EP3SL70F780I4 - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
部品番号: EP3SL70F780I4 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2625 | $26,250.00 |
| 100 | $2350 | $235,000.00 |
| 500 | $2100 | $1,050,000.00 |
| 1,000 | $1850 | $1,850,000.00 |
EP3SL70F780I4 概要
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be programmed and reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier above fixed-function Application-Specific Standard Products (ASSPs) and below fully custom ASICs, offering hardware-level parallelism, customizable I/O protocols, and on-chip memory. Within Intel's programmable logic portfolio, Stratix III devices sit in the high-performance tier above Cyclone III and below Stratix IV/V, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs.
Key specifications of the EP3SL70F780I4 include 67,500 logic elements organized into 2,700 logic array blocks (LABs), 384 18x18 multipliers for DSP, and 4 PLLs plus 48 global clock networks. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through 488 user I/O pins with 8 phase-locked loops and dedicated high-speed transceiver blocks. Embedded memory totals 2,699,264 bits distributed across M9K and M144K block RAM primitives.
The Stratix III L architecture employs an 8-input adaptive logic module (ALM) which doubles the effective logic capacity compared to traditional 4-input LUT designs. Programmable Power Technology allows unused logic to be placed in low-power states, while speed-grade I4 timing supports internal clocks up to approximately 450 MHz depending on design margin and tool version. Configuration is loaded via JTAG or serial passive/active flash modes.
Typical applications for the EP3SL70F780I4 include ASIC prototyping and emulation, high-speed digital signal processing (radar, software-defined radio, video processing), test and measurement instrumentation, and high-bandwidth data acquisition front ends. Industrial-grade temperature rating (-40C to +100C) also suits factory automation, medical imaging, and aerospace ground systems.
When designing with this part, ensure your Quartus II tool version supports the Stratix III device family and that the 780-FBGA PCB layout provides adequate power decoupling near every VCCIO/VCCINT pin. Designers migrating to newer Intel FPGA families should review pin-out compatibility and voltage requirements, as Stratix III uses different I/O bank voltages than Stratix 10 and Cyclone 10 GX families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SL70F780I4 that are not available from the manufacturer datasheet alone.
ドロップイン代替品: EP3SL70F780I4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL70F780I4 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Family, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL70F780I3N
✅ ドロップイン✓ 在庫あり
$1240 / 個
データシートを見る →EP3SL70F780I3
✅ ドロップイン✓ 在庫あり
$1096.81 / 個
データシートを見る →EP3SL70F780C4N
✅ ドロップイン✓ 在庫あり
$1210 / 個
データシートを見る →EP3SL70F780C4LN
✅ ドロップイン✓ 在庫あり
$1380 / 個
データシートを見る →EP3SL70F780C4
✅ ドロップイン✓ 在庫あり
$745.32 / 個
データシートを見る →EP3SL70F780I4 最大定格＆電気的特性
| Series | Stratix III L |
| Logic Elements | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory | 2,699,264 bits |
| DSP Blocks (18x18 Multipliers) | 384 |
| User I/O Pins | 488 |
| PLLs | 8 |
| Global Clock Networks | 48 |
| パッケージ | 780-ball FC-FBGA |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Speed Grade | I4 |
| 動作温度 | -40C to +100C (Industrial) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Configuration Interface | JTAG, Serial Passive, Serial Active |
EP3SL70F780I4 780-ball fc-fbga ピン配置ガイド
EP3SL70F780I4 (780-ball fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL70F780I4.
詳細は データシート をご参照ください。
主な用途
EP3SL70F780I4 の用途: 6 件s: ASIC Prototyping and Emulation, High-Performance Digital Signal Processing, Test and Measurement Instrumentation, Software-Defined Radio (SDR), High-Bandwidth Data Acquisition, Industrial Control and Factory Automation.
ASIC Prototyping and Emulation
The EP3SL70F780I4's 67,500 logic elements, 2,699,264 bits of embedded memory, and 384 18x18 multipliers make it well-suited for ASIC prototyping and in-circuit emulation of mid-complexity ASICs. The 780-ball FC-FBGA package provides 488 user I/O pins, allowing emulation of wide bus interfaces such as DDR2/DDR3 controllers and high-speed parallel protocols. Quartus II's TimeQuest timing analyzer supports source-synchronous emulation, and the device's industrial temperature rating allows validation in realistic operating environments. Compared to ASIC fabrication cycles, FPGA prototyping reduces verification turnaround from weeks to days, accelerating time-to-market for complex SoC designs. Source: Stratix III Device Handbook 'Design Considerations' chapter.
おすすめ
High-Performance Digital Signal Processing
With 384 dedicated 18x18 multipliers and 2.7 Mbit of embedded memory, the EP3SL70F780I4 sustains hundreds of GMACs of DSP throughput, making it ideal for radar baseband processing, software-defined radio channelizers, and digital video codec pipelines. The 8-input ALM architecture enables efficient implementation of pipelined FIR and FFT cores, while the 48 global clock networks simplify multi-clock-domain designs. The industrial temperature range supports outdoor deployment in telecommunications infrastructure and aerospace ground systems. Compared to DSP processors, FPGA-based DSP delivers 10-100x higher throughput per watt for fixed-function transforms. Source: Stratix III Device Handbook 'DSP Blocks' chapter and Intel Application Note AN-531.
