Intel

EP2C5T144I8N - Cyclone II FPGA, 4,608 LEs, 144-TQFP | Intel

N.º da peça: EP2C5T144I8N ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.2 V Vdss 144-LQFP (TQFP) 22x22 mm Package 119,808 bits (~117 Kbits) Memory
A partir de $11.2 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-08
Preços por volume
Qtd. Preço unitário Total
1 $18.74 $18,74
10 $17.5 $175,00
100 $14.95 $1.495,00
500 $12.8 $6.400,00
1.000 $11.2 $11.200,00
ℹ️ Todos os preços estão em USD

EP2C5T144I8N Visão geral

The Intel (formerly Altera) EP2C5T144I8N is a low-cost Cyclone II Field-Programmable Gate Array (FPGA) housed in a 144-pin TQFP package, offering 4,608 logic elements (LEs) and 119,808 bits (approximately 117 Kbits) of embedded memory. Built on a 1.2 V, low-power SRAM process, it operates over the industrial temperature range (-40C to +85C) and features 89 user I/O pins with LVDS support in select banks, delivering a balance of density, performance, and cost for high-volume applications.

What is an FPGA? A Field-Programmable Gate Array is a reconfigurable semiconductor device containing an array of logic blocks (lookup tables, flip-flops, and routing) that can be programmed after manufacture to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits. The Cyclone II family positioned FPGAs as affordable alternatives to ASICs in cost-sensitive designs, making programmable logic accessible to consumer, industrial, and communications markets where earlier FPGAs had been economically impractical.

Key features include 4,608 LEs, 119,808 RAM bits distributed across M4K memory blocks, 13 embedded 18x18 multipliers for DSP-style workloads, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS. The device supports configuration via serial (AS) or parallel (PS) modes and contains built-in JTAG boundary-scan for in-system programming. Eight global clock networks plus two PLLs per quadrant (when present) simplify timing closure for synchronous designs across the 144-pin footprint.

Architecturally, Cyclone II uses a 90 nm process with a Stratix-derived routing fabric adapted for low-cost positioning. Multipliers are wired to 9-Kbit memory blocks, enabling efficient DSP and FIFO implementations without consuming logic fabric. Internal configuration bits are stored in SRAM, requiring an external configuration flash or download cable on every power-up.

Typical applications include industrial motor control, low-cost video processing, protocol bridging, USB and Ethernet interface logic, educational FPGA development boards, and consumer electronics glue logic. The wide operating temperature range also supports outdoor industrial deployments.

When designing with this device, verify that the I/O bank voltage references match the chosen signaling standard; mis-referenced VCCIO rails are a common board-bring-up failure. Also confirm the configuration scheme (AS vs PS) supports your boot-time budget.

This page synthesizes distributor pricing, functional equivalents within the same Cyclone II family, and PCB-reuse design notes not consolidated in the manufacturer datasheet.

Alternativas drop-in para EP2C5T144I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP2C5T144I8N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.

Altera
Package: LQFP-144 (T144) 20x20 mm, 0.5 mm pitch
Operating Temperature: 0C to +85C (commercial)
Process Technology: TSMC 90 nm low-k
Comparar com EP2C5T144I8N →
Altera
Package: 144-LQFP (TQFP), 20 × 20 mm, 0.5 mm pitch
Operating Temperature: 0 °C to +85 °C (Commercial, 'C' grade)
Speed Grade: 7 (mid commercial)
Comparar com EP2C5T144I8N →
Altera
Package: 144-pin TQFP (T144), 22x22 mm
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: TSMC 90 nm low-k
Comparar com EP2C5T144I8N →
Intel
Process Technology: 90 nm CMOS (TSMC low-k)
Comparar com EP2C5T144I8N →
Intel
Package: TQFP-144 (T144), 22x22 mm, 0.5mm pitch
Operating Temperature: 0C to +85C (Commercial, suffix C)
Process Technology: 90 nm
Comparar com EP2C5T144I8N →
Intel
Package: 144-LQFP (TQFP-144)
Process Technology: 90 nm CMOS
Speed Grade: I8
Comparar com EP2C5T144I8N →
Intel
Package: 144-pin TQFP (TQFP-144)
Process Technology: 90 nm TSMC low-k dielectric
Speed Grade: -8
Comparar com EP2C5T144I8N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP2C5T144C8N

