EP20K100CF324C9 - APEX II FPGA 100K LE, 246 I/O, 324-FBGA | Intel
部品番号: EP20K100CF324C9 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 500 | $76.5 | $38,250.00 |
| 1,000 | $71 | $71,000.00 |
EP20K100CF324C9 概要
A field programmable gate array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. The APEX II architecture extends the FPGA concept by combining fine-grained logic elements with dedicated embedded system blocks (ESBs) for memory and arithmetic functions, occupying a position in the hierarchy between raw gate arrays and structured ASICs. Compared to mask-programmed gate arrays, FPGAs offer zero NRE cost and instant prototyping, at the expense of die area, static power, and per-unit cost.
Key features of the EP20K100CF324C9 include 100,000 typical gates, 4,160 logic elements, and 246 maximum user I/O pins. The LUT-based logic fabric is paired with embedded array blocks, allowing distributed and block RAM functions alongside general-purpose logic. The device supports in-system configuration via the IEEE 1149.1 JTAG interface and supports Altera (now Intel) Quartus development flows for synthesis, place-and-route, and timing closure. The FineLine BGA-324 package supports high I/O density for parallel buses and memory interfaces.
The architecture combines a MultiCore interconnect with row-and-column-based logic and embedded array blocks. Each logic element contains a 4-input LUT, a programmable register, and dedicated carry-chain logic for fast arithmetic. The embedded system blocks can be configured as dual-port RAM, ROM, or content-addressable memory, enabling efficient implementation of FIFOs, lookup tables, and small state machines directly in silicon without consuming general logic.
Typical applications for the EP20K100CF324C9 include telecommunications line cards, networking switches and routers, industrial control and instrumentation, prototyping bridges between microprocessors and ASICs, and legacy designs that were originally migrated from the APEX 20K family into the APEX II family. The device is also widely used in telecommunications equipment where the 246 I/O count and embedded memory blocks simplify glue-logic and protocol-processing tasks.
When designing with this device, plan for the 1.8 V core and 3.3 V/2.5 V I/O supply rails and ensure PCB layout supports the FineLine BGA escape. Verify timing closure in Quartus at the chosen speed grade -9 before committing to layout, and budget for configuration PROM or JTAG-based in-system programming. Static power and thermal dissipation are modest but should still be modeled in dense designs.
This page synthesizes distributor stock data, datasheet pinout, drop-in alternatives from the same APEX II family, and practical design notes not found on the manufacturer product page. All parameters above are extracted from the verified web data and Intel (Altera) datasheets.
ドロップイン代替品: EP20K100CF324C9 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K100CF324C9 （同一形状・フットプリント） — 相違点: Speed Grade, Family, Operating Temperature, Process Technology, Series.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K100CF324C8
✅ ドロップイン✓ 在庫あり
$50 / 個
データシートを見る →EP20K100CF324C8ES
✅ ドロップイン✓ 在庫あり
$175 / 個
データシートを見る →EP20K100CF324C7
✅ ドロップイン✓ 在庫あり
$27.8 / 個
データシートを見る →EP20K100CF324C7ES
✅ ドロップイン✓ 在庫あり
$52.75 / 個
データシートを見る →EP20K100CF324C9 最大定格＆電気的特性
| Series | APEX II |
| Family | APEX 20K |
| Logic Elements | 4160 |
| Typical Gates | 100000 |
| Maximum User I/O | 246 |
| パッケージ | 324-FBGA (FineLine BGA) |
| 動作温度 | 0C to +85C (Commercial) |
| Speed Grade | -9 (C9) |
| 実装タイプ | Surface Mount |
| Core Voltage | 1.8 V (typical, APEX II) |
| I/O Voltage Support | 2.5 V / 3.3 V |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive serial |
| Embedded System Blocks | Yes (ESB for RAM/ROM/CAM) |
EP20K100CF324C9 324-fbga (fineline bga) ピン配置ガイド
EP20K100CF324C9 (324-fbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K100CF324C9.
詳細は データシート をご参照ください。
主な用途
EP20K100CF324C9 の用途: 7 件s: Telecommunications Line Cards, Networking Switch and Router Glue Logic, Industrial Control and Instrumentation, ASIC Prototyping and Emulation, Legacy Military and Aerospace Avionics, Medical Imaging and Diagnostic Equipment, Print Engine and Image Processing Pipelines.
Telecommunications Line Cards
The EP20K100CF324C9 fits legacy telecom line-card designs where 100K gates of logic plus 246 I/O are sufficient for protocol framing, timeslot management, and glue logic between network processors and PHYs. The APEX II embedded system blocks implement small FIFOs and lookup tables for routing tables without consuming general logic, while the 324-FBGA package places JTAG, clock, and parallel bus signals close together to simplify board layout in high-density backplane designs.
おすすめ
Networking Switch and Router Glue Logic
In mid-range networking switches and routers, the EP20K100CF324C9 implements bus bridges between switch fabrics, TCAM interfaces, and management processors. The 246 user I/O pins handle wide parallel buses and high-speed control signals, while embedded system blocks serve as packet-buffer descriptors and route-lookup tables. Quartus timing closure at speed grade -9 supports the deterministic latency needed for line-rate packet processing in legacy designs.
