EP2C5T144I8N - Cyclone II FPGA, 4,608 LEs, 144-TQFP | Intel
Артикул: EP2C5T144I8N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.74 | $18,74 |
| 10 | $17.5 | $175,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $12.8 | $6.400,00 |
| 1.000 | $11.2 | $11.200,00 |
EP2C5T144I8N Обзор
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor device containing an array of logic blocks (lookup tables, flip-flops, and routing) that can be programmed after manufacture to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits. The Cyclone II family positioned FPGAs as affordable alternatives to ASICs in cost-sensitive designs, making programmable logic accessible to consumer, industrial, and communications markets where earlier FPGAs had been economically impractical.
Key features include 4,608 LEs, 119,808 RAM bits distributed across M4K memory blocks, 13 embedded 18x18 multipliers for DSP-style workloads, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS. The device supports configuration via serial (AS) or parallel (PS) modes and contains built-in JTAG boundary-scan for in-system programming. Eight global clock networks plus two PLLs per quadrant (when present) simplify timing closure for synchronous designs across the 144-pin footprint.
Architecturally, Cyclone II uses a 90 nm process with a Stratix-derived routing fabric adapted for low-cost positioning. Multipliers are wired to 9-Kbit memory blocks, enabling efficient DSP and FIFO implementations without consuming logic fabric. Internal configuration bits are stored in SRAM, requiring an external configuration flash or download cable on every power-up.
Typical applications include industrial motor control, low-cost video processing, protocol bridging, USB and Ethernet interface logic, educational FPGA development boards, and consumer electronics glue logic. The wide operating temperature range also supports outdoor industrial deployments.
When designing with this device, verify that the I/O bank voltage references match the chosen signaling standard; mis-referenced VCCIO rails are a common board-bring-up failure. Also confirm the configuration scheme (AS vs PS) supports your boot-time budget.
This page synthesizes distributor pricing, functional equivalents within the same Cyclone II family, and PCB-reuse design notes not consolidated in the manufacturer datasheet.
Аналоги без доработки для EP2C5T144I8N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP2C5T144I8N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP2C5T144C8N
✅ Прямая замена✓ В наличии
$19.8 / шт.
Открыть даташит →EP2C5T144C7N
✅ Прямая замена✓ В наличии
$12.4 / шт.
Открыть даташит →EP2C5T144C6N
✅ Прямая замена✓ В наличии
$5.1 / шт.
Открыть даташит →EP2C5T144I8
✅ Прямая замена✓ В наличии
$11.83 / шт.
Открыть даташит →EP2C8T144I8N
✅ Прямая замена✓ В наличии
$17.5 / шт.
Открыть даташит →EP2C8T144C8N
✅ Прямая замена✓ В наличии
$41.5 / шт.
Открыть даташит →EP2C5T144I8N Максимальные параметры и электрические характеристики
| Family | Cyclone II |
| Logic Elements (LEs) | 4,608 |
| Embedded Memory | 119,808 bits (~117 Kbits) |
| Embedded Multipliers | 13 (18x18) |
| Maximum User I/O | 89 |
| PLLs | 2 |
| Core Voltage | 1.2 V |
| Рабочая температура | -40C to +85C (Industrial) |
| Корпус | 144-LQFP (TQFP) 22x22 mm |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 |
| Process Node | 90 nm |
| Статус RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) |
Конфигурация выводов EP2C5T144I8N
| Контакт 1 | I/O — General purpose user I/O (Bank 1) |
| Контакт 2 | I/O — General purpose user I/O (Bank 1) |