✅ Drop-In
Altera
📦 144-LQFP (TQFP)
Cyclone II · 4,608 · 119,808 bits (M4K blocks) · 13 · 89 · 2 · 1.15 V to 1.25 V (typ. 1.2 V) · 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)

✓ Em estoque

$19.8 / unidade

Ver ficha técnica →

EP2C5T144C7N

✅ Drop-In
Altera
📦 144-LQFP (TQFP)
Cyclone® II · EP2C5 · 4,608 · 119,808 · 89 · 158 · Up to 13 · 2

✓ Em estoque

$12.4 / unidade

Ver ficha técnica →

EP2C5T144C6N

✅ Drop-In
Altera
📦 144-LQFP (TQFP)
Cyclone II · Cyclone II · 4608 · 119808 bits · 89 · 4 · 13 · 2

✓ Em estoque

$5.1 / unidade

Ver ficha técnica →

EP2C5T144I8

✅ Drop-In
Intel
📦 144-LQFP (TQFP)
Cyclone II · 4,608 · 119,808 · 89 · 312 · 5,000 · 13 · 2

✓ Em estoque

$11.83 / unidade

Ver ficha técnica →

EP2C8T144I8N

✅ Drop-In
Intel
📦 144-LQFP (TQFP)
Cyclone II · 8,256 · 165,888 · 36 (M4K) · 36 · 85 · 144-pin TQFP (TQFP-144) · 90 nm TSMC low-k dielectric

✓ Em estoque

$17.5 / unidade

Ver ficha técnica →

EP2C8T144C8N

✅ Drop-In
Intel
📦 144-LQFP (TQFP)
Cyclone II · 8,256 · 516 · 165,888 bits (162 Kbit) · 36 · 85 · 2 · 1.15 V to 1.25 V (typ. 1.2 V)

✓ Em estoque

$41.5 / unidade

Ver ficha técnica →

EP2C5T144I8N Classificações máximas e características elétricas

Family Cyclone II
Logic Elements (LEs) 4,608
Embedded Memory 119,808 bits (~117 Kbits)
Embedded Multipliers 13 (18x18)
Maximum User I/O 89
PLLs 2
Core Voltage 1.2 V
Temperatura de operação -40C to +85C (Industrial)
Encapsulamento 144-LQFP (TQFP) 22x22 mm
Tipo de montagem Surface Mount
Nível MSL 3
Process Node 90 nm
Status RoHS Compliant
Lead-Free Yes
Configuration Mode Active Serial (AS) / Passive Serial (PS)

