EP2S60F1020I4 - Stratix II 60K LEs FPGA | Intel / Altera | 1020-FBGA
部品番号: EP2S60F1020I4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2006.78 | $2,006.78 |
| 10 | $1906.44 | $19,064.40 |
| 100 | $1755.93 | $175,593.00 |
| 500 | $1605.42 | $802,710.00 |
| 1,000 | $1454.92 | $1,454,920.00 |
EP2S60F1020I4 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic through a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers (software-defined, lower throughput). The Stratix II family specifically targets high-performance digital signal processing, communications, and high-speed serial I/O applications, sitting under the broader taxonomy: programmable logic -> logic device -> semiconductor IC.
Key features of the EP2S60F1020I4 include up to 36 embedded 18x18 multipliers (DSP blocks) for high-speed arithmetic, twelve global clock networks with phase-locked loops (PLLs), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device embeds TriMatrix memory blocks totaling approximately 2.5 Mbits, distributed as 4096-bit M512, 8 Kbit M4K, and 512 Kbit M-RAM blocks for flexible on-chip buffering.
Architecturally, the Stratix II introduces an innovative adaptive logic module (ALM) that replaces traditional 4-input LUTs with 8-input fracturable LUTs, increasing effective logic density by roughly 2x compared to the original Stratix family. Combined with the dedicated DSP blocks and up to 12 PLLs, this allows the EP2S60 to address designs requiring high logic utilization, complex arithmetic pipelines, and multiple clock domains in a single device.
Typical applications include high-speed digital signal processing for baseband processing, telecom backhaul switching, military radar systems, test and measurement equipment, and high-end video processing. The combination of 60K logic elements, dedicated multipliers, and abundant I/O makes the EP2S60F1020I4 a mainstream workhorse for mid-to-high density FPGA designs of its era.
When designing with this device, plan for power consumption carefully. A fully utilized EP2S60 can dissipate 20 W or more; thermal management through the FC-FBGA exposed die pad and adequate PCB copper is essential. Designers should also note that the Stratix II family is now legacy - new designs should consider Cyclone IV/V or Stratix IV/V equivalents, but existing designs can still be supported with this part.
This page synthesizes distributor pricing, verified parametric data from the manufacturer datasheet, and drop-in same-package alternatives (including temperature-grade and speed-grade variants) that share the 1020-FBGA footprint, providing information not consolidated in a single distributor listing.
ドロップイン代替品: EP2S60F1020I4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S60F1020I4 （同一形状・フットプリント） — 相違点: Package, RoHS Status, Operating Temperature, Speed Grade, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S60F1020I4N
✅ ドロップイン✓ 在庫あり
$270 / 個
データシートを見る →EP2S60F1020C5N
✅ ドロップイン✓ 在庫あり
$143.75 / 個
データシートを見る →EP2S60F1020C4N
✅ ドロップイン✓ 在庫あり
$67 / 個
データシートを見る →EP2S60F1020C3N
✅ ドロップイン✓ 在庫あり
$1095 / 個
データシートを見る →EP2S90F1020I4
✅ ドロップイン✓ 在庫あり
$2200 / 個
データシートを見る →EP2S130F1020I4
✅ ドロップイン✓ 在庫あり
$1395 / 個
データシートを見る →EP2S180F1020I4
✅ ドロップイン✓ 在庫あり
$11250 / 個
データシートを見る →EP2S60F1020I4 最大定格＆電気的特性
| Manufacturer | Intel / Altera |
| Series | Stratix II |
| Logic Elements (LEs) | 60,440 |
| Embedded Memory (bits) | 2,544,192 |
| Number of LABs/CLBs | 3022 |
| Number of CLBs | 24176 |
| Maximum User I/O | 718 |
| Operating Voltage (Core) | 1.2 V |
| Process Technology | 90 nm CMOS |
| Temperature Grade | Industrial (-40C to +100C TJ) |
| Package Type | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | 33 mm x 33 mm |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
| Number of PLLs | 12 |
| Global Clock Networks | 16 |
| Embedded Multipliers (18x18) | 36 |
| Transceiver Count | 0 (no embedded transceivers) |
| RoHS ステータス | Non-compliant (contains lead per legacy Altera package) |
EP2S60F1020I4 33 mm x 33 mm ピン配置ガイド
EP2S60F1020I4 (33 mm x 33 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S60F1020I4.
