EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
部品番号: EP1SGX25DF672C7N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $350 | $3,500.00 |
| 100 | $310 | $31,000.00 |
| 500 | $275 | $137,500.00 |
| 1,000 | $245 | $245,000.00 |
EP1SGX25DF672C7N 概要
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, and DSP slices. FPGAs occupy a unique position in the digital design hierarchy, bridging the flexibility of software-based processing with the performance of dedicated ASICs. Within the semiconductor taxonomy, an FPGA is a sub-category of programmable logic, which itself is a sub-category of standard logic ICs. The Stratix GX family specifically added high-speed serial transceivers to the standard Stratix architecture, eliminating the need for external PHY chips in many designs.
Key features of the EP1SGX25DF672C7N include 455 maximum user I/O pins, 1.5V core operation, industrial-grade 0°C to 85°C commercial temperature range, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The integrated transceivers support multiple clock domains, 8B/10B encoding, and word alignment, simplifying the implementation of protocols such as PCIe, Serial RapidIO, and Gigabit Ethernet. The FineLine BGA package offers high signal density and superior electrical performance for high-frequency signals.
Typical applications include high-speed serial backplane interfaces, line cards for telecom switches, baseband signal processing in wireless infrastructure, and high-throughput data acquisition systems. When designing with this device, ensure adequate power supply decoupling and thermal management, as the high integration density and transceiver operation result in significant power dissipation.
ドロップイン代替品: EP1SGX25DF672C7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1SGX25DF672C7N （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EP1SGX25DF672C7ES
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データシートを見る →EP1SGX25DF672C7
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$125.4 / 個
データシートを見る →EP1SGX25DF672C6N
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$210 / 個
データシートを見る →EP1SGX25DF672C5N
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$1232.25 / 個
データシートを見る →EP1SGX25CF672C7N
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$338.5 / 個
データシートを見る →EP1SGX10DF672C7N
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価格はお問い合わせください
データシートを見る →EP1SGX25DF672C7N 最大定格＆電気的特性
| Series | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Maximum User I/O | 455 |
| Number of Transceivers | 4 |
| Transceiver Data Rate (Max) | 3.125 Gbps |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 動作温度 | 0 °C to 85 °C (Commercial) |
| パッケージ | 672-ball FineLine BGA (FBGA-672) |
| Package Dimensions | 33 × 33 mm, 1 mm pitch |
| 実装タイプ | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free, per datasheet) |
| Speed Grade | C7 |
| RoHS ステータス | Compliant |
EP1SGX25DF672C7N 33 × 33 mm, 1 mm pitch ピン配置ガイド
EP1SGX25DF672C7N (33 × 33 mm, 1 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1SGX25DF672C7N.
詳細は データシート をご参照ください。
主な用途
EP1SGX25DF672C7N の用途: 7 件s: High-Speed Serial Backplane Interface, Telecom Line Card Protocol Processing, Wireless Baseband Signal Processing, High-Throughput Data Acquisition System, Video Broadcast Equipment, PCIe Endpoint / Root Complex Design, Industrial Control & Test Equipment.
High-Speed Serial Backplane Interface
The EP1SGX25DF672C7N is purpose-built for serial backplane applications through its 4 multi-gigabit transceivers rated to 3.125 Gbps. These transceivers integrate 8B/10B encoding, word alignment, and clock-data recovery, eliminating the need for external PHY chips on the line card. Placed on switch fabric line cards, the FPGA aggregates multiple backplane lanes into parallel logic, with 25,660 logic elements providing ample headroom for protocol processing and packet buffering.
おすすめ
Telecom Line Card Protocol Processing
The 25,660 logic elements and 1.944 Mbits of block RAM in the EP1SGX25DF672C7N make it ideal for telecom line cards that need to terminate serial protocols and process payloads in parallel. The FPGA typically handles framing, deframing, and cell/packet reassembly for protocols like Serial RapidIO or custom backplane fabrics. The 672-FBGA package supports up to 455 user I/O for connection to network processors and traffic managers.
おすすめ
Wireless Baseband Signal Processing
In wireless base station designs, the EP1SGX25DF672C7N's combination of DSP blocks, block RAM, and multi-gigabit transceivers enables digital up/down conversion, channelization, and CPRI/OBSAI fronthaul interfacing. The transceiver data rate supports CPRI rates up to 3.072 Gbps (option 3), connecting the baseband FPGA to remote radio heads. The 25K logic elements accommodate multiple antenna paths in a single device.
