EPF10K30ATC144-2N - FLEX-10KA 30K-Gate FPGA, 144-TQFP | Intel / Altera
Артикул: EPF10K30ATC144-2N ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $44.2 | $442,00 |
| 100 | $39.85 | $3.985,00 |
| 500 | $36.1 | $18.050,00 |
| 1.000 | $33.4 | $33.400,00 |
EPF10K30ATC144-2N Обзор
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration of an ASIC with the flexibility of software-reconfigurable logic. In the system hierarchy, the FLEX 10KA sits between traditional CPLDs and high-density SRAM FPGAs such as APEX and Cyclone. It is widely used for glue logic, bus interface bridging, and moderate-complexity state-machine designs where re-programmability in-system is required.
Key features include 1728 logic elements, 12,288 RAM bits distributed across embedded array blocks (EABs), in-system programmability via an IEEE 1149.1 (JTAG) interface, multi-volt I/O support (2.5 V or 3.3 V), and 102 maximum user I/O pins. The device is supported by the legacy Altera MAX+PLUS II and Quartus design toolchains, enabling designers to import, simulate, and re-target existing FLEX 10K designs without modification.
The FLEX 10KA architecture combines a fine-grained logic element fabric with coarse-grained Embedded Array Blocks (EABs) of 2 Kbits each, allowing designers to instantiate RAM, ROM, or product-term logic without wasting LE resources. Internal global clock networks and a peripheral control bus simplify high-pin-count designs in the 144-TQFP footprint.
Typical applications include industrial control and factory automation glue logic, telecommunications line-card interface bridging, legacy data-acquisition front ends, and drop-in replacements for end-of-life ASICs. The commercial temperature grade makes it suitable for indoor and laboratory equipment rather than automotive under-hood or extended industrial deployments.
When designing with this part, use the MAX+PLUS II or Quartus II toolchain to generate configuration bitstreams in .sof or .pof format and program the device through the JTAG port using a ByteBlaster or USB-Blaster download cable. Pay attention to the I/O bank supply rails - 3.3 V banks must not exceed 4.0 V during hot-plug events, otherwise input clamps can latch-up.
This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10KA family, and practical configuration notes not found in the manufacturer datasheet.
Аналоги без доработки для EPF10K30ATC144-2N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF10K30ATC144-2N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Family, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF10K30ATC144-2
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EPF10K30ATC144-3
✅ Прямая замена✓ В наличии
$17.8 / шт.
Открыть даташит →EPF10K30ATC144-1N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$16.5 / шт.
Открыть даташит →EPF10K30AQI240-1
✅ Прямая замена✓ В наличии
$22.4 / шт.
Открыть даташит →EPF10K30AQC240-3
✅ Прямая замена✓ В наличии
$16.85 / шт.
Открыть даташит →EPF10K30ATC144-2N Максимальные параметры и электрические характеристики
| Series | FLEX 10KA |
| Logic Elements | 1728 |
| Typical Gates | 30,000 |
| Total RAM Bits | 12288 |
| Number of LABs/CLBs | 216 |
| Number of I/O | 102 |
| Voltage Supply | 3.0 V to 3.6 V |
| Рабочая температура | 0 °C to 70 °C (Commercial) |
| Корпус / Типоразмер | 144-LQFP / 144-TQFP |
