N | EP1AGX35CF484C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 50,160 | 50,160 (same) | 50,160 (same) | 35,160 (-30%) |
| Total RAM Bits | 2,475,072 | 2,475,072 (same) | 2,475,072 (same) | 1,349,376 (-45%) |
| Transceiver Channels | 12 (3.125 Gbps) | 12 (3.125 Gbps) | 12 (3.125 Gbps) | 12 (3.125 Gbps) |
| User I/O Pins | 232 | 232 (same) | 232 (same) | 232 (same) |
| Speed Grade | C3 (fastest) | C6 (slower) | I7 (industrial temp, slower) | C6 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
주요 차별점
- Highest speed grade (C3) within the EP1AGX50 family (vs EP1AGX50CF484C6N)
- Commercial temperature range with full transceiver performance (vs EP1AGX50CF484I7N)
- Mid-density with full 12-transceiver count (vs EP1AGX35CF484C6N)
설계 노트
Estimated: The EP1AGX50CF484C3 has separate analog and digital supply rails. The 1.2V VCCINT (core) rail typically draws 800 mA to 1.5 A under full logic utilization; VCCA_PLL, VCCA_TX, and VCCA_RX each need isolated filtering from VCCINT to prevent PLL and SERDES jitter. Use a four-layer PCB with dedicated power planes, ferrite-bead-isolated analog supplies, and bulk + decoupling per the Arria GX hardware reference. Designers should budget 5-8W typical power consumption and provide thermal relief via thermal vias under the BGA thermal pad.
The 484-FBGA package uses a 1.0 mm ball pitch and requires multilayer PCB fabrication with microvia (laser-drilled) technology for breakout routing. Route all transceiver channels on the top layers with continuous ground reference and length-match within 0.127 mm per the Arria GX hardware reference. Maintain 100-ohm differential impedance for SERDES pairs and 50-ohm single-ended for clock signals. Place the configuration flash (EPCS16/EPCS64) within 2 cm of the FPGA DATA0/DCLK/ASDO/nCSO pins to avoid configuration timing failures.
Common pitfalls when designing with the EP1AGX50CF484C3 include: (1) failing to power-up VCCINT before VCCA_PLL - causes PLL lock failures and intermittent transceiver errors; (2) not terminating the REFCLK inputs with proper AC coupling - degrades SERDES jitter to the point of link failure at 3.125 Gbps; (3) using NRND lifecycle parts without securing last-time-buy inventory - leading to production line-down scenarios. Always validate bitstream generation in Quartus II v13.1 (final version with Arria GX support) before committing to production.
규정 준수 정보
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGA not intended for automotive functional safety). Lead-free (Pb-free) finish on C-grade and N-suffix parts. Conflict-mineral compliance maintained per Intel's supply chain policy.