Intel

EP4CE6E22I7N - Cyclone IV E FPGA 6K LEs 91 I/O | Intel

N.º da peça: EP4CE6E22I7N ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.0 V to 1.2 V (nominal 1.2 V) Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 144-pin EQFP (Plastic Enhanced QFP) with exposed pad Package Up to 20 Speed 270 Kbits Memory
A partir de $11.85 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-07
Preços por volume
Qtd. Preço unitário Total
1 $28.5 $28,50
10 $24.75 $247,50
100 $20.1 $2.010,00
500 $16.95 $8.475,00
1.000 $14.2 $14.200,00
3.000 $11.85 $35.550,00
ℹ️ Todos os preços estão em USD

EP4CE6E22I7N Visão geral

The Intel (formerly Altera) EP4CE6E22I7N is a low-cost, low-power Cyclone IV E Field-Programmable Gate Array (FPGA) built on a 60 nm process, offering 6,272 logic elements (6K LEs) and 91 user I/Os housed in a 144-pin EQFP (Enhanced Plastic Quad Flat Pack) package with exposed thermal pad. The device integrates 270 Kbits of embedded RAM, 392 configurable logic blocks (CLBs), and two general-purpose PLLs, with a core operating frequency up to 472.5 MHz in industrial-grade silicon rated -40C to +100C junction (I7 grade).

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined by the user via a hardware description language and configuration bitstream, rather than fixed at the factory. Positioned in the system hierarchy, FPGAs sit between programmable microcontrollers (software-driven, lower throughput) and application-specific integrated circuits (ASICs, fixed-function, higher NRE). The Cyclone IV E family specifically targets cost-sensitive, high-volume applications where ASIC-like density is unnecessary but microcontrollers cannot meet parallelism, throughput, or custom I/O requirements. Within Intel's FPGA portfolio, the Cyclone IV E sits below the Cyclone 10 LP and MAX 10 families in logic density but shares the same Quartus Prime design toolchain.

Key features of the EP4CE6E22I7N include 6,272 logic elements (4-input LUT4 architecture), 270 Kbits embedded RAM supporting true dual-port, single-port, shift-register, and ROM modes, 91 user I/O pins, two PLLs, 4 Kbits of user flash memory for non-volatile configuration or data storage, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports serial configuration via EPCS flash or JTAG and includes a global clock network supporting up to 20 clock pins.

Architecturally, the Cyclone IV E series uses 4-input look-up tables (LUT4) as the basic logic element, with each LE containing a register and dedicated carry chain logic for arithmetic operations. The 144-pin EQFP package provides a thermal pad that can be soldered to PCB copper to reduce theta_JA and improve heat extraction for high-toggle-rate designs approaching the maximum operating frequency.

Typical applications include industrial motor control, video processing bridges, low-cost ASIC prototyping, LED display controllers, and consumer electronics interfaces. The wide operating temperature range makes the I7N grade suitable for industrial control and factory automation environments.

When designing with this FPGA, plan for a configuration source (EPCS flash or JTAG), adequate decoupling on each VCCINT/VCCIO rail (0.1 uF ceramic per pin plus bulk capacitance), and thermal management for designs approaching the maximum toggle rate.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Alternativas drop-in para EP4CE6E22I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP4CE6E22I7N (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Family, Global Clock Networks.

Intel
Package: 144-LQFP Exposed Pad (E22)
Process Technology: 60 nm low-power
Operating Temperature: 0C to +85C
Comparar com EP4CE6E22I7N →
Intel
Global Clock Networks: 10
Comparar com EP4CE6E22I7N →
Intel
Process Technology: TSMC 60 nm low-k
Operating Temperature: 0 °C to +85 °C (Commercial)
Comparar com EP4CE6E22I7N →
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
Process Technology: 60 nm
Operating Temperature: -40 C to +85 C (industrial, C6 speed grade)
Comparar com EP4CE6E22I7N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Operating Temperature: 0C to +85C (commercial)
Family: EP4CE6
Comparar com EP4CE6E22I7N →
Intel
Package: 144-pin EQFP with exposed pad (22 x 22 mm)
Process Technology: 60 nm (low-power)
Global Clock Networks: 8
Comparar com EP4CE6E22I7N →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Process Technology: 60 nm
Comparar com EP4CE6E22I7N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP4CE6E22C8N