詳細は データシート をご参照ください。
主な用途
EP2S60F1020I4 の用途: 7 件s: Telecom Baseband Processing, High-Speed Test & Measurement Equipment, Military Radar and Signal Intelligence, Broadcast Video Processing, Industrial Motor Control and Automation, Medical Imaging Systems, High-Performance Networking Switching.
Telecom Baseband Processing
The EP2S60F1020I4's 60,440 logic elements and 36 embedded 18x18 multipliers deliver the DSP throughput needed for 3G/4G baseband processing in mid-range wireless infrastructure. Placed on a custom line card with DDR2/QDR memory interfaces via the device's 718 user I/Os, the Stratix II fabric implements chip-rate processing, turbo/Viterbi decoding, and FFT-based OFDM channelization at full line rates. The 12 PLLs generate the multiple synchronized clocks required for ADC/DAC sample domains, digital up/down conversion stages, and backplane Ethernet interfaces. The 2.5 Mbits of embedded TriMatrix memory eliminates external buffer chips for many intermediate stages.
おすすめ
High-Speed Test & Measurement Equipment
With 718 user I/Os, the EP2S60F1020I4 enables logic analyzers, protocol testers, and arbitrary waveform generators that require massive parallel data capture. The 1020-FBGA package supports the wide bus widths needed to interface with high-speed ADC/DAC devices, and the dedicated 18x18 multipliers accelerate real-time DSP computations such as FFT and digital filtering. The 12 PLLs distribute low-jitter clocks across the fabric, critical for instruments where timing accuracy defines measurement quality. The industrial temperature grade (-40C to +100C) allows deployment in laboratory and field environments without thermal derating.
おすすめ
Military Radar and Signal Intelligence
The EP2S60F1020I4 is widely used in military radar and SIGINT systems where high logic density, real-time DSP performance, and industrial temperature range converge. The 36 18x18 multipliers implement pulse compression, MTI filtering, and beamforming computations; the 2.5 Mbits of embedded memory serves as fast corner-turn memory for range-Doppler processing. The 1020-FBGA exposed-die package provides robust thermal dissipation for high-altitude and avionics applications. Legacy systems designed in the mid-2000s continue to use this part because of mature Quartus II tool flow and well-characterized IP libraries for radar signal processing.
おすすめ
Broadcast Video Processing
The EP2S60F1020I4's 60K logic elements support real-time HD video processing pipelines including color space conversion, scaling, de-interlacing, and frame-rate conversion in broadcast studio equipment. The abundant I/O (718 pins) accommodates multiple parallel SDI/HDMI interfaces plus DDR2 frame buffers, while the dedicated DSP blocks accelerate motion estimation and other compute-intensive video algorithms. The industrial temperature range supports the variable cooling conditions of broadcast truck and studio installations. Legacy broadcast manufacturers continue to use this part because of proven Quartus II toolchain support and certified design IP for SDI/HD-SDI standards.
おすすめ
Industrial Motor Control and Automation
The EP2S60F1020I4 serves in high-end industrial servo drives and CNC machines, where its 60K logic elements and 36 dedicated multipliers execute multi-axis field-oriented control (FOC) loops, position/speed PID controllers, and EtherCAT/PROFIBUS protocol stacks. The 718 user I/Os connect to multiple encoder inputs, gate drivers for IGBT/MOSFET power stages, and isolated industrial Ethernet PHYs. The industrial temperature grade and robust FC-FBGA package with high-vibration solder-joint reliability suit factory floor deployment. The 12 PLLs synchronize current-sampling ADCs with PWM generation to minimize control-loop latency.
おすすめ
Medical Imaging Systems
The EP2S60F1020I4 enables real-time image reconstruction in CT, MRI, and ultrasound systems, where its 36 18x18 multipliers accelerate back-projection, beamforming, and Fourier-domain reconstruction algorithms. The 2.5 Mbits of embedded memory buffer raw scan lines and partial reconstructions without external SRAM access latency. The 718 user I/Os interface to multi-channel analog front ends, image storage subsystems, and display pipelines. The industrial temperature grade and reliable FC-BGA package suit the long-life-cycle requirements of medical equipment where field upgrades must be supported for 10-15 years after initial product launch.
