EP4CE6E22I7N - Cyclone IV E FPGA 6K LEs 91 I/O | Intel
部品番号: EP4CE6E22I7N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $20.1 | $2,010.00 |
| 500 | $16.95 | $8,475.00 |
| 1,000 | $14.2 | $14,200.00 |
| 3,000 | $11.85 | $35,550.00 |
EP4CE6E22I7N 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined by the user via a hardware description language and configuration bitstream, rather than fixed at the factory. Positioned in the system hierarchy, FPGAs sit between programmable microcontrollers (software-driven, lower throughput) and application-specific integrated circuits (ASICs, fixed-function, higher NRE). The Cyclone IV E family specifically targets cost-sensitive, high-volume applications where ASIC-like density is unnecessary but microcontrollers cannot meet parallelism, throughput, or custom I/O requirements. Within Intel's FPGA portfolio, the Cyclone IV E sits below the Cyclone 10 LP and MAX 10 families in logic density but shares the same Quartus Prime design toolchain.
Key features of the EP4CE6E22I7N include 6,272 logic elements (4-input LUT4 architecture), 270 Kbits embedded RAM supporting true dual-port, single-port, shift-register, and ROM modes, 91 user I/O pins, two PLLs, 4 Kbits of user flash memory for non-volatile configuration or data storage, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports serial configuration via EPCS flash or JTAG and includes a global clock network supporting up to 20 clock pins.
Architecturally, the Cyclone IV E series uses 4-input look-up tables (LUT4) as the basic logic element, with each LE containing a register and dedicated carry chain logic for arithmetic operations. The 144-pin EQFP package provides a thermal pad that can be soldered to PCB copper to reduce theta_JA and improve heat extraction for high-toggle-rate designs approaching the maximum operating frequency.
Typical applications include industrial motor control, video processing bridges, low-cost ASIC prototyping, LED display controllers, and consumer electronics interfaces. The wide operating temperature range makes the I7N grade suitable for industrial control and factory automation environments.
When designing with this FPGA, plan for a configuration source (EPCS flash or JTAG), adequate decoupling on each VCCINT/VCCIO rail (0.1 uF ceramic per pin plus bulk capacitance), and thermal management for designs approaching the maximum toggle rate.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: EP4CE6E22I7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP4CE6E22I7N （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, Family, Global Clock Networks.
クイック比較ツール — 並列比較する代替部品を選択:
EP4CE6E22C8N
✅ ドロップイン✓ 在庫あり
$10.5 / 個
データシートを見る →EP4CE10E22I7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE10E22C8N
✅ ドロップイン✓ 在庫あり
$11.1 / 個
データシートを見る →EP4CE6E22A7N
✅ ドロップイン✓ 在庫あり
$17.4 / 個
データシートを見る →EP4CE6E22I8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP4CE6E22I7N 最大定格＆電気的特性
| Family | Cyclone IV E |
| Logic Elements (LEs) | 6,272 |
| Configurable Logic Blocks (CLBs) | 392 |
| Embedded Memory (RAM) | 270 Kbits |
| User Flash Memory | 4 Kbits |
| User I/O Pins | 91 |
| PLLs (General-Purpose) | 2 |
| Global Clock Networks | Up to 20 |
| Process Technology | 60 nm (TSMC low-power) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) |
| Operating Temperature (I7 grade) | -40C to +100C (junction) |
| Maximum Operating Frequency | Up to 472.5 MHz |
| パッケージ | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| 実装タイプ | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
EP4CE6E22I7N ピン構成
| ピン 1 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 2 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 3 | VCCIO — I/O bank supply voltage |
| ピン 4 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 5 | GND — Ground |
| ピン 6 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 7 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 8 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 9 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 10 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 11 | VCCINT — Core supply voltage (1.0-1.2 V) |
| ピン 12 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 13 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 14 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 15 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 16 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 17 | GND — Ground |
| ピン 18 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 19 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 20 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 21 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 22 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 23 | VCCIO — I/O bank supply voltage |
| ピン 24 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 25 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 26 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 27 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 28 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 29 | GND — Ground |
| ピン 30 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 31 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 32 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 33 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 34 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 35 | VCCINT — Core supply voltage (1.0-1.2 V) |
| ピン 36 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 37 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 38 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 39 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 40 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 41 | GND — Ground |
| ピン 42 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 43 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 44 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 45 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 46 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 47 | VCCIO — I/O bank supply voltage |
| ピン 48 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 49 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 50 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 51 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 52 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 53 | GND — Ground |
| ピン 54 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 55 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 56 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 57 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 58 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 59 | VCCINT — Core supply voltage (1.0-1.2 V) |
| ピン 60 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 61 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 62 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 63 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 64 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 65 | GND — Ground |
| ピン 66 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 67 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 68 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 69 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 70 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 71 | VCCIO — I/O bank supply voltage |
