EP2C5T144I8N - Cyclone II FPGA, 4,608 LEs, 144-TQFP | Intel
部品番号: EP2C5T144I8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.74 | $18.74 |
| 10 | $17.5 | $175.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $12.8 | $6,400.00 |
| 1,000 | $11.2 | $11,200.00 |
EP2C5T144I8N 概要
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor device containing an array of logic blocks (lookup tables, flip-flops, and routing) that can be programmed after manufacture to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits. The Cyclone II family positioned FPGAs as affordable alternatives to ASICs in cost-sensitive designs, making programmable logic accessible to consumer, industrial, and communications markets where earlier FPGAs had been economically impractical.
Key features include 4,608 LEs, 119,808 RAM bits distributed across M4K memory blocks, 13 embedded 18x18 multipliers for DSP-style workloads, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS. The device supports configuration via serial (AS) or parallel (PS) modes and contains built-in JTAG boundary-scan for in-system programming. Eight global clock networks plus two PLLs per quadrant (when present) simplify timing closure for synchronous designs across the 144-pin footprint.
Architecturally, Cyclone II uses a 90 nm process with a Stratix-derived routing fabric adapted for low-cost positioning. Multipliers are wired to 9-Kbit memory blocks, enabling efficient DSP and FIFO implementations without consuming logic fabric. Internal configuration bits are stored in SRAM, requiring an external configuration flash or download cable on every power-up.
Typical applications include industrial motor control, low-cost video processing, protocol bridging, USB and Ethernet interface logic, educational FPGA development boards, and consumer electronics glue logic. The wide operating temperature range also supports outdoor industrial deployments.
When designing with this device, verify that the I/O bank voltage references match the chosen signaling standard; mis-referenced VCCIO rails are a common board-bring-up failure. Also confirm the configuration scheme (AS vs PS) supports your boot-time budget.
This page synthesizes distributor pricing, functional equivalents within the same Cyclone II family, and PCB-reuse design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: EP2C5T144I8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2C5T144I8N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP2C5T144C8N
✅ ドロップイン✓ 在庫あり
$19.8 / 個
データシートを見る →EP2C5T144C7N
✅ ドロップイン✓ 在庫あり
$12.4 / 個
データシートを見る →EP2C5T144C6N
✅ ドロップイン✓ 在庫あり
$5.1 / 個
データシートを見る →EP2C5T144I8
✅ ドロップイン✓ 在庫あり
$11.83 / 個
データシートを見る →EP2C8T144I8N
✅ ドロップイン✓ 在庫あり
$17.5 / 個
データシートを見る →EP2C8T144C8N
✅ ドロップイン✓ 在庫あり
$41.5 / 個
データシートを見る →EP2C5T144I8N 最大定格＆電気的特性
| Family | Cyclone II |
| Logic Elements (LEs) | 4,608 |
| Embedded Memory | 119,808 bits (~117 Kbits) |
| Embedded Multipliers | 13 (18x18) |
| Maximum User I/O | 89 |
| PLLs | 2 |
| Core Voltage | 1.2 V |
| 動作温度 | -40C to +85C (Industrial) |
| パッケージ | 144-LQFP (TQFP) 22x22 mm |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 |
| Process Node | 90 nm |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) |
EP2C5T144I8N ピン構成
| ピン 1 | I/O — General purpose user I/O (Bank 1) |
| ピン 2 | I/O — General purpose user I/O (Bank 1) |
