EP20K1000CB652C8ES - APEX 20KC FPGA 1M Gates 652-BGA | Intel
MPN: EP20K1000CB652C8ES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $278 | $2,780.00 |
| 100 | $255 | $25,500.00 |
| 250 | $238 | $59,500.00 |
| 500 | $220 | $110,000.00 |
Drop-in alternatives for EP20K1000CB652C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K1000CB652C7NJ
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175 / Unit
View Datasheet →EP20K1000CB652C7NJ
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175 / Unit
View Datasheet →EP20K1000CB652C8
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K1000CB652I8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K1000CF672C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$245.09 / Unit
View Datasheet →EP20K1000CB652C8ES Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 38,400 |
| System Gates | 1,000,000 (1M) |
| Embedded Memory (RAM bits) | 327,680 (plus 1,521,600 including parity) |
| Embedded System Blocks (ESBs) | 88 |
| User I/Os | 488 |
| PLLs | 4 |
| DLLs / LVDS Channels | 4 LVDS |
| Core Voltage | 1.8 V |
| Process Technology | 0.15 µm all-layer copper |
| Max Internal Frequency | 301.21 MHz |
| Propagation Delay | 1.6 ns |
| Package | 652-BGA (FCBGA, 45 x 45 mm, 1.27 mm pitch) |
| Operating Temperature | 0 °C to 85 °C (Commercial, C8 speed grade) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL |
EP20K1000CB652C8ES 652-bga (fcbga, 45 x 45 mm, 1.27 mm pitch) Pin Configuration Guide
Complete pinout information for EP20K1000CB652C8ES (652-bga (fcbga, 45 x 45 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CB652C8ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CB652C8ES is suitable for 6 applications: Telecommunication Line Card Design, ASIC Prototyping and Emulation, Industrial Control and Automation, Military / Aerospace Legacy Avionics, DSP Co-Processing and Software-Defined Radio, High-Speed Data Acquisition Front Ends.
Telecommunication Line Card Design
The EP20K1000CB652C8ES's 38,400 logic elements, 488 user I/Os, and 4 LVDS channels make it a strong fit for telecom line-card prototyping where multi-channel serial interfaces aggregate TDM, SONET/SDH, or Ethernet traffic. The 4 PLLs provide independent clock synthesis for backplane and fabric domains. Compared with newer Cyclone families, the APEX 20KC's MultiVolt I/O (1.5 V to 3.3 V) simplifies bridging between legacy 3.3 V PHY devices and 1.8 V core logic without external level shifters. Designers typically instantiate multiple soft UTOPIA, POS-PHY, or SPI-4.2 cores alongside the embedded system blocks, which double as packet-buffer RAM. This part is a fit for maintaining legacy OC-48 / STM-16 line cards where existing firmware, host drivers, and PCBs were validated against the APEX 20KC silicon.
Recommended
ASIC Prototyping and Emulation
With 1 million system gates of programmable logic, the EP20K1000CB652C8ES has historically been used as an ASIC prototyping vehicle for sub-million-gate designs. Engineers partition the target ASIC into multiple APEX 20KC devices using the MultiVolt and MultiDevice configuration flows of Quartus II. The 1.6 ns propagation delay and 301 MHz maximum internal frequency support pre-silicon verification of ARM, DSP, and PCI cores at near-real-time speeds. The 652-ball FCBGA's 488 user I/Os deliver enough off-chip bandwidth to map ASIC pin-outs directly. For new ASIC prototyping projects, Intel Stratix IV/V emulation boards offer higher density, but the EP20K1000 remains a cost-effective choice for legacy emulation flows and university teaching labs.
Recommended
Industrial Control and Automation
The EP20K1000CB652C8ES suits industrial automation systems that require a flexible, software-upgradable control plane and a high count of parallel I/O channels. With 488 user I/Os and PCI/LVTTL-compatible I/O standards, it can directly interface stepper-motor drivers, PLC I/O racks, and industrial sensors without external bus expanders. The 88 Embedded System Blocks provide 4 Kbit memory usable as lookup tables for motor-control waveform synthesis or as PID coefficient storage. Operating from 0 °C to 85 °C (C8 commercial grade), it covers most factory-floor enclosures. For new industrial designs the Cyclone V or Cyclone 10 LP families are preferred, but the EP20K1000CB652C8ES remains a drop-in solution for upgrading installed control boards.
Recommended
Military / Aerospace Legacy Avionics
Although the EP20K1000CB652C8ES is a commercial-temperature part (C8 grade), the APEX 20KC family has been used in avionics and military systems that require software-upgradable signal processing. The 4 LVDS channels support ARINC 429 and MIL-STD-1553 bridges at moderate bit rates, while the 1.6 ns propagation delay is sufficient for radar front-end timing. Because the part is now in Last-Time-Buy status, long-life programs (15-25 year support windows) typically place last-time-buy orders and bank stock. For new aerospace designs, consider the radiation-tolerant Microsemi/RTAX or Xilinx Virtex-5QV families, but the EP20K1000CB652C8ES is a known-quantity solution for existing platforms.
