EP2S60F1020C4 - 60K LE Stratix II FPGA, 1020-BGA | Intel
部品番号: EP2S60F1020C4 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1560 | $156,000.00 |
| 500 | $1395 | $697,500.00 |
| 1,000 | $1240 | $1,240,000.00 |
EP2S60F1020C4 概要
A Field Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, DSP blocks, PLLs, high-speed transceivers) on a single die. In the broader taxonomy, an FPGA belongs to programmable logic devices -> logic ICs -> digital integrated circuits -> semiconductors. Stratix II positioned Intel/Altera as a leader in mid-2000s high-density FPGA families for ASIC prototyping, DSP acceleration, and telecom infrastructure.
Key features of the EP2S60F1020C4 include embedded multiplier blocks for DSP, TriMatrix on-chip memory (MLAB + M512 + M4K + M-RAM blocks totaling 2,544,192 RAM bits), up to 12 dedicated PLL clock managers per device, and 4 phase-locked loop-based high-speed transceivers supporting source-synchronous interfaces. The -C4 speed grade denotes a commercial-temperature (0C to +85C) device with a moderate speed bin, suitable for cost-sensitive designs where the absolute fastest timing closure is not required.
The architecture employs an ALM (Adaptive Logic Module)-based logic element, allowing 6-input LUT-based combinational and arithmetic logic plus dedicated register bits per ALM. This contrasts with the 4-input LUT architecture of the original Stratix family and provides roughly 50% greater logic capacity per area, enabling the EP2S60 to fit larger designs at equivalent device sizes. The 1020-ball FC-FBGA package supports extensive I/O count while maintaining signal integrity for source-synchronous memory and parallel interfaces.
Typical applications for EP2S60F1020C4 include ASIC prototyping and emulation, digital signal processing (FFT, baseband processing), telecom line cards, video processing pipelines, and high-performance industrial control. It is also widely deployed in PCIe endpoint and bridging applications, motor control, and embedded compute platforms requiring substantial on-chip memory.
When designing with this part, plan I/O bank assignments early because 718 pins must be allocated across 8-9 banks with dedicated VCCIO rails per bank. Use the Quartus II design suite (legacy, free licenses for Stratix II are still available from Intel's website) for synthesis, place-and-route, and timing closure. The -C4 speed grade trades peak Fmax for cost savings; for designs approaching 500 MHz internal logic, consider the -C5 speed grade instead.
This page synthesizes distributor stock and pricing, drop-in alternatives from the Stratix II family, and practical design notes that go beyond the manufacturer datasheet.
ドロップイン代替品: EP2S60F1020C4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S60F1020C4 （同一形状・フットプリント） — 相違点: Package, RoHS Status, Speed Grade, Family, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S60F1020C4N
✅ ドロップイン✓ 在庫あり
$67 / 個
データシートを見る →EP2S60F1020C5
✅ ドロップイン✓ 在庫あり
$995 / 個
データシートを見る →EP2S60F1020C5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$143.75 / 個
データシートを見る →EP2S60F1020I4
✅ ドロップイン✓ 在庫あり
$1454.92 / 個
データシートを見る →EP2S60F1020C3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1380 / 個
データシートを見る →EP2S60F1020C4 最大定格＆電気的特性
| Series | Stratix II |
| Logic Elements | 60,440 LE |
| Total Memory Bits | 2,544,192 bits |
| Number of LABs | 3022 |
| Number of User I/O | 718 |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 711.24 MHz |
| Process Technology | 90 nm CMOS |
| Speed Grade | -C4 (commercial) |
| 動作温度 | 0C to +85C (commercial) |
| パッケージ | 1020-ball FC-FBGA (FineLine BGA) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant (lead-free per Intel/Altera product page) |
EP2S60F1020C4 1020-ball fc-fbga (fineline bga) ピン配置ガイド
EP2S60F1020C4 (1020-ball fc-fbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S60F1020C4.
詳細は データシート をご参照ください。
主な用途
EP2S60F1020C4 の用途: 6 件s: ASIC Prototyping and Emulation, Digital Signal Processing (DSP), Telecom Line Cards and Network Infrastructure, Video Processing Pipelines, High-Performance Industrial Control, PCI Express Endpoint and Bridging.
ASIC Prototyping and Emulation
The EP2S60F1020C4 is well suited to ASIC prototyping because its 60,440 LEs and 2,544 Kbit of TriMatrix block RAM can map mid-complexity ASICs (typically 1-2M gates) with predictable timing closure. Its 718 user I/Os accommodate wide bus-based prototypes with multiple source-synchronous memory interfaces (DDR2/QDRII), which is essential when emulating ASICs that target high-bandwidth DRAM subsystems. Quartus II synthesis and incremental compile shorten bring-up time versus custom ASIC flows, while the FC-FBGA package supports the high pin count needed for FPGA-based emulation boards.
おすすめ
Digital Signal Processing (DSP)
Embedded multiplier blocks make EP2S60F1020C4 a strong fit for DSP workloads such as FFT, FIR filtering, and baseband processing. The TriMatrix memory architecture provides low-latency on-chip data buffering at the multiplier outputs, avoiding round-trips to external memory and allowing sustained GMAC/s throughput. In telecom base stations the device can implement multi-channel uplink/downlink chains at hundreds of MHz clock rates, and the 711 MHz core Fmax headroom supports high-order modulation schemes. Quartus II MegaWizard IP cores (FFT, FIR, DDS) accelerate DSP integration.
