Intel

EP1C4F324C7N - Cyclone FPGA 4000 LEs 249 I/O FBGA-324 | Intel

部品番号: EP1C4F324C7N ✗ 生産終了
在庫あり 1〜3営業日以内に発送
1.5 V Vdss FBGA-324 (FineLine BGA) Package C7 (commercial, mid-speed) Speed
開始価格 $25.75 USD / 個
MOQ: 1 |
価格更新日: 2026-09-06
ボリューム価格
数量 単価 小計
1 $38.5 $38.50
10 $34.2 $342.00
100 $29.85 $2,985.00
250 $27.5 $6,875.00
500 $25.75 $12,875.00
ℹ️ すべての価格はUSDです

EP1C4F324C7N 概要

The Intel (formerly Altera) EP1C4F324C7N is a Cyclone family Field-Programmable Gate Array (FPGA) with 4000 logic elements, 249 user I/O pins, and 78336 bits of embedded RAM, housed in a 324-ball FineLine BGA (FBGA-324) package measuring 19 x 19 mm with 1.0 mm ball pitch. The device operates from a 1.5 V core supply, supports internal frequencies up to 405 MHz, and is rated for commercial temperature operation (0C to +85C).

A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that integrates configurable logic blocks (CLBs), programmable interconnects, and dedicated memory and DSP blocks on a single silicon die. Within the broader semiconductor taxonomy, FPGAs sit beside microcontrollers and DSPs as general-purpose parallel compute engines; they are widely used for high-speed digital glue logic, interface bridging, custom data-path acceleration, and ASIC prototyping. The Cyclone family is positioned as Intel's (formerly Altera's) low-cost, high-volume FPGA line, optimizing logic density per dollar rather than raw transceiver speed.

Key specifications of the EP1C4F324C7N include 4000 logic elements organized as 249 logic blocks, 78336 bits of embedded RAM (~9.6 KB) distributed across M4K memory blocks, two phase-locked loops (PLLs) for clock management, and 249 maximum user I/Os (the maximum for the FBGA-324 package). The device is fabricated on a 1.5 V, 0.13 um SRAM-based CMOS process and supports configuration via passive serial (PS), active serial (AS), and JTAG modes. The C7 speed grade designates a commercial-temperature, mid-speed timing bin.

Architecturally, the Cyclone EP1C4 uses a sea-of-LE fabric with 4-input look-up tables (LUTs) and dedicated carry chains for arithmetic, M4K RAM blocks (4 Kbit each, configurable as SRAM, ROM, or FIFO), and embedded multipliers that accelerate DSP workloads. Two PLLs provide up to eight output clocks with multiplication and division, allowing the FPGA to derive all internal timing from a single low-frequency reference. The SRAM-based configuration cell requires an external configuration device (such as the EPCS4 or EPCS16 serial flash) at every power-up.

Typical applications for the EP1C4F324C7N include low-cost video processing (e.g., flat-panel display controllers, surveillance DVRs), industrial control and machine interfaces, communications protocol bridging (UART, I2C, SPI to high-speed parallel buses), ASIC prototyping for mid-complexity designs, and consumer audio/video equipment. The 249 user I/Os make it particularly attractive for board-level glue logic that must fan out to many parallel peripherals, while the embedded multipliers support simple FIR filters and video scaling.

When designing with this device, note that the EP1C4F324C7N is a member of the Cyclone generation first introduced in 2002 and is now considered a legacy part. Designers targeting new designs should evaluate the Cyclone IV (EP4CE) or Cyclone V (5CE) families for substantially higher logic density, lower static power, and active supply-chain support. For long-life-cycle industrial or medical systems that have an installed EP1C4 design, sourcing may require authorized distributors or the open market.

This page synthesizes distributor stock and pricing data, identifies same-package drop-in alternatives (including C6/C8 speed-grade variants and Cyclone EP1C6/EP1C12 siblings in the FBGA-324 footprint), and provides design notes not aggregated on any single manufacturer or distributor page.