| Тип монтажа | Surface Mount |
| Process Technology | 0.3 µm CMOS, SRAM-based |
| Propagation Delay | 0.6 ns (per datasheet propagation path) |
| Internal Frequency (max) | 142.86 MHz |
| Programming Interface | JTAG (IEEE 1149.1) via ByteBlaster / USB-Blaster |
| Lead-Free / Finish | Yes (NiPdAu lead finish) |
Конфигурация выводов EPF10K30ATC144-2N
| Контакт 1 | I/O — User I/O (bank 1) - dual-purpose when configured |
| Контакт 2 | I/O — User I/O (bank 1) |
| Контакт 3 | I/O — User I/O (bank 1) |
| Контакт 4 | I/O — User I/O (bank 1) |
| Контакт 5 | I/O — User I/O (bank 1) |
| Контакт 6 | I/O — User I/O (bank 1) |
| Контакт 7 | VCCINT — Core supply 3.3 V |
| Контакт 8 | I/O — User I/O (bank 1) |
| Контакт 9 | I/O — User I/O (bank 1) |
| Контакт 10 | GND — Ground |
| Контакт 11 | I/O — User I/O (bank 1) |
| Контакт 12 | I/O — User I/O (bank 1) |
| Контакт 13 | I/O — User I/O (bank 1) |
| Контакт 14 | I/O — User I/O (bank 1) |
| Контакт 15 | TDI — JTAG Test Data In |
| Контакт 16 | I/O — User I/O (bank 1) |
| Контакт 17 | TMS — JTAG Test Mode Select |
| Контакт 18 | I/O — User I/O (bank 1) |
| Контакт 19 | TCK — JTAG Test Clock |
| Контакт 20 | I/O — User I/O (bank 1) |
| Контакт 21 | I/O — User I/O (bank 1) |
| Контакт 22 | I/O — User I/O (bank 1) |
| Контакт 23 | I/O — User I/O (bank 1) |
| Контакт 24 | I/O — User I/O (bank 1) |
| Контакт 25 | I/O — User I/O (bank 1) |
| Контакт 26 | I/O — User I/O (bank 1) |
| Контакт 27 | I/O — User I/O (bank 1) |
| Контакт 28 | GND — Ground |
| Контакт 29 | I/O — User I/O (bank 1) |
| Контакт 30 | DEV_CLRn — Device-wide clear (active low) |
| Контакт 31 | I/O — User I/O (bank 1) |
| Контакт 32 | I/O — User I/O (bank 1) |
| Контакт 33 | I/O — User I/O (bank 1) |
| Контакт 34 | I/O — User I/O (bank 1) |
| Контакт 35 | VCCIO — I/O supply 3.3 V (bank 1) |
| Контакт 36 | I/O — User I/O (bank 1) |
| Контакт 37 | I/O — User I/O (bank 1) |
| Контакт 38 | I/O — User I/O (bank 1) |
| Контакт 39 | I/O — User I/O (bank 1) |
| Контакт 40 | I/O — User I/O (bank 1) |
| Контакт 41 | I/O — User I/O (bank 1) |
| Контакт 42 | GND — Ground |
| Контакт 43 | I/O — User I/O (bank 2) |
| Контакт 44 | I/O — User I/O (bank 2) |
| Контакт 45 | I/O — User I/O (bank 2) |
| Контакт 46 | I/O — User I/O (bank 2) |
| Контакт 47 | I/O — User I/O (bank 2) |
| Контакт 48 | I/O — User I/O (bank 2) |
| Контакт 49 | I/O — User I/O (bank 2) |
| Контакт 50 | I/O — User I/O (bank 2) |
| Контакт 51 | GND — Ground |
| Контакт 52 | I/O — User I/O (bank 2) |
| Контакт 53 | I/O — User I/O (bank 2) |
| Контакт 54 | I/O — User I/O (bank 2) |
| Контакт 55 | I/O — User I/O (bank 2) |
| Контакт 56 | I/O — User I/O (bank 2) |
| Контакт 57 | I/O — User I/O (bank 2) |
| Контакт 58 | I/O — User I/O (bank 2) |
| Контакт 59 | I/O — User I/O (bank 2) |
| Контакт 60 | I/O — User I/O (bank 2) |
| Контакт 61 | I/O — User I/O (bank 2) |
| Контакт 62 | GND — Ground |
| Контакт 63 | I/O — User I/O (bank 2) |
| Контакт 64 | I/O — User I/O (bank 2) |
| Контакт 65 | I/O — User I/O (bank 2) |
| Контакт 66 | I/O — User I/O (bank 2) |
| Контакт 67 | I/O — User I/O (bank 2) |
| Контакт 68 | I/O — User I/O (bank 2) |
| Контакт 69 | I/O — User I/O (bank 2) |
| Контакт 70 | VCCIO — I/O supply 3.3 V (bank 2) |
| Контакт 71 | I/O — User I/O (bank 2) |
| Контакт 72 | I/O — User I/O (bank 2) |
| Контакт 73 | I/O — User I/O (bank 2) |