| Контакт 3 | I/O — General purpose user I/O (Bank 1) |
| Контакт 4 | I/O — General purpose user I/O (Bank 1) |
| Контакт 5 | I/O — General purpose user I/O (Bank 1) |
| Контакт 6 | I/O — General purpose user I/O (Bank 1) |
| Контакт 7 | VCCIO1 — I/O bank 1 supply reference |
| Контакт 8 | I/O — General purpose user I/O (Bank 1) |
| Контакт 9 | I/O — General purpose user I/O (Bank 1) |
| Контакт 10 | I/O — General purpose user I/O (Bank 1) |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — General purpose user I/O (Bank 1) |
| Контакт 13 | I/O — General purpose user I/O (Bank 1) |
| Контакт 14 | I/O — General purpose user I/O (Bank 1) |
| Контакт 15 | I/O — General purpose user I/O (Bank 1) |
| Контакт 16 | I/O — General purpose user I/O (Bank 1) |
| Контакт 17 | I/O — General purpose user I/O (Bank 1) |
| Контакт 18 | I/O — General purpose user I/O (Bank 1) |
| Контакт 19 | I/O — General purpose user I/O (Bank 1) |
| Контакт 20 | I/O — General purpose user I/O (Bank 1) |
| Контакт 21 | GND — Ground |
| Контакт 22 | I/O — General purpose user I/O (Bank 2) |
| Контакт 23 | I/O — General purpose user I/O (Bank 2) |
| Контакт 24 | I/O — General purpose user I/O (Bank 2) |
| Контакт 25 | I/O — General purpose user I/O (Bank 2) |
| Контакт 26 | I/O — General purpose user I/O (Bank 2) |
| Контакт 27 | I/O — General purpose user I/O (Bank 2) |
| Контакт 28 | VCCIO2 — I/O bank 2 supply reference |
| Контакт 29 | I/O — General purpose user I/O (Bank 2) |
| Контакт 30 | I/O — General purpose user I/O (Bank 2) |
| Контакт 31 | I/O — General purpose user I/O (Bank 2) |
| Контакт 32 | I/O — General purpose user I/O (Bank 2) |
| Контакт 33 | GND — Ground |
| Контакт 34 | I/O — General purpose user I/O (Bank 2) |
| Контакт 35 | I/O — General purpose user I/O (Bank 2) |
| Контакт 36 | I/O — General purpose user I/O (Bank 2) |
| Контакт 37 | I/O — General purpose user I/O (Bank 2) |
| Контакт 38 | I/O — General purpose user I/O (Bank 2) |
| Контакт 39 | I/O — General purpose user I/O (Bank 2) |
| Контакт 40 | I/O — General purpose user I/O (Bank 2) |
| Контакт 41 | I/O — General purpose user I/O (Bank 2) |
| Контакт 42 | I/O — General purpose user I/O (Bank 2) |
| Контакт 43 | GND — Ground |
| Контакт 44 | I/O — General purpose user I/O (Bank 3) |
| Контакт 45 | I/O — General purpose user I/O (Bank 3) |
| Контакт 46 | I/O — General purpose user I/O (Bank 3) |
| Контакт 47 | I/O — General purpose user I/O (Bank 3) |
| Контакт 48 | I/O — General purpose user I/O (Bank 3) |
| Контакт 49 | VCCIO3 — I/O bank 3 supply reference |
| Контакт 50 | I/O — General purpose user I/O (Bank 3) |
| Контакт 51 | I/O — General purpose user I/O (Bank 3) |
| Контакт 52 | I/O — General purpose user I/O (Bank 3) |
| Контакт 53 | I/O — General purpose user I/O (Bank 3) |
| Контакт 54 | GND — Ground |
| Контакт 55 | I/O — General purpose user I/O (Bank 3) |
| Контакт 56 | I/O — General purpose user I/O (Bank 3) |
| Контакт 57 | I/O — General purpose user I/O (Bank 3) |
| Контакт 58 | I/O — General purpose user I/O (Bank 3) |
| Контакт 59 | I/O — General purpose user I/O (Bank 3) |
| Контакт 60 | I/O — General purpose user I/O (Bank 3) |
| Контакт 61 | I/O — General purpose user I/O (Bank 3) |
| Контакт 62 | I/O — General purpose user I/O (Bank 3) |
| Контакт 63 | I/O — General purpose user I/O (Bank 3) |
| Контакт 64 | I/O — General purpose user I/O (Bank 3) |
| Контакт 65 | I/O — General purpose user I/O (Bank 3) |
| Контакт 66 | I/O — General purpose user I/O (Bank 3) |
| Контакт 67 | GND — Ground |
| Контакт 68 | I/O — General purpose user I/O (Bank 4) |