| ピン 3 | I/O — General purpose user I/O (Bank 1) |
| ピン 4 | I/O — General purpose user I/O (Bank 1) |
| ピン 5 | I/O — General purpose user I/O (Bank 1) |
| ピン 6 | I/O — General purpose user I/O (Bank 1) |
| ピン 7 | VCCIO1 — I/O bank 1 supply reference |
| ピン 8 | I/O — General purpose user I/O (Bank 1) |
| ピン 9 | I/O — General purpose user I/O (Bank 1) |
| ピン 10 | I/O — General purpose user I/O (Bank 1) |
| ピン 11 | GND — Ground |
| ピン 12 | I/O — General purpose user I/O (Bank 1) |
| ピン 13 | I/O — General purpose user I/O (Bank 1) |
| ピン 14 | I/O — General purpose user I/O (Bank 1) |
| ピン 15 | I/O — General purpose user I/O (Bank 1) |
| ピン 16 | I/O — General purpose user I/O (Bank 1) |
| ピン 17 | I/O — General purpose user I/O (Bank 1) |
| ピン 18 | I/O — General purpose user I/O (Bank 1) |
| ピン 19 | I/O — General purpose user I/O (Bank 1) |
| ピン 20 | I/O — General purpose user I/O (Bank 1) |
| ピン 21 | GND — Ground |
| ピン 22 | I/O — General purpose user I/O (Bank 2) |
| ピン 23 | I/O — General purpose user I/O (Bank 2) |
| ピン 24 | I/O — General purpose user I/O (Bank 2) |
| ピン 25 | I/O — General purpose user I/O (Bank 2) |
| ピン 26 | I/O — General purpose user I/O (Bank 2) |
| ピン 27 | I/O — General purpose user I/O (Bank 2) |
| ピン 28 | VCCIO2 — I/O bank 2 supply reference |
| ピン 29 | I/O — General purpose user I/O (Bank 2) |
| ピン 30 | I/O — General purpose user I/O (Bank 2) |
| ピン 31 | I/O — General purpose user I/O (Bank 2) |
| ピン 32 | I/O — General purpose user I/O (Bank 2) |
| ピン 33 | GND — Ground |
| ピン 34 | I/O — General purpose user I/O (Bank 2) |
| ピン 35 | I/O — General purpose user I/O (Bank 2) |
| ピン 36 | I/O — General purpose user I/O (Bank 2) |
| ピン 37 | I/O — General purpose user I/O (Bank 2) |
| ピン 38 | I/O — General purpose user I/O (Bank 2) |
| ピン 39 | I/O — General purpose user I/O (Bank 2) |
| ピン 40 | I/O — General purpose user I/O (Bank 2) |
| ピン 41 | I/O — General purpose user I/O (Bank 2) |
| ピン 42 | I/O — General purpose user I/O (Bank 2) |
| ピン 43 | GND — Ground |
| ピン 44 | I/O — General purpose user I/O (Bank 3) |
| ピン 45 | I/O — General purpose user I/O (Bank 3) |
| ピン 46 | I/O — General purpose user I/O (Bank 3) |
| ピン 47 | I/O — General purpose user I/O (Bank 3) |
| ピン 48 | I/O — General purpose user I/O (Bank 3) |
| ピン 49 | VCCIO3 — I/O bank 3 supply reference |
| ピン 50 | I/O — General purpose user I/O (Bank 3) |
| ピン 51 | I/O — General purpose user I/O (Bank 3) |
| ピン 52 | I/O — General purpose user I/O (Bank 3) |
| ピン 53 | I/O — General purpose user I/O (Bank 3) |
| ピン 54 | GND — Ground |
| ピン 55 | I/O — General purpose user I/O (Bank 3) |
| ピン 56 | I/O — General purpose user I/O (Bank 3) |
| ピン 57 | I/O — General purpose user I/O (Bank 3) |
| ピン 58 | I/O — General purpose user I/O (Bank 3) |
| ピン 59 | I/O — General purpose user I/O (Bank 3) |
| ピン 60 | I/O — General purpose user I/O (Bank 3) |
| ピン 61 | I/O — General purpose user I/O (Bank 3) |
| ピン 62 | I/O — General purpose user I/O (Bank 3) |
| ピン 63 | I/O — General purpose user I/O (Bank 3) |
| ピン 64 | I/O — General purpose user I/O (Bank 3) |
| ピン 65 | I/O — General purpose user I/O (Bank 3) |
| ピン 66 | I/O — General purpose user I/O (Bank 3) |
| ピン 67 | GND — Ground |
| ピン 68 | I/O — General purpose user I/O (Bank 4) |
| ピン 69 | I/O — General purpose user I/O (Bank 4) |
| ピン 70 | I/O — General purpose user I/O (Bank 4) |