✅ Drop-In
Intel
📦 144-pin EQFP
Cyclone IV E · EP4CE6 · 6,272 · 276,480 bits (270 Kbits) · 15 (18x18) · 2 (up to 4 clock networks) · 91 · 1.15 V to 1.25 V

✓ Em estoque

$10.5 / unidade

Ver ficha técnica →

EP4CE10E22I7N

✅ Drop-In
📦 144-pin EQFP
10K LEs vs 6K LEs (+65% logic); same 144-EQFP package, same I7 grade, pin-to-pin footprint upgrade

📋 Alternativa de referência (fora do catálogo)

EP4CE10E22C8N

✅ Drop-In
Intel
📦 144-pin EQFP
Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✓ Em estoque

$11.1 / unidade

Ver ficha técnica →

EP4CE6E22A7N

✅ Drop-In
Intel
📦 144-pin EQFP
Cyclone IV E · 6,272 · 276,480 · 15 · 91 · 4 · 2 · 10

✓ Em estoque

$17.4 / unidade

Ver ficha técnica →

EP4CE6E22I8N

✅ Drop-In
📦 144-pin EQFP
I8 speed grade vs I7 speed grade (faster timing closure); same 144-EQFP package, same 6K LEs, pin-to-pin

📋 Alternativa de referência (fora do catálogo)

EP4CE6E22I7N Classificações máximas e características elétricas

Family Cyclone IV E
Logic Elements (LEs) 6,272
Configurable Logic Blocks (CLBs) 392
Embedded Memory (RAM) 270 Kbits
User Flash Memory 4 Kbits
User I/O Pins 91
PLLs (General-Purpose) 2
Global Clock Networks Up to 20
Process Technology 60 nm (TSMC low-power)
Core Voltage (VCCINT) 1.0 V to 1.2 V (nominal 1.2 V)
Operating Temperature (I7 grade) -40C to +100C (junction)
Maximum Operating Frequency Up to 472.5 MHz
Encapsulamento 144-pin EQFP (Plastic Enhanced QFP) with exposed pad
Tipo de montagem Surface Mount
Configuration Method Serial (EPCS) or JTAG
Supported I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL
Nível MSL 3 (per JEDEC J-STD-020)
Status RoHS Compliant

Configuração de pinos do EP4CE6E22I7N

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pino 1 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 2 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 3 VCCIO — I/O bank supply voltage
Pino 4 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 5 GND — Ground
Pino 6 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 7 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 8 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 9 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 10 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 11 VCCINT — Core supply voltage (1.0-1.2 V)
Pino 12 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 13 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 14 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 15 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 16 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 17 GND — Ground
Pino 18 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 19 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 20 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 21 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 22 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 23 VCCIO — I/O bank supply voltage
Pino 24 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 25 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 26 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 27 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 28 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 29 GND — Ground
Pino 30 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 31 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 32 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 33 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 34 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 35 VCCINT — Core supply voltage (1.0-1.2 V)
Pino 36 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 37 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 38 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 39 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 40 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 41 GND — Ground
Pino 42 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 43 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 44 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 45 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 46 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 47 VCCIO — I/O bank supply voltage
Pino 48 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 49 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 50 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 51 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 52 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 53 GND — Ground
Pino 54 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 55 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 56 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 57 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 58 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 59 VCCINT — Core supply voltage (1.0-1.2 V)
Pino 60 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 61 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 62 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 63 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 64 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 65 GND — Ground
Pino 66 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 67 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 68 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 69 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 70 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 71 VCCIO — I/O bank supply voltage
Pino 72 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 73 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 74 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 75 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 76 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 77 GND — Ground
Pino 78 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 79 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 80 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 81 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 82 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 83 VCCINT — Core supply voltage (1.0-1.2 V)
Pino 84 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 85 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 86 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 87 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 88 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 89 GND — Ground
Pino 90 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 91 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 92 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 93 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 94 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 95 VCCIO — I/O bank supply voltage
Pino 96 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 97 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 98 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 99 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 100 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 101 GND — Ground
Pino 102 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 103 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 104 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 105 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 106 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 107 VCCINT — Core supply voltage (1.0-1.2 V)
Pino 108 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 109 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 110 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 111 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 112 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 113 GND — Ground
Pino 114 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 115 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 116 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 117 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 118 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 119 VCCIO — I/O bank supply voltage
Pino 120 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 121 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 122 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 123 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 124 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 125 GND — Ground
Pino 126 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 127 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 128 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 129 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 130 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 131 VCCINT — Core supply voltage (1.0-1.2 V)
Pino 132 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 133 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 134 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 135 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 136 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 137 GND — Ground
Pino 138 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 139 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 140 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 141 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 142 I/O — User I/O (bank-dependent LVDS/LVCMOS)
Pino 143 VCCIO — I/O bank supply voltage
Pino 144 I/O — User I/O (bank-dependent LVDS/LVCMOS)