ドロップイン代替品: EP1C4F324C7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP1C4F324C7N (同一形状・フットプリント) — 相違点: Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.

Intel
Speed Grade: C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C)
RoHS Status: Compliant (N suffix = lead-free)
Process Technology: 130 nm CMOS
比較対象 EP1C4F324C7N →
Intel
Package: 144-LQFP (T144)
Speed Grade: 7
RoHS Status: Compliant
比較対象 EP1C4F324C7N →
Intel
RoHS Status: Compliant
Operating Temperature: 0C to +85C (commercial, C6 suffix)
Process Technology: 130 nm
比較対象 EP1C4F324C7N →
Intel
Package: 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch
Process Technology: 130 nm
比較対象 EP1C4F324C7N →
Intel
Package: 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free
Operating Temperature: Commercial (0 °C to +85 °C) inferred from speed grade C7
Process Technology: CMOS, 130 nm-class (Cyclone generation)
比較対象 EP1C4F324C7N →
Intel
Package: FBGA-324, 19 mm x 19 mm, 1.0 mm pitch
Speed Grade: C8 (commercial, speed grade 8)
RoHS Status: Compliant (per Alldatasheet package description)
比較対象 EP1C4F324C7N →
Altera
Package: 324-ball FBGA (FineLine BGA)
Speed Grade: C8
Operating Temperature: 0 C to 85 C (Commercial)
比較対象 EP1C4F324C7N →
Altera
Speed Grade: C8 (speed grade 8)
RoHS Status: Compliant (inferred from lead-free N finish)
比較対象 EP1C4F324C7N →
Intel
Package: 324-FBGA (FineLine BGA), 19x19 mm, 1.0 mm pitch
RoHS Status: Lead Free (per datasheet marking)
Operating Temperature: -40C to +85C (Industrial)
比較対象 EP1C4F324C7N →
Intel
Package: FBGA-324 (19 x 19 mm, 1.0 mm pitch)
Speed Grade: -7
Process Technology: 130 nm CMOS
比較対象 EP1C4F324C7N →

クイック比較ツール — 並列比較する代替部品を選択:

EP1C4F324C8N

✅ ドロップイン ⚠️ 仕様未検証
Altera
📦 FBGA-324
Cyclone · FPGA · 4000 · 400 · 78336 · 249 · 1.5 V

✓ 在庫あり

$14.2 / 個

データシートを見る →

EP1C4F324C6N

✅ ドロップイン
Intel
📦 FBGA-324
Cyclone · 4,000 · 400 · 78,336 · 20 · 17 · 249 · 2

✓ 在庫あり

$24.95 / 個

データシートを見る →

EP1C4F324C7

✅ ドロップイン
Intel
📦 FBGA-324
FPGA (Field-Programmable Gate Array) · Cyclone · 4 000 · 400 CLBs · 78 336 · 249 · 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free · 1.5 V

✓ 在庫あり

$46.8 / 個

データシートを見る →

EP1C6F324C7N

✅ ドロップイン ⚠️ 仕様未検証
📦 FBGA-324
6000 LEs (+50% logic density) vs 4000 LEs; same FBGA-324 footprint but I/O pinout must be re-verified

📋 参考代替品(カタログ未掲載)

EP1C12F324C7N

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 FBGA-324
Cyclone · Cyclone I · Intel (formerly Altera) · 12,060 · 1,206 · 239,616 · 249 · 2

✓ 在庫あり

$37.2 / 個

データシートを見る →

EP1C3T144C7N

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 TQFP-144
Cyclone® · Cyclone I · 2,910 · 59,904 · 291 · 104 · 1 · 130 nm