Configuração de pinos do EP2C5T144I8N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — General purpose user I/O (Bank 1)
Pino 2 I/O — General purpose user I/O (Bank 1)
Pino 3 I/O — General purpose user I/O (Bank 1)
Pino 4 I/O — General purpose user I/O (Bank 1)
Pino 5 I/O — General purpose user I/O (Bank 1)
Pino 6 I/O — General purpose user I/O (Bank 1)
Pino 7 VCCIO1 — I/O bank 1 supply reference
Pino 8 I/O — General purpose user I/O (Bank 1)
Pino 9 I/O — General purpose user I/O (Bank 1)
Pino 10 I/O — General purpose user I/O (Bank 1)
Pino 11 GND — Ground
Pino 12 I/O — General purpose user I/O (Bank 1)
Pino 13 I/O — General purpose user I/O (Bank 1)
Pino 14 I/O — General purpose user I/O (Bank 1)
Pino 15 I/O — General purpose user I/O (Bank 1)
Pino 16 I/O — General purpose user I/O (Bank 1)
Pino 17 I/O — General purpose user I/O (Bank 1)
Pino 18 I/O — General purpose user I/O (Bank 1)
Pino 19 I/O — General purpose user I/O (Bank 1)
Pino 20 I/O — General purpose user I/O (Bank 1)
Pino 21 GND — Ground
Pino 22 I/O — General purpose user I/O (Bank 2)
Pino 23 I/O — General purpose user I/O (Bank 2)
Pino 24 I/O — General purpose user I/O (Bank 2)
Pino 25 I/O — General purpose user I/O (Bank 2)
Pino 26 I/O — General purpose user I/O (Bank 2)
Pino 27 I/O — General purpose user I/O (Bank 2)
Pino 28 VCCIO2 — I/O bank 2 supply reference
Pino 29 I/O — General purpose user I/O (Bank 2)
Pino 30 I/O — General purpose user I/O (Bank 2)
Pino 31 I/O — General purpose user I/O (Bank 2)
Pino 32 I/O — General purpose user I/O (Bank 2)
Pino 33 GND — Ground
Pino 34 I/O — General purpose user I/O (Bank 2)
Pino 35 I/O — General purpose user I/O (Bank 2)
Pino 36 I/O — General purpose user I/O (Bank 2)
Pino 37 I/O — General purpose user I/O (Bank 2)
Pino 38 I/O — General purpose user I/O (Bank 2)
Pino 39 I/O — General purpose user I/O (Bank 2)
Pino 40 I/O — General purpose user I/O (Bank 2)
Pino 41 I/O — General purpose user I/O (Bank 2)
Pino 42 I/O — General purpose user I/O (Bank 2)
Pino 43 GND — Ground
Pino 44 I/O — General purpose user I/O (Bank 3)
Pino 45 I/O — General purpose user I/O (Bank 3)
Pino 46 I/O — General purpose user I/O (Bank 3)
Pino 47 I/O — General purpose user I/O (Bank 3)
Pino 48 I/O — General purpose user I/O (Bank 3)
Pino 49 VCCIO3 — I/O bank 3 supply reference
Pino 50 I/O — General purpose user I/O (Bank 3)
Pino 51 I/O — General purpose user I/O (Bank 3)
Pino 52 I/O — General purpose user I/O (Bank 3)
Pino 53 I/O — General purpose user I/O (Bank 3)
Pino 54 GND — Ground
Pino 55 I/O — General purpose user I/O (Bank 3)
Pino 56 I/O — General purpose user I/O (Bank 3)
Pino 57 I/O — General purpose user I/O (Bank 3)
Pino 58 I/O — General purpose user I/O (Bank 3)
Pino 59 I/O — General purpose user I/O (Bank 3)
Pino 60 I/O — General purpose user I/O (Bank 3)
Pino 61 I/O — General purpose user I/O (Bank 3)
Pino 62 I/O — General purpose user I/O (Bank 3)
Pino 63 I/O — General purpose user I/O (Bank 3)
Pino 64 I/O — General purpose user I/O (Bank 3)
Pino 65 I/O — General purpose user I/O (Bank 3)
Pino 66 I/O — General purpose user I/O (Bank 3)
Pino 67 GND — Ground
Pino 68 I/O — General purpose user I/O (Bank 4)
Pino 69 I/O — General purpose user I/O (Bank 4)
Pino 70 I/O — General purpose user I/O (Bank 4)
Pino 71 I/O — General purpose user I/O (Bank 4)
Pino 72 I/O — General purpose user I/O (Bank 4)
Pino 73 I/O — General purpose user I/O (Bank 4)
Pino 74 I/O — General purpose user I/O (Bank 4)
Pino 75 VCCIO4 — I/O bank 4 supply reference
Pino 76 I/O — General purpose user I/O (Bank 4)
Pino 77 I/O — General purpose user I/O (Bank 4)
Pino 78 I/O — General purpose user I/O (Bank 4)
Pino 79 GND — Ground
Pino 80 I/O — General purpose user I/O (Bank 4)
Pino 81 I/O — General purpose user I/O (Bank 4)
Pino 82 I/O — General purpose user I/O (Bank 4)
Pino 83 I/O — General purpose user I/O (Bank 4)
Pino 84 I/O — General purpose user I/O (Bank 4)
Pino 85 I/O — General purpose user I/O (Bank 4)
Pino 86 I/O — General purpose user I/O (Bank 4)
Pino 87 I/O — General purpose user I/O (Bank 4)
Pino 88 I/O — General purpose user I/O (Bank 4)
Pino 89 GND — Ground
Pino 90 nCONFIG — Configuration control (active low)
Pino 91 nSTATUS — Configuration status (active low)
Pino 92 CONFIG_DONE — Configuration done indicator
Pino 93 TDI — JTAG test data in
Pino 94 TMS — JTAG test mode select
Pino 95 TCK — JTAG test clock
Pino 96 TDO — JTAG test data out
Pino 97 GND — Ground
Pino 98 MSEL0 — Configuration mode select 0
Pino 99 MSEL1 — Configuration mode select 1
Pino 100 MSEL2 — Configuration mode select 2
Pino 101 DATA0 — Configuration data input (AS/PS)
Pino 102 DCLK — Configuration clock
Pino 103 nCS — Serial configuration chip select
Pino 104 ASDO — Active serial data out
Pino 105 VCCINT — Core supply 1.2 V
Pino 106 GND — Ground
Pino 107 I/O — General purpose user I/O (Bank 4)
Pino 108 I/O — General purpose user I/O (Bank 4)
Pino 109 I/O — General purpose user I/O (Bank 4)
Pino 110 I/O — General purpose user I/O (Bank 4)
Pino 111 I/O — General purpose user I/O (Bank 4)
Pino 112 I/O — General purpose user I/O (Bank 4)
Pino 113 I/O — General purpose user I/O (Bank 4)
Pino 114 I/O — General purpose user I/O (Bank 4)
Pino 115 I/O — General purpose user I/O (Bank 4)
Pino 116 I/O — General purpose user I/O (Bank 4)
Pino 117 I/O — General purpose user I/O (Bank 4)
Pino 118 I/O — General purpose user I/O (Bank 4)
Pino 119 I/O — General purpose user I/O (Bank 4)
Pino 120 I/O — General purpose user I/O (Bank 4)
Pino 121 GND — Ground
Pino 122 I/O — General purpose user I/O (Bank 4)
Pino 123 I/O — General purpose user I/O (Bank 4)
Pino 124 I/O — General purpose user I/O (Bank 4)
Pino 125 I/O — General purpose user I/O (Bank 4)
Pino 126 I/O — General purpose user I/O (Bank 4)
Pino 127 VCCINT — Core supply 1.2 V
Pino 128 I/O — General purpose user I/O (Bank 4)
Pino 129 I/O — General purpose user I/O (Bank 4)
Pino 130 I/O — General purpose user I/O (Bank 4)
Pino 131 I/O — General purpose user I/O (Bank 4)
Pino 132 I/O — General purpose user I/O (Bank 4)
Pino 133 GND — Ground
Pino 134 I/O — General purpose user I/O (Bank 1)
Pino 135 I/O — General purpose user I/O (Bank 1)
Pino 136 I/O — General purpose user I/O (Bank 1)
Pino 137 I/O — General purpose user I/O (Bank 1)
Pino 138 I/O — General purpose user I/O (Bank 1)
Pino 139 VCCIO1 — I/O bank 1 supply reference
Pino 140 I/O — General purpose user I/O (Bank 1)
Pino 141 I/O — General purpose user I/O (Bank 1)
Pino 142 I/O — General purpose user I/O (Bank 1)
Pino 143 I/O — General purpose user I/O (Bank 1)
Pino 144 GND — Ground