| Контакт 69 | I/O — General purpose user I/O (Bank 4) |
| Контакт 70 | I/O — General purpose user I/O (Bank 4) |
| Контакт 71 | I/O — General purpose user I/O (Bank 4) |
| Контакт 72 | I/O — General purpose user I/O (Bank 4) |
| Контакт 73 | I/O — General purpose user I/O (Bank 4) |
| Контакт 74 | I/O — General purpose user I/O (Bank 4) |
| Контакт 75 | VCCIO4 — I/O bank 4 supply reference |
| Контакт 76 | I/O — General purpose user I/O (Bank 4) |
| Контакт 77 | I/O — General purpose user I/O (Bank 4) |
| Контакт 78 | I/O — General purpose user I/O (Bank 4) |
| Контакт 79 | GND — Ground |
| Контакт 80 | I/O — General purpose user I/O (Bank 4) |
| Контакт 81 | I/O — General purpose user I/O (Bank 4) |
| Контакт 82 | I/O — General purpose user I/O (Bank 4) |
| Контакт 83 | I/O — General purpose user I/O (Bank 4) |
| Контакт 84 | I/O — General purpose user I/O (Bank 4) |
| Контакт 85 | I/O — General purpose user I/O (Bank 4) |
| Контакт 86 | I/O — General purpose user I/O (Bank 4) |
| Контакт 87 | I/O — General purpose user I/O (Bank 4) |
| Контакт 88 | I/O — General purpose user I/O (Bank 4) |
| Контакт 89 | GND — Ground |
| Контакт 90 | nCONFIG — Configuration control (active low) |
| Контакт 91 | nSTATUS — Configuration status (active low) |
| Контакт 92 | CONFIG_DONE — Configuration done indicator |
| Контакт 93 | TDI — JTAG test data in |
| Контакт 94 | TMS — JTAG test mode select |
| Контакт 95 | TCK — JTAG test clock |
| Контакт 96 | TDO — JTAG test data out |
| Контакт 97 | GND — Ground |
| Контакт 98 | MSEL0 — Configuration mode select 0 |
| Контакт 99 | MSEL1 — Configuration mode select 1 |
| Контакт 100 | MSEL2 — Configuration mode select 2 |
| Контакт 101 | DATA0 — Configuration data input (AS/PS) |
| Контакт 102 | DCLK — Configuration clock |
| Контакт 103 | nCS — Serial configuration chip select |
| Контакт 104 | ASDO — Active serial data out |
| Контакт 105 | VCCINT — Core supply 1.2 V |
| Контакт 106 | GND — Ground |
| Контакт 107 | I/O — General purpose user I/O (Bank 4) |
| Контакт 108 | I/O — General purpose user I/O (Bank 4) |
| Контакт 109 | I/O — General purpose user I/O (Bank 4) |
| Контакт 110 | I/O — General purpose user I/O (Bank 4) |
| Контакт 111 | I/O — General purpose user I/O (Bank 4) |
| Контакт 112 | I/O — General purpose user I/O (Bank 4) |
| Контакт 113 | I/O — General purpose user I/O (Bank 4) |
| Контакт 114 | I/O — General purpose user I/O (Bank 4) |
| Контакт 115 | I/O — General purpose user I/O (Bank 4) |
| Контакт 116 | I/O — General purpose user I/O (Bank 4) |
| Контакт 117 | I/O — General purpose user I/O (Bank 4) |
| Контакт 118 | I/O — General purpose user I/O (Bank 4) |
| Контакт 119 | I/O — General purpose user I/O (Bank 4) |
| Контакт 120 | I/O — General purpose user I/O (Bank 4) |
| Контакт 121 | GND — Ground |
| Контакт 122 | I/O — General purpose user I/O (Bank 4) |
| Контакт 123 | I/O — General purpose user I/O (Bank 4) |
| Контакт 124 | I/O — General purpose user I/O (Bank 4) |
| Контакт 125 | I/O — General purpose user I/O (Bank 4) |
| Контакт 126 | I/O — General purpose user I/O (Bank 4) |
| Контакт 127 | VCCINT — Core supply 1.2 V |
| Контакт 128 | I/O — General purpose user I/O (Bank 4) |
| Контакт 129 | I/O — General purpose user I/O (Bank 4) |
| Контакт 130 | I/O — General purpose user I/O (Bank 4) |
| Контакт 131 | I/O — General purpose user I/O (Bank 4) |
| Контакт 132 | I/O — General purpose user I/O (Bank 4) |
| Контакт 133 | GND — Ground |
| Контакт 134 | I/O — General purpose user I/O (Bank 1) |
| Контакт 135 | I/O — General purpose user I/O (Bank 1) |
| Контакт 136 | I/O — General purpose user I/O (Bank 1) |
