EP2S60F1020I5N - 60K LE Stratix II FPGA, 718 I/O, 1020-BGA
部品番号: EP2S60F1020I5N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198 | $198,000.00 |
EP2S60F1020I5N 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, the EP2S60F1020I5N sits in the Stratix II family -> high-end FPGA -> programmable logic device -> semiconductor. FPGAs differ from ASICs by being fully re-programmable in the field, and from CPLDs by offering far higher logic capacity, embedded RAM, and DSP capability.
Key features of the EP2S60F1020I5N include 60,440 logic elements, 718 user I/O pins, 1.2 V core voltage with on-chip voltage regulation, dedicated DSP blocks for high-speed arithmetic, abundant TriMatrix embedded memory, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL.
Architecture-wise, Stratix II devices employ an adaptive logic module (ALM) structure that delivers up to 2.5x the performance and 2x the density of prior Stratix generations, with 8-input fracturable look-up tables (LUTs) per ALM. This enables efficient mapping of wide-fanin logic and arithmetic paths while reducing interconnect congestion.
Typical applications include high-speed digital signal processing, telecom baseband and line-card designs, military and aerospace signal processing, ASIC prototyping, high-performance video and image processing, and software-defined radio platforms where massive parallelism is required.
When designing with this part, ensure a robust multi-rail power distribution network because Stratix II requires separate VCCINT, VCCIO bank supplies, PLL analog supplies, and transceiver supplies. Thermal management is essential at high-utilization workloads; the FC-FBGA package requires careful PCB stack-up and thermal vias for heat removal.
This page synthesizes distributor pricing, lifecycle status, and Stratix II family cross-references not found in the manufacturer datasheet alone, supporting faster component selection and BOM risk reduction.
ドロップイン代替品: EP2S60F1020I5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S60F1020I5N （同一形状・フットプリント） — 相違点: Operating Temperature, Speed Grade, Family, Package, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S60F1020I4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$270 / 個
データシートを見る →EP2S60F1020C5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$143.75 / 個
データシートを見る →EP2S60F1020C4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$67 / 個
データシートを見る →EP2S60F1020C3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1095 / 個
データシートを見る →EP2S130F1020I4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1380 / 個
データシートを見る →EP2S60F1020I5N 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 60440 |
| User I/O Count | 718 |
| Operating Frequency (max) | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| パッケージ | 1020-ball FC-FBGA |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +100C (industrial) |
| Speed Grade | I5 |
| Temperature Grade | Industrial |
EP2S60F1020I5N 1020-ball fc-fbga ピン配置ガイド
EP2S60F1020I5N (1020-ball fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S60F1020I5N.
詳細は データシート をご参照ください。
主な用途
EP2S60F1020I5N の用途: 6 件s: High-Performance Digital Signal Processing, Telecom Baseband and Line-Card Designs, ASIC Prototyping and Emulation, Software-Defined Radio Platforms, High-Speed Video and Image Processing, Military and Aerospace Signal Processing.
High-Performance Digital Signal Processing
The EP2S60F1020I5N fits high-performance DSP applications because its 60,440 logic elements combined with dedicated 18x18 multiplier DSP blocks enable hundreds of GMACS throughput. The 1020-ball FC-FBGA package exposes 718 user I/O pins, allowing wide parallel data paths to external DDR2 or QDRII SRAM memories. Operating at up to 609.76 MHz, the device supports multi-channel FIR filters, FFT engines, and radar signal processing pipelines. The 1.2 V VCCINT and 90 nm CMOS process deliver favorable performance-per-watt for sustained DSP workloads.
おすすめ
Telecom Baseband and Line-Card Designs
The EP2S60F1020I5N fits telecom baseband processing because its high logic density, multi-standard I/O support (LVDS, SSTL, HSTL), and dedicated SERDES capability enable protocol bridging and packet processing at line rates. The 1020-ball FC-FBGA supports the abundant I/O required for backplane interfaces, SFP/SFP+ connectors, and parallel backplane buses. Industrial temperature grading supports outdoor cabinet deployment. Designers typically pair the EP2S60F1020I5N with external PHY devices and DDR2 SDRAM for buffer memory in multi-gigabit switching applications.
おすすめ
ASIC Prototyping and Emulation
The EP2S60F1020I5N is widely used as an ASIC prototyping platform because its 60,440 logic elements, abundant TriMatrix embedded memory, and 718 I/O pins allow mapping of multi-million-gate ASIC designs onto one or two FPGAs. Designers partition ASIC RTL across multiple EP2S60 devices with board-level partitioning, taking advantage of the FC-FBGA package's high I/O count for chip-to-chip signals. The 90 nm process node and Quartus II timing closure flow are well-validated for ASIC verification, with vector replay and live in-circuit emulation commonly deployed.