Aplicações típicas

EP2C5T144I8N é adequado para 6 aplicaçãos: Industrial Motor Control, Low-Cost Video Processing Bridge, Protocol Bridging (USB / Ethernet / UART), Educational FPGA Development Boards, Consumer Electronics Glue Logic, Test & Measurement Front-End Logic.

🏭

Industrial Motor Control

The EP2C5T144I8N fits industrial motor-control designs because its 4,608 LEs and 13 embedded 18x18 multipliers are sufficient for field-oriented control (FOC) algorithms, encoder decoding, and PWM generation on a single chip. The industrial -40C to +85C temperature range covers cabinet-mounted drives, and the 89 user I/O pins handle quadrature encoder inputs, Hall sensors, and gate-driver enable signals. Compared with a microcontroller, this FPGA can execute the control loop at much higher PWM frequencies (above 100 kHz), reducing audible switching noise and improving torque ripple. Power estimation per Cyclone II datasheet: 1.2 V core at typical 250 mA plus I/O bank current. Place bypass capacitors as close to each VCCIO and VCCINT pin pair as the 144-TQFP land pattern allows.

📺

Low-Cost Video Processing Bridge

The EP2C5T144I8N is widely used as a video-format bridge (BT.656 to parallel RGB, or HDMI input to LVDS output) in cost-sensitive consumer and prosumer products. The 4,608 LEs hold a line buffer plus color-space conversion, and the M4K memory blocks provide FIFO buffering of video lines. LVDS support in selected I/O banks permits direct connection to LVDS panels without external buffers. Engineers should budget 25-30% LE utilization for typical color-space conversion plus timing controller logic, leaving headroom for additional overlay or graphics processing. The 144-TQFP package is hand-solderable for prototype builds, which is unusual for an FPGA of this density.

