EP4CE6E22I7N - Cyclone IV E FPGA 6K LEs 91 I/O | Intel
Référence : EP4CE6E22I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $20.1 | $2 010,00 |
| 500 | $16.95 | $8 475,00 |
| 1 000 | $14.2 | $14 200,00 |
| 3 000 | $11.85 | $35 550,00 |
EP4CE6E22I7N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined by the user via a hardware description language and configuration bitstream, rather than fixed at the factory. Positioned in the system hierarchy, FPGAs sit between programmable microcontrollers (software-driven, lower throughput) and application-specific integrated circuits (ASICs, fixed-function, higher NRE). The Cyclone IV E family specifically targets cost-sensitive, high-volume applications where ASIC-like density is unnecessary but microcontrollers cannot meet parallelism, throughput, or custom I/O requirements. Within Intel's FPGA portfolio, the Cyclone IV E sits below the Cyclone 10 LP and MAX 10 families in logic density but shares the same Quartus Prime design toolchain.
Key features of the EP4CE6E22I7N include 6,272 logic elements (4-input LUT4 architecture), 270 Kbits embedded RAM supporting true dual-port, single-port, shift-register, and ROM modes, 91 user I/O pins, two PLLs, 4 Kbits of user flash memory for non-volatile configuration or data storage, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports serial configuration via EPCS flash or JTAG and includes a global clock network supporting up to 20 clock pins.
Architecturally, the Cyclone IV E series uses 4-input look-up tables (LUT4) as the basic logic element, with each LE containing a register and dedicated carry chain logic for arithmetic operations. The 144-pin EQFP package provides a thermal pad that can be soldered to PCB copper to reduce theta_JA and improve heat extraction for high-toggle-rate designs approaching the maximum operating frequency.
Typical applications include industrial motor control, video processing bridges, low-cost ASIC prototyping, LED display controllers, and consumer electronics interfaces. The wide operating temperature range makes the I7N grade suitable for industrial control and factory automation environments.
When designing with this FPGA, plan for a configuration source (EPCS flash or JTAG), adequate decoupling on each VCCINT/VCCIO rail (0.1 uF ceramic per pin plus bulk capacitance), and thermal management for designs approaching the maximum toggle rate.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP4CE6E22I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE6E22I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Family, Global Clock Networks.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE6E22C8N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP4CE10E22I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE10E22C8N
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EP4CE6E22A7N
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →EP4CE6E22I8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE6E22I7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV E |
| Logic Elements (LEs) | 6,272 |
| Configurable Logic Blocks (CLBs) | 392 |
| Embedded Memory (RAM) | 270 Kbits |
| User Flash Memory | 4 Kbits |
| User I/O Pins | 91 |
| PLLs (General-Purpose) | 2 |
| Global Clock Networks | Up to 20 |
| Process Technology | 60 nm (TSMC low-power) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) |
| Operating Temperature (I7 grade) | -40C to +100C (junction) |
| Maximum Operating Frequency | Up to 472.5 MHz |
| Boîtier | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| Type de montage | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de EP4CE6E22I7N
| Broche 1 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 2 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 3 | VCCIO — I/O bank supply voltage |
| Broche 4 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 5 | GND — Ground |
| Broche 6 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 7 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 8 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 9 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 10 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 11 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Broche 12 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 13 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 14 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 15 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 16 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 19 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 20 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 21 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 22 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 23 | VCCIO — I/O bank supply voltage |
| Broche 24 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 25 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 26 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 27 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 28 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 29 | GND — Ground |
| Broche 30 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 31 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 32 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 33 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 34 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 35 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Broche 36 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 37 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 38 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 39 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 40 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 43 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 44 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 45 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 46 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 47 | VCCIO — I/O bank supply voltage |
| Broche 48 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 49 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 50 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 51 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 52 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 55 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 56 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 57 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 58 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 59 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Broche 60 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 61 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 62 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 63 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 64 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 67 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 68 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 69 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 70 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 71 | VCCIO — I/O bank supply voltage |
| Broche 72 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 73 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 74 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 75 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 76 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 79 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 80 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 81 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 82 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 83 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Broche 84 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 85 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 86 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 87 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 88 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 91 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 92 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 93 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 94 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 95 | VCCIO — I/O bank supply voltage |
| Broche 96 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 97 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 98 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 99 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 100 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 103 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 104 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 105 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 106 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 107 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Broche 108 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 109 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 110 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 111 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 112 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 113 | GND — Ground |
| Broche 114 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 115 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 116 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 117 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 118 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 119 | VCCIO — I/O bank supply voltage |
| Broche 120 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 121 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 122 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 123 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 124 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 127 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 128 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 129 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 130 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 131 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Broche 132 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 133 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 134 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 135 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 136 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 139 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 140 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 141 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 142 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
| Broche 143 | VCCIO — I/O bank supply voltage |
| Broche 144 | I/O — User I/O (bank-dependent LVDS/LVCMOS) |
Applications typiques
EP4CE6E22I7N convient pour 7 applications: Industrial Motor Control, Video Processing Bridge, Low-Cost ASIC Prototyping, LED Display Controllers, Consumer Electronics Interfaces, Test and Measurement Instrumentation, Industrial Communication Gateways.
