5M1270ZF324C4N - MAX V CPLD, 980 Macrocells, 324-FBGA | Intel
部品番号: 5M1270ZF324C4N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.4 | $21,400.00 |
5M1270ZF324C4N 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocells with a centralized interconnect fabric. It sits in the programmable logic hierarchy between simple PLDs (PAL/GAL) and higher-density FPGAs, offering instant-on operation, deterministic timing, and high fan-in. CPLDs are widely used as interface bridges, I/O expanders, and state-machine controllers where sub-10 ns deterministic latency and unlimited in-system reprogrammability are required without the configuration overhead of an FPGA.
Key features include 980 macrocells organized across 127 logic array blocks (LABs), 4 user I/O banks for flexible voltage interfacing, JTAG-based IEEE 1149.1 boundary-scan support, and a built-in flash configuration memory that eliminates external boot PROM. The MAX V family also integrates a user flash memory (UFM) block, reducing system BOM by combining logic and parameter storage in a single chip.
Architecturally, the device uses a non-volatile, look-up-table backed macrocell array with a continuous FastTrack interconnect that delivers constant pin-to-pin delay regardless of logic placement. This deterministic timing simplifies static timing closure and makes the 5M1270ZF324C4N attractive for safety-critical or hard-real-time control loops where FPGA compile-time variability is unacceptable.
Typical applications include I/O expansion for microcontrollers without sufficient pin count, level-shifting between 1.8 V, 2.5 V, 3.3 V, and 5 V domains, power-sequencer implementation for multi-rail ASICs/SoCs, LED-display scanning and refresh, and legacy peripheral bus bridging (PCI, ISA, VME) in long-lifecycle industrial systems. The 0 C to +70 C commercial temperature range suits indoor, fan-cooled enclosures.
When designing with this device, allocate a decoupling network of 0.1 uF and 10 uF capacitors adjacent to every supply pin, follow Intel's FBGA-324 PCB layout guidelines for microvia escape, and use the Quartus Prime programmer (JTAG or USB-Blaster) for in-system programming. The 324-ball FBGA package requires 1.0 mm pitch fan-out and is not hand-solderable, so assembly must use reflow profiles compliant with JEDEC J-STD-020.
This page synthesizes distributor pricing, parametric alternatives, and practical PCB-layout notes not consolidated in the manufacturer datasheet alone.
ドロップイン代替品: 5M1270ZF324C4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5M1270ZF324C4N （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Mounting Type, Configuration Memory, Programming Interface.
クイック比較ツール — 並列比較する代替部品を選択:
5M1270ZF324I5N
✅ ドロップイン✓ 在庫あり
$13.95 / 個
データシートを見る →5M1270ZF324A5N
✅ ドロップイン✓ 在庫あり
$17.85 / 個
データシートを見る →5M1270ZF324C5N
✅ ドロップイン✓ 在庫あり
$7.5 / 個
データシートを見る →5M1270ZF324C4N 最大定格＆電気的特性
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 980 |
| Number of Logic Array Blocks (LABs) | 127 |
| Number of User I/Os | 271 |
| Maximum Internal Operating Frequency | 304 MHz |
| Pin-to-Pin Propagation Delay (tPD) | 6.2 ns |
| Operating Supply Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (per bank) |
| パッケージ | FBGA-324 (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 C to +70 C (Commercial) |
| Configuration Memory | Internal flash (non-volatile, instant-on) |
| User Flash Memory (UFM) | Yes (8 Kbits, internal) |
| JTAG / IEEE 1149.1 | Supported |
| Programming Interface | JTAG, USB-Blaster, ByteBlaster |
| RoHS ステータス | Compliant |
5M1270ZF324C4N fbga-324 (fineline bga) ピン配置ガイド
5M1270ZF324C4N (fbga-324 (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5M1270ZF324C4N.
