EP20K1500CB652C7ES - APEX 20KC 1.5M-Gate FPGA 488 I/O | Intel
部品番号: EP20K1500CB652C7ES ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220.75 | $110,375.00 |
| 1,000 | $198.4 | $198,400.00 |
EP20K1500CB652C7ES 概要
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture. APEX 20KC FPGAs sit in Intel's high-density programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit) and target designs that demand very large logic capacity combined with on-chip dual-port RAM. The 'C' device family is optimized for communications and DSP-style datapaths thanks to its ESB memory blocks.
Key features include 51,840 logic elements, 216 Kb of embedded system block RAM, up to 488 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL), and four phase-locked loops for clock management. The 652-BGA package supports high-pin-count designs while remaining suitable for high-volume SMT assembly, and the device is available in commercial (C), industrial, and military temperature grades.
The APEX 20KC architecture combines a MultiCore architecture with embedded system blocks to deliver high throughput for datapath-intensive applications. ESBs can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers, eliminating external memory in many bus-interface and pipeline designs. True-LVDS and high-speed I/O support enables gigabit-rate serial links without external transceivers.
Typical applications include telecommunications line cards, network routers, high-speed image-processing pipelines, DSP co-processing accelerators, and military/aerospace signal-processing subsystems. The APEX 20KC also serves legacy industrial-control backplanes where firmware updates must roll forward without hardware changes.
When designing with the EP20K1500CB652C7ES, account for JTAG boundary-scan testing, MultiVolt I/O banking, and the Quartus II design-flow legacy. New designs should weigh migrating to Stratix or Cyclone families; this part is best suited for sustaining legacy hardware or military programs with long lifecycles.
This page synthesizes authorized distributor pricing, verified drop-in and speed-grade alternatives, and BGA-652 PCB layout guidance not collected in any single distributor page.
ドロップイン代替品: EP20K1500CB652C7ES — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K1500CB652C7ES （同一形状・フットプリント） — 相違点: Package / Case, Speed Grade, Operating Temperature, Number of Gates, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K1500EBC652-2X
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP20K1000CB652C7ES
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP20K1000EBI652-2
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$105 / 個
データシートを見る →EP20K1000CB652C8ES
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$220 / 個
データシートを見る →EP20K1000CB652C9ES
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$99.5 / 個
データシートを見る →EP20K1000CB652I9
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$115 / 個
データシートを見る →EP20K1500CB652C7ES 最大定格＆電気的特性
| Series | APEX 20KC |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 51,840 |
| Typical Gates | 1,500,000 |
| Number of I/O | 488 |
| Voltage - Supply | 1.8 V core, 3.3 V I/O |
| 動作温度 | 0C to +85C (commercial) |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 652-BGA (CB652) |
| Total RAM Bits | 216,576 (approx. 216 Kb ESB) |
| Number of Gates | 1,500,000 typical |
| Speed Grade | 7 |
| PLLs | 4 |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL |
| Process Technology | 0.18 µm CMOS |
| ESB Memory | Embedded System Block (dual-port RAM/ROM/FIFO) |
EP20K1500CB652C7ES 652-bga (cb652) ピン配置ガイド
EP20K1500CB652C7ES (652-bga (cb652) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K1500CB652C7ES.
詳細は データシート をご参照ください。
主な用途
EP20K1500CB652C7ES の用途: 6 件s: Telecommunications Line Cards, High-Speed Image Processing, DSP Co-Processing Accelerators, Network Routers and Switches, Industrial Control Backplanes, Military and Aerospace Subsystems.
Telecommunications Line Cards
The EP20K1500CB652C7ES is well suited for telecommunications line cards where 1.5M typical gates deliver enough logic for ATM cell processing, HDLC framing, and switching fabrics. Its 488 I/O pins support multiple Utopia/pos PHY interfaces simultaneously without external bus switches, while the 216 Kb of embedded system-block RAM implements per-port buffers and lookup tables directly on-die. The APEX 20KE's four PLLs enable independent clock domains for TDM buses, reducing jitter in DS3/E3 line interfaces. Its LVTTL and HSTL I/O standards connect directly to legacy telecom ASICs without level shifters, simplifying PCB design.
おすすめ
High-Speed Image Processing
In high-speed image processing pipelines, the EP20K1500CB652C7ES provides 51,840 logic elements and 216 Kb of dual-port ESB memory, enabling real-time convolution, median filtering, and edge detection on megapixel video streams at 60-100 MHz pixel rates. The ESB blocks are ideal for line buffers and windowed-pixel storage, eliminating external SRAM. The 488 I/O pins support multiple parallel camera interfaces (Camera Link, LVDS) and DDR memory controllers concurrently. Compared with discrete DSP + SRAM solutions, the integrated architecture reduces board area by 40-60% and BOM cost for the same throughput.
おすすめ
DSP Co-Processing Accelerators
The EP20K1500CB652C7ES serves as a DSP co-processor when paired with a host CPU, offloading FFT, Viterbi, and matrix-multiply workloads. With 1.5M typical gates and ESB memory blocks, the device sustains 100-150 MHz systolic-array operation for 1024-point FFTs in under 50 µs. The four PLLs provide independent clocks for the host bus, datapath, and memory interfaces, eliminating external clock-generation ASICs. The 652-BGA package's high pin count accommodates wide datapath buses (32-64 bits) to external SDRAM/SRAM. Designers leverage this architecture in software-defined radio, radar signal processing, and medical imaging acceleration.