| Контакт 137 | I/O — General purpose user I/O (Bank 1) |
| Контакт 138 | I/O — General purpose user I/O (Bank 1) |
| Контакт 139 | VCCIO1 — I/O bank 1 supply reference |
| Контакт 140 | I/O — General purpose user I/O (Bank 1) |
| Контакт 141 | I/O — General purpose user I/O (Bank 1) |
| Контакт 142 | I/O — General purpose user I/O (Bank 1) |
| Контакт 143 | I/O — General purpose user I/O (Bank 1) |
| Контакт 144 | GND — Ground |
Типичное применение
EP2C5T144I8N подходит для 6 применениеs: Industrial Motor Control, Low-Cost Video Processing Bridge, Protocol Bridging (USB / Ethernet / UART), Educational FPGA Development Boards, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic.
Industrial Motor Control
The EP2C5T144I8N fits industrial motor-control designs because its 4,608 LEs and 13 embedded 18x18 multipliers are sufficient for field-oriented control (FOC) algorithms, encoder decoding, and PWM generation on a single chip. The industrial -40C to +85C temperature range covers cabinet-mounted drives, and the 89 user I/O pins handle quadrature encoder inputs, Hall sensors, and gate-driver enable signals. Compared with a microcontroller, this FPGA can execute the control loop at much higher PWM frequencies (above 100 kHz), reducing audible switching noise and improving torque ripple. Power estimation per Cyclone II datasheet: 1.2 V core at typical 250 mA plus I/O bank current. Place bypass capacitors as close to each VCCIO and VCCINT pin pair as the 144-TQFP land pattern allows.
Рекомендуется
Low-Cost Video Processing Bridge
The EP2C5T144I8N is widely used as a video-format bridge (BT.656 to parallel RGB, or HDMI input to LVDS output) in cost-sensitive consumer and prosumer products. The 4,608 LEs hold a line buffer plus color-space conversion, and the M4K memory blocks provide FIFO buffering of video lines. LVDS support in selected I/O banks permits direct connection to LVDS panels without external buffers. Engineers should budget 25-30% LE utilization for typical color-space conversion plus timing controller logic, leaving headroom for additional overlay or graphics processing. The 144-TQFP package is hand-solderable for prototype builds, which is unusual for an FPGA of this density.
Рекомендуется
Protocol Bridging (USB / Ethernet / UART)
When a host processor lacks a particular peripheral, the EP2C5T144I8N can implement glue logic that bridges between standards - for example, USB 2.0 high-speed to parallel FIFO, or 100 Mbit Ethernet MAC plus UDP offload. The device's JTAG interface enables in-field firmware updates, and 119,808 bits of embedded RAM comfortably hold packet buffers for typical industrial protocols. Designers should use Altera's soft IP cores (Nios II, Triple-Speed Ethernet, USB) with Quartus II 13.0sp1, the last version with full Cyclone II support. Power sequencing: bring up VCCINT (1.2 V) before VCCIO and CONF_DONE pin within 100 ms of configuration start.
Рекомендуется
Educational FPGA Development Boards
Universities and hobbyists favor the EP2C5T144I8N because it balances density, hand-solderability, and price. The 144-TQFP is the largest pitch that is still practical to hand-solder with a fine-tip iron, and 4,608 LEs is enough to teach a full RISC-V soft core, VGA controller, and audio pipeline simultaneously. Reference designs ship with EPCS4 configuration flash, 50 MHz clock, SRAM, LEDs, and pushbuttons, allowing students to focus on HDL rather than board bring-up. Quartus II Web Edition remains free and supports this device without a license, which keeps the total learning cost minimal.