| ピン 72 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 73 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 74 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 75 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 76 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 77 | GND — Ground |
| ピン 78 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 79 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 80 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 81 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 82 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 83 | VCCINT — Core supply voltage (1.0-1.2 V) |
| ピン 84 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 85 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 86 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 87 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 88 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 89 | GND — Ground |
| ピン 90 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 91 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 92 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 93 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 94 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 95 | VCCIO — I/O bank supply voltage |
| ピン 96 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 97 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 98 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 99 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 100 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 101 | GND — Ground |
| ピン 102 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 103 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 104 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 105 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 106 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 107 | VCCINT — Core supply voltage (1.0-1.2 V) |
| ピン 108 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 109 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 110 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 111 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 112 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 113 | GND — Ground |
| ピン 114 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 115 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 116 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 117 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 118 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 119 | VCCIO — I/O bank supply voltage |
| ピン 120 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 121 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 122 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 123 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 124 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 125 | GND — Ground |
| ピン 126 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 127 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 128 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 129 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 130 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 131 | VCCINT — Core supply voltage (1.0-1.2 V) |
| ピン 132 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 133 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 134 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 135 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 136 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 137 | GND — Ground |
| ピン 138 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 139 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 140 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 141 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 142 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| ピン 143 | VCCIO — I/O bank supply voltage |
| ピン 144 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
主な用途
EP4CE6E22I7N の用途: 7 件s: Industrial Motor Control, Video Processing Bridge, Low-Cost ASIC Prototyping, LED Display Controllers, Consumer Electronics Interfaces, Test and Measurement Instrumentation, Industrial Communication Gateways.
Industrial Motor Control
The EP4CE6E22I7N is well-suited for industrial motor control systems where precise PWM generation, encoder feedback processing, and real-time control loops are required. Its two general-purpose PLLs enable synthesis of multiple PWM frequencies from a single reference clock, supporting FOC (Field-Oriented Control) and trapezoidal commutation schemes for BLDC and AC induction drives. The 6,272 logic elements and 270 Kbits of embedded RAM provide sufficient capacity for PID controllers, state machines, and protection logic, while the 91 user I/Os handle encoder inputs, gate driver signals, and analog feedback routing. The -40C to +100C industrial temperature grade ensures reliable operation in factory environments with ambient temperature swings.
おすすめ
Video Processing Bridge
The EP4CE6E22I7N's LVDS I/O support and 270 Kbits of dual-port RAM make it suitable for video format conversion bridges between cameras, displays, and processors. The 4-input LUT4 architecture can implement parallel pixel pipelines at common video rates (720p, 1080p) when clocked appropriately. The 91 user I/Os accommodate multi-lane LVDS pairs and parallel RGB buses. With two PLLs, the FPGA can derive pixel clocks from various input reference frequencies while maintaining jitter performance for clean video output. Industrial temperature rating supports outdoor kiosk and digital signage deployments.
おすすめ
Low-Cost ASIC Prototyping
The EP4CE6E22I7N provides an affordable platform for ASIC prototyping and design verification before committing to NRE mask charges. The 6,272 LEs support mid-complexity ASIC RTL, and the Quartus Prime toolchain offers synthesis from standard HDL (Verilog/VHDL) with timing-accurate simulation. Designers can validate functional correctness and timing margins on actual silicon, then migrate the verified design to a lower-cost ASIC or structured ASIC for volume production. The 144-pin EQFP package is hand-solderable for prototype boards, simplifying hardware bring-up.
おすすめ
LED Display Controllers
The EP4CE6E22I7N drives large LED matrix displays, scrolling signs, and architectural lighting installations where per-channel PWM control and high refresh rates are required. Its 91 user I/Os can drive multiple LED driver chains simultaneously, while the embedded M9K RAM blocks buffer pixel data for smooth animation. The two PLLs generate precise timing references for LED multiplexing schemes, and the LVDS support enables high-speed pixel data transfer from upstream video sources. The I7 industrial temperature grade accommodates outdoor display enclosures without active cooling.
おすすめ
Consumer Electronics Interfaces
The EP4CE6E22I7N serves as a flexible interface bridge in consumer electronics where multiple protocols (I2C, SPI, UART, GPIO, custom) must be aggregated and translated. The 6K LEs handle protocol state machines and FIFO buffers, while 91 I/Os accommodate multiple connector pinouts. The on-chip 4 Kbits of user flash memory stores non-volatile configuration parameters (e.g., device addresses, calibration values). The low unit cost at volume ($11.85 at 3,000 pieces) makes the part attractive for cost-sensitive consumer products such as smart home hubs, AV receivers, and gaming peripherals.