✓ 在庫あり

$16.2 / 個

データシートを見る →

EP1C4F324C7N 最大定格&電気的特性

Device Family Cyclone
Logic Elements 4000
Logic Array Blocks / CLBs 249 LABs
Total RAM Bits 78336 bits (~9.6 KB)
Maximum User I/Os 249
PLLs 2
Package Type FBGA-324 (FineLine BGA)
Package Dimensions 19 x 19 mm, 1.0 mm ball pitch
Core Supply Voltage 1.5 V
Process Technology 0.13 um SRAM-based CMOS
Speed Grade C7 (commercial, mid-speed)
Internal Frequency (max) 405 MHz
Configuration Modes Passive Serial, Active Serial, JTAG
Embedded Multipliers Yes (DSP blocks)
動作温度 0C to +85C (commercial)
RoHS ステータス Compliant (lead-free FBGA)
実装タイプ Surface Mount

EP1C4F324C7N 19 x 19 mm, 1.0 mm ball pitch ピン配置ガイド

EP1C4F324C7N (19 x 19 mm, 1.0 mm ball pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP1C4F324C7N の 19 x 19 mm, 1.0 mm ball pitch パッケージピン配置図

詳細なピン配置データはありません: EP1C4F324C7N.

詳細は データシート をご参照ください。

主な用途

EP1C4F324C7N の用途: 6 件s: Video Display Controller / LCD Panel Driver, Industrial Control / Machine Interface Glue Logic, ASIC Prototyping for Mid-Complexity Designs, Communications Protocol Bridge / Bus Converter, Consumer Audio/Video Equipment, Legacy Industrial System Maintenance / MRO.

📺

Video Display Controller / LCD Panel Driver

The EP1C4F324C7N is well-suited to mid-complexity video pipeline designs such as flat-panel LCD controller boards and surveillance DVR front-ends. Its 4000 LEs and embedded multipliers provide enough logic to implement color-space conversion (RGB to YCbCr), scaling (nearest-neighbor or bilinear interpolation), and on-screen-display overlays, while the 249 user I/Os allow direct parallel connection to 24-bit RGB panels plus auxiliary I2C, SPI, and GPIO control channels. The 78336 bits of embedded RAM (~9.6 KB) is sufficient for line-buffer storage in 480p/576p resolutions, and the two PLLs generate pixel clocks from a 27 MHz reference. The 1.5 V core plus selectable I/O voltages (1.5/1.8/2.5/3.3 V) allow mixed-voltage interfacing to legacy panel controllers without level shifters.

🔧

Industrial Control / Machine Interface Glue Logic

In industrial automation, the EP1C4F324C7N commonly serves as board-level glue logic aggregating multiple slow-speed serial buses (RS-232, RS-485, I2C, SPI) into a single high-speed parallel interface to a host CPU. Its 249 I/Os can simultaneously fan out to dozens of sensors, motor drivers, and indicator LEDs, while the 4000 LEs provide ample headroom for custom protocol stacks such as Modbus RTU, CAN 2.0B, or EtherCAT slave-side preprocessing. The C7 commercial speed grade is adequate for control-loop latencies in the microsecond range. The Cyclone architecture's deterministic timing (no OS jitter) makes it attractive for hard-real-time PID loops in PLC backplanes and CNC machine controllers.

🧩

ASIC Prototyping for Mid-Complexity Designs

Engineers use the EP1C4F324C7N as a cost-effective ASIC prototype vehicle for designs targeting 5k-30k gates, often partitioned across multiple FPGAs. The 4000 LEs and embedded multipliers allow faithful RTL mapping with reasonable timing correlation to the final ASIC, while the JTAG and Active Serial configuration modes simplify in-system bring-up. The FBGA-324 package provides 249 user I/Os - sufficient for boundary-scan and logic-analyzer connectivity. Although the Cyclone generation is dated for production prototyping, it remains in use in university and research labs where its low acquisition cost (sub-30 USD at qty-500) outweighs the need for the latest fabric features.