Recommended
DSP Co-Processing and Software-Defined Radio
The EP20K1000CB652C8ES integrates 88 Embedded System Blocks that can each be configured as a hardware multiplier, giving the device sufficient DSP throughput for multi-channel baseband processing in software-defined radio and audio processing. Its 4 PLLs and 4 LVDS channels let designers connect to external ADC/DAC devices such as the AD9857 or AD6620 over high-speed serial links. The 327,680 RAM bits provide ample sample buffering for FIR filters and FFT cores. Although modern Cyclone V/10 devices offer higher DSP block density per Watt, the EP20K1000CB652C8ES continues to support legacy SDR and audio DSP reference designs that were validated against Altera's IP cores.
Recommended
High-Speed Data Acquisition Front Ends
The EP20K1000CB652C8ES's 488 I/Os and LVDS capability enable aggregation of multiple high-speed ADC data streams into a single processing fabric. Each ESB can be used as a small dual-port RAM to buffer ADC samples while a soft DMA engine transfers them to external memory. The device's 301 MHz maximum internal frequency is sufficient for state-machine-based sequencing of ADC sample clocks and trigger logic. For multi-board systems the MultiVolt I/O simplifies interfacing 3.3 V ADCs with 1.8 V core logic. The part has been historically deployed in ultrasound front ends, oscilloscope acquisition boards, and camera-link aggregation systems.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CB652C8ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CB652C7 | EP20K1000CB652C7N | EP20K1000CB652C8 | EP20K1000CB652I8N | EP20K1000CF672C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 652-BGA (FCBGA, 45 x 45 mm) | 652-BGA (FCBGA, 45 x 45 mm) - same | 652-BGA (FCBGA, 45 x 45 mm) - same | 652-BGA (FCBGA, 45 x 45 mm) - same | 652-BGA (FCBGA, 45 x 45 mm) - same | 672-BGA (FCBGA) - different pinout |
| Logic Elements | 38,400 | 38,400 (same die) | 38,400 (same die) | 38,400 (same die) | 38,400 (same die) | 38,400 (same die) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 508 (different package) |
| Speed Grade | C8 (commercial) | C7 (commercial, ~12% faster) | C7 (commercial, ~12% faster) | C8 (commercial, identical to ES) | I8 (industrial -40 to +100 C) | C8 (commercial) |
| Operating Temperature | 0 to 85 C (commercial) | 0 to 85 C | 0 to 85 C | 0 to 85 C | -40 to +100 C (industrial) | 0 to 85 C |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Last-time-buy inventory only - higher unit price but known-quantity silicon for legacy system sustainment (vs EP20K1000CB652C7)
- Industrial temperature variant available in same CB652 package (vs EP20K1000CB652I8N)
- Smaller 488-I/O BGA footprint than the 508-I/O 672-BGA variant (vs EP20K1000CF672C8)
Design Notes
The EP20K1000CB652C8ES requires a 1.8 V core supply with a tolerance of +/-5% and a peak current of up to 5 A depending on toggle rate. Use a low-impedance decoupling network of 10 x 0.1 uF X7R plus 4 x 10 uF bulk ceramic capacitors placed within 5 mm of the BGA balls. The MultiVolt I/O banks operate from 1.5 V, 1.8 V, 2.5 V, or 3.3 V supplies - each bank must be powered independently and brought up in sequence (typically 1.8 V core first, then I/O VCCIO) to avoid latch-up. Always consult the Quartus II PowerPlay analyzer for design-specific dynamic power estimation.
The 652-ball FCBGA package dissipates heat primarily through the BGA balls and PCB copper planes. Maximum junction temperature is 125 C; thermal resistance (theta_JA) on a standard 8-layer JEDEC test board is approximately 12 C/W. For continuous operation at 5 W dissipation, design with at least four 4 x 4 thermal via arrays (0.3 mm pitch) under the central BGA region connected to internal copper planes. Forced airflow of 200 LFM is recommended in enclosed chassis. Use the device thermal-diode input (TMP_DIODE) with an external temperature sensor for dynamic thermal monitoring.
The CB652 FCBGA uses 1.27 mm ball pitch on a 45 x 45 mm substrate, which requires microvia (or via-in-pad) PCB technology for fan-out. Use a 6-8 layer stack-up with the BGA breakout layer as the second signal layer from the top. Maintain a 0.2 mm clearance between BGA pads and antipads, and route differential pairs (LVDS) with 100 ohm differential impedance and length matching within 1 mm. A continuous ground reference plane underneath the BGA improves both power integrity and EMI performance. The site lists EP20K1000CB652C7NJ as a related part already covered on XAIPART for cross-reference.
Do not assume that a newer Quartus Prime release will synthesize an APEX 20KC design - support was dropped after Quartus II 13.0sp1. Retain an older Quartus II installation for bitstream generation, or migrate to a supported family. Configuration via JTAG requires the nCONFIG pin to be tied high through a 10 kohm pull-up. Avoid tying MSEL pins to incompatible levels - C8 devices require MSEL[3:0] = 0100 for FPP x8 mode. For multi-FPGA prototyping boards, the EPC16 or EPC2 configuration PROM is required to chain bitstreams. The 'ES' suffix indicates an engineering sample - it is functionally equivalent to production silicon but is not recommended for volume manufacturing.
Compliance Information
RoHS and lead-free compliance per distributor listings. Halogen-free and conflict-minerals status are not explicitly stated in the verified data.