おすすめ
High-Performance Networking Switching
The EP2S60F1020I4 functions as a custom packet processor or fabric interface in 10-Gigabit Ethernet switches and network taps. The 60K logic elements implement header parsing, lookup tables, and queue management for line-rate processing, while the 36 dedicated multipliers accelerate hash computations and CRC operations. The 718 I/Os connect to multiple 10G SFP+ modules, switch fabric ASICs, and DDR2 packet buffers. The industrial temperature grade supports outdoor and uncontrolled-environment deployment. Legacy switch designs leverage this part's mature reference designs and Quartus II IP cores for SGMII/XAUI interfaces.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S60F1020I4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S60F1020I4N | EP2S60F1020C5N | EP2S60F1020C4N | EP2S90F1020I4 | EP2S130F1020I4 | EP2S180F1020I4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 1020-FBGA | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements (LEs) | 60,440 | 60,440 (same) | 60,440 (same) | 60,440 (same) | 90,960 (+50%) | 132,540 (+119%) | 179,400 (+197%) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) | 4,520,448 (+78%) | 6,747,840 (+165%) | 9,383,040 (+269%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I4 | I4 (same) | C5 (faster, commercial) | C4 (slower, commercial) | I4 (same) | I4 (same) | I4 (same) |
| Embedded Multipliers (18x18) | 36 | 36 (same) | 36 (same) | 36 (same) | 48 (+33%) | 63 (+75%) | 96 (+167%) |
| Number of PLLs | 12 | 12 (same) | 12 (same) | 12 (same) | 12 (same) | 12 (same) | 12 (same) |
| Maximum User I/O | 718 | 718 (same) | 718 (same) | 718 (same) | 718 (same) | 742 (+3%) | 742 (+3%) |
| RoHS / Lead-Free | Non-RoHS (lead BGA) | RoHS (N suffix) | RoHS (N suffix) | RoHS (N suffix) | Non-RoHS (lead BGA) | Non-RoHS (lead BGA) | Non-RoHS (lead BGA) |
主な差別化要因
- Backward-compatible lead-free variant available in same package （vs EP2S60F1020I4N)
- Higher-density siblings in same package for board reuse （vs EP2S90F1020I4 / EP2S130F1020I4 / EP2S180F1020I4)
- Same silicon, different speed/temperature grades for cost optimization （vs EP2S60F1020C5N / EP2S60F1020C4N / EP2S60F1020C3N)
設計ノート
Estimated: A fully utilized EP2S60F1020I4 can consume 20-30 W depending on clock rate and toggle activity. The 1020-FBGA exposed-die package must be soldered to a PCB thermal pad with at least 4 thermal vias to a 4-layer 2 oz copper inner ground plane. A heatsink is typically required for continuous full-power operation; without thermal management, junction temperature may exceed the 100C industrial limit at high toggle rates. Use a power sequencer to ensure VCCINT (1.2 V core) ramps before VCCIO (I/O bank voltages) to avoid I/O latch-up damage.
Design the PCB for the 1.0 mm pitch 1020-ball FC-BGA. Use microvia (laser-drilled) stack-ups in the BGA fanout region, transitioning to standard 8-mil traces outside the breakout. Match trace lengths for DDR2/QSPI LVDS pairs within 50 mil tolerance. Decoupling requires 100 nF X7R capacitors on every VCC pin pair, plus bulk 100 uF tantalum or ceramic capacitors on each supply rail. The JTAG chain (TCK, TMS, TDI, TDO) must be kept short (<2 inches total) and protected from noise with a 4.7 k pull-up on TCK and TMS.
Configuration mode selection (PS vs FPP vs JTAG) is set by MSEL pins; confirm these are pulled to the correct logic level via external resistors before power-up. Failing to configure the device before releasing the nCONFIG/nSTATUS lines will result in a stalled startup. Also, the legacy Altera Quartus II software (version 13.0 or earlier for Stratix II) is required - newer Quartus versions do not support Stratix II. For new designs, plan to migrate to Cyclone V or Arria 10 before the Quartus II toolchain is deprecated.
LVDS signaling on the EP2S60F1020I4 requires 100 ohm differential termination near the receiver; use external resistors on the PCB (the device does not have internal LVDS termination in all banks). For DDR2 interfaces, enforce 25 mil length matching between clock and data signals to maintain timing margins. The 12 PLLs require clean isolated supply rails - place a ferrite bead and 10 uF + 100 nF filter on each PLL analog supply (VCCA_PLL) to prevent jitter from digital switching noise coupling through the substrate.
コンプライアンス情報
EP2S60F1020I4 contains lead BGA balls and is generally not RoHS compliant. Use EP2S60F1020I4N (lead-free) for RoHS-compliant designs. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC. Always verify current compliance status with the manufacturer before using in restricted regions.