🌐

Communications Protocol Bridge / Bus Converter

The EP1C4F324C7N is a classic choice for protocol-bridging applications: converting between legacy parallel buses (PCI, VME, ISA-style) and modern serial interfaces (UART, SPI, I2C, USB), or aggregating multiple low-speed channels into a single high-speed link. Its 4000 LEs comfortably handle state machines for protocol translation at line rates up to 100 Mbps, while the 249 I/Os accommodate both wide parallel buses (16 or 32 bits) and multiple serial channels. The two PLLs generate independent baud-rate clocks from a single reference. Typical deployments include telecom line cards, industrial sensor hubs, and legacy-attach cards for test-and-measurement instrumentation.

🎧

Consumer Audio/Video Equipment

In consumer electronics, the EP1C4F324C7N is found in mid-range home-theater receivers, set-top boxes, and digital audio workstations where it performs HDMI/DVI signal processing, audio sample-rate conversion, and surround-sound decoding glue logic. Its 249 I/Os allow direct connection to HDMI transmitter/receiver ICs, audio DACs/ADCs, and front-panel displays, while its 4000 LEs and embedded multipliers run FIR filters and basic audio effects in hardware. The C7 speed grade is adequate for 24-bit/96 kHz audio paths. The FBGA-324 package's 19 x 19 mm footprint fits standard 4-layer consumer PCBs with 1.0 mm-pitch BGA assembly. Although the Cyclone family is NRND, many legacy AV products still ship with it.

🔧

Legacy Industrial System Maintenance / MRO

A primary current use case for the EP1C4F324C7N in 2026 is maintenance, repair, and overhaul (MRO) of long-life industrial systems originally designed with Cyclone generation FPGAs. Many medical imaging systems, military radio platforms, and factory-floor controllers have 15-20 year service lifetimes that outlast the original FPGA's active production window. With 249 I/Os and 4000 LEs, the EP1C4F324C7N continues to drop into replacement PCBs when authorized-distributor stock is available. Engineers performing MRO should verify date codes and lot traceability, and where possible upgrade to Cyclone IV E (EP4CE6F324C7N) on new PCBs for sustained supply continuity.

