EP2C5T144I8N - Cyclone II FPGA, 4,608 LEs, 144-TQFP | Intel
Référence : EP2C5T144I8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.74 | $18,74 |
| 10 | $17.5 | $175,00 |
| 100 | $14.95 | $1 495,00 |
| 500 | $12.8 | $6 400,00 |
| 1 000 | $11.2 | $11 200,00 |
EP2C5T144I8N Présentation
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor device containing an array of logic blocks (lookup tables, flip-flops, and routing) that can be programmed after manufacture to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits. The Cyclone II family positioned FPGAs as affordable alternatives to ASICs in cost-sensitive designs, making programmable logic accessible to consumer, industrial, and communications markets where earlier FPGAs had been economically impractical.
Key features include 4,608 LEs, 119,808 RAM bits distributed across M4K memory blocks, 13 embedded 18x18 multipliers for DSP-style workloads, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS. The device supports configuration via serial (AS) or parallel (PS) modes and contains built-in JTAG boundary-scan for in-system programming. Eight global clock networks plus two PLLs per quadrant (when present) simplify timing closure for synchronous designs across the 144-pin footprint.
Architecturally, Cyclone II uses a 90 nm process with a Stratix-derived routing fabric adapted for low-cost positioning. Multipliers are wired to 9-Kbit memory blocks, enabling efficient DSP and FIFO implementations without consuming logic fabric. Internal configuration bits are stored in SRAM, requiring an external configuration flash or download cable on every power-up.
Typical applications include industrial motor control, low-cost video processing, protocol bridging, USB and Ethernet interface logic, educational FPGA development boards, and consumer electronics glue logic. The wide operating temperature range also supports outdoor industrial deployments.
When designing with this device, verify that the I/O bank voltage references match the chosen signaling standard; mis-referenced VCCIO rails are a common board-bring-up failure. Also confirm the configuration scheme (AS vs PS) supports your boot-time budget.
This page synthesizes distributor pricing, functional equivalents within the same Cyclone II family, and PCB-reuse design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP2C5T144I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C5T144I8N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C5T144C8N
✅ Remplacement direct✓ En stock
$19.8 / unité
Voir la fiche technique →EP2C5T144C7N
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →EP2C5T144C6N
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →EP2C5T144I8
✅ Remplacement direct✓ En stock
$11.83 / unité
Voir la fiche technique →EP2C8T144I8N
✅ Remplacement direct✓ En stock
$17.5 / unité
Voir la fiche technique →EP2C8T144C8N
✅ Remplacement direct✓ En stock
$41.5 / unité
Voir la fiche technique →EP2C5T144I8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements (LEs) | 4,608 |
| Embedded Memory | 119,808 bits (~117 Kbits) |
| Embedded Multipliers | 13 (18x18) |
| Maximum User I/O | 89 |
| PLLs | 2 |
| Core Voltage | 1.2 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 144-LQFP (TQFP) 22x22 mm |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Process Node | 90 nm |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) |
Configuration des broches de EP2C5T144I8N
| Broche 1 | I/O — General purpose user I/O (Bank 1) |
| Broche 2 | I/O — General purpose user I/O (Bank 1) |
| Broche 3 | I/O — General purpose user I/O (Bank 1) |
| Broche 4 | I/O — General purpose user I/O (Bank 1) |
| Broche 5 | I/O — General purpose user I/O (Bank 1) |
| Broche 6 | I/O — General purpose user I/O (Bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply reference |
| Broche 8 | I/O — General purpose user I/O (Bank 1) |
| Broche 9 | I/O — General purpose user I/O (Bank 1) |
| Broche 10 | I/O — General purpose user I/O (Bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — General purpose user I/O (Bank 1) |
| Broche 13 | I/O — General purpose user I/O (Bank 1) |
| Broche 14 | I/O — General purpose user I/O (Bank 1) |
| Broche 15 | I/O — General purpose user I/O (Bank 1) |
| Broche 16 | I/O — General purpose user I/O (Bank 1) |
| Broche 17 | I/O — General purpose user I/O (Bank 1) |
| Broche 18 | I/O — General purpose user I/O (Bank 1) |
| Broche 19 | I/O — General purpose user I/O (Bank 1) |
