EP1S80F1508C7 - Stratix 80K LEs, 1203 I/O FPGA BGA-1508 | Intel
MPN: EP1S80F1508C7 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $139.85 | $139.85 |
| 10 | $132.5 | $1,325.00 |
| 100 | $124.2 | $12,420.00 |
| 500 | $115.8 | $57,900.00 |
| 1,000 | $108.4 | $108,400.00 |
Drop-in alternatives for EP1S80F1508C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1S80F1508C7N
β Drop-Inπ Reference alternative (not in catalog)
EP1S80F1508C6
β Drop-Inβ In Stock
$148.2 / Unit
View Datasheet βEP1S80F1508C5
β Drop-Inπ Reference alternative (not in catalog)
EP1S80F1508I7N
β Drop-Inπ Reference alternative (not in catalog)
EP1S80F1508C6AA
β Drop-Inβ In Stock
$175 / Unit
View Datasheet βEP1S80F1508C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 79,040 |
| Total LABs/CLBs | 7,904 |
| Total Memory Bits | 7,427,520 |
| Number of I/O | 1203 |
| DSP Blocks | 28 |
| Embedded Multipliers (9x9) | 224 |
| Process Technology | 0.13 um, all-layer copper SRAM |
| Core Voltage | 1.5 V |
| Speed Grade | C7 |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 1508-BBGA, FCBGA |
| Package Body Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Configuration Memory | SRAM (volatile, requires external config device) |
| RoHS Status | Compliant (lead-free) |
EP1S80F1508C7 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1S80F1508C7 (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S80F1508C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S80F1508C7 is suitable for 6 applications: Telecom Base-Station Channel Card, High-Speed Data Acquisition Backplane, ASIC Prototyping Platform, DSP-Intensive Signal Processing Card, Image and Video Processing Pipeline, Industrial Control and Automation.
Telecom Base-Station Channel Card
The EP1S80F1508C7's 79,040 LEs and 28 DSP blocks with 224 9x9 multipliers make it a strong fit for multi-carrier baseband processing in WCDMA/LTE channel cards, supporting parallel demodulation paths and channel coding. The 7.4 Mbit TriMatrix embedded RAM buffers symbol-rate data between DSP blocks and external QDR SRAM/DDR SDRAM with sub-10 ns access latency, reducing off-chip bandwidth pressure. Its 1203 user I/O pins aggregate parallel RapidIO/CPRI links to baseband backplanes without external bus expander logic, while Altera's hard IP for DDR SDRAM and QDR SRAM controllers simplifies timing closure for memory-intensive line cards. Power estimation must consider ~1.5W quiescent plus dynamic power that scales with toggle rate; the FCBGA package requires a 12-layer PCB with continuous ground and power planes under the BGA.
Recommended
High-Speed Data Acquisition Backplane
The EP1S80F1508C7's 1203 user I/O enables aggregation of 16+ LVDS data lanes at 1 Gbps each, feeding the 7.4 Mbit embedded RAM for first-level FIFO buffering before DMA to host processors via PCIe hard IP. The 28 DSP blocks support real-time decimation filtering and FFT pre-processing on streaming ADC samples at rates of 250-500 MSPS, offloading computational burden from software. Commercial-grade 0C to +85C operation matches most lab-instrument environments, and the 1.5V core with multiple VCCIO banks allows direct interfacing to 3.3V, 2.5V, and 1.8V ADC/DAC companion parts without level shifters. Estimated dynamic power for a 70%-toggle-rate design is approximately 8-10W; a heatsink or 6+ square inch copper pour is recommended for sustained operation.
Recommended
ASIC Prototyping Platform
The EP1S80F1508C7's 79,040 LEs make it a common building block for ASIC prototyping platforms that stitch multiple FPGAs together for multi-million-gate emulation. Designers map gate-equivalent ASIC RTL into the Stratix LUTs, M4K/M-RAM blocks, and DSP blocks, with the 1203 I/O pins providing high-fanout TDM traces between FPGAs on the prototyping board. The 1.5V core and 0.13-micrometer process deliver predictable timing closure for prototype bring-up and software validation ahead of ASIC tape-out. Quartus II / Quartus Prime software supports incremental compilation and LogicLock regions for incremental prototyping iterations, dramatically shortening bring-up cycles versus a full re-synthesis.
Recommended
DSP-Intensive Signal Processing Card
Each of the EP1S80F1508C7's 28 DSP blocks contains eight 9x9 multipliers plus an adder tree and accumulators, totaling 224 multipliers and enabling up to 56 GMACs of 18x18-equivalent throughput in parallel FIR/FFT pipelines. For radar pulse compression, the device supports >250 MHz DSP-block clock rates, comfortably handling 4096-point FFTs at >60k transforms per second. The 7.4 Mbit embedded RAM is partitioned to hold FFT twiddle factors and FIR coefficients without external memory access, reducing latency. The device's 1.5V core voltage keeps dynamic power moderate for radar-class workloads, while the 0C to +85C commercial range matches indoor and sheltered outdoor enclosures typical of signal-intelligence installations.