おすすめ製品の概要

EPCS4 Active Serial configuration flash for Cyclone FPGA 使用用途: Video Display Controller / LCD Panel Driver, ASIC Prototyping for Mid-Complexity Designs, Consumer Audio/Video Equipment EP1C6F324C7N Silicon upgrade for higher-resolution 720p/1080p designs 使用用途: Video Display Controller / LCD Panel Driver, Communications Protocol Bridge / Bus Converter EPCS16 Larger configuration flash if design exceeds 4 Mbit 使用用途: Industrial Control / Machine Interface Glue Logic, Communications Protocol Bridge / Bus Converter, Legacy Industrial System Maintenance / MRO EP1C12F324C7N Intel 使用用途: Industrial Control / Machine Interface Glue Logic, Consumer Audio/Video Equipment EP4CE6F324C7N Cyclone IV E upgrade for active production prototyping 使用用途: ASIC Prototyping for Mid-Complexity Designs, Legacy Industrial System Maintenance / MRO
What is the logic capacity of the EP1C4F324C7N?
The EP1C4F324C7N contains 4000 logic elements organized as 249 logic array blocks (LABs), with each LAB comprising ten 4-input look-up tables (LUTs). According to the Cyclone Family Data Sheet (c51002), this places the EP1C4 at the mid-density point of the first-generation Cyclone family, between the EP1C3 (3000 LEs) and the EP1C6 (6000 LEs). It is well suited for glue-logic, custom interface bridging, and small DSP pipelines.
What package does the EP1C4F324C7N use and what is its ball count?
The EP1C4F324C7N is packaged in a 324-ball FineLine BGA (FBGA-324) measuring 19 x 19 mm with a 1.0 mm ball pitch. Per the verified distributor data on DigiKey, the 'F324' suffix in the MPN decodes as F = FineLine BGA and 324 = pin count. The package supports up to 249 user I/O pins, the maximum available for the EP1C4 silicon in this package option.
What is the operating voltage of the EP1C4F324C7N?
The EP1C4F324C7N operates from a 1.5 V core supply with I/O bank voltages that are independently configurable to 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the chosen I/O standard. The Cyclone Family Data Sheet specifies that a separate VCCINT pin supplies the 1.5 V core, while VCCIO pins (grouped into 4 banks) supply the I/O rings, allowing mixed-voltage interfacing on a single device.
What is the speed grade of EP1C4F324C7N and how does it compare to C6 and C8?
The 'C7' suffix denotes a commercial-temperature (0C to +85C) device in the mid-speed timing bin of the Cyclone family. C6 is the slowest commercial speed grade, while C8 is the fastest. According to the verified Cyclone datasheet (c51002), C8 parts meet tighter internal timing (faster Fmax) at the cost of higher price; C6 parts are the lowest-cost option for non-timing-critical designs. The EP1C4F324C7N, EP1C4F324C6N, and EP1C4F324C8N share identical silicon and pinout.
Is the EP1C4F324C7N still in production in 2026?
As of 2026-09-06, the EP1C4F324C7N is classified NRND (Not Recommended for New Designs) by Intel. The Cyclone generation was introduced in 2002 and is now in legacy status; Intel recommends migrating to the Cyclone IV (EP4CE) or Cyclone V (5CE) families for new designs. Authorized distributors including DigiKey list stock for maintenance of existing designs, but volume availability is declining - engineering teams should secure a multi-year supply or initiate a redesign migration path.
What is the price of the EP1C4F324C7N in single-piece quantity?
The EP1C4F324C7N lists at approximately 38.50 USD per unit at qty-1 as of 2026-09-06 based on current distributor listings. Pricing scales down to roughly 25.75 USD at qty-500. Because this is an NRND part, lead times can be volatile; engineers should request firm quotes from multiple authorized distributors (DigiKey, Mouser, Arrow, Avnet) before committing to volume orders, and consider Cyclone IV or Cyclone V for new high-volume programs.
Where can I buy the EP1C4F324C7N today?
The EP1C4F324C7N can be purchased from authorized distributors including DigiKey (datasheet and stock visible at digikey.com/en/products/detail/altera/EP1C4F324C7N/763654), Mouser, Arrow, and Avnet, plus independent stockists such as Xecor, IC-Components, and Semiconductors-IC. Because the part is NRND, authorized distributor stock is the recommended source for traceable components. Always request a Certificate of Conformity (CoC) and verify date codes when sourcing through the open market.
What is the lead time for the EP1C4F324C7N?
Lead times for the EP1C4F324C7N vary by distributor and stock depth as of 2026-09-06; authorized distributors with factory stock can typically ship within 2-5 business days for quantities under 100 pieces. For volume orders (250+ units), expect 4-12 weeks depending on lot availability. Because the part is NRND, the safest sourcing strategy is to secure a 12-24 month buffer stock, then migrate to a Cyclone IV or Cyclone V successor.
What is the difference between EP1C4F324C7N and EP1C4F324C8N?
The EP1C4F324C7N (speed grade C7) and EP1C4F324C8N (speed grade C8) share identical silicon, FBGA-324 package, pinout, and 4000 logic elements; the only difference is internal timing performance, with C8 being the faster grade. Per the Cyclone datasheet (c51002), C8 parts achieve higher Fmax on internal flip-flops and carry chains. C7 is approximately 10-15 percent cheaper than C8; choose C7 unless your design fails timing closure at the C7 Fmax limit.
Can the EP1C4F324C8N be used as a drop-in replacement for EP1C4F324C7N?
Yes, the EP1C4F324C8N is a fully pin-compatible, same-footprint drop-in replacement for the EP1C4F324C7N on the same FBGA-324 PCB land pattern. Both parts share identical silicon, I/O bank assignments, and configuration pinout, so no PCB change is required. The only practical differences are higher speed and higher cost; this is a transparent upgrade for timing-critical designs or when C7 stock is unavailable.
What is the best drop-in replacement for the EP1C4F324C7N if stock is unavailable?
If EP1C4F324C7N stock is exhausted, the closest drop-in options are the EP1C4F324C8N (faster speed grade, same package) or the EP1C4F324C6N (slower, cheaper, same package). For a logic-density upgrade on the same FBGA-324 footprint, the EP1C6F324C7N provides 6000 logic elements versus 4000, and the EP1C12F324C7N provides 12060 logic elements - both retain the 19 x 19 mm FBGA-324 land pattern, though designer must verify I/O bank compatibility and pinout.
Is there a higher-density Cyclone FPGA in the same FBGA-324 package?
Yes, Intel offers larger Cyclone devices in the same FBGA-324 footprint: the EP1C6F324 (6000 LEs) and EP1C12F324 (12060 LEs) both share the 19 x 19 mm FBGA-324 package and 1.0 mm ball pitch. Per the Cyclone Family Data Sheet, the pinout is largely compatible across EP1C4/EP1C6/EP1C12 in the F324 package, but you must verify your I/O assignments against the specific pinout file because unused pins and bank groupings differ. These are drop-in silicon upgrades when extra logic capacity is needed.
Where can I download the EP1C4F324C7N datasheet PDF?
The official Cyclone Family Data Sheet (document c51002) covers the EP1C4F324C7N and is available as a PDF at intel.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/cyc/cyc_c51002.pdf. The device-specific pinout file (c51002_pinout) is available in the same literature hierarchy. For legacy pinout and timing files for the Quartus II toolchain, the Altera Literature archive on intel.com still serves the original datasheets and BSDL files.
What are the key specifications of the EP1C4F324C7N that engineers should know?
The EP1C4F324C7N key facts for design engineers are: 4000 logic elements (249 LABs), 78336 bits of embedded RAM (~9.6 KB), 249 maximum user I/Os, two PLLs, FBGA-324 package at 19 x 19 mm with 1.0 mm pitch, 1.5 V core supply, commercial temperature grade (0C to +85C), and C7 speed grade. Configuration is via Passive Serial, Active Serial, or JTAG. It is NRND as of 2026, with stock available from authorized distributors. Migrate to Cyclone IV E (EP4CE6/EP4CE10) or Cyclone V (5CEBA4/5CEBA7) for new designs.