| Broche 20 | I/O — General purpose user I/O (Bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — General purpose user I/O (Bank 2) |
| Broche 23 | I/O — General purpose user I/O (Bank 2) |
| Broche 24 | I/O — General purpose user I/O (Bank 2) |
| Broche 25 | I/O — General purpose user I/O (Bank 2) |
| Broche 26 | I/O — General purpose user I/O (Bank 2) |
| Broche 27 | I/O — General purpose user I/O (Bank 2) |
| Broche 28 | VCCIO2 — I/O bank 2 supply reference |
| Broche 29 | I/O — General purpose user I/O (Bank 2) |
| Broche 30 | I/O — General purpose user I/O (Bank 2) |
| Broche 31 | I/O — General purpose user I/O (Bank 2) |
| Broche 32 | I/O — General purpose user I/O (Bank 2) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — General purpose user I/O (Bank 2) |
| Broche 35 | I/O — General purpose user I/O (Bank 2) |
| Broche 36 | I/O — General purpose user I/O (Bank 2) |
| Broche 37 | I/O — General purpose user I/O (Bank 2) |
| Broche 38 | I/O — General purpose user I/O (Bank 2) |
| Broche 39 | I/O — General purpose user I/O (Bank 2) |
| Broche 40 | I/O — General purpose user I/O (Bank 2) |
| Broche 41 | I/O — General purpose user I/O (Bank 2) |
| Broche 42 | I/O — General purpose user I/O (Bank 2) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — General purpose user I/O (Bank 3) |
| Broche 45 | I/O — General purpose user I/O (Bank 3) |
| Broche 46 | I/O — General purpose user I/O (Bank 3) |
| Broche 47 | I/O — General purpose user I/O (Bank 3) |
| Broche 48 | I/O — General purpose user I/O (Bank 3) |
| Broche 49 | VCCIO3 — I/O bank 3 supply reference |
| Broche 50 | I/O — General purpose user I/O (Bank 3) |
| Broche 51 | I/O — General purpose user I/O (Bank 3) |
| Broche 52 | I/O — General purpose user I/O (Bank 3) |
| Broche 53 | I/O — General purpose user I/O (Bank 3) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — General purpose user I/O (Bank 3) |
| Broche 56 | I/O — General purpose user I/O (Bank 3) |
| Broche 57 | I/O — General purpose user I/O (Bank 3) |
| Broche 58 | I/O — General purpose user I/O (Bank 3) |
| Broche 59 | I/O — General purpose user I/O (Bank 3) |
| Broche 60 | I/O — General purpose user I/O (Bank 3) |
| Broche 61 | I/O — General purpose user I/O (Bank 3) |
| Broche 62 | I/O — General purpose user I/O (Bank 3) |
| Broche 63 | I/O — General purpose user I/O (Bank 3) |
| Broche 64 | I/O — General purpose user I/O (Bank 3) |
| Broche 65 | I/O — General purpose user I/O (Bank 3) |
| Broche 66 | I/O — General purpose user I/O (Bank 3) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — General purpose user I/O (Bank 4) |
| Broche 69 | I/O — General purpose user I/O (Bank 4) |
| Broche 70 | I/O — General purpose user I/O (Bank 4) |
| Broche 71 | I/O — General purpose user I/O (Bank 4) |
| Broche 72 | I/O — General purpose user I/O (Bank 4) |
| Broche 73 | I/O — General purpose user I/O (Bank 4) |
| Broche 74 | I/O — General purpose user I/O (Bank 4) |
| Broche 75 | VCCIO4 — I/O bank 4 supply reference |
| Broche 76 | I/O — General purpose user I/O (Bank 4) |
| Broche 77 | I/O — General purpose user I/O (Bank 4) |
| Broche 78 | I/O — General purpose user I/O (Bank 4) |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — General purpose user I/O (Bank 4) |
| Broche 81 | I/O — General purpose user I/O (Bank 4) |
| Broche 82 | I/O — General purpose user I/O (Bank 4) |
| Broche 83 | I/O — General purpose user I/O (Bank 4) |
| Broche 84 | I/O — General purpose user I/O (Bank 4) |
| Broche 85 | I/O — General purpose user I/O (Bank 4) |
| Broche 86 | I/O — General purpose user I/O (Bank 4) |
| Broche 87 | I/O — General purpose user I/O (Bank 4) |
| Broche 88 | I/O — General purpose user I/O (Bank 4) |
| Broche 89 | GND — Ground |
| Broche 90 | nCONFIG — Configuration control (active low) |
| Broche 91 | nSTATUS — Configuration status (active low) |
| Broche 92 | CONFIG_DONE — Configuration done indicator |
| Broche 93 | TDI — JTAG test data in |
| Broche 94 | TMS — JTAG test mode select |
| Broche 95 | TCK — JTAG test clock |
| Broche 96 | TDO — JTAG test data out |
| Broche 97 | GND — Ground |
| Broche 98 | MSEL0 — Configuration mode select 0 |
| Broche 99 | MSEL1 — Configuration mode select 1 |
| Broche 100 | MSEL2 — Configuration mode select 2 |
| Broche 101 | DATA0 — Configuration data input (AS/PS) |
| Broche 102 | DCLK — Configuration clock |
| Broche 103 | nCS — Serial configuration chip select |
| Broche 104 | ASDO — Active serial data out |
| Broche 105 | VCCINT — Core supply 1.2 V |
| Broche 106 | GND — Ground |
| Broche 107 | I/O — General purpose user I/O (Bank 4) |