おすすめ
Test and Measurement Instrumentation
The EP3SL70F780I4 serves as the reconfigurable processing core in high-bandwidth oscilloscopes, logic analyzers, and protocol testers. Its 488 user I/O pins accommodate multi-channel LVDS acquisition paths at hundreds of Mbps per lane, while 2.7 Mbit of embedded memory buffers waveform captures before downstream processing. Industrial temperature rating ensures stable operation in production-floor ATE environments, and the 1.1 V core supply keeps power dissipation manageable even at full utilization. The Quartus II SignalTap II embedded logic analyzer provides real-time visibility without external probes, accelerating validation cycles. Source: Stratix III Device Handbook 'Configuration' chapter.
おすすめ
Software-Defined Radio (SDR)
The EP3SL70F780I4 enables software-defined radio implementations for wireless base stations, military radios, and cognitive radio research platforms. The 384 18x18 multipliers execute parallel channelization and demodulation for multiple simultaneous carriers, while 488 user I/O pins interface to high-speed ADCs and DACs through LVDS or HSTL. Industrial temperature rating suits outdoor mounted radios and vehicular communication systems. The device's PLLs and 48 global clock networks simplify multi-rate clocking required for sample-rate conversion and digital down-conversion. Source: Stratix III Device Handbook 'PLLs and Clock Networks' chapter.
おすすめ
High-Bandwidth Data Acquisition
The EP3SL70F780I4 functions as the data-routing and pre-processing engine in high-bandwidth data acquisition systems for medical imaging (CT, ultrasound front ends), particle physics detectors, and high-speed video capture. The 2,699,264-bit embedded memory acts as a deep FIFO for absorbing ADC bursts, while 488 user I/O pins accept parallel LVDS data from multiple ADC channels. Industrial temperature rating supports deployment in MRI suites and outdoor imaging systems. Quartus II's SOPC Builder integrates soft processor cores (Nios II) for control-plane tasks alongside data-plane DSP. Source: Stratix III Device Handbook 'Memory Interfaces' chapter.
おすすめ
Industrial Control and Factory Automation
The EP3SL70F780I4 supports deterministic real-time control loops in factory automation equipment, programmable logic controllers (PLCs), and motion controllers. The 488 user I/O pins connect to multi-axis encoder inputs, PWM outputs, and industrial Ethernet PHYs, while 384 18x18 multipliers compute field-oriented control (FOC) algorithms for AC motor drives. Industrial temperature rating ensures reliable operation in factory-floor environments with ambient temperatures up to +85C and beyond. The device's deterministic latency and parallel architecture outperform microcontroller-based PLCs for high-axis-count motion control. Source: Stratix III Device Handbook 'Industrial Applications' section.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL70F780I4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL70F780I3N | EP3SL70F780I3 | EP3SL70F780C4N | EP3SL70F780C4LN | EP3SL70F780C4 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Speed Grade | I4 | I3 (faster) | I3 (faster) | C4 (slower) | C4L (lower power) | C4 (slower) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 |
| DSP Multipliers (18x18) | 384 | 384 | 384 | 384 | 384 | 384 |
主な差別化要因
- Faster speed-grade I3 option available in same package （vs EP3SL70F780I3N)
- Lower-power commercial variant available for non-industrial use （vs EP3SL70F780C4LN)
- Industrial temperature range covers -40C to +100C junction （vs EP3SL70F780C4N)
設計ノート
The EP3SL70F780I4 requires multiple power rails: VCCINT (1.1 V core), VCCPLL (1.1 V analog), VCCIO (1.2 V to 3.3 V per bank), VCCAUX (2.5 V), and VCCPD (3.3 V or 2.5 V). All supplies must be sequenced per the Stratix III handbook 'Power Management' chapter to avoid latch-up. Use a dedicated LDO or switching regulator per rail with bulk decoupling of 100 uF plus 0.1 uF and 0.01 uF ceramics close to each VCC pin cluster. Decoupling capacitance must be sized to handle inrush during configuration.
Estimated: at full utilization (67,500 LE, 384 multipliers, 2.7 Mbit memory toggling at 200 MHz), the EP3SL70F780I4 dissipates approximately 8-12 W. The 780-ball FC-FBGA has a typical theta_JA of 12-15 C/W on a standard 8-layer PCB with adequate thermal vias. Designers should target junction temperature below +100C for industrial reliability; using Quartus II's PowerPlay power analyzer is essential to confirm thermal margin in dense designs.
The 780-ball FC-FBGA uses 1.0 mm ball pitch, requiring 0.5 mm diameter via-in-pad plating with filled and capped vias for proper assembly. The PCB stack-up should be at least 8 layers with dedicated power and ground planes adjacent to the outer signal layers. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general-purpose I/O. Intel provides reference design layout files for the Stratix III development kit that demonstrate compliant escape routing.
The EP3SL70F780I4 supports JTAG, serial passive (EPCS), and serial active flash configuration modes. For production boards, use a dedicated EPCS or third-party SPI flash with at least 32 Mbit capacity for full bitstream storage. Configure the MSEL[3:0] pins with the correct pull-up/pull-down resistors to select the desired configuration mode. Always include a JTAG header on prototype boards for in-system programming and SignalTap II debugging.
Avoid leaving unused I/O pins floating; configure them as outputs driven low or as inputs with internal weak pull-up to prevent oscillation. Do not mix 1.5 V and 1.8 V VCCIO on adjacent banks without consulting the bank compatibility matrix. When migrating from Stratix II, the I/O bank architecture differs and bank voltages must be re-validated. Always use Quartus II's pin planner to verify I/O standard compatibility before PCB layout.
コンプライアンス情報
RoHS and REACH compliant per Intel product declaration. AEC-Q100 not applicable as the device is a commercial/industrial FPGA, not an automotive-qualified IC. Lead-free confirmed; halogen-free status not explicitly disclosed by manufacturer.