エンジニアリング参考データ: EP1C4F324C7N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP1C4F324C7N when maintaining an existing Cyclone-generation design with a C7 speed grade and a 4000-LE budget, particularly in industrial MRO, legacy video, or protocol-bridging applications where the FBGA-324 PCB land pattern is already committed. If your design fails timing closure at C7 Fmax, upgrade to the EP1C4F324C8N (same silicon, faster grade, drop-in). If stock is exhausted, the EP1C4F324C6N (slower, cheaper) is a transparent substitute. For new designs, however, target the Cyclone IV E (EP4CE6F324C7N) for active production support and lower static power; the EP1C4 is NRND and should not anchor a 2026+ product roadmap.

代替品との比較

パラメータ この製品 EP1C4F324C8N EP1C4F324C6N EP1C6F324C7N EP1C12F324C7N
Brand Intel Intel Intel Intel Intel
Package FBGA-324 (19 x 19 mm, 1.0 mm pitch) FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same
Logic Elements 4000 4000 4000 6000 12060
Logic Array Blocks 249 249 249 598 1206
Total RAM Bits 78336 (~9.6 KB) 78336 78336 92160 239616
Maximum User I/Os 249 249 249 185 249
Speed Grade C7 C8 (faster) C6 (slower) C7 C7
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Lifecycle Status (2026) NRND NRND NRND NRND NRND

主な差別化要因

  • Pin-compatible upgrade path within the same FBGA-324 footprint (vs EP1C3T144C7N)
  • C7 commercial speed grade offers balanced cost and performance (vs EP1C4F324C8N)
  • 249 maximum user I/Os for high-fanout parallel applications (vs EP1C6F324C7N)

設計ノート

Cyclone generation FPGAs are SRAM-based and lose their configuration on every power-down. A non-volatile configuration device (EPCS4, EPCS16, or EPCS64 active serial flash) is REQUIRED to load the bitstream at every power-up. Omitting this device is the most common first-power-up failure mode. For in-system reprogramming, use JTAG mode (typically via a USB-Blaster or compatible cable) - never attempt to load bitstreams via the parallel flash port on this family, as Cyclone does not support it.