おすすめ
Telecom Line Cards and Network Infrastructure
The 718 user I/O count and dedicated source-synchronous interface support make EP2S60F1020C4 appropriate for telecom line cards handling multi-gigabit serial links, packet classification, and traffic management. The PLL-rich clock tree supports multiple independent interface rates from a single reference, while the embedded memory buffers packets at line rate without external lookups. The 90 nm Stratix II core runs typical networking logic at 200-300 MHz Fmax, which suits OC-192/STM-64 forwarding paths and 10G Ethernet MAC/PHY bridging. Hot-swap and JTAG features simplify field diagnostics.
おすすめ
Video Processing Pipelines
Wide internal buses and high I/O count make EP2S60F1020C4 well suited to broadcast video processing pipelines including HD-SDI ingest, scaling, deinterlacing, and overlay composition. The on-chip TriMatrix memory (M4K blocks) acts as line buffers for real-time pixel-domain processing at 148.5 MHz (1080i) or 148.5/1.001 MHz (1080p) pixel clocks. The 1020-ball FC-FBGA package supports simultaneous HD-SDI receive, DDR2 frame buffer, and DVI/HDMI output interfaces on a single device. Quartus II Video and Image Processing Suite IP cores (Scaler, Deinterlacer, Color Space Converter) shorten development.
おすすめ
High-Performance Industrial Control
Industrial motion controllers, programmable logic controllers (PLCs), and high-speed machine vision systems use EP2S60F1020C4 to combine deterministic control loops with parallel sensor aggregation. The 718 user I/Os multiplex dozens of incremental encoder channels, GPIO, and high-speed LVDS links while maintaining sub-microsecond deterministic latency. On-chip DSP blocks implement field-oriented control (FOC) loops for multi-axis motor drives, and the TriMatrix memory buffers sensor data without external SRAM. The commercial temperature grade suits most factory-floor enclosures.
おすすめ
PCI Express Endpoint and Bridging
The Stratix II family supports PCI Express x1/x4/x8 endpoints via hard IP cores, making EP2S60F1020C4 a practical choice for PCIe add-in cards, embedded hosts, and protocol bridges (for example, PCIe-to-DDR or PCIe-to-Local Bus). Quartus II MegaWizard generates the PCIe hard IP block, transaction layer, and DMA engine; the device's 60K LEs accommodate the application logic and DMA descriptors while 2,544 Kbit of on-chip memory handles packet buffering. The 1020-ball FC-FBGA package supports the high-speed transceiver pins required for x8 Gen1 PCIe lanes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S60F1020C4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S60F1020C4N | EP2S60F1020C5 | EP2S60F1020I4 | EP2S60F1020C3 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 60,440 LE | 60,440 LE | 60,440 LE | 60,440 LE | 60,440 LE |
| Total Memory Bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| User I/O | 718 | 718 | 718 | 718 | 718 |
| Speed Grade | -C4 | -C4 | -C5 (faster) | -I4 (industrial) | -C3 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| RoHS Compliance | Non-N (may be lead-bearing) | Lead-free, RoHS | Non-N (may be lead-bearing) | Non-N (may be lead-bearing) | Non-N (may be lead-bearing) |
主な差別化要因
- Faster speed grade available for tight timing closure （vs EP2S60F1020C4)
- Lead-free RoHS-compliant drop-in variant available （vs EP2S60F1020C4)
- Industrial temperature grade drop-in variant available （vs EP2S60F1020C4)
設計ノート
The 1020-ball FC-FBGA package requires a multilayer PCB (typically 8+ layers) with microvia or via-in-pad technology. Route all differential pairs (LVDS, DDR2, PCIe) with matched lengths within the tolerance specified in the Stratix II Device Handbook, and follow Intel's recommended decoupling scheme with 0.1 uF and 0.01 uF capacitors placed within 100 mil of every VCC pin. Estimated: with 718 user I/Os across 8-9 I/O banks, plan VCCIO rail count and power-plane layout before PCB layout begins; missing one bank is a common LTB-stage board respin cause.
At typical utilization (60-70% LEs, 50% memory, moderate toggle rate), the EP2S60F1020C4 can dissipate 5-8 W. The FC-FBGA package does not include an exposed thermal pad, so thermal relief depends entirely on board-level thermal design. Attach a heatsink with thermal interface material (TIM) on the package top side, or use forced-air cooling. Estimated: at 85C ambient with no airflow, junction temperature may exceed the 100C commercial limit at full utilization; verify with a thermal probe in the prototype.
Do not assume EP2S60F1020C4 and EP2S60F1020C4N differ in any way beyond ball-finish compliance - the die, pinout, and JTAG ID are identical, and Quartus II programs both with the same SOF/POF files. Conversely, EP2S60F1020C4 vs EP2S60F1020I4 requires a fresh Quartus II compile because the silicon speed/temperature model differs; copying a -C4 SOF to a -I4 board will produce timing violations in cold conditions. Always re-validate timing after swapping the ordering code, even when only temperature grade changes.
コンプライアンス情報
EP2S60F1020C4 (non-N) uses lead-bearing BGA balls and is therefore not RoHS compliant; the EP2S60F1020C4N variant is the lead-free, RoHS-compliant equivalent on the same die and package. AEC-Q100 qualification does not apply to commercial/industrial-grade FPGAs; for automotive applications use a separately AEC-Q100-qualified device. REACH compliance statement available from Intel product page.