| ピン 71 | I/O — General purpose user I/O (Bank 4) |
| ピン 72 | I/O — General purpose user I/O (Bank 4) |
| ピン 73 | I/O — General purpose user I/O (Bank 4) |
| ピン 74 | I/O — General purpose user I/O (Bank 4) |
| ピン 75 | VCCIO4 — I/O bank 4 supply reference |
| ピン 76 | I/O — General purpose user I/O (Bank 4) |
| ピン 77 | I/O — General purpose user I/O (Bank 4) |
| ピン 78 | I/O — General purpose user I/O (Bank 4) |
| ピン 79 | GND — Ground |
| ピン 80 | I/O — General purpose user I/O (Bank 4) |
| ピン 81 | I/O — General purpose user I/O (Bank 4) |
| ピン 82 | I/O — General purpose user I/O (Bank 4) |
| ピン 83 | I/O — General purpose user I/O (Bank 4) |
| ピン 84 | I/O — General purpose user I/O (Bank 4) |
| ピン 85 | I/O — General purpose user I/O (Bank 4) |
| ピン 86 | I/O — General purpose user I/O (Bank 4) |
| ピン 87 | I/O — General purpose user I/O (Bank 4) |
| ピン 88 | I/O — General purpose user I/O (Bank 4) |
| ピン 89 | GND — Ground |
| ピン 90 | nCONFIG — Configuration control (active low) |
| ピン 91 | nSTATUS — Configuration status (active low) |
| ピン 92 | CONFIG_DONE — Configuration done indicator |
| ピン 93 | TDI — JTAG test data in |
| ピン 94 | TMS — JTAG test mode select |
| ピン 95 | TCK — JTAG test clock |
| ピン 96 | TDO — JTAG test data out |
| ピン 97 | GND — Ground |
| ピン 98 | MSEL0 — Configuration mode select 0 |
| ピン 99 | MSEL1 — Configuration mode select 1 |
| ピン 100 | MSEL2 — Configuration mode select 2 |
| ピン 101 | DATA0 — Configuration data input (AS/PS) |
| ピン 102 | DCLK — Configuration clock |
| ピン 103 | nCS — Serial configuration chip select |
| ピン 104 | ASDO — Active serial data out |
| ピン 105 | VCCINT — Core supply 1.2 V |
| ピン 106 | GND — Ground |
| ピン 107 | I/O — General purpose user I/O (Bank 4) |
| ピン 108 | I/O — General purpose user I/O (Bank 4) |
| ピン 109 | I/O — General purpose user I/O (Bank 4) |
| ピン 110 | I/O — General purpose user I/O (Bank 4) |
| ピン 111 | I/O — General purpose user I/O (Bank 4) |
| ピン 112 | I/O — General purpose user I/O (Bank 4) |
| ピン 113 | I/O — General purpose user I/O (Bank 4) |
| ピン 114 | I/O — General purpose user I/O (Bank 4) |
| ピン 115 | I/O — General purpose user I/O (Bank 4) |
| ピン 116 | I/O — General purpose user I/O (Bank 4) |
| ピン 117 | I/O — General purpose user I/O (Bank 4) |
| ピン 118 | I/O — General purpose user I/O (Bank 4) |
| ピン 119 | I/O — General purpose user I/O (Bank 4) |
| ピン 120 | I/O — General purpose user I/O (Bank 4) |
| ピン 121 | GND — Ground |
| ピン 122 | I/O — General purpose user I/O (Bank 4) |
| ピン 123 | I/O — General purpose user I/O (Bank 4) |
| ピン 124 | I/O — General purpose user I/O (Bank 4) |
| ピン 125 | I/O — General purpose user I/O (Bank 4) |
| ピン 126 | I/O — General purpose user I/O (Bank 4) |
| ピン 127 | VCCINT — Core supply 1.2 V |
| ピン 128 | I/O — General purpose user I/O (Bank 4) |
| ピン 129 | I/O — General purpose user I/O (Bank 4) |
| ピン 130 | I/O — General purpose user I/O (Bank 4) |
| ピン 131 | I/O — General purpose user I/O (Bank 4) |
| ピン 132 | I/O — General purpose user I/O (Bank 4) |
| ピン 133 | GND — Ground |
| ピン 134 | I/O — General purpose user I/O (Bank 1) |
| ピン 135 | I/O — General purpose user I/O (Bank 1) |
| ピン 136 | I/O — General purpose user I/O (Bank 1) |
| ピン 137 | I/O — General purpose user I/O (Bank 1) |
| ピン 138 | I/O — General purpose user I/O (Bank 1) |
| ピン 139 | VCCIO1 — I/O bank 1 supply reference |