🌐

Protocol Bridging (USB / Ethernet / UART)

When a host processor lacks a particular peripheral, the EP2C5T144I8N can implement glue logic that bridges between standards - for example, USB 2.0 high-speed to parallel FIFO, or 100 Mbit Ethernet MAC plus UDP offload. The device's JTAG interface enables in-field firmware updates, and 119,808 bits of embedded RAM comfortably hold packet buffers for typical industrial protocols. Designers should use Altera's soft IP cores (Nios II, Triple-Speed Ethernet, USB) with Quartus II 13.0sp1, the last version with full Cyclone II support. Power sequencing: bring up VCCINT (1.2 V) before VCCIO and CONF_DONE pin within 100 ms of configuration start.

🎓

Educational FPGA Development Boards

Universities and hobbyists favor the EP2C5T144I8N because it balances density, hand-solderability, and price. The 144-TQFP is the largest pitch that is still practical to hand-solder with a fine-tip iron, and 4,608 LEs is enough to teach a full RISC-V soft core, VGA controller, and audio pipeline simultaneously. Reference designs ship with EPCS4 configuration flash, 50 MHz clock, SRAM, LEDs, and pushbuttons, allowing students to focus on HDL rather than board bring-up. Quartus II Web Edition remains free and supports this device without a license, which keeps the total learning cost minimal.

📱

Consumer Electronics Glue Logic

In consumer products such as set-top boxes, printers, and home appliances, the EP2C5T144I8N replaces multiple discrete logic ICs by integrating level shifting, display timing, button debouncing, and LED control. Consolidation from 4-6 standard-logic chips to one FPGA reduces PCB area, BOM count, and assembly cost. The industrial temperature variant (this part) is preferred for products sold into global markets where warehouse and shipping conditions may briefly exceed commercial-grade limits. Estimated static power: ~50 mW at typical use; dynamic power depends on toggle rate and should be simulated with the Quartus PowerPlay tool.

🔧

Test & Measurement Front-End Logic

Test instruments and ATE fixtures use the EP2C5T144I8N to implement custom stimulus generation, response capture, and protocol-aware handshake logic between the device under test (DUT) and the host. The 13 embedded multipliers can compute CRC, checksum, or simple FFT pre-processing in-line with sample acquisition, while M4K blocks provide double buffering. With 89 user I/O pins the FPGA can directly drive up to 11 LVDS pairs (using LVDS in supported banks) or 89 single-ended signals, often sufficient to replace a mid-range ASIC in low-volume test gear.