おすすめ
High-Throughput Data Acquisition System
The EP1SGX25DF672C7N serves as the processing heart of high-speed data acquisition systems, accepting data from multi-gigabit ADCs through its transceivers and performing real-time DSP, packetization, and storage interface logic. The 1.944 Mbits of embedded RAM provide buffering for high-bandwidth streaming data. The commercial 0–85 °C operating range suits laboratory and industrial instrumentation environments.
おすすめ
Video Broadcast Equipment
Broadcast video routers and processing equipment leverage the EP1SGX25DF672C7N's transceivers for SDI (Serial Digital Interface) transport at 270 Mbps, 1.485 Gbps, and 2.97 Gbps standards (SD-SDI, HD-SDI, 3G-SDI). The 25K logic elements support real-time video processing functions such as up/down/cross-conversion, color space conversion, and overlay generation. Multiple transceivers allow multi-channel video aggregation in a single FPGA.
おすすめ
PCIe Endpoint / Root Complex Design
The EP1SGX25DF672C7N supports PCI Express Gen 1 (2.5 Gbps) endpoint and root complex designs through its integrated transceivers, with Altera-provided PCIe IP cores in Quartus II. The 672-FBGA package supplies sufficient user I/O for system integration including memory controllers (DDR/DDR2) and local bus interfaces. Design teams can prototype PCIe Gen 1 systems before migrating to Cyclone V GT or Arria V GZ for production.
おすすめ
Industrial Control & Test Equipment
In industrial test and measurement equipment, the EP1SGX25DF672C7N provides reconfigurable logic for custom instrument front-ends, signal generation, and protocol bridging. The combination of 25K logic elements, multi-gigabit transceivers, and 455 user I/O suits high-channel-count instruments such as protocol analyzers, ATE (Automatic Test Equipment) interface cards, and high-speed digitizers. The commercial temperature range fits factory floor and laboratory use cases.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1SGX25DF672C7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1SGX25DF672C7ES | EP1SGX25DF672C7 | EP1SGX25DF672C6N | EP1SGX25CF672C7N | EP1SGX10DF672C7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (33x33 mm) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | C7 | C7 ES | C7 | C6 (slower) | C7 | C7 |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- Integrated multi-gigabit transceivers eliminate external PHY chips （vs EP1S25F672C7N (non-GX Stratix))
- Higher logic density than Stratix GX 10K variant （vs EP1SGX10DF672C7N)
- Same 672-FBGA footprint across the Stratix GX family （vs EP1SGX25DF1020C7N)
設計ノート
The EP1SGX25DF672C7N with active transceivers can dissipate 5-8 W under typical workloads, scaling up with transceiver utilization and logic toggle rates. The 672-FBGA package requires a multi-layer PCB thermal solution including thermal vias under the exposed die pad and adequate copper pour on inner/outer layers. Designers must consult Altera's PowerPlay early power estimation tools in Quartus II before PCB layout to size the thermal solution correctly.
The 672-FBGA package with 1.0 mm pitch demands HDI PCB stack-up with microvia-in-pad technology for breakout routing. Each BGA ball requires at least one ground via for signal return paths and power decoupling. Maintain 100 µF of bulk decoupling per power rail (VCCINT, VCCIO, VCCA, VCCP) with 0.1 µF and 1 nF high-frequency capacitors placed as close as possible to the package balls. Reference the Altera Stratix GX hardware reference design for stack-up recommendations.
Transceiver channels must be routed with controlled-impedance differential pairs (typically 100 Ω differential) with matched lengths within a lane (intra-pair skew < 1 ps) and inter-lane matching per protocol specification. Use loss-controlled PCB material such as Megtron 6 or Rogers RO4350B for channels exceeding 10 Gbps·inch. Transceiver reference clocks require dedicated low-jitter oscillators (typical 100 MHz, < 1 ps RMS jitter) routed with isolation from switching signals.
Common pitfalls include: (1) failing to use Altera's configuration device (EPC16 or EPCS) for fast parallel configuration, leading to slow serial boot times; (2) ignoring the JTAG chain topology and TDI/TDO pin assignment that creates configuration failures; (3) overlooking the special power-up sequencing requirements for VCCINT before VCCIO; (4) using non-IBIS-validated models for backplane channel simulation. Always validate the complete reference design flow with Quartus II before committing to layout.
コンプライアンス情報
RoHS-compliant per Altera/Intel product page; lead-free BGA balls. AEC-Q100 not applicable for FPGAs. REACH status not explicitly confirmed in available data. Last Time Buy status as of 2026-09-07.