EP1K100FI484-2 - 100K Gate ACEX-1K FPGA 2.5V 484-FBGA | Intel
部品番号: EP1K100FI484-2 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $130 | $65,000.00 |
| 1,000 | $118 | $118,000.00 |
EP1K100FI484-2 概要
What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after manufacture. In the broader taxonomy, FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Each FPGA contains configurable logic blocks (LEs), programmable interconnect, and I/O elements, all controlled by a vendor-specific configuration bitstream. The ACEX-1K family is part of Intel's (Altera's) low-cost, high-volume FPGA line targeting glue logic, bridge, and control-plane applications.
The EP1K100FI484-2 features 49,152 memory bits distributed across its EABs, 333 maximum user I/O pins, and supports in-system programming via the IEEE 1149.1 (JTAG) interface and Altera's proprietary configuration schemes. Its embedded array blocks enable implementation of megafunctions such as dual-port RAM, ROM, and specialized arithmetic functions without consuming general-purpose logic, reducing overall die area and improving timing closure for memory-intensive designs.
Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control and instrumentation, video and image processing pipelines, and PCI/CompactPCI bridge interfaces. The 484-pin FBGA package supports high I/O count designs with signal integrity advantages over lower-pin-count packages.
When designing with this device, ensure that the Quartus II (or MAX+PLUS II) toolchain supports the targeted speed grade and that PCB layout provides sufficient decoupling and matched impedance for high-speed I/O. The -2 speed grade indicates a mid-tier performance bin; the -1 grade is faster and the -3 grade is the slowest. Engineers should review the ACEX-1K family datasheet for I/O standard support, configuration timing, and power estimation guidance.
This page synthesizes distributor availability, drop-in pin-compatible ACEX-1K alternatives, and practical design considerations not found in the manufacturer datasheet alone.
ドロップイン代替品: EP1K100FI484-2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1K100FI484-2 （同一形状・フットプリント） — 相違点: Configuration Method, Process Technology, Speed Grade, Package, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP1K100FC484-2
✅ ドロップイン✓ 在庫あり
$33.4 / 個
データシートを見る →EP1K100FC484-2N
✅ ドロップイン✓ 在庫あり
$58.4 / 個
データシートを見る →EP1K100FC484-1N
✅ ドロップイン✓ 在庫あり
$58.4 / 個
データシートを見る →EP1K100FC484-3
✅ ドロップイン✓ 在庫あり
$52.5 / 個
データシートを見る →EP1K100FC484-3N
✅ ドロップイン✓ 在庫あり
$65.1 / 個
データシートを見る →EP1K100EFI484-2
✅ ドロップイン✓ 在庫あり
$67.5 / 個
データシートを見る →EP1K100FC484-1
✅ ドロップイン✓ 在庫あり
$52.1 / 個
データシートを見る →EP1K100FI484-2 最大定格＆電気的特性
| Series | ACEX-1K |
| Family | ACEX-1K Programmable Logic Device Family |
| Typical Gates | 100,000 |
| Logic Elements (Cells) | 4,992 |
| Total RAM Bits | 49,152 |
| Number of I/O | 333 |
| 動作電源電圧 | 2.5 V |
| Maximum Operating Frequency | 250 MHz |
| Process Technology | CMOS, 2.5 V |
| 動作温度範囲 | -40C to +85C (Industrial) |
| Speed Grade | -2 (mid) |
| パッケージ | 484-BBGA (FineLine BGA) |
| 実装タイプ | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) + serial/parallel |
| RoHS ステータス | unknown |
EP1K100FI484-2 484-bbga (fineline bga) ピン配置ガイド
EP1K100FI484-2 (484-bbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1K100FI484-2.
詳細は データシート をご参照ください。
主な用途
EP1K100FI484-2 の用途: 7 件s: Digital Signal Processing (DSP) Front-End, Telecommunications Glue Logic, Industrial Control and Instrumentation, Video and Image Processing Pipeline, PCI / CompactPCI Bridge Interface, Legacy Embedded System Maintenance, Test and Measurement Equipment.
