EP1C12F324C8L - Cyclone FPGA 12,060 LEs FBGA-324 | Intel
部品番号: EP1C12F324C8L ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.4 | $23,400.00 |
EP1C12F324C8L 概要
What is a Cyclone FPGA? The Cyclone family is a low-cost SRAM-based FPGA line introduced by Altera (now part of Intel's Programmable Solutions Group) targeting high-volume, cost-sensitive applications. As a member of the broader programmable logic device (PLD) taxonomy, Cyclone devices sit between simple CPLDs and high-performance FPGAs like Stratix, offering a balance of logic density, embedded memory, and I/O bandwidth at a lower price point. The EP1C12 sits in the middle of the original Cyclone lineup, providing ample resources for glue logic, bus bridging, and moderate DSP workloads.
Key features of the EP1C12F324C8L include 12,060 logic elements, 239,616 bits of embedded RAM organized as M4K blocks, two PLL blocks for clock management, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The device operates from a 1.5 V core supply with separate VCCIO banks configurable to 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling flexible mixed-voltage interfacing.
Architecturally, the Cyclone FPGA uses a 4-input lookup table (LUT)-based logic element with embedded carry chains for efficient arithmetic, distributed and block RAM for on-chip storage, and a configurable interconnect fabric. The 1.0 mm pitch FBGA-324 package enables fine-pitch PCB assembly while maintaining signal integrity for moderate-speed designs.
Typical applications include industrial control and glue logic, telecommunication line cards, video processing pipelines, and embedded computing platforms. The low-power variant is well-suited for portable test equipment and fanless industrial designs where thermal dissipation is constrained.
When designing with this device, ensure proper decoupling on all VCC and VCCIO rails and follow Intel's PCB layout guidelines for FineLine BGA packages. Configuration via JTAG or active serial (AS) modes requires an external configuration device or download cable, depending on system requirements.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving procurement and engineering teams a single reference for evaluation.
ドロップイン代替品: EP1C12F324C8L — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1C12F324C8L （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP1C12F324C8N
✅ ドロップイン✓ 在庫あり
$51.75 / 個
データシートを見る →EP1C12F324C7N
✅ ドロップイン✓ 在庫あり
$37.2 / 個
データシートを見る →EP1C12F324C6N
✅ ドロップイン✓ 在庫あり
$22.1 / 個
データシートを見る →EP1C12F324C8
✅ ドロップイン✓ 在庫あり
$21.5 / 個
データシートを見る →EP1C12F324C7
✅ ドロップイン✓ 在庫あり
$40.26 / 個
データシートを見る →EP1C12F324C6AA
✅ ドロップイン✓ 在庫あり
$36.9 / 個
データシートを見る →EP1C12F324C8L 最大定格＆電気的特性
| Family | Cyclone |
| Logic Elements | 12,060 |
| Embedded RAM Bits | 239,616 |
| M4K RAM Blocks | 52 |
| User I/O Pins | 249 |
| PLLs | 2 |
| パッケージ | FBGA-324 |
| Package Body Size | 19 x 19 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | 8 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | CMOS, 130 nm |
| 動作温度 | 0C to +85C (commercial) |
| Power Variant | Low-power (L suffix) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount (BGA) |
EP1C12F324C8L 19 x 19 mm ピン配置ガイド
EP1C12F324C8L (19 x 19 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1C12F324C8L.
詳細は データシート をご参照ください。
主な用途
EP1C12F324C8L の用途: 6 件s: Industrial Control & Glue Logic, Telecommunication Line Cards, Video Processing Pipelines, Embedded Computing Platforms, Portable Test & Measurement, Automotive Infotainment & Driver Assistance.
Industrial Control & Glue Logic
The EP1C12F324C8L's 12,060 logic elements and 249 user I/O pins make it well-suited for industrial control platforms requiring extensive glue-logic integration. Placed between microcontrollers and peripheral buses (SPI, I2C, parallel data paths), the device absorbs timing mismatches and protocol-bridging tasks that would otherwise require multiple discrete CPLDs. The 1.5 V-3.3 V VCCIO banks allow direct interfacing with 3.3 V industrial sensors and 1.8 V ARM Cortex processors without external level shifters. The 'L' suffix low-power variant reduces core current by ~30% compared to the standard EP1C12F324C8N, enabling fanless operation in sealed control cabinets. Design tip: instantiate two PLL outputs to generate independent clocks for motor-control PWM and communication UARTs.
おすすめ
Telecommunication Line Cards
Telecommunication line cards leverage the EP1C12F324C8L's 52 M4K RAM blocks (239,616 bits) for packet buffering and lookup-table storage. The two on-chip PLLs synthesize the precise clock frequencies required for T1/E1, HDSL, and Ethernet PHY interfaces, while 249 user I/Os route parallel data buses to backplane connectors. The Cyclone fabric can implement channelized framing, HDLC controllers, and ATM segmentation-and-reassembly engines. Its commercial temperature range (0C to +85C) suits central-office equipment with controlled cooling. Compared with ASIC alternatives, the EP1C12F324C8L offers field-programmable flexibility for late-stage protocol updates during carrier qualification cycles.
おすすめ
Video Processing Pipelines
The EP1C12F324C8L implements video-format conversion and scaling pipelines in mid-range broadcast and surveillance systems. The 12,060 LEs execute line-buffer management, deinterlacing algorithms, and on-screen-display compositing, while M4K blocks serve as pixel FIFOs between clock domains. LVDS I/O support enables direct interfacing with Camera Link or FlatLink serializers without external transceivers. Designers typically pair the EP1C12 with an external SDRAM frame buffer via the FPGA's I/O banks. The FBGA-324 footprint provides ample routing channels for parallel video buses (16-24 bit RGB) while keeping the BOM cost below equivalent DSP + memory solutions.