Aplicações típicas

EP4CE6E22I7N é adequado para 7 aplicaçãos: Industrial Motor Control, Video Processing Bridge, Low-Cost ASIC Prototyping, LED Display Controllers, Consumer Electronics Interfaces, Test and Measurement Instrumentation, Industrial Communication Gateways.

🏭

Industrial Motor Control

The EP4CE6E22I7N is well-suited for industrial motor control systems where precise PWM generation, encoder feedback processing, and real-time control loops are required. Its two general-purpose PLLs enable synthesis of multiple PWM frequencies from a single reference clock, supporting FOC (Field-Oriented Control) and trapezoidal commutation schemes for BLDC and AC induction drives. The 6,272 logic elements and 270 Kbits of embedded RAM provide sufficient capacity for PID controllers, state machines, and protection logic, while the 91 user I/Os handle encoder inputs, gate driver signals, and analog feedback routing. The -40C to +100C industrial temperature grade ensures reliable operation in factory environments with ambient temperature swings.

📺

Video Processing Bridge

The EP4CE6E22I7N's LVDS I/O support and 270 Kbits of dual-port RAM make it suitable for video format conversion bridges between cameras, displays, and processors. The 4-input LUT4 architecture can implement parallel pixel pipelines at common video rates (720p, 1080p) when clocked appropriately. The 91 user I/Os accommodate multi-lane LVDS pairs and parallel RGB buses. With two PLLs, the FPGA can derive pixel clocks from various input reference frequencies while maintaining jitter performance for clean video output. Industrial temperature rating supports outdoor kiosk and digital signage deployments.

🔧

Low-Cost ASIC Prototyping

The EP4CE6E22I7N provides an affordable platform for ASIC prototyping and design verification before committing to NRE mask charges. The 6,272 LEs support mid-complexity ASIC RTL, and the Quartus Prime toolchain offers synthesis from standard HDL (Verilog/VHDL) with timing-accurate simulation. Designers can validate functional correctness and timing margins on actual silicon, then migrate the verified design to a lower-cost ASIC or structured ASIC for volume production. The 144-pin EQFP package is hand-solderable for prototype boards, simplifying hardware bring-up.

💡

LED Display Controllers

The EP4CE6E22I7N drives large LED matrix displays, scrolling signs, and architectural lighting installations where per-channel PWM control and high refresh rates are required. Its 91 user I/Os can drive multiple LED driver chains simultaneously, while the embedded M9K RAM blocks buffer pixel data for smooth animation. The two PLLs generate precise timing references for LED multiplexing schemes, and the LVDS support enables high-speed pixel data transfer from upstream video sources. The I7 industrial temperature grade accommodates outdoor display enclosures without active cooling.

📱

Consumer Electronics Interfaces

The EP4CE6E22I7N serves as a flexible interface bridge in consumer electronics where multiple protocols (I2C, SPI, UART, GPIO, custom) must be aggregated and translated. The 6K LEs handle protocol state machines and FIFO buffers, while 91 I/Os accommodate multiple connector pinouts. The on-chip 4 Kbits of user flash memory stores non-volatile configuration parameters (e.g., device addresses, calibration values). The low unit cost at volume ($11.85 at 3,000 pieces) makes the part attractive for cost-sensitive consumer products such as smart home hubs, AV receivers, and gaming peripherals.

🔬

Test and Measurement Instrumentation

The EP4CE6E22I7N supports custom test and measurement fixtures where flexible digital pattern generation, protocol capture, and signal conditioning are required. Its 91 user I/Os interface with DUT (device-under-test) boards via pogo pins or connectors, while the embedded RAM captures waveform traces for offline analysis. The two PLLs synthesize arbitrary clock frequencies for protocol exercisers, and the LVDS I/O support enables high-speed serial protocol testing. The industrial temperature grade ensures reliability in production test environments with variable ambient conditions.