Digital Signal Processing (DSP) Front-End
The EP1K100FI484-2's 4,992 logic elements and 49,152 RAM bits via EABs make it well-suited to DSP front-end tasks such as FIR filtering, FFT pre-processing, and sample-rate conversion in industrial instrumentation. The 250 MHz fMAX and 333 user I/O enable parallel multiplier-accumulator architectures, while the 484-FBGA package supports the high pin count typical of multi-channel data acquisition. Power consumption is dominated by toggle rate; Quartus II PowerPlay estimation guides thermal budgets. Compared to a microcontroller, this FPGA achieves deterministic latency for sample-accurate processing. Companion components: ADC/DAC ICs (e.g., AD7606), external SRAM.
おすすめ
Telecommunications Glue Logic
In telecom bridging applications, the EP1K100FI484-2 functions as glue logic between backplane buses, line cards, and protocol converters where programmable bus widths and timing are required. The 333 user I/O pins comfortably accommodate 32-bit data plus control, while the 2.5 V core and configurable I/O standards (3.3 V, 2.5 V, 1.8 V) allow direct interfacing to LVCMOS, LVTTL, and PCI buses. Industrial temperature grading suits central-office and outside-plant equipment. The ACEX-1K family is widely deployed in legacy TDM/Ethernet bridges. Companion components: PHY transceivers, clock buffers, SRAM.
おすすめ
Industrial Control and Instrumentation
The EP1K100FI484-2's industrial temperature range (-40C to +85C) and high-I/O FBGA package make it a strong fit for PLCs, motor-control boards, and process-instrumentation front-ends. EABs implement lookup tables for sensor linearization, while general LEs handle encoder decoding (e.g., quadrature), PWM generation, and Modbus/Profibus framing. The 484-FBGA package enables dense designs with mixed analog/digital I/O. Compared to microcontrollers, the FPGA delivers deterministic interrupt latency for safety-critical control loops. Companion components: motor-driver ICs, isolated RS-485 transceivers, precision ADCs.
おすすめ
Video and Image Processing Pipeline
For video pipeline applications (image preprocessing, format conversion, basic image enhancement), the EP1K100FI484-2's 4,992 LEs and 49,152 RAM bits support real-time line-buffer architectures for mid-resolution video streams. EAB-based dual-port RAM implements line delays and frame stores without external memory. The 333 I/O pins accept parallel digital video buses (BT.656, BT.1120) and output to display drivers. Industrial grading suits machine-vision cameras and factory-floor imaging. For higher resolutions, migrate to Cyclone II/III with more EABs and dedicated DSP blocks. Companion components: image sensors, video DACs.
おすすめ
PCI / CompactPCI Bridge Interface
The EP1K100FI484-2's 333 user I/O and 49,152 RAM bits enable implementation of 32-bit/33 MHz PCI or CompactPCI bridge interfaces, including bus arbitration, parity generation, and target/master state machines. ACEX-1K EABs provide parity-LUT and configuration-space register storage, while general LEs handle transaction-layer logic. The 484-FBGA package supports the wide data/address bus plus sideband signals. Industrial temperature grade suits CompactPCI chassis. Cyclone II is the modern equivalent. Companion components: PCI connectors, clock generators, level translators.
おすすめ
Legacy Embedded System Maintenance
For maintaining deployed systems using ACEX-1K designs, the EP1K100FI484-2 remains the canonical 100K-gate, 484-FBGA industrial variant. Engineers performing field service, repair, or feature upgrades use this part to maintain bitstream and pinout compatibility with existing PCBs. EAB-based megafunctions (FIFOs, dual-port RAM, CAMs) preserve behavioral compatibility. Drop-in alternatives within the ACEX-1K family (e.g., EP1K100FC484-2, EP1K100EFI484-2) enable temperature-grade substitution. For new designs, migration to Cyclone-series FPGAs is recommended. Companion components: configuration PROMs, JTAG programmers.