What is the logic element count of EP2C5T144I8N?
The EP2C5T144I8N contains 4,608 logic elements (LEs) according to the Cyclone II Device Handbook. This entry-level density in the Cyclone II family makes it suitable for glue-logic, control, and low-throughput DSP tasks where higher-density FPGAs would be overkill.
How much embedded memory does EP2C5T144I8N have?
The EP2C5T144I8N provides 119,808 bits of embedded RAM organized into M4K memory blocks, equivalent to approximately 117 Kbits. Each M4K block can be configured as RAM, ROM, or FIFO and supports true dual-port operation for parallel data paths.
How many user I/O pins does EP2C5T144I8N provide?
The EP2C5T144I8N exposes 89 user I/O pins across 4 I/O banks in the 144-TQFP package, leaving 55 pins reserved for supply, ground, JTAG, and configuration. Bank-based VCCIO references allow mixing of I/O standards such as LVTTL, LVCMOS, PCI, and LVDS on the same device.
What is the operating temperature of EP2C5T144I8N?
The 'I' suffix in EP2C5T144I8N designates the industrial temperature range of -40C to +85C, making the device suitable for outdoor enclosures, factory automation, and automotive-cabin (non-powertrain) applications where commercial-grade parts would fail.
Is EP2C5T144I8N RoHS compliant?
Yes. The EP2C5T144I8N is RoHS compliant per Altera/Intel product declarations and uses lead-free finish suitable for reflow profiles up to 260C peak. The 144-TQFP package is MSL-3 rated, so dry-pack handling and floor-life tracking are required.
Where can I download the EP2C5T144I8N datasheet PDF?
The official Cyclone II Device Handbook (Volume 1, approximately 470 pages) covering the EP2C5T144I8N is available from the Altera/Intel literature archive. The most reliable mirror is the legacy Altera site at https://www.altera.com/literature/hb/cyc2/cyc2_handbook.pdf, which is the canonical datasheet referenced in this product page.
Where can I buy EP2C5T144I8N and what is the price?
The EP2C5T144I8N is in stock at Heisener, LCSC, and authorized distributors as of 2026-09-08. Heisener lists the unit price at $18.74 and LCSC at $23.48; tier pricing above is based on those listings. Authorized franchised distributors include Arrow Electronics with stock confirmation available online.
What is the lead time for EP2C5T144I8N orders?
Heisener reports immediate shipping on stocked EP2C5T144I8N reels with an estimated delivery window of April 4 to April 9 for expedited orders (as of 2026-09-08). For production volumes above 1,000 units, distributor stocking and lead time should be confirmed directly with Arrow or authorized partners.
Is EP2C5T144I8N still in production in 2026?
The EP2C5T144I8N remains active in distribution channels as of 2026-09-08. Although the Cyclone II family has been superseded by Cyclone IV and Cyclone 10, Intel continues to support existing customers and authorized distributors still hold meaningful inventory, including 18,528 pieces listed at Heisener.
What is the difference between EP2C5T144I8N and EP2C5T144C8N?
The EP2C5T144I8N (industrial, -40C to +85C) and EP2C5T144C8N (commercial, 0C to +85C) share identical logic resources, package, and pinout. The only difference is the operating temperature grade. Choose the I-grade variant for outdoor or industrial deployments; the C-grade is sufficient for benign indoor consumer and laboratory environments.
EP2C5T144I8N vs EP2C8T144C8N - which should I choose?
The EP2C5T144I8N offers 4,608 LEs and the EP2C8T144C8N offers 8,256 LEs in the same 144-TQFP package, so they are footprint-compatible. Choose EP2C5T144I8N when 4,608 LEs are sufficient for the design; choose EP2C8T144C8N when extra logic, more multipliers (18 vs 13), or additional I/O headroom are needed at a modest cost premium.
Can EP2C8T144I8N replace EP2C5T144I8N as a drop-in?
Yes, the EP2C8T144I8N in the same 144-TQFP package is a drop-in upgrade. The pinout is identical, core voltage is the same at 1.2 V, and the larger device offers 8,256 LEs versus 4,608 with 18 embedded multipliers versus 13. Existing bitstreams designed for EP2C5 must be recompiled because of resource-density differences, but no PCB rework is needed.
When should I choose EP2C5T144I8N over a newer Cyclone 10 LP?
Choose EP2C5T144I8N when cost is the dominant constraint and the design fits within 4,608 LEs, especially when an existing Cyclone II toolchain and IP are already in place. Choose a Cyclone 10 LP device for new designs needing lower static power, modern transceivers, updated IDE support, and a longer active lifecycle guarantee.
What is the best cross-brand replacement for EP2C5T144I8N?
There is no true cross-brand drop-in replacement for the EP2C5T144I8N because the pinout, configuration interface, and JTAG ID are Intel/Altera-specific. Cross-brand functional equivalents exist (e.g., Lattice iCE40 or Xilinx Spartan-6 in similar density), but they require PCB rework, tool-chain migration, and full re-verification of the bitstream.
What are the key specifications of EP2C5T144I8N that engineers should know?
Key specifications: 4,608 LEs, 119,808 bits embedded RAM in M4K blocks, 13 embedded 18x18 multipliers, 89 user I/O across 4 banks, 2 PLLs, 1.2 V core supply, industrial -40C to +85C range, 144-LQFP package 22x22 mm, RoHS compliant, AS/PS configuration. Cyclone II uses a 90 nm process node.

Dados de referência de engenharia para EP2C5T144I8N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose EP2C5T144I8N when you need an FPGA in the 4,608-LE density range with industrial -40C to +85C temperature support in a hand-solderable 144-TQFP package. It is the right pick for motor control, industrial glue logic, and educational boards that may be deployed in non-climate-controlled environments. If your design fits in 4,608 LEs and will only see indoor commercial temperatures, choose EP2C5T144C8N to save cost. If you anticipate resource growth, design the PCB for EP2C5T144I8N today and migrate to EP2C8T144I8N later - the footprint is identical. For new designs requiring long lifecycle guarantees and modern transceivers, evaluate Cyclone 10 LP instead.