🌐

Industrial Communication Gateways

The EP4CE6E22I7N implements protocol conversion gateways between industrial fieldbuses (Modbus, CAN, RS-485, Profibus) and Ethernet/IP networks in factory automation. Its 6,272 LEs handle multiple concurrent protocol stacks with deterministic timing, while the LVDS-capable I/Os support high-speed industrial Ethernet PHYs. The 270 Kbits embedded RAM provides buffering for message queues between bus segments. The -40C to +100C industrial temperature grade, combined with low power consumption, suits DIN-rail mounted controllers in 24/7 factory operations.

What is the EP4CE6E22I7N FPGA and what family does it belong to?
The EP4CE6E22I7N is a low-power, low-cost Cyclone IV E Field-Programmable Gate Array (FPGA) from Intel (formerly Altera). According to the manufacturer datasheet, it integrates 6,272 logic elements, 270 Kbits of embedded RAM, and 91 user I/Os in a 144-pin EQFP package. The Cyclone IV E series is the production-volume Cyclone IV variant targeting cost-sensitive industrial and consumer designs.
What is the operating temperature range of EP4CE6E22I7N?
The EP4CE6E22I7N (I7 grade) operates from -40C to +100C junction temperature, per the manufacturer part number decoding convention. According to the Intel Cyclone IV device handbook, the I7 suffix designates the industrial-grade silicon variant. This makes the part suitable for factory automation, outdoor equipment, and other harsh-environment applications.
How much embedded memory does EP4CE6E22I7N have?
The EP4CE6E22I7N integrates 270 Kbits of embedded RAM (M9K blocks), distributed across the logic array as dual-port, single-port, shift-register, or ROM memory. The block RAM architecture supports configurable widths and FIFO modes per the manufacturer datasheet, enabling efficient buffer and datapath implementation without consuming logic resources.
Where to buy EP4CE6E22I7N online?
The EP4CE6E22I7N is available from authorized distributors including DigiKey, Mouser, and Octopart-listed suppliers, as of 2026-10-08. DigiKey reports active stock with same-day shipping. Independent distributors such as Heisener and WIN SOURCE also list inventory but verify authenticity when sourcing through non-franchised channels.
What is the price of EP4CE6E22I7N as of 2026?
The EP4CE6E22I7N unit price ranges from approximately $28.50 at qty 1 down to $11.85 at qty 3000, as of 2026-10-08 distributor listings. Volume pricing reflects the Cyclone IV E family's positioning as a cost-optimized FPGA. Contact distributors directly for exact current pricing and stock confirmation.
Is EP4CE6E22I7N in stock at major distributors?
As of 2026-10-08, the EP4CE6E22I7N shows active stock at DigiKey with same-day shipping availability. According to the Altera Community discussion thread, some buyers have experienced sold-out situations due to Cyclone IV E supply constraints - check current stock at DigiKey, Mouser, and Octopart before committing to a BOM with a 10+ year service life requirement.
What is the lead time for EP4CE6E22I7N?
Lead time for the EP4CE6E22I7N from authorized distributors is typically same-day to 2 weeks when in stock, as of 2026-10-08. For long-term supply, note that the Altera Community thread discusses evaluating alternative FPGAs because of market-driven stock tightness. Lead times from independent distributors may extend to 8-12 weeks.
What is the difference between EP4CE6E22I7N and EP4CE10E22I7N?
The EP4CE10E22I7N is the 10K-logic-element step above the EP4CE6E22I7N (6K LEs), both in the same 144-pin EQFP package and I7 industrial temperature grade. According to the ETEI comparison reference, the EP4CE10E22I7N has 10,320 LEs vs the EP4CE6's 6,272 LEs, ~414 Kbits RAM vs 270 Kbits, and 91 I/Os (same). Pin-compatible upgrade path with higher logic density.