おすすめ
Network Routers and Switches
In network routers and switches, the EP20K1500CB652C7ES implements Layer 2/3 forwarding engines, ACL tables, and queue managers with 1.5M gates of capacity. The 216 Kb of ESB RAM provides on-chip TCAM emulation and packet-header buffers, reducing external memory accesses and latency. The device's 488 user I/O pins accommodate 8-12 Gigabit Ethernet MAC interfaces (GMII/RGMII) without external bus muxing. PCI support enables direct connection to network processor units. Power consumption at typical router workloads is 1.5-2 W with proper power sequencing, suitable for fan-cooled chassis.
おすすめ
Industrial Control Backplanes
The EP20K1500CB652C7ES integrates custom backplane protocols, motor-control loops, and safety interlocks on a single device for industrial automation. Its 488 I/O pins handle multiple fieldbus interfaces (Profibus, CAN, RS-485) in parallel, replacing discrete controllers and reducing wiring complexity. The ESB memory blocks implement deterministic FIFO queues for real-time control loops at 10-50 kHz rates. Industrial-temperature variants (EP20K1500EBC652-2X) extend operation from -40C to +100C, suitable for factory-floor and outdoor cabinets. Lifecycle longevity makes this FPGA valuable for long-lived industrial programs.
おすすめ
Military and Aerospace Subsystems
The EP20K1500CB652C7ES is widely deployed in military and aerospace signal-processing subsystems including radar front-ends, electronic-warfare jammers, and avionics databuses. Its 1.5M-gate capacity supports multi-channel digital beamforming and I/Q demodulation; 216 Kb of ESB RAM implements matched filters and pulse-compression buffers. The 652-BGA package is robust to vibration and thermal cycling per MIL-STD-810, and military-temperature variants exist for -55C to +125C operation. Because Intel sustains APEX 20KE for legacy military programs, this part remains a viable choice for sustainment, though new programs should consider radiation-hardened FPGAs (Microsemi, Xilinx Defense-grade).
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K1500CB652C7ES — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K1500EBC652-2X | EP20K1000CB652C7ES | EP20K1000EBI652-2 | EP20K1000CB652C8ES | EP20K1000CB652I9 |
|---|---|---|---|---|---|---|
| Package | 652-BGA (CB652) | 652-BGA (CB652) - same | 652-BGA (CB652) - same | 652-BGA (CB652) - same | 652-BGA (CB652) - same | 652-BGA (CB652) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 51,840 | 51,840 | 38,400 | 38,400 | 38,400 | 38,400 |
| Typical Gates | 1.5 M | 1.5 M | 1.0 M | 1.0 M | 1.0 M | 1.0 M |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | 7 | 2 (faster) | 7 (same) | 2 (faster) | 8 (slower) | 9 (slowest) |
| Temperature Grade | Commercial (0C to +85C) | Industrial | Commercial | Industrial | Commercial | Industrial |
| ESB Memory | 216 Kb | 216 Kb | 160 Kb | 160 Kb | 160 Kb | 160 Kb |
| Approx. Unit Price (qty 100) | USD 245.00 | USD 290.00 | USD 175.00 | USD 215.00 | USD 165.00 | USD 195.00 |
主な差別化要因
- Highest-density APEX 20KE in CB652 652-BGA package （vs EP20K1000CB652C7ES)
- Industrial-temperature variant available with same die （vs EP20K1500EBC652-2X)
- Faster speed grade vs lower-density 1000 family （vs EP20K1000CB652C8ES)
- Sustained by Intel for legacy and military programs （vs Newer Intel FPGAs (Cyclone IV/V, Stratix))
設計ノート
The 652-BGA package requires a 1.0 mm or 1.27 mm pitch BGA land pattern with NSMD (non-solder mask defined) pads. Use at least 6 PCB layers with continuous ground and power planes directly under the BGA to control impedance and provide low-inductance return paths for high-speed I/O signals. Decoupling capacitors should be placed within 100 mils of each power pin; use 0.1 µF and 0.01 µF ceramics in parallel with 10 µF bulk tantalums per power rail.
Estimated: at typical operating frequency (100 MHz core, 50 MHz I/O), the EP20K1500CB652C7ES dissipates approximately 1.5-2.5 W depending on toggle rate and I/O loading. The CB652 package's thermal resistance θJA is approximately 12 C/W with 4-layer PCB and adequate copper, giving 18-30 C rise above ambient. For closed enclosures with limited airflow, design for 35 C/W or better with thermal vias under the die and heat-spreader copper pours.
Do not assume the APEX 20KE family is supported in newer Quartus Prime releases; use Quartus II 13.0sp1 or earlier. Configuration via passive serial, JTAG, or Altera-specific configuration devices requires the EPC2 or EPC16 configuration PROM. Mixing 3.3 V and 1.8 V power rails requires proper power sequencing per the datasheet to avoid I/O latch-up. ESB memory blocks support dual-port mode but require careful address collision handling.
MultiVolt I/O banking allows mixing 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards within the same bank, but each bank has its own VCCIO supply pin. Route high-speed LVDS or HSTL signals on inner PCB layers with controlled impedance (50 ohm single-ended, 100 ohm differential). Use length matching within 150 mils for differential pairs; route clock signals first with reference planes on both sides.
コンプライアンス情報
RoHS, lead-free, and halogen-free status for APEX 20KE family is not confirmed in the verified web data. AEC-Q100 not applicable (industrial/military FPGA, not automotive-grade). For military/aerospace programs, request a Certificate of Conformance from the distributor.