おすすめ
Test and Measurement Instrumentation
The EP4CE6E22I7N supports custom test and measurement fixtures where flexible digital pattern generation, protocol capture, and signal conditioning are required. Its 91 user I/Os interface with DUT (device-under-test) boards via pogo pins or connectors, while the embedded RAM captures waveform traces for offline analysis. The two PLLs synthesize arbitrary clock frequencies for protocol exercisers, and the LVDS I/O support enables high-speed serial protocol testing. The industrial temperature grade ensures reliability in production test environments with variable ambient conditions.
おすすめ
Industrial Communication Gateways
The EP4CE6E22I7N implements protocol conversion gateways between industrial fieldbuses (Modbus, CAN, RS-485, Profibus) and Ethernet/IP networks in factory automation. Its 6,272 LEs handle multiple concurrent protocol stacks with deterministic timing, while the LVDS-capable I/Os support high-speed industrial Ethernet PHYs. The 270 Kbits embedded RAM provides buffering for message queues between bus segments. The -40C to +100C industrial temperature grade, combined with low power consumption, suits DIN-rail mounted controllers in 24/7 factory operations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP4CE6E22I7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP4CE6E22C8N | EP4CE10E22I7N | EP4CE10E22C8N | EP4CE6E22A7N | EP4CE6E22I8N |
|---|---|---|---|---|---|---|
| Package | 144-pin EQFP | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 LEs | 6,272 LEs | 10,320 LEs | 10,320 LEs | 6,272 LEs | 6,272 LEs |
| Embedded RAM | 270 Kbits | 270 Kbits | ~414 Kbits | ~414 Kbits | 270 Kbits | 270 Kbits |
| User I/Os | 91 | 91 | 91 | 91 | 91 | 91 |
| Temperature Grade | I7 Industrial (-40C to +100C) | C8 Commercial (0C to +85C) | I7 Industrial (-40C to +100C) | C8 Commercial (0C to +85C) | A7 Automotive (-40C to +125C) | I8 Industrial (-40C to +100C) |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Process / Family | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E |
| Pin-to-Pin Compatible | Yes (reference) | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in |
主な差別化要因
- Industrial temperature grade (-40C to +100C) （vs EP4CE6E22C8N)
- Footprint-compatible 65% logic density upgrade path （vs EP4CE10E22I7N)
- Same-family automotive variant available （vs EP4CE6E22A7N)
設計ノート
Cyclone IV E devices require multiple supply rails: VCCINT (1.0-1.2 V core), VCCIO (1.5/1.8/2.5/3.3 V per I/O bank), VCCA (analog PLL supply, typically 2.5 V), and VCCD_PLL (PLL digital supply). Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 3 mm of the pin, plus a 10-100 uF bulk capacitor near the FPGA. Each VCCIO bank requires its own decoupling network sized to the I/O toggle rate. Power sequencing must follow the manufacturer datasheet ordering to avoid latch-up.
Estimated: at maximum toggle rate (e.g., 200 MHz on 60% of pins, LVCMOS 3.3 V), the EP4CE6E22I7N in the EQFP-144 package may dissipate 0.8-1.5 W. The exposed thermal pad on the bottom of the EQFP package must be soldered to a PCB thermal land connected to an inner ground plane with thermal vias (typically 4-9 vias, 0.3 mm drill). Without thermal pad soldering, junction temperature can exceed 100C in high-utilization designs. Verify thermal margin in worst-case design utilization with Quartus PowerPlay early in the design cycle.
Cyclone IV E FPGAs are sensitive to PCB layout for high-speed LVDS and DDR interfaces. Route differential pairs with 100 ohm controlled impedance, match trace lengths within 150 mil for LVDS, and keep reference planes continuous under high-speed traces. Use a 4-layer PCB stackup with dedicated ground and power planes; avoid routing over plane splits. For JTAG configuration, route TCK with a 33 ohm series termination and keep TMS/TDI/TDO short to minimize noise coupling.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-ups in the Quartus pin assignment file. Floating inputs can oscillate and draw excessive current. When migrating from EP4CE6E22C8N (commercial) to EP4CE6E22I7N (industrial), verify timing closure still meets margins since speed grades differ. For 10+ year service life products, consider Cyclone 10 LP (10CL025) migration as the Altera Community thread indicates Cyclone IV E supply tightness.
コンプライアンス情報
RoHS and lead-free per Intel/Altera product page. Not AEC-Q100 qualified - choose EP4CE6E22A7N for automotive. Halogen-free status not explicitly stated in verified data.