| ピン 140 | I/O — General purpose user I/O (Bank 1) |
| ピン 141 | I/O — General purpose user I/O (Bank 1) |
| ピン 142 | I/O — General purpose user I/O (Bank 1) |
| ピン 143 | I/O — General purpose user I/O (Bank 1) |
| ピン 144 | GND — Ground |
主な用途
EP2C5T144I8N の用途: 6 件s: Industrial Motor Control, Low-Cost Video Processing Bridge, Protocol Bridging (USB / Ethernet / UART), Educational FPGA Development Boards, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic.
Industrial Motor Control
The EP2C5T144I8N fits industrial motor-control designs because its 4,608 LEs and 13 embedded 18x18 multipliers are sufficient for field-oriented control (FOC) algorithms, encoder decoding, and PWM generation on a single chip. The industrial -40C to +85C temperature range covers cabinet-mounted drives, and the 89 user I/O pins handle quadrature encoder inputs, Hall sensors, and gate-driver enable signals. Compared with a microcontroller, this FPGA can execute the control loop at much higher PWM frequencies (above 100 kHz), reducing audible switching noise and improving torque ripple. Power estimation per Cyclone II datasheet: 1.2 V core at typical 250 mA plus I/O bank current. Place bypass capacitors as close to each VCCIO and VCCINT pin pair as the 144-TQFP land pattern allows.
おすすめ
Low-Cost Video Processing Bridge
The EP2C5T144I8N is widely used as a video-format bridge (BT.656 to parallel RGB, or HDMI input to LVDS output) in cost-sensitive consumer and prosumer products. The 4,608 LEs hold a line buffer plus color-space conversion, and the M4K memory blocks provide FIFO buffering of video lines. LVDS support in selected I/O banks permits direct connection to LVDS panels without external buffers. Engineers should budget 25-30% LE utilization for typical color-space conversion plus timing controller logic, leaving headroom for additional overlay or graphics processing. The 144-TQFP package is hand-solderable for prototype builds, which is unusual for an FPGA of this density.
おすすめ
Protocol Bridging (USB / Ethernet / UART)
When a host processor lacks a particular peripheral, the EP2C5T144I8N can implement glue logic that bridges between standards - for example, USB 2.0 high-speed to parallel FIFO, or 100 Mbit Ethernet MAC plus UDP offload. The device's JTAG interface enables in-field firmware updates, and 119,808 bits of embedded RAM comfortably hold packet buffers for typical industrial protocols. Designers should use Altera's soft IP cores (Nios II, Triple-Speed Ethernet, USB) with Quartus II 13.0sp1, the last version with full Cyclone II support. Power sequencing: bring up VCCINT (1.2 V) before VCCIO and CONF_DONE pin within 100 ms of configuration start.
おすすめ
Educational FPGA Development Boards
Universities and hobbyists favor the EP2C5T144I8N because it balances density, hand-solderability, and price. The 144-TQFP is the largest pitch that is still practical to hand-solder with a fine-tip iron, and 4,608 LEs is enough to teach a full RISC-V soft core, VGA controller, and audio pipeline simultaneously. Reference designs ship with EPCS4 configuration flash, 50 MHz clock, SRAM, LEDs, and pushbuttons, allowing students to focus on HDL rather than board bring-up. Quartus II Web Edition remains free and supports this device without a license, which keeps the total learning cost minimal.