おすすめ
Test and Measurement Equipment
The EP1K100FI484-2's deterministic timing and high I/O count suit digital test pattern generation, protocol analyzers, and logic-analyzer acquisition back-ends in benchtop instrumentation. EAB-based pattern ROM stores test vectors, while LEs implement counter/timer chains and protocol decoders. The 250 MHz fMAX enables generation and capture of high-speed digital stimuli. Industrial temperature grade suits laboratory and factory-floor use. Modern replacements include Cyclone IV/MAX 10 with on-chip ADCs. Companion components: comparators, DACs, high-speed transceivers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1K100FI484-2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1K100FC484-2 | EP1K100FC484-2N | EP1K100FC484-1N | EP1K100EFI484-2 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BBGA (FineLine BGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements (Cells) | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Number of I/O | 333 | 333 | 333 | 333 | 333 |
| Operating Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum Operating Frequency | 250 MHz | 250 MHz | 250 MHz | 250 MHz (faster bin) | 250 MHz |
| Operating Temperature Range | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Enhanced Industrial) |
| Speed Grade | -2 | -2 | -2N | -1N | -2 |
主な差別化要因
- Industrial temperature grade in the 100K-gate 484-FBGA tier （vs EP1K100FC484-2)
- Mid-tier -2 speed grade offers balanced performance/cost （vs EP1K100FC484-1N)
- Standard industrial variant with broadest distributor availability （vs EP1K100EFI484-2)
設計ノート
The 484-ball FineLine BGA package requires careful PCB layout: escape routing on inner layers with via-in-pad or dog-bone fanouts, and a continuous ground plane beneath the BGA to control impedance and reduce SSN. Use the ACEX-1K family datasheet's recommended land pattern and follow IPC-7351 naming conventions. Provide at least one 0.1 uF + 10 uF decoupling capacitor pair per VCCINT/VCCIO power pin pair, placed as close to the balls as the breakout allows. Add bulk capacitance on the 2.5 V core rail to handle inrush during configuration.
Do not confuse temperature grade suffixes: 'I' (Industrial -40C to +85C), 'C' (Commercial 0C to +85C), 'E' (Enhanced industrial). All variants share the same pinout in the 484-FBGA package, so PCB compatibility is preserved, but operating temperature must match the deployment environment. Also note that the ACEX-1K family uses MAX+PLUS II or Quartus II (legacy) toolchains; modern Quartus versions may not support ACEX-1K, requiring the legacy MAX+PLUS II software for bitstream generation.
Estimated: at 250 MHz toggle rate with 60-70% utilization, the EP1K100FI484-2 can consume 1-2 W from the 2.5 V core rail (estimate based on ACEX-1K family typical power). Use Quartus II PowerPlay to estimate actual dissipation for your design; derate the FBGA thermal resistance (~20 C/W theta-JA typical for 484-FBGA) and ensure the design includes adequate copper thermal vias under the package. Add a heatsink if the design targets industrial temperature extremes with high toggle rates.
Route configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) carefully and keep them short; these signals are susceptible to noise and must be pulled up correctly per the ACEX-1K family datasheet. JTAG (TCK, TMS, TDI, TDO) traces should be length-matched and guarded by ground to maintain signal integrity during in-system programming. The MSEL[0..2] pins select the configuration mode and must be tied to the correct logic levels for the chosen configuration scheme (AS, AP, PS, JTAG).
コンプライアンス情報
Compliance data not explicitly stated in verified web data; the ACEX-1K family is from an older product generation and RoHS/REACH status should be confirmed with the specific lot via the manufacturer's material declaration documents. The -2N suffix variants are typically lead-free, while legacy -2 (no N) variants may use tin-lead balls.