おすすめ
Software-Defined Radio Platforms
The EP2S60F1020I5N fits software-defined radio (SDR) platforms because its logic density and DSP throughput can implement multiple concurrent modulation/demodulation chains while maintaining real-time processing margins. The 1020-ball FC-FBGA's I/O count accommodates wide parallel ADC/DAC interfaces and high-speed LVDS data streams. Combined with its industrial temperature grade, the device supports ruggedized military and aerospace SDR deployments including tactical radios, electronic warfare subsystems, and signal-intelligence platforms operating from -40C to +100C.
おすすめ
High-Speed Video and Image Processing
The EP2S60F1020I5N serves high-speed video processing applications because its logic density and embedded memory bandwidth support real-time 1080p60 and 4K video pipelines, including color space conversion, scaling, deinterlacing, and codec preprocessing. The 1020-ball FC-FBGA package provides the 718 user I/O required for parallel CameraLink, DVI/HDMI, or DisplayPort bridge implementations. Industrial temperature grading supports broadcast equipment and surveillance applications, while 1.2 V core operation keeps power consumption manageable in multi-board imaging systems.
おすすめ
Military and Aerospace Signal Processing
The EP2S60F1020I5N is qualified for military and aerospace signal processing because its industrial temperature range (-40C to +100C), high logic density, and ruggedized FC-FBGA package meet MIL-STD environmental requirements. Applications include radar front-end processing, electronic countermeasures, secure communications, and avionics displays. Designers pair the device with rad-tolerant memory and protocol ASICs, using the 718 I/O count for sensor array interfaces. Long-term programs should verify part availability through authorized defense distributors given Last Time Buy status.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S60F1020I5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S60F1020I4N | EP2S60F1020C5N | EP2S60F1020C4N | EP2S60F1020C3N | EP2S130F1020I4N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA | 1020-ball FC-FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60440 | 60440 | 60440 | 60440 | 60440 | 132540 |
| User I/O Pins | 718 | 718 | 718 | 718 | 718 | 718 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I5 | I4 (slower) | C5 | C4 | C3 (slowest) | I4 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主な差別化要因
- Highest speed grade in the EP2S60F1020 family （vs EP2S60F1020I4N)
- Industrial temperature range versus commercial only （vs EP2S60F1020C5N)
- Lower-cost 60K alternative to 130K variant （vs EP2S130F1020I4N)
設計ノート
Stratix II devices require a multi-rail power distribution network: VCCINT (1.2 V core), VCCIO (per-bank I/O voltages, often 1.5 V, 1.8 V, 2.5 V, or 3.3 V), VCCPD (3.3 V pre-driver), VCCA_PLL (analog PLL supply), and VCCAUX (2.5 V auxiliary). Use a power-sequencing controller such as the LTC2923 or TPS5430 to enforce proper rail ordering. Decoupling: place 0.1 uF X7R ceramics within 100 mils of every VCCINT and VCCIO pin, plus bulk 47 uF to 100 uF tantalum or polymer caps per power island. Inrush current during configuration can exceed 4 A; size your regulator accordingly.
The 1020-ball FC-FBGA package has a relatively high junction-to-ambient thermal resistance (theta_JA around 12-15 C/W with optimized PCB design). At high utilization, the EP2S60F1020I5N can dissipate 5-10 W. Use a 12-layer or higher PCB stack-up with dedicated inner ground and power planes; place thermal via arrays (0.3 mm pitch, 0.2 mm drill) under the BGA to conduct heat to inner planes and an optional heat spreader. For high-altitude or sealed enclosures, characterize with a thermal camera to ensure junction temperature stays below 100C.
Use a high-density interconnect (HDI) PCB process with 4-mil traces and 4-mil spaces for BGA breakout. The FC-FBGA ball pitch is typically 1.0 mm. Escape routing should follow via-in-pad or microvia designs to fan out from the 1020-ball array without exceeding signal-integrity budgets. Pair each high-speed differential pair (LVDS) with matched-length routing (within 25 mils) and 100 ohm differential impedance. Reference plane continuity is essential for all 50 ohm single-ended and 100 ohm differential traces crossing the BGA field.
Do not assume pin-compatible variants without verifying the ball map. EP2S60F1020I5N and EP2S130F1020I4N share the 1020-ball FC-FBGA package, but the silicon die differs and Quartus II pin assignments must be re-validated for any unused I/O banks. Configuration mode (AS, PS, JTAG) requires proper MSEL pin strapping; floating MSEL pins will fail to configure. JTAG chain integrity must be verified with the Quartus II programmer before soldering; rework on a 1020-ball BGA is extremely difficult.
Differential LVDS pairs should be routed with 100 ohm differential impedance using a coplanar waveguide with ground (CPWG) structure on outer layers, or stripline on inner layers. Minimize layer transitions; each via adds approximately 0.5 to 1.5 nH of inductance. For DDR2 SDRAM interfaces, use matched-length (within 50 mils), matched-impedance (50 ohm SE) routing with proper write-leveling calibration in the Quartus II DDR2 controller. Place external memory within 2 inches of the FPGA to maintain signal integrity.
コンプライアンス情報
Compliance data not present in Verified Web Data; engineer should request REACH/RoHS declaration from Intel/Altera directly given Last Time Buy status.