おすすめ
Embedded Computing Platforms
Embedded SBCs (single-board computers) and custom compute modules often use the EP1C12F324C8L as a peripheral-expansion controller alongside a host CPU. The FPGA's 249 I/Os are mapped to expansion headers exposing GPIO, PWM, quadrature encoder, and high-speed parallel interfaces. With two PLLs, the device generates the clock trees required by SD card controllers, LCD panels, and external ADC/DAC peripherals. The 'L' low-power variant is favored in battery-powered portable test equipment where quiescent current matters. Compared with discrete 74-series logic implementations, the EP1C12 integrates weeks of design rework into a single programmable device.
おすすめ
Portable Test & Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters employ the EP1C12F324C8L for sample-rate conversion, trigger logic, and display driving. The 52 M4K blocks provide deep capture buffers while the 12,060 LEs implement FIR filters and statistical accumulators. The low-power 'L' variant extends battery life by ~25-30% compared with the standard-power EP1C12F324C8N, critical for field-service instruments. JTAG-based configuration via download cable allows iterative firmware updates during calibration development. Designers can route LVDS pairs directly to high-speed ADC front-ends, eliminating an external deserializer stage.
おすすめ
Automotive Infotainment & Driver Assistance
Mid-tier automotive infotainment head units and rear-seat entertainment systems use the EP1C12F324C8L to bridge LVDS display panels with the application processor. The device's 12,060 LEs drive touch-screen controllers, audio CODEC interfaces, and CAN/LIN bus bridges. For driver-assistance rear-view camera modules, the FPGA composites overlay graphics onto the live video stream and handles frame-rate conversion between the camera and the head-unit display. The -40C to +125C automotive grade is not available on the EP1C12 series; for true automotive applications designers migrate to Cyclone III or Cyclone IV Auto families.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1C12F324C8L — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1C12F324C8N | EP1C12F324C7N | EP1C12F324C6N | EP1C12F324C8 | EP1C12F324C7 | EP1C12F324C6AA |
|---|---|---|---|---|---|---|---|
| Package | FBGA-324 | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Speed Grade | 8 (slowest) | 8 | 7 (faster) | 6 (fastest) | 8 | 7 (faster) | 6 (fastest) |
| Power Variant | Low-power (L) | Standard | Standard | Standard | Standard | Standard | Standard + extended grade |
| Lead-Free Finish | L suffix (low-power, may be SnPb) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No | No | Yes |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | Extended grade |
| Embedded RAM | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits |
| User I/O | 249 | 249 | 249 | 249 | 249 | 249 | 249 |
| Approx. Unit Price (USD) | $38.50 | $36.00 | $48.00 | $58.00 | $34.00 | $45.00 | $72.00 |
主な差別化要因
- Low-power Cyclone variant in FBGA-324 （vs EP1C12F324C8N)
- Faster internal logic timing closure （vs EP1C12F324C8N)
- Lead-free finish for RoHS programs （vs EP1C12F324C8)
設計ノート
The EP1C12F324C8L is a low-power variant, but at 12,060 LEs with 100% utilization and 100 MHz internal clocks, core dissipation can still reach 0.8-1.2 W. The FBGA-324 package has a theta_JA of approximately 18-22 C/W on a standard JEDEC 4-layer test board with no airflow. Estimated: at 1 W dissipation the junction temperature rises 18-22C above ambient. For sealed enclosures without airflow, design a copper pour under the BGA thermal balls and consider 100-200 LFM forced-air cooling if sustained utilization exceeds 80%.
The FBGA-324 with 1.0 mm pitch requires 4-6 layer PCB stackup with controlled-impedance routing for LVDS pairs. Use 0.8 mm microvia stack-ups (laser-drilled) for inner-row BGA fan-out; 0.4 mm via-in-pad with copper fill is acceptable for high-density designs. Estimated: each LVDS pair should be routed with 100 ohm differential impedance and length-matched within 0.5 mm. Reference Intel AN-315 (Cyclone Hardware Design Guidelines) for via-pattern recommendations and decoupling placement.
Do not confuse 'L' (low-power) with 'I' (industrial temperature) in the ordering code. The EP1C12F324C8L is commercial 0C to +85C low-power; the industrial equivalent is EP1C12F324I8N. Also note that the C8 speed grade is the slowest Cyclone bin - if your design has aggressive Fmax targets (>150 MHz internal logic), select C7 or C6 speed grades instead. Configuration mode (JTAG vs Active Serial vs Passive Serial) must be selected via MSEL pins before power-up; mis-setting MSEL causes configuration failure.
Place decoupling capacitors on the bottom side of the PCB directly under the BGA with via-in-pad connections to the VCCINT and VCCIO planes. Use one 0.1 uF X7R per VCC pin and one 10 uF bulk capacitor per voltage rail. Keep PLL analog supply pins (VCC_PLL) isolated with a pi-filter (ferrite bead + 10 uF + 0.1 uF) to minimize jitter; this is the most common Cyclone layout pitfall and the dominant source of PLL lock failures.
コンプライアンス情報
RoHS compliance assumed for 'N' suffix variants; the 'L' low-power C8L variant finish type was not explicitly stated in the verified data. Reach, halogen-free, and conflict-mineral status were not available in the retrieved web data; refer to the manufacturer's declaration letter for confirmation.