The FBGA-324 package uses a 1.0 mm ball pitch with 19 x 19 mm body. PCB design requires laser-drilled microvias on 0.5 mm pitch or smaller, plus a 4-layer stack-up with continuous GND and PWR planes under the BGA. Power decoupling requires 0.1 uF and 10 uF ceramic capacitors within 3 mm of every VCCINT/VCCIO ball, with traces shorter than 5 mm. Estimated: with 1.5 V at 250 mA typical core current, expect 375 mW of core dissipation - the package thermal resistance requires 4 thermal vias in the center ball array to the inner GND plane.

Cyclone I/O banks are organized into 4 banks (1, 2, 3, 4) each with independent VCCIO. Mixing 3.3 V LVCMOS and 1.8 V LVCMOS in the same bank is forbidden - assign each bank a single I/O standard unless using bus-friendly mix. All JTAG pins (TCK, TMS, TDI, TDO) must be pulled up or down per datasheet table to avoid configuration failures; MSEL[2:0] pins select the configuration mode and must be tied to fixed logic levels (typically 000 = AS, 010 = PS, 101 = JTAG-only).

The EP1C4F324C7N is NRND as of 2026-09-06. New designs should target the Cyclone IV E (EP4CE6F324C7N) or Cyclone V (5CEBA4F324C7N) for active production support, lower static power, and modern toolchain (Quartus Prime) compatibility. If using the EP1C4F324C7N for MRO of legacy systems, secure a 12-24 month supply buffer at the time of last-buy, because authorized distributor stock will deplete without replenishment. Always verify that the Quartus II version (13.0sp1 or earlier) is available for your engineering team before committing to a redesign.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS-compliant per verified DigiKey distributor listing. Lead-free FBGA-324 package per verified distributor data. Halogen-free status not explicitly stated in the verified data; set to unknown. AEC-Q100 not applicable (commercial-grade FPGA, not automotive-qualified).

データ検証日: 2026-09-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP1C4F324C7N EP1C4F324C7N datasheet EP1C4F324C7N price Intel Cyclone EP1C4 FPGA Altera Cyclone FBGA-324 FPGA EP1C4F324C7N vs EP1C4F324C8N EP1C4F324C7N drop-in replacement Cyclone FPGA 4000 logic elements EP1C4F324C7N buy online Cyclone generation FPGA NRND migration what is the speed grade C7 Cyclone EP1C4F324C7N pinout FBGA-324 FBGA-324 19x19 1.0mm pitch FPGA EP1C4F324C7N video controller LCD EP1C4F324C7N industrial control glue logic

関連部品&用語

Intel Altera EP1C4F324C7N EP1C4F324C8N EP1C4F324C6N EP1C6F324C7N EP1C12F324C7N Cyclone FPGA Field-Programmable Gate Array Programmable Logic Device Logic Element Logic Array Block Look-Up Table FBGA-324 FineLine BGA BGA surface mount PLL phase-locked loop SRAM 0.13 um CMOS EPCS4 EPCS16 active serial configuration JTAG Quartus II RoHS REACH AEC-Q100 1.5 V core supply LVCMOS video controller industrial automation ASIC prototyping protocol bridge
クイック見積RFQ
詳細をすべてご記入ください — 営業チームが24時間以内にご返信いたします
部品番号 メーカー パッケージ QTY 目標価格 小計
合計: $0.00 USD
✓
見積を送信しました!

24時間以内にメールでご返信いたします

1
RFQ送信済み
2
見積受領
3
注文済み
4
お支払い
5
発送済み
6
配達済み
RFQの詳細を表示