Comparação com alternativas

Parâmetro Este produto EP2C5T144C8N EP2C5T144C7N EP2C5T144I8 EP2C8T144I8N EP2C8T144C8N
Package 144-LQFP (TQFP) 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same
Brand Intel Intel Intel Intel Intel Intel
Logic Elements 4,608 4,608 4,608 4,608 8,256 8,256
Embedded Memory 119,808 bits 119,808 bits 119,808 bits 119,808 bits 165,888 bits 165,888 bits
Embedded Multipliers (18x18) 13 13 13 13 18 18
User I/O Pins 89 89 89 89 85 85
Operating Temperature -40C to +85C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +85C (Industrial) -40C to +85C (Industrial) 0C to +85C (Commercial)
Speed Grade 8 8 7 8 8 8
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V

Principais diferenciais

  • Industrial temperature range in the 144-TQFP package (vs EP2C5T144C8N)
  • Same-package density upgrade path (vs EP2C5T144I8 vs EP2C8T144I8N)
  • Hand-solderable TQFP package (vs EP2C5F256I8N (FBGA-256))

Notas de projeto

Estimated: Cyclone II core current at typical 4,608-LE utilization is roughly 200-300 mA from a 1.2 V VCCINT rail; each VCCIO bank adds up to 100 mA depending on toggle rate. Provide a 1.2 V LDO or switching regulator rated for at least 500 mA, and add 0.1 uF ceramic bypass capacitors within 5 mm of every VCCINT and VCCIO pin. Decoupling values: one 10 uF bulk + one 0.1 uF per pin pair is the conservative Cyclone II recommendation.

The 144-TQFP 22x22 mm package uses 0.5 mm pitch leads; route with 0.15 mm/6 mil traces and use a 4-layer PCB with continuous ground plane beneath the device for return-current control. All eight GND pins must be soldered to the ground plane with multiple vias to reduce inductance. Place the EPCS configuration flash within 25 mm of the FPGA, keep DCLK short, and add a 25-50 ohm series termination on DCLK if the trace exceeds 50 mm.

Configuration fails on first power-up if VCCINT and VCCIO rise-time relationships are violated: VCCINT must reach 1.0 V within 100 ms and VCCIO must follow within 100 ms afterward. Stratix II and Cyclone II use different MSEL pull-up/pull-down schemes; verify MSEL[2:0] against the Cyclone II handbook (not Cyclone III/IV) before board fab. Avoid leaving unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-up to prevent shoot-through during configuration.

Estimated: at maximum junction temperature +85C industrial limit, the 144-TQFP requires approximately 26 C/W theta_JA still-air thermal resistance to keep die temperature below 85C when dissipating 1 W. Cyclone II typically dissipates 0.5-1.5 W at moderate utilization, so no heatsink is needed but PCB copper area (at least 4 sq cm on top layer) is recommended for margin. Forced airflow is rarely required unless utilization exceeds 80%.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified - choose EP2C5AT144A7N for automotive. Halogen-free status not explicitly declared; default treated as unknown per data authenticity rules.

Dados verificados em: 2026-09-08 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP2C5T144I8N EP2C5T144I8N datasheet Intel Cyclone II FPGA 144-TQFP Altera Cyclone II EP2C5 4608 logic elements EP2C5T144I8N industrial grade FPGA 144-LQFP low-cost FPGA development board EP2C5T144I8N vs EP2C8T144I8N EP2C5T144I8N drop-in replacement buy EP2C5T144I8N online price what is the LE count of EP2C5T144I8N EP2C5T144I8N pinout 144-TQFP Cyclone II FPGA motor control industrial

Componentes & termos relacionados

Intel Altera EP2C5T144I8N EP2C5T144C8N EP2C5T144I8 EP2C8T144I8N Cyclone II FPGA Field-Programmable Gate Array Logic Element LE M4K memory block embedded multiplier 144-LQFP TQFP RoHS REACH industrial temperature range Quartus II JTAG EPCS configuration flash Active Serial configuration PLL LVDS motor control video bridge protocol bridge
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