| Broche 108 | I/O — General purpose user I/O (Bank 4) |
| Broche 109 | I/O — General purpose user I/O (Bank 4) |
| Broche 110 | I/O — General purpose user I/O (Bank 4) |
| Broche 111 | I/O — General purpose user I/O (Bank 4) |
| Broche 112 | I/O — General purpose user I/O (Bank 4) |
| Broche 113 | I/O — General purpose user I/O (Bank 4) |
| Broche 114 | I/O — General purpose user I/O (Bank 4) |
| Broche 115 | I/O — General purpose user I/O (Bank 4) |
| Broche 116 | I/O — General purpose user I/O (Bank 4) |
| Broche 117 | I/O — General purpose user I/O (Bank 4) |
| Broche 118 | I/O — General purpose user I/O (Bank 4) |
| Broche 119 | I/O — General purpose user I/O (Bank 4) |
| Broche 120 | I/O — General purpose user I/O (Bank 4) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — General purpose user I/O (Bank 4) |
| Broche 123 | I/O — General purpose user I/O (Bank 4) |
| Broche 124 | I/O — General purpose user I/O (Bank 4) |
| Broche 125 | I/O — General purpose user I/O (Bank 4) |
| Broche 126 | I/O — General purpose user I/O (Bank 4) |
| Broche 127 | VCCINT — Core supply 1.2 V |
| Broche 128 | I/O — General purpose user I/O (Bank 4) |
| Broche 129 | I/O — General purpose user I/O (Bank 4) |
| Broche 130 | I/O — General purpose user I/O (Bank 4) |
| Broche 131 | I/O — General purpose user I/O (Bank 4) |
| Broche 132 | I/O — General purpose user I/O (Bank 4) |
| Broche 133 | GND — Ground |
| Broche 134 | I/O — General purpose user I/O (Bank 1) |
| Broche 135 | I/O — General purpose user I/O (Bank 1) |
| Broche 136 | I/O — General purpose user I/O (Bank 1) |
| Broche 137 | I/O — General purpose user I/O (Bank 1) |
| Broche 138 | I/O — General purpose user I/O (Bank 1) |
| Broche 139 | VCCIO1 — I/O bank 1 supply reference |
| Broche 140 | I/O — General purpose user I/O (Bank 1) |
| Broche 141 | I/O — General purpose user I/O (Bank 1) |
| Broche 142 | I/O — General purpose user I/O (Bank 1) |
| Broche 143 | I/O — General purpose user I/O (Bank 1) |
| Broche 144 | GND — Ground |
Applications typiques
EP2C5T144I8N convient pour 6 applications: Industrial Motor Control, Low-Cost Video Processing Bridge, Protocol Bridging (USB / Ethernet / UART), Educational FPGA Development Boards, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic.
Industrial Motor Control
The EP2C5T144I8N fits industrial motor-control designs because its 4,608 LEs and 13 embedded 18x18 multipliers are sufficient for field-oriented control (FOC) algorithms, encoder decoding, and PWM generation on a single chip. The industrial -40C to +85C temperature range covers cabinet-mounted drives, and the 89 user I/O pins handle quadrature encoder inputs, Hall sensors, and gate-driver enable signals. Compared with a microcontroller, this FPGA can execute the control loop at much higher PWM frequencies (above 100 kHz), reducing audible switching noise and improving torque ripple. Power estimation per Cyclone II datasheet: 1.2 V core at typical 250 mA plus I/O bank current. Place bypass capacitors as close to each VCCIO and VCCINT pin pair as the 144-TQFP land pattern allows.
Recommandé
Low-Cost Video Processing Bridge
The EP2C5T144I8N is widely used as a video-format bridge (BT.656 to parallel RGB, or HDMI input to LVDS output) in cost-sensitive consumer and prosumer products. The 4,608 LEs hold a line buffer plus color-space conversion, and the M4K memory blocks provide FIFO buffering of video lines. LVDS support in selected I/O banks permits direct connection to LVDS panels without external buffers. Engineers should budget 25-30% LE utilization for typical color-space conversion plus timing controller logic, leaving headroom for additional overlay or graphics processing. The 144-TQFP package is hand-solderable for prototype builds, which is unusual for an FPGA of this density.
Recommandé
Protocol Bridging (USB / Ethernet / UART)
When a host processor lacks a particular peripheral, the EP2C5T144I8N can implement glue logic that bridges between standards - for example, USB 2.0 high-speed to parallel FIFO, or 100 Mbit Ethernet MAC plus UDP offload. The device's JTAG interface enables in-field firmware updates, and 119,808 bits of embedded RAM comfortably hold packet buffers for typical industrial protocols. Designers should use Altera's soft IP cores (Nios II, Triple-Speed Ethernet, USB) with Quartus II 13.0sp1, the last version with full Cyclone II support. Power sequencing: bring up VCCINT (1.2 V) before VCCIO and CONF_DONE pin within 100 ms of configuration start.