おすすめ
Consumer Electronics Glue Logic
In consumer products such as set-top boxes, printers, and home appliances, the EP2C5T144I8N replaces multiple discrete logic ICs by integrating level shifting, display timing, button debouncing, and LED control. Consolidation from 4-6 standard-logic chips to one FPGA reduces PCB area, BOM count, and assembly cost. The industrial temperature variant (this part) is preferred for products sold into global markets where warehouse and shipping conditions may briefly exceed commercial-grade limits. Estimated static power: ~50 mW at typical use; dynamic power depends on toggle rate and should be simulated with the Quartus PowerPlay tool.
おすすめ
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EP2C5T144I8N to implement custom stimulus generation, response capture, and protocol-aware handshake logic between the device under test (DUT) and the host. The 13 embedded multipliers can compute CRC, checksum, or simple FFT pre-processing in-line with sample acquisition, while M4K blocks provide double buffering. With 89 user I/O pins the FPGA can directly drive up to 11 LVDS pairs (using LVDS in supported banks) or 89 single-ended signals, often sufficient to replace a mid-range ASIC in low-volume test gear.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2C5T144I8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2C5T144C8N | EP2C5T144C7N | EP2C5T144I8 | EP2C8T144I8N | EP2C8T144C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 | 8,256 |
| Embedded Memory | 119,808 bits | 119,808 bits | 119,808 bits | 119,808 bits | 165,888 bits | 165,888 bits |
| Embedded Multipliers (18x18) | 13 | 13 | 13 | 13 | 18 | 18 |
| User I/O Pins | 89 | 89 | 89 | 89 | 85 | 85 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 8 | 8 | 7 | 8 | 8 | 8 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主な差別化要因
- Industrial temperature range in the 144-TQFP package （vs EP2C5T144C8N)
- Same-package density upgrade path （vs EP2C5T144I8 vs EP2C8T144I8N)
- Hand-solderable TQFP package （vs EP2C5F256I8N (FBGA-256))
設計ノート
Estimated: Cyclone II core current at typical 4,608-LE utilization is roughly 200-300 mA from a 1.2 V VCCINT rail; each VCCIO bank adds up to 100 mA depending on toggle rate. Provide a 1.2 V LDO or switching regulator rated for at least 500 mA, and add 0.1 uF ceramic bypass capacitors within 5 mm of every VCCINT and VCCIO pin. Decoupling values: one 10 uF bulk + one 0.1 uF per pin pair is the conservative Cyclone II recommendation.
The 144-TQFP 22x22 mm package uses 0.5 mm pitch leads; route with 0.15 mm/6 mil traces and use a 4-layer PCB with continuous ground plane beneath the device for return-current control. All eight GND pins must be soldered to the ground plane with multiple vias to reduce inductance. Place the EPCS configuration flash within 25 mm of the FPGA, keep DCLK short, and add a 25-50 ohm series termination on DCLK if the trace exceeds 50 mm.
Configuration fails on first power-up if VCCINT and VCCIO rise-time relationships are violated: VCCINT must reach 1.0 V within 100 ms and VCCIO must follow within 100 ms afterward. Stratix II and Cyclone II use different MSEL pull-up/pull-down schemes; verify MSEL[2:0] against the Cyclone II handbook (not Cyclone III/IV) before board fab. Avoid leaving unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up to prevent shoot-through during configuration.
Estimated: at maximum junction temperature +85C industrial limit, the 144-TQFP requires approximately 26 C/W theta_JA still-air thermal resistance to keep die temperature below 85C when dissipating 1 W. Cyclone II typically dissipates 0.5-1.5 W at moderate utilization, so no heatsink is needed but PCB copper area (at least 4 sq cm on top layer) is recommended for margin. Forced airflow is rarely required unless utilization exceeds 80%.
コンプライアンス情報
RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified - choose EP2C5AT144A7N for automotive. Halogen-free status not explicitly declared; default treated as unknown per data authenticity rules.