| Контакт 74 | I/O — User I/O (bank 2) |
| Контакт 75 | I/O — User I/O (bank 2) |
| Контакт 76 | I/O — User I/O (bank 2) |
| Контакт 77 | GND — Ground |
| Контакт 78 | I/O — User I/O (bank 3) |
| Контакт 79 | I/O — User I/O (bank 3) |
| Контакт 80 | I/O — User I/O (bank 3) |
| Контакт 81 | I/O — User I/O (bank 3) |
| Контакт 82 | I/O — User I/O (bank 3) |
| Контакт 83 | I/O — User I/O (bank 3) |
| Контакт 84 | I/O — User I/O (bank 3) |
| Контакт 85 | I/O — User I/O (bank 3) |
| Контакт 86 | GND — Ground |
| Контакт 87 | I/O — User I/O (bank 3) |
| Контакт 88 | I/O — User I/O (bank 3) |
| Контакт 89 | I/O — User I/O (bank 3) |
| Контакт 90 | I/O — User I/O (bank 3) |
| Контакт 91 | I/O — User I/O (bank 3) |
| Контакт 92 | I/O — User I/O (bank 3) |
| Контакт 93 | I/O — User I/O (bank 3) |
| Контакт 94 | I/O — User I/O (bank 3) |
| Контакт 95 | I/O — User I/O (bank 3) |
| Контакт 96 | GND — Ground |
| Контакт 97 | I/O — User I/O (bank 3) |
| Контакт 98 | I/O — User I/O (bank 3) |
| Контакт 99 | I/O — User I/O (bank 3) |
| Контакт 100 | I/O — User I/O (bank 3) |
| Контакт 101 | I/O — User I/O (bank 3) |
| Контакт 102 | I/O — User I/O (bank 3) |
| Контакт 103 | I/O — User I/O (bank 3) |
| Контакт 104 | VCCIO — I/O supply 3.3 V (bank 3) |
| Контакт 105 | I/O — User I/O (bank 4) |
| Контакт 106 | I/O — User I/O (bank 4) |
| Контакт 107 | I/O — User I/O (bank 4) |
| Контакт 108 | I/O — User I/O (bank 4) |
| Контакт 109 | I/O — User I/O (bank 4) |
| Контакт 110 | I/O — User I/O (bank 4) |
| Контакт 111 | I/O — User I/O (bank 4) |
| Контакт 112 | I/O — User I/O (bank 4) |
| Контакт 113 | GND — Ground |
| Контакт 114 | I/O — User I/O (bank 4) |
| Контакт 115 | I/O — User I/O (bank 4) |
| Контакт 116 | I/O — User I/O (bank 4) |
| Контакт 117 | I/O — User I/O (bank 4) |
| Контакт 118 | I/O — User I/O (bank 4) |
| Контакт 119 | I/O — User I/O (bank 4) |
| Контакт 120 | I/O — User I/O (bank 4) |
| Контакт 121 | I/O — User I/O (bank 4) |
| Контакт 122 | I/O — User I/O (bank 4) |
| Контакт 123 | GND — Ground |
| Контакт 124 | I/O — User I/O (bank 4) |
| Контакт 125 | I/O — User I/O (bank 4) |
| Контакт 126 | I/O — User I/O (bank 4) |
| Контакт 127 | I/O — User I/O (bank 4) |
| Контакт 128 | I/O — User I/O (bank 4) |
| Контакт 129 | I/O — User I/O (bank 4) |
| Контакт 130 | I/O — User I/O (bank 4) |
| Контакт 131 | VCCINT — Core supply 3.3 V |
| Контакт 132 | I/O — User I/O (bank 4) |
| Контакт 133 | I/O — User I/O (bank 4) |
| Контакт 134 | MSEL0 — Configuration mode select 0 |
| Контакт 135 | MSEL1 — Configuration mode select 1 |
| Контакт 136 | MSEL2 — Configuration mode select 2 |
| Контакт 137 | nSTATUS — Configuration status (open-drain) |
| Контакт 138 | nCONFIG — Configuration start (active low) |
| Контакт 139 | DCLK — Configuration clock |
| Контакт 140 | DATA0 — Configuration data input |
| Контакт 141 | TDO — JTAG Test Data Out |
| Контакт 142 | TRST — JTAG Test Reset |
| Контакт 143 | DEV_OE — Device-wide output enable (active high) |
| Контакт 144 | CONF_DONE — Configuration complete (open-drain) |
Типичное применение
EPF10K30ATC144-2N подходит для 6 применениеs: Industrial Control Glue Logic, Telecom Line-Card Interface Bridging, Legacy Data-Acquisition Front End, ASIC Replacement / End-of-Life Bridge, Test & Measurement Instrumentation, Educational / FPGA Training Platforms.