Recommandé
Educational FPGA Development Boards
Universities and hobbyists favor the EP2C5T144I8N because it balances density, hand-solderability, and price. The 144-TQFP is the largest pitch that is still practical to hand-solder with a fine-tip iron, and 4,608 LEs is enough to teach a full RISC-V soft core, VGA controller, and audio pipeline simultaneously. Reference designs ship with EPCS4 configuration flash, 50 MHz clock, SRAM, LEDs, and pushbuttons, allowing students to focus on HDL rather than board bring-up. Quartus II Web Edition remains free and supports this device without a license, which keeps the total learning cost minimal.
Recommandé
Consumer Electronics Glue Logic
In consumer products such as set-top boxes, printers, and home appliances, the EP2C5T144I8N replaces multiple discrete logic ICs by integrating level shifting, display timing, button debouncing, and LED control. Consolidation from 4-6 standard-logic chips to one FPGA reduces PCB area, BOM count, and assembly cost. The industrial temperature variant (this part) is preferred for products sold into global markets where warehouse and shipping conditions may briefly exceed commercial-grade limits. Estimated static power: ~50 mW at typical use; dynamic power depends on toggle rate and should be simulated with the Quartus PowerPlay tool.
Recommandé
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EP2C5T144I8N to implement custom stimulus generation, response capture, and protocol-aware handshake logic between the device under test (DUT) and the host. The 13 embedded multipliers can compute CRC, checksum, or simple FFT pre-processing in-line with sample acquisition, while M4K blocks provide double buffering. With 89 user I/O pins the FPGA can directly drive up to 11 LVDS pairs (using LVDS in supported banks) or 89 single-ended signals, often sufficient to replace a mid-range ASIC in low-volume test gear.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C5T144I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C5T144C8N | EP2C5T144C7N | EP2C5T144I8 | EP2C8T144I8N | EP2C8T144C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 | 8,256 |
| Embedded Memory | 119,808 bits | 119,808 bits | 119,808 bits | 119,808 bits | 165,888 bits | 165,888 bits |
| Embedded Multipliers (18x18) | 13 | 13 | 13 | 13 | 18 | 18 |
| User I/O Pins | 89 | 89 | 89 | 89 | 85 | 85 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 8 | 8 | 7 | 8 | 8 | 8 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Industrial temperature range in the 144-TQFP package (vs EP2C5T144C8N)
- Same-package density upgrade path (vs EP2C5T144I8 vs EP2C8T144I8N)
- Hand-solderable TQFP package (vs EP2C5F256I8N (FBGA-256))
Notes de conception
Estimated: Cyclone II core current at typical 4,608-LE utilization is roughly 200-300 mA from a 1.2 V VCCINT rail; each VCCIO bank adds up to 100 mA depending on toggle rate. Provide a 1.2 V LDO or switching regulator rated for at least 500 mA, and add 0.1 uF ceramic bypass capacitors within 5 mm of every VCCINT and VCCIO pin. Decoupling values: one 10 uF bulk + one 0.1 uF per pin pair is the conservative Cyclone II recommendation.
The 144-TQFP 22x22 mm package uses 0.5 mm pitch leads; route with 0.15 mm/6 mil traces and use a 4-layer PCB with continuous ground plane beneath the device for return-current control. All eight GND pins must be soldered to the ground plane with multiple vias to reduce inductance. Place the EPCS configuration flash within 25 mm of the FPGA, keep DCLK short, and add a 25-50 ohm series termination on DCLK if the trace exceeds 50 mm.
Configuration fails on first power-up if VCCINT and VCCIO rise-time relationships are violated: VCCINT must reach 1.0 V within 100 ms and VCCIO must follow within 100 ms afterward. Stratix II and Cyclone II use different MSEL pull-up/pull-down schemes; verify MSEL[2:0] against the Cyclone II handbook (not Cyclone III/IV) before board fab. Avoid leaving unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up to prevent shoot-through during configuration.
Estimated: at maximum junction temperature +85C industrial limit, the 144-TQFP requires approximately 26 C/W theta_JA still-air thermal resistance to keep die temperature below 85C when dissipating 1 W. Cyclone II typically dissipates 0.5-1.5 W at moderate utilization, so no heatsink is needed but PCB copper area (at least 4 sq cm on top layer) is recommended for margin. Forced airflow is rarely required unless utilization exceeds 80%.
Informations de conformité
RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified - choose EP2C5AT144A7N for automotive. Halogen-free status not explicitly declared; default treated as unknown per data authenticity rules.