Рекомендуется
Consumer Electronics Glue Logic
In consumer products such as set-top boxes, printers, and home appliances, the EP2C5T144I8N replaces multiple discrete logic ICs by integrating level shifting, display timing, button debouncing, and LED control. Consolidation from 4-6 standard-logic chips to one FPGA reduces PCB area, BOM count, and assembly cost. The industrial temperature variant (this part) is preferred for products sold into global markets where warehouse and shipping conditions may briefly exceed commercial-grade limits. Estimated static power: ~50 mW at typical use; dynamic power depends on toggle rate and should be simulated with the Quartus PowerPlay tool.
Рекомендуется
Test & Measurement Front-End Logic
Test instruments and ATE fixtures use the EP2C5T144I8N to implement custom stimulus generation, response capture, and protocol-aware handshake logic between the device under test (DUT) and the host. The 13 embedded multipliers can compute CRC, checksum, or simple FFT pre-processing in-line with sample acquisition, while M4K blocks provide double buffering. With 89 user I/O pins the FPGA can directly drive up to 11 LVDS pairs (using LVDS in supported banks) or 89 single-ended signals, often sufficient to replace a mid-range ASIC in low-volume test gear.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP2C5T144I8N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP2C5T144C8N | EP2C5T144C7N | EP2C5T144I8 | EP2C8T144I8N | EP2C8T144C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 | 8,256 |
| Embedded Memory | 119,808 bits | 119,808 bits | 119,808 bits | 119,808 bits | 165,888 bits | 165,888 bits |
| Embedded Multipliers (18x18) | 13 | 13 | 13 | 13 | 18 | 18 |
| User I/O Pins | 89 | 89 | 89 | 89 | 85 | 85 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 8 | 8 | 7 | 8 | 8 | 8 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Ключевые отличия
- Industrial temperature range in the 144-TQFP package (против EP2C5T144C8N)
- Same-package density upgrade path (против EP2C5T144I8 vs EP2C8T144I8N)
- Hand-solderable TQFP package (против EP2C5F256I8N (FBGA-256))
Заметки по проектированию
Estimated: Cyclone II core current at typical 4,608-LE utilization is roughly 200-300 mA from a 1.2 V VCCINT rail; each VCCIO bank adds up to 100 mA depending on toggle rate. Provide a 1.2 V LDO or switching regulator rated for at least 500 mA, and add 0.1 uF ceramic bypass capacitors within 5 mm of every VCCINT and VCCIO pin. Decoupling values: one 10 uF bulk + one 0.1 uF per pin pair is the conservative Cyclone II recommendation.
The 144-TQFP 22x22 mm package uses 0.5 mm pitch leads; route with 0.15 mm/6 mil traces and use a 4-layer PCB with continuous ground plane beneath the device for return-current control. All eight GND pins must be soldered to the ground plane with multiple vias to reduce inductance. Place the EPCS configuration flash within 25 mm of the FPGA, keep DCLK short, and add a 25-50 ohm series termination on DCLK if the trace exceeds 50 mm.
Configuration fails on first power-up if VCCINT and VCCIO rise-time relationships are violated: VCCINT must reach 1.0 V within 100 ms and VCCIO must follow within 100 ms afterward. Stratix II and Cyclone II use different MSEL pull-up/pull-down schemes; verify MSEL[2:0] against the Cyclone II handbook (not Cyclone III/IV) before board fab. Avoid leaving unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up to prevent shoot-through during configuration.
Estimated: at maximum junction temperature +85C industrial limit, the 144-TQFP requires approximately 26 C/W theta_JA still-air thermal resistance to keep die temperature below 85C when dissipating 1 W. Cyclone II typically dissipates 0.5-1.5 W at moderate utilization, so no heatsink is needed but PCB copper area (at least 4 sq cm on top layer) is recommended for margin. Forced airflow is rarely required unless utilization exceeds 80%.
Информация о соответствии
RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified - choose EP2C5AT144A7N for automotive. Halogen-free status not explicitly declared; default treated as unknown per data authenticity rules.