Industrial Motor Control
The EP4CE6E22I7N is well-suited for industrial motor control systems where precise PWM generation, encoder feedback processing, and real-time control loops are required. Its two general-purpose PLLs enable synthesis of multiple PWM frequencies from a single reference clock, supporting FOC (Field-Oriented Control) and trapezoidal commutation schemes for BLDC and AC induction drives. The 6,272 logic elements and 270 Kbits of embedded RAM provide sufficient capacity for PID controllers, state machines, and protection logic, while the 91 user I/Os handle encoder inputs, gate driver signals, and analog feedback routing. The -40C to +100C industrial temperature grade ensures reliable operation in factory environments with ambient temperature swings.
Recommandé
Video Processing Bridge
The EP4CE6E22I7N's LVDS I/O support and 270 Kbits of dual-port RAM make it suitable for video format conversion bridges between cameras, displays, and processors. The 4-input LUT4 architecture can implement parallel pixel pipelines at common video rates (720p, 1080p) when clocked appropriately. The 91 user I/Os accommodate multi-lane LVDS pairs and parallel RGB buses. With two PLLs, the FPGA can derive pixel clocks from various input reference frequencies while maintaining jitter performance for clean video output. Industrial temperature rating supports outdoor kiosk and digital signage deployments.
Recommandé
Low-Cost ASIC Prototyping
The EP4CE6E22I7N provides an affordable platform for ASIC prototyping and design verification before committing to NRE mask charges. The 6,272 LEs support mid-complexity ASIC RTL, and the Quartus Prime toolchain offers synthesis from standard HDL (Verilog/VHDL) with timing-accurate simulation. Designers can validate functional correctness and timing margins on actual silicon, then migrate the verified design to a lower-cost ASIC or structured ASIC for volume production. The 144-pin EQFP package is hand-solderable for prototype boards, simplifying hardware bring-up.
Recommandé
LED Display Controllers
The EP4CE6E22I7N drives large LED matrix displays, scrolling signs, and architectural lighting installations where per-channel PWM control and high refresh rates are required. Its 91 user I/Os can drive multiple LED driver chains simultaneously, while the embedded M9K RAM blocks buffer pixel data for smooth animation. The two PLLs generate precise timing references for LED multiplexing schemes, and the LVDS support enables high-speed pixel data transfer from upstream video sources. The I7 industrial temperature grade accommodates outdoor display enclosures without active cooling.
Recommandé
Consumer Electronics Interfaces
The EP4CE6E22I7N serves as a flexible interface bridge in consumer electronics where multiple protocols (I2C, SPI, UART, GPIO, custom) must be aggregated and translated. The 6K LEs handle protocol state machines and FIFO buffers, while 91 I/Os accommodate multiple connector pinouts. The on-chip 4 Kbits of user flash memory stores non-volatile configuration parameters (e.g., device addresses, calibration values). The low unit cost at volume ($11.85 at 3,000 pieces) makes the part attractive for cost-sensitive consumer products such as smart home hubs, AV receivers, and gaming peripherals.
Recommandé
Test and Measurement Instrumentation
The EP4CE6E22I7N supports custom test and measurement fixtures where flexible digital pattern generation, protocol capture, and signal conditioning are required. Its 91 user I/Os interface with DUT (device-under-test) boards via pogo pins or connectors, while the embedded RAM captures waveform traces for offline analysis. The two PLLs synthesize arbitrary clock frequencies for protocol exercisers, and the LVDS I/O support enables high-speed serial protocol testing. The industrial temperature grade ensures reliability in production test environments with variable ambient conditions.