詳細は データシート をご参照ください。
主な用途
5M1270ZF324C4N の用途: 7 件s: Microcontroller I/O Expansion, Multi-Rail Power Sequencing, Legacy Bus Bridging (PCI / ISA / VME), LED Display Scanning and Refresh, Industrial Control Glue Logic, I2C / SPI / UART Protocol Bridging, Consumer Electronics Display Interface.
Microcontroller I/O Expansion
The 5M1270ZF324C4N is well suited as an I/O-expander for microcontrollers that lack sufficient GPIO pins, such as ARM Cortex-M0 designs with limited pin count. Its 271 user I/Os across four programmable banks allow direct fan-out from a single SPI or parallel host bus, while the 6.2 ns pin-to-pin delay provides near-zero added latency for real-time control loops. The internal flash configuration means no external boot PROM is required, reducing BOM cost in industrial PLC modules and appliance controllers. Place the CPLD between the MCU and the external load drivers, mapping each host register bit to one or more physical pins.
おすすめ
Multi-Rail Power Sequencing
The 5M1270ZF324C4N is widely used to sequence multiple power rails in ASIC, SoC, and FPGA-based designs where supply turn-on order matters. Its non-volatile instant-on configuration and 4 independent I/O banks (each programmable to 1.2 V-3.3 V) let one CPLD drive ENABLE pins of several DC-DC regulators without external level shifters. With 980 macrocells, complex state-machine sequences (PGOOD feedback, fault retry, watchdog) fit easily, and the 6.2 ns tPD allows glitch-free rail switching at sub-microsecond intervals. Designers typically wire the CPLD to monitor PGOOD from each rail before asserting the next ENABLE.
おすすめ
Legacy Bus Bridging (PCI / ISA / VME)
The 5M1270ZF324C4N functions as a deterministic bridge between modern processors and legacy parallel buses such as PCI, ISA, or VME in long-lifecycle industrial, military, and aerospace systems. Its constant 6.2 ns pin-to-pin delay across the FastTrack interconnect removes the compile-time timing variability of an FPGA, which is critical when emulating fixed bus protocols. The 271 user I/Os comfortably accommodate 32-bit data plus 32-bit address plus control signals. Internal flash memory lets one device store both the protocol bridge logic and small parameter tables, eliminating an external EEPROM.
おすすめ
LED Display Scanning and Refresh
Large LED video walls, scoreboards, and signage matrices use the 5M1270ZF324C4N as a scan-driver controller, where each row is multiplexed at high speed. The 304 MHz internal frequency supports scan rates above 1 MHz for sub-millisecond refresh of 32-row displays, and the 271 I/Os comfortably drive 16-32 row drivers without external bus-expanders. Instant-on behavior from internal flash is valuable for unattended digital-signage installations that must boot cleanly after a power cycle. Designers commonly pair the CPLD with a host microcontroller that sends pixel data over SPI and lets the CPLD handle the row-scan timing.
おすすめ
Industrial Control Glue Logic
In factory-automation PLCs, motor controllers, and process-control instruments, the 5M1270ZF324C4N replaces dozens of 74-series TTL glue-logic chips with a single programmable device. The 980 macrocells and 271 I/Os accept hundreds of combinational and sequential logic terms that previously required multiple PAL/GAL devices, saving PCB area and reducing inventory SKUs. The deterministic timing simplifies IEC 61131-3 functional-safety certification, and the non-volatile configuration eliminates the warm-up boot window seen in SRAM-based FPGAs. Quartus Prime IP cores for SPI, I2C, and UART simplify communication interface implementation.
おすすめ
I2C / SPI / UART Protocol Bridging
The 5M1270ZF324C4N acts as a transparent protocol bridge when a system must interconnect devices that use incompatible serial interfaces - for example, translating an SPI sensor to an I2C bus master, or converting RS-232 to RS-422. With 980 macrocells, multiple independent bridges can run in parallel, and the 304 MHz fMAX comfortably supports 50 MHz SPI clocking without timing closure issues. Quartus Prime Lite ships free IP cores for I2C, SPI, and UART, reducing HDL development time. The internal user flash memory (UFM, 8 Kbits) can store bridge configuration parameters and non-volatile settings.
