EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
부품 번호: EP1SGX25DF672C7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $350 | $3,500.00 |
| 100 | $310 | $31,000.00 |
| 500 | $275 | $137,500.00 |
| 1,000 | $245 | $245,000.00 |
EP1SGX25DF672C7N 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, and DSP slices. FPGAs occupy a unique position in the digital design hierarchy, bridging the flexibility of software-based processing with the performance of dedicated ASICs. Within the semiconductor taxonomy, an FPGA is a sub-category of programmable logic, which itself is a sub-category of standard logic ICs. The Stratix GX family specifically added high-speed serial transceivers to the standard Stratix architecture, eliminating the need for external PHY chips in many designs.
Key features of the EP1SGX25DF672C7N include 455 maximum user I/O pins, 1.5V core operation, industrial-grade 0°C to 85°C commercial temperature range, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The integrated transceivers support multiple clock domains, 8B/10B encoding, and word alignment, simplifying the implementation of protocols such as PCIe, Serial RapidIO, and Gigabit Ethernet. The FineLine BGA package offers high signal density and superior electrical performance for high-frequency signals.
Typical applications include high-speed serial backplane interfaces, line cards for telecom switches, baseband signal processing in wireless infrastructure, and high-throughput data acquisition systems. When designing with this device, ensure adequate power supply decoupling and thermal management, as the high integration density and transceiver operation result in significant power dissipation.
드롭인 대체품: EP1SGX25DF672C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF672C7N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF672C7ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX25DF672C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$125.4 / 개
데이터시트 보기 →EP1SGX25DF672C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX25DF672C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1232.25 / 개
데이터시트 보기 →EP1SGX25CF672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$338.5 / 개
데이터시트 보기 →EP1SGX10DF672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP1SGX25DF672C7N 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Maximum User I/O | 455 |
| Number of Transceivers | 4 |
| Transceiver Data Rate (Max) | 3.125 Gbps |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 동작 온도 | 0 °C to 85 °C (Commercial) |
| 패키지 | 672-ball FineLine BGA (FBGA-672) |
| Package Dimensions | 33 × 33 mm, 1 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free, per datasheet) |
| Speed Grade | C7 |
| RoHS 상태 | Compliant |
EP1SGX25DF672C7N 33 × 33 mm, 1 mm pitch 핀 구성 가이드
EP1SGX25DF672C7N(33 × 33 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF672C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF672C7N 적합 용도: 7 애플리케이션s: High-Speed Serial Backplane Interface, Telecom Line Card Protocol Processing, Wireless Baseband Signal Processing, High-Throughput Data Acquisition System, Video Broadcast Equipment, PCIe Endpoint / Root Complex Design, Industrial Control & Test Equipment.
High-Speed Serial Backplane Interface
The EP1SGX25DF672C7N is purpose-built for serial backplane applications through its 4 multi-gigabit transceivers rated to 3.125 Gbps. These transceivers integrate 8B/10B encoding, word alignment, and clock-data recovery, eliminating the need for external PHY chips on the line card. Placed on switch fabric line cards, the FPGA aggregates multiple backplane lanes into parallel logic, with 25,660 logic elements providing ample headroom for protocol processing and packet buffering.
추천
Telecom Line Card Protocol Processing
The 25,660 logic elements and 1.944 Mbits of block RAM in the EP1SGX25DF672C7N make it ideal for telecom line cards that need to terminate serial protocols and process payloads in parallel. The FPGA typically handles framing, deframing, and cell/packet reassembly for protocols like Serial RapidIO or custom backplane fabrics. The 672-FBGA package supports up to 455 user I/O for connection to network processors and traffic managers.
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Wireless Baseband Signal Processing
In wireless base station designs, the EP1SGX25DF672C7N's combination of DSP blocks, block RAM, and multi-gigabit transceivers enables digital up/down conversion, channelization, and CPRI/OBSAI fronthaul interfacing. The transceiver data rate supports CPRI rates up to 3.072 Gbps (option 3), connecting the baseband FPGA to remote radio heads. The 25K logic elements accommodate multiple antenna paths in a single device.