Recommandé
Industrial Communication Gateways
The EP4CE6E22I7N implements protocol conversion gateways between industrial fieldbuses (Modbus, CAN, RS-485, Profibus) and Ethernet/IP networks in factory automation. Its 6,272 LEs handle multiple concurrent protocol stacks with deterministic timing, while the LVDS-capable I/Os support high-speed industrial Ethernet PHYs. The 270 Kbits embedded RAM provides buffering for message queues between bus segments. The -40C to +100C industrial temperature grade, combined with low power consumption, suits DIN-rail mounted controllers in 24/7 factory operations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE6E22I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE6E22C8N | EP4CE10E22I7N | EP4CE10E22C8N | EP4CE6E22A7N | EP4CE6E22I8N |
|---|---|---|---|---|---|---|
| Package | 144-pin EQFP | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same | 144-pin EQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 LEs | 6,272 LEs | 10,320 LEs | 10,320 LEs | 6,272 LEs | 6,272 LEs |
| Embedded RAM | 270 Kbits | 270 Kbits | ~414 Kbits | ~414 Kbits | 270 Kbits | 270 Kbits |
| User I/Os | 91 | 91 | 91 | 91 | 91 | 91 |
| Temperature Grade | I7 Industrial (-40C to +100C) | C8 Commercial (0C to +85C) | I7 Industrial (-40C to +100C) | C8 Commercial (0C to +85C) | A7 Automotive (-40C to +125C) | I8 Industrial (-40C to +100C) |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Process / Family | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E | 60 nm Cyclone IV E |
| Pin-to-Pin Compatible | Yes (reference) | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in |
Principaux différenciateurs
- Industrial temperature grade (-40C to +100C) (vs EP4CE6E22C8N)
- Footprint-compatible 65% logic density upgrade path (vs EP4CE10E22I7N)
- Same-family automotive variant available (vs EP4CE6E22A7N)
Notes de conception
Cyclone IV E devices require multiple supply rails: VCCINT (1.0-1.2 V core), VCCIO (1.5/1.8/2.5/3.3 V per I/O bank), VCCA (analog PLL supply, typically 2.5 V), and VCCD_PLL (PLL digital supply). Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 3 mm of the pin, plus a 10-100 uF bulk capacitor near the FPGA. Each VCCIO bank requires its own decoupling network sized to the I/O toggle rate. Power sequencing must follow the manufacturer datasheet ordering to avoid latch-up.
Estimated: at maximum toggle rate (e.g., 200 MHz on 60% of pins, LVCMOS 3.3 V), the EP4CE6E22I7N in the EQFP-144 package may dissipate 0.8-1.5 W. The exposed thermal pad on the bottom of the EQFP package must be soldered to a PCB thermal land connected to an inner ground plane with thermal vias (typically 4-9 vias, 0.3 mm drill). Without thermal pad soldering, junction temperature can exceed 100C in high-utilization designs. Verify thermal margin in worst-case design utilization with Quartus PowerPlay early in the design cycle.
Cyclone IV E FPGAs are sensitive to PCB layout for high-speed LVDS and DDR interfaces. Route differential pairs with 100 ohm controlled impedance, match trace lengths within 150 mil for LVDS, and keep reference planes continuous under high-speed traces. Use a 4-layer PCB stackup with dedicated ground and power planes; avoid routing over plane splits. For JTAG configuration, route TCK with a 33 ohm series termination and keep TMS/TDI/TDO short to minimize noise coupling.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with internal weak pull-ups in the Quartus pin assignment file. Floating inputs can oscillate and draw excessive current. When migrating from EP4CE6E22C8N (commercial) to EP4CE6E22I7N (industrial), verify timing closure still meets margins since speed grades differ. For 10+ year service life products, consider Cyclone 10 LP (10CL025) migration as the Altera Community thread indicates Cyclone IV E supply tightness.
Informations de conformité
RoHS and lead-free per Intel/Altera product page. Not AEC-Q100 qualified - choose EP4CE6E22A7N for automotive. Halogen-free status not explicitly stated in verified data.