Recommended
Image and Video Processing Pipeline
The EP1S80F1508C7's 7.4 Mbit embedded RAM holds multiple full HD video frame lines (1920x1080x10-bit = ~20.7 Mbit) at high frame rates when distributed across M-RAM blocks, supporting real-time image processing such as Bayer demosaicing, edge detection, and histogram equalization in pipeline form. The 1203 I/O pins accommodate parallel camera-sensor interfaces (LVDS sub-LVDS, HiSPi) and HDMI/DVI output pipelines without external serializers. The 28 DSP blocks accelerate 2D convolution operations for image filters at clock rates up to 250 MHz. Commercial temperature grade is acceptable for indoor medical-imaging and broadcast equipment, where ambient temperature is controlled, while the FCBGA's 1 mm pitch simplifies PCB routing compared to finer-pitch Stratix variants.
Recommended
Industrial Control and Automation
The EP1S80F1508C7's 79,040 LEs implement complex state machines for multi-axis motion control, while the 28 DSP blocks execute high-rate PI/PID loops and field-oriented control (FOC) algorithms for servo drives. The 1203 I/O pins aggregate multiple encoder interfaces (EnDat, BiSS, SSI), PWM outputs for motor inverters, and EtherCAT/PROFINET fieldbus links to controllers. With 7.4 Mbit embedded RAM, designers store commutation tables and trajectory profiles for fast access during multi-axis coordination cycles. Designers requiring extended-temperature operation should select the EP1S80F1508I7N industrial variant (same package) for -40C to +100C operation in factory-floor enclosures without thermal derating. The FCBGA package's 1 mm ball pitch allows standard PCB manufacturing processes.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80F1508C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80F1508C7N | EP1S80F1508C6 | EP1S80F1508C5 | EP1S80F1508I7N | EP1S80F1508C6AA |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-BBGA, FCBGA (33x33 mm, 1.0 mm pitch) | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (slowest) | I7 (industrial, equivalent speed) | C6 (with AA customer screening) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Embedded Memory Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| User I/O Pins | 1203 | 1203 | 1203 | 1203 | 1203 | 1203 |
| DSP Blocks / Multipliers | 28 / 224 (9x9) | 28 / 224 | 28 / 224 | 28 / 224 | 28 / 224 | 28 / 224 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete / NRND | Last-time-buy | Last-time-buy |
Key Differentiators
- Faster C7 speed grade than C6/C5 alternatives (vs EP1S80F1508C6)
- Commercial temperature versus industrial variant (vs EP1S80F1508I7N)
- Standard ball finish versus lead-free ball finish (vs EP1S80F1508C7N)
- Same 1508-FCBGA package across entire speed/temp matrix (vs EP1S80F1508C5)
Design Notes
Estimated: at 70% toggle rate and 250 MHz logic clock, dynamic power for EP1S80F1508C7 is approximately 8-10W on top of ~1.5W quiescent. The 1508-FCBGA package has limited top-side heat dissipation; place a thermal interface material and heatsink or use at least 6 square inches of copper pour on the top-side inner plane with thermal vias to the bottom layer. Ensure junction temperature stays below 100C in commercial temperature applications.
The 1508-BBGA package requires 12+ layer PCB with continuous ground and power planes routed to all four BGA quadrants. Use 0.8 mm micro-via-in-pad with staggered 1.0 mm outer-pitch escape routing; ball-pad diameter 0.5 mm requires 0.15 mm trace width with 0.15 mm clearance per IPC-6012 Class 3 for reliability. Decoupling: place 0.1 uF X7R capacitors within 1 mm of every VCCIO ball, plus 10 uF bulk capacitors every 10 balls along power rails.
The Stratix family uses volatile SRAM configuration - the device WILL NOT boot without an external configuration device (EPC16, EPC64, or MAX-II CPLD). For production designs, also add a 1 ms POR delay and verify CONF_DONE rises correctly. For JTAG programming, ensure TCK frequency stays below 33 MHz; pull TDI/TDO/TMS to known states via 10K resistors when unused. Never run VCCINT at less than 1.5V nominal during configuration or the device may have brown-out logic corruption.
Stratix LVDS pairs require matched-length routing within 0.5 mm and 100-ohm differential impedance with reference plane continuity - never route LVDS over plane splits. For DDR SDRAM interfaces, follow Altera's external memory interface guidelines for t-dwell matching (CK-to-DQS within 50 ps); use the Memory Interface Generator (MIG) tool inside Quartus to generate constraint files. Place the configuration flash within 50 mm of the FPGA's MSEL[2:0] and DCLK pins to minimize noise on the configuration bus.
Compliance Information
Per Intel/Altera product page, the EP1S80F1508C7 is RoHS-compliant but uses standard (non-lead-free) ball finish; for lead-free RoHS-compliant ball finish choose EP1S80F1508C7N. AEC-Q100 not applicable for non-automotive FPGA. Halogen-free status not explicitly stated in verified data - marked unknown.