What is the difference between EP4CE6E22I7N and EP4CE6E22C8N?
The EP4CE6E22C8N is the commercial temperature grade variant (0C to +85C, C8 speed grade) of the same 6K-LE Cyclone IV E die, while the EP4CE6E22I7N is the industrial -40C to +100C, I7 speed grade. According to the ETEI comparison reference, both share the same 144-pin EQFP package, 270 Kbit logic, and 91 I/Os, making them drop-in replacements for temperature-spec-compatible designs.
When should I choose EP4CE6E22I7N over EP4CE10E22I7N?
Choose EP4CE6E22I7N when your logic utilization fits within 6,272 LEs and 270 Kbits of embedded RAM. Choose EP4CE10E22I7N when you need more headroom (10K LEs, ~414 Kbits RAM) but the same 144-pin EQFP footprint. The pin-compatible EP4CE10E22I7N provides future expansion capability on identical PCB layouts, at higher unit cost.
Is EP4CE6E22I7N suitable for industrial motor control?
Yes, the EP4CE6E22I7N's -40C to +100C industrial temperature grade, 6,272 LEs of processing capacity, two PLLs for precise PWM generation, and 91 user I/Os make it well suited for industrial motor control applications. According to the manufacturer datasheet, it supports LVDS signaling for encoder feedback and provides sufficient logic density for FOC (Field-Oriented Control) and trapezoidal commutation algorithms.
What is the best drop-in replacement for EP4CE6E22I7N?
The best pin-compatible drop-in replacement for EP4CE6E22I7N is the EP4CE6E22C8N (commercial 0C-85C, same 144-pin EQFP, same 6K LEs). For 10+ year service-life designs concerned about Cyclone IV E supply, the Altera Community recommends migrating to Cyclone IV GX (EP4CGX22CF19) or to the Cyclone 10 LP family (10CL025) with PCB layout rework. The EP4CE10E22I7N offers a footprint-compatible upgrade path within the same family.
Can EP4CE10E22I7N replace EP4CE6E22I7N without PCB changes?
Yes, the EP4CE10E22I7N is a pin-compatible footprint upgrade for the EP4CE6E22I7N in the same 144-pin EQFP package. Both share identical pinouts per the manufacturer datasheet, so the EP4CE10E22I7N can be soldered onto existing EP4CE6E22I7N PCB footprints without redesign, providing 10,320 LEs vs 6,272 LEs of headroom. Verify I/O bank voltage compatibility before substitution.
Where to download EP4CE6E22I7N datasheet PDF?
The EP4CE6E22I7N datasheet is available as part of the Cyclone IV Device Handbook at the official Intel (Altera) literature portal. The Cyclone IV Device Family Overview datasheet (cyiv-51001) covers device specifications, package details, and electrical characteristics. Alldatasheet.com also hosts the PDF for download. Per the manufacturer URL above, the Cyclone IV handbook PDF is the authoritative source.
What is the pinout of EP4CE6E22I7N?
The EP4CE6E22I7N uses a 144-pin EQFP (Enhanced Plastic Quad Flat Pack) package with exposed thermal pad. Per the manufacturer datasheet, the package has 91 user I/O pins distributed across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. Refer to the Cyclone IV Device Handbook pin-out tables for the complete pin assignment for the E22 package variant.
What are the key specifications of EP4CE6E22I7N that engineers should know?
The EP4CE6E22I7N provides 6,272 logic elements, 270 Kbits embedded RAM, 91 user I/Os, 2 PLLs, and 4 Kbits user flash memory in a 144-pin EQFP package. According to the manufacturer datasheet, it operates at -40C to +100C junction (I7 grade), supports 1.0 V to 1.2 V core voltage, and achieves up to 472.5 MHz core frequency. Configuration is via EPCS serial flash or JTAG.