おすすめ
Consumer Electronics Display Interface
In set-top boxes, smart-TVs, and projector front-ends, the 5M1270ZF324C4N performs HDMI, LVDS, or RGB-to-eDP level shifting and format conversion where deterministic latency matters. The four programmable I/O banks let one CPLD interface simultaneously to 1.8 V SoC pads, 3.3 V HDMI receivers, and 5 V-tolerant display panels without external level shifters. The non-volatile instant-on configuration means the display output is stable within microseconds of power-up, eliminating the splash-screen artifacts common with FPGA-based solutions. The 19 mm x 19 mm FBGA-324 footprint fits easily beneath the BGA of an SoC.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5M1270ZF324C4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5M1270ZF324I5N | 5M1270ZF324A5N | 5M1270ZF324C5N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-324 | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) |
| Number of Macrocells | 980 | 980 | 980 | 980 |
| Number of User I/Os | 271 | 271 | 271 | 271 |
| Pin-to-Pin Delay (tPD) | 6.2 ns | 7.5 ns | 6.2 ns | 7.5 ns |
| Operating Temperature | 0 C to +70 C | -40 C to +100 C | Automotive grade | 0 C to +70 C |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Internal Flash (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Family | MAX V | MAX V | MAX V | MAX V |
主な差別化要因
- Fastest speed grade in the 5M1270Z family （vs 5M1270ZF324C5N)
- Higher commercial temperature margin than industrial part （vs 5M1270ZF324I5N)
- Internal 8 Kbit UFM eliminates external EEPROM （vs Discrete MAX II CPLD + external EEPROM designs)
- 271 user I/Os from 324-ball FBGA （vs Smaller MAX V members in EQFP packages)
設計ノート
The FBGA-324 uses 1.0 mm ball pitch, which is at the limit of standard 4-layer FR-4 PCBs without microvias. Use 0.2 mm laser-drilled microvias or via-in-pad construction for the inner-row escape, and route signal traces on the top layer to keep the breakout area compact. Apply a continuous ground plane on layer 2 directly beneath the BGA to control return-current paths and reduce simultaneous-switching-noise (SSN). Per Intel AN 466, the maximum PCB warpage during reflow must stay below 0.1 mm to avoid solder joint cracking on the corner balls.
Each of the 324 balls requires proper decoupling: place one 0.1 uF X7R ceramic capacitor within 2 mm of every VCCINT and VCCIO ball, and add four bulk 10 uF tantalum or polymer capacitors distributed around the package perimeter. Group the four VCCIO rails by bank and tie each bank to its own filtered supply to prevent digital switching noise from one bank coupling into another. The 1.8 V VCCINT rail should have a dedicated ferrite bead to isolate it from the 3.3 V system rail.
Do not assume JTAG pins can be left floating - TMS, TDI, and TCK must each be pulled to VCCIO of bank 3 through 10 kohm resistors to keep the TAP controller in a benign state at power-up. Failing to do so can cause unintended JTAG state transitions during in-rush, occasionally corrupting the flash configuration on borderline parts. Also, leave TCK pulled low through 10 kohm, not high, so the TAP defaults to the Test-Logic-Reset state on power-up. Use the Quartus Prime programmer's verify-after-program option to detect any flash corruption early in production.
Route all clock and high-speed differential pairs (LVDS) on the top layer over a continuous ground reference on layer 2. Keep clock traces shorter than 25 mm to avoid reflections above 200 MHz. For each I/O bank, group the 1.2 V-3.3 V signals together and place the VCCIO decoupling caps adjacent to the bank power pin. Estimated: with 271 user I/Os and 304 MHz fMAX, peak simultaneous switching current can reach ~800 mA; verify this with an IBIS simulation before final layout.
コンプライアンス情報
RoHS and REACH compliance confirmed per Intel product environmental compliance documentation. The commercial C4 suffix is not AEC-Q100 qualified - choose the 5M1270ZF324A5N variant for automotive. Lead-free and halogen-free per Intel MAX V datasheet.