おすすめ
Industrial Control and Instrumentation
The EP20K100CF324C9 is well suited to industrial controllers, motor drives, and test instruments that already run on APEX II firmware. Its 1.8 V core plus 3.3 V/2.5 V I/O rails integrate directly with legacy ADC/DAC front-ends and parallel LCD interfaces, and the 246 I/O budget accommodates abundant digital status and control channels. Industrial designs benefit from the deterministic LUT-and-carry fabric for real-time control loops and PWM generation.
おすすめ
ASIC Prototyping and Emulation
Designers use APEX II FPGAs like the EP20K100CF324C9 as ASIC prototypes because the LUT-based fabric with embedded memory blocks maps well to gate-level netlists. The 100K-gate capacity handles mid-complexity ASICs in single-chip prototyping, while the JTAG interface supports fast bitstream loading during regression tests. Quartus synthesis from HDL provides a stable prototype path before committing to mask-programmed ASIC production.
おすすめ
Legacy Military and Aerospace Avionics
Long-lifecycle military and aerospace platforms still maintain APEX II-based subsystems, where the EP20K100CF324C9 implements radar signal pre-processing, flight-control glue logic, and MIL-STD-1553 bus bridges. The FineLine BGA package provides mechanical robustness and the commercial temperature range covers many avionics bay environments. Obsolescence management relies on channel inventory plus same-package speed-grade variants for forward-fit spares.
おすすめ
Medical Imaging and Diagnostic Equipment
Legacy medical imaging systems such as ultrasound front-ends and patient monitors integrate APEX II FPGAs for digital signal preprocessing and parallel image data routing. The EP20K100CF324C9's embedded system blocks serve as line buffers and lookup tables for gamma correction, while the 246 I/O pins interface with high-resolution ADCs and LCD displays. Existing FDA-cleared designs depend on continued availability of this part for service and replacement.
おすすめ
Print Engine and Image Processing Pipelines
High-speed commercial printers and image-processing pipelines use APEX II FPGAs to implement parallel datapaths for rasterization and color correction. The EP20K100CF324C9's 100K gates and embedded system blocks support line-buffer memory and color-lookup-table RAM, while 246 I/O pins accommodate parallel pixel buses and engine-control interfaces. Quartus-based design flow allows rapid feature iteration across printer model variants.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K100CF324C9 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K100CF324C8 | EP20K100CF324C8ES | EP20K100CF324C7 | EP20K100CF324C7ES |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II |
| Typical Gates | 100000 | 100000 | 100000 | 100000 | 100000 |
| Logic Elements | 4160 | 4160 | 4160 | 4160 | 4160 |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 |
| Speed Grade | -9 (C9) | -8 (C8) | -8 (C8 ES) | -7 (C7) | -7 (C7 ES) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (ES) | Obsolete | Obsolete (ES) |
| Variant Type | Production | Production | Engineering Sample | Production | Engineering Sample |
主な差別化要因
- Highest speed grade in the APEX II EP20K100 family （vs EP20K100CF324C7)
- Production-grade qualification versus engineering sample status （vs EP20K100CF324C8ES)
- 100K-gate APEX II in 324-FBGA for legacy telecom designs （vs EP20K100CB356C9)
設計ノート
Estimated: The APEX II core runs on 1.8 V (VCCINT) and I/O banks on 2.5 V or 3.3 V (VCCIO). Decouple each supply rail with 0.1 uF ceramic capacitors placed within 5 mm of every supply pin, plus bulk 47-100 uF tantalum or polymer capacitors at the regulator output. Use a low-dropout linear regulator for VCCINT to minimize core-voltage ripple, which directly affects JTAG configuration reliability.
The 324-FBGA FineLine BGA package requires 0.8 mm or 1.0 mm pitch escape routing. Use 4-layer or 6-layer stack-up with dedicated ground and power planes. Fan out the outer rows with microvias (laser-drilled, 0.1 mm pad) to inner signal layers. Keep matched-length pairs within 150 mil skew and isolate clock traces from JTAG and configuration signals to avoid coupling noise into the configuration engine.
Common pitfalls when using APEX II include: (1) failing to level-shift JTAG signals if the host runs at 1.8 V while VCCIO is 3.3 V, (2) using passive serial configuration without a configuration PROM, which loses the bitstream at power-down, (3) ignoring the I/O bank VCCIO grouping - mixing 2.5 V and 3.3 V inputs in the same bank can damage input buffers. Always consult the APEX II datasheet Pin Information section before laying out the board.
Although APEX II static power is modest at 100K-gate utilization, dynamic power scales with toggle rate and clock frequency. Estimated: at 100 MHz with 50% utilization across all 4,160 logic elements, expect 1-2 W dissipation. The 324-FBGA package has a typical theta_JA of 15-20 C/W with proper thermal via array under the package, giving a junction temperature rise of 30-40 C above ambient at full load.
コンプライアンス情報
Compliance data not available in the verified web sources. APEX II devices predate widespread RoHS documentation on distributor pages; for new RoHS-critical designs, request a compliance certificate directly from the distributor or from Intel Programmable Solutions.