Dados de referência de engenharia para EP4CE6E22I7N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose EP4CE6E22I7N for industrial-grade (-40C to +100C), mid-density (6K LEs, 270 Kbits RAM) FPGA applications requiring 91 user I/Os in a 144-pin EQFP package. It is the right balance for industrial motor control, video bridges, and consumer interface designs. Choose EP4CE6E22C8N if your design operates only in 0C-85C environments and you need the lowest cost. Choose EP4CE10E22I7N when you anticipate needing more than 6K LEs - it shares the same footprint for drop-in upgrade. For 10+ year service-life products, evaluate migrating to Cyclone 10 LP family to mitigate Cyclone IV E supply risks discussed in the Altera Community.

Comparação com alternativas

Parâmetro Este produto EP4CE6E22C8N EP4CE10E22I7N EP4CE10E22C8N EP4CE6E22A7N EP4CE6E22I8N
Package 144-pin EQFP 144-pin EQFP - same 144-pin EQFP - same 144-pin EQFP - same 144-pin EQFP - same 144-pin EQFP - same
Brand Intel Intel Intel Intel Intel Intel
Logic Elements 6,272 LEs 6,272 LEs 10,320 LEs 10,320 LEs 6,272 LEs 6,272 LEs
Embedded RAM 270 Kbits 270 Kbits ~414 Kbits ~414 Kbits 270 Kbits 270 Kbits
User I/Os 91 91 91 91 91 91
Temperature Grade I7 Industrial (-40C to +100C) C8 Commercial (0C to +85C) I7 Industrial (-40C to +100C) C8 Commercial (0C to +85C) A7 Automotive (-40C to +125C) I8 Industrial (-40C to +100C)
PLLs 2 2 2 2 2 2
Process / Family 60 nm Cyclone IV E 60 nm Cyclone IV E 60 nm Cyclone IV E 60 nm Cyclone IV E 60 nm Cyclone IV E 60 nm Cyclone IV E
Pin-to-Pin Compatible Yes (reference) Yes - drop-in Yes - drop-in Yes - drop-in Yes - drop-in Yes - drop-in

Principais diferenciais

  • Industrial temperature grade (-40C to +100C) (vs EP4CE6E22C8N)
  • Footprint-compatible 65% logic density upgrade path (vs EP4CE10E22I7N)
  • Same-family automotive variant available (vs EP4CE6E22A7N)

Notas de projeto

Cyclone IV E devices require multiple supply rails: VCCINT (1.0-1.2 V core), VCCIO (1.5/1.8/2.5/3.3 V per I/O bank), VCCA (analog PLL supply, typically 2.5 V), and VCCD_PLL (PLL digital supply). Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 3 mm of the pin, plus a 10-100 uF bulk capacitor near the FPGA. Each VCCIO bank requires its own decoupling network sized to the I/O toggle rate. Power sequencing must follow the manufacturer datasheet ordering to avoid latch-up.

Estimated: at maximum toggle rate (e.g., 200 MHz on 60% of pins, LVCMOS 3.3 V), the EP4CE6E22I7N in the EQFP-144 package may dissipate 0.8-1.5 W. The exposed thermal pad on the bottom of the EQFP package must be soldered to a PCB thermal land connected to an inner ground plane with thermal vias (typically 4-9 vias, 0.3 mm drill). Without thermal pad soldering, junction temperature can exceed 100C in high-utilization designs. Verify thermal margin in worst-case design utilization with Quartus PowerPlay early in the design cycle.

Cyclone IV E FPGAs are sensitive to PCB layout for high-speed LVDS and DDR interfaces. Route differential pairs with 100 ohm controlled impedance, match trace lengths within 150 mil for LVDS, and keep reference planes continuous under high-speed traces. Use a 4-layer PCB stackup with dedicated ground and power planes; avoid routing over plane splits. For JTAG configuration, route TCK with a 33 ohm series termination and keep TMS/TDI/TDO short to minimize noise coupling.

Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-ups in the Quartus pin assignment file. Floating inputs can oscillate and draw excessive current. When migrating from EP4CE6E22C8N (commercial) to EP4CE6E22I7N (industrial), verify timing closure still meets margins since speed grades differ. For 10+ year service life products, consider Cyclone 10 LP (10CL025) migration as the Altera Community thread indicates Cyclone IV E supply tightness.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS and lead-free per Intel/Altera product page. Not AEC-Q100 qualified - choose EP4CE6E22A7N for automotive. Halogen-free status not explicitly stated in verified data.

Dados verificados em: 2026-10-08 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP4CE6E22I7N EP4CE6E22I7N datasheet Cyclone IV E EP4CE6 datasheet Intel FPGA 6K logic elements 144 EQFP EP4CE6E22I7N pinout EP4CE6E22I7N industrial temperature FPGA EP4CE6E22I7N vs EP4CE10E22I7N EP4CE6E22I7N vs EP4CE6E22C8N EP4CE6E22I7N buy price Cyclone IV E drop-in replacement FPGA 91 user I/O 270 Kbits RAM low-cost industrial FPGA Cyclone IV

Componentes & termos relacionados

Intel Altera EP4CE6E22I7N EP4CE6E22C8N EP4CE10E22I7N EP4CE10E22C8N EP4CE6E22A7N EP4CE6E22I8N Cyclone IV E FPGA Field-Programmable Gate Array Logic Element LUT4 PLL Embedded RAM M9K memory block LVDS JTAG EPCS configuration flash 144-pin EQFP RoHS AEC-Q100 industrial temperature grade Quartus Prime Verilog VHDL
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