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High-Throughput Data Acquisition System
The EP1SGX25DF672C7N serves as the processing heart of high-speed data acquisition systems, accepting data from multi-gigabit ADCs through its transceivers and performing real-time DSP, packetization, and storage interface logic. The 1.944 Mbits of embedded RAM provide buffering for high-bandwidth streaming data. The commercial 0–85 °C operating range suits laboratory and industrial instrumentation environments.
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Video Broadcast Equipment
Broadcast video routers and processing equipment leverage the EP1SGX25DF672C7N's transceivers for SDI (Serial Digital Interface) transport at 270 Mbps, 1.485 Gbps, and 2.97 Gbps standards (SD-SDI, HD-SDI, 3G-SDI). The 25K logic elements support real-time video processing functions such as up/down/cross-conversion, color space conversion, and overlay generation. Multiple transceivers allow multi-channel video aggregation in a single FPGA.
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PCIe Endpoint / Root Complex Design
The EP1SGX25DF672C7N supports PCI Express Gen 1 (2.5 Gbps) endpoint and root complex designs through its integrated transceivers, with Altera-provided PCIe IP cores in Quartus II. The 672-FBGA package supplies sufficient user I/O for system integration including memory controllers (DDR/DDR2) and local bus interfaces. Design teams can prototype PCIe Gen 1 systems before migrating to Cyclone V GT or Arria V GZ for production.
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Industrial Control & Test Equipment
In industrial test and measurement equipment, the EP1SGX25DF672C7N provides reconfigurable logic for custom instrument front-ends, signal generation, and protocol bridging. The combination of 25K logic elements, multi-gigabit transceivers, and 455 user I/O suits high-channel-count instruments such as protocol analyzers, ATE (Automatic Test Equipment) interface cards, and high-speed digitizers. The commercial temperature range fits factory floor and laboratory use cases.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF672C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF672C7ES | EP1SGX25DF672C7 | EP1SGX25DF672C6N | EP1SGX25CF672C7N | EP1SGX10DF672C7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (33x33 mm) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | C7 | C7 ES | C7 | C6 (slower) | C7 | C7 |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Integrated multi-gigabit transceivers eliminate external PHY chips (vs EP1S25F672C7N (non-GX Stratix))
- Higher logic density than Stratix GX 10K variant (vs EP1SGX10DF672C7N)
- Same 672-FBGA footprint across the Stratix GX family (vs EP1SGX25DF1020C7N)
설계 노트
The EP1SGX25DF672C7N with active transceivers can dissipate 5-8 W under typical workloads, scaling up with transceiver utilization and logic toggle rates. The 672-FBGA package requires a multi-layer PCB thermal solution including thermal vias under the exposed die pad and adequate copper pour on inner/outer layers. Designers must consult Altera's PowerPlay early power estimation tools in Quartus II before PCB layout to size the thermal solution correctly.
The 672-FBGA package with 1.0 mm pitch demands HDI PCB stack-up with microvia-in-pad technology for breakout routing. Each BGA ball requires at least one ground via for signal return paths and power decoupling. Maintain 100 µF of bulk decoupling per power rail (VCCINT, VCCIO, VCCA, VCCP) with 0.1 µF and 1 nF high-frequency capacitors placed as close as possible to the package balls. Reference the Altera Stratix GX hardware reference design for stack-up recommendations.
Transceiver channels must be routed with controlled-impedance differential pairs (typically 100 Ω differential) with matched lengths within a lane (intra-pair skew < 1 ps) and inter-lane matching per protocol specification. Use loss-controlled PCB material such as Megtron 6 or Rogers RO4350B for channels exceeding 10 Gbps·inch. Transceiver reference clocks require dedicated low-jitter oscillators (typical 100 MHz, < 1 ps RMS jitter) routed with isolation from switching signals.
Common pitfalls include: (1) failing to use Altera's configuration device (EPC16 or EPCS) for fast parallel configuration, leading to slow serial boot times; (2) ignoring the JTAG chain topology and TDI/TDO pin assignment that creates configuration failures; (3) overlooking the special power-up sequencing requirements for VCCINT before VCCIO; (4) using non-IBIS-validated models for backplane channel simulation. Always validate the complete reference design flow with Quartus II before committing to layout.
규정 준수 정보
RoHS-compliant per Altera/Intel product page; lead-free BGA balls. AEC-Q100 not applicable for FPGAs. REACH status not explicitly confirmed in available data. Last Time Buy status as of 2026-09-07.