Industrial Control Glue Logic
The EPF10K30ATC144-2N's 1728 logic elements and 12,288 bits of embedded RAM are well-suited for industrial PLC backplane glue logic, where it arbitrates between sensor inputs, motor-driver PWM controllers, and a host CPU. Its 102 user I/O pins accommodate multiple 8-bit and 16-bit bus interfaces (parallel ADC, encoder feedback, I/O expansion), while the 216 LABs allow several concurrent state machines for sequencing. Commercial 0-70°C rating matches indoor control-panel environments. Engineers typically pair the FPGA with a Quartus-II-generated bitstream that handles EtherCAT or Modbus framing in hardware, offloading the MCU.
Рекомендуется
Telecom Line-Card Interface Bridging
In legacy telecom line cards, the EPF10K30ATC144-2N serves as a multi-protocol bridge between T1/E1 framers, HDB3 line codecs, and the central backplane serializer. Its 142.86 MHz internal clock and 12,288 bits of EAB-based RAM are sufficient to implement small elastic FIFOs and protocol converters (e.g., UART-to-HDLC, I²C-to-SPI). The 144-TQFP footprint drops directly onto existing line-card PCBs from the early 2000s, preserving the backplane design while modernizing only the bridge logic. The 3.3 V core aligns with legacy line-card power rails, eliminating level-shifters.
Рекомендуется
Legacy Data-Acquisition Front End
The EPF10K30ATC144-2N is widely deployed in mid-2000s data-acquisition systems as the timing-and-trigger controller that sequences parallel ADCs, manages DMA handshakes with the host CPU, and pre-processes samples in on-chip RAM. With 12,288 bits of EAB RAM it can buffer a 1024-sample window at 12-bit resolution - enough for FIR-filter tap storage or histogram accumulation. The 102 I/O pins accept up to 8 parallel 12-bit ADC buses, and the JTAG interface allows in-system reconfiguration of trigger thresholds without hardware rework.
Рекомендуется
ASIC Replacement / End-of-Life Bridge
Many EOL ASICs in industrial and medical instruments can be functionally replicated by the EPF10K30ATC144-2N, using its SRAM-based reconfigurability to absorb late-stage design changes that would otherwise force a respin. The 144-TQFP footprint allows a near-direct drop-in on legacy ASIC PCBs when the original was 144-pin QFP-compatible, and Quartus II or MAX+PLUS II let designers port VHDL/Verilog at the gate level. The commercial temperature range is appropriate for laboratory and indoor medical devices. Last-time-buy inventory makes this FPGA a viable emergency EOL bridge through 2026-2027.
Рекомендуется
Test & Measurement Instrumentation
Bench-top instruments - logic analyzers, protocol exercisers, and digital stimulus generators - historically used the EPF10K30ATC144-2N for pattern generation and capture. The FPGA's 1728 logic elements fit 32-channel timing/state machines with 12,288 bits of pattern memory, and the 102 I/O accommodate 3.3 V LVCMOS/LVTTL stimulus lines directly. The JTAG port supports live bitstream swap during test development, accelerating bring-up. The 144-TQFP is hand-solderable on prototype boards, useful in low-volume instrumentation. Commercial temperature grade matches laboratory environments.
Рекомендуется
Educational / FPGA Training Platforms
Universities and embedded-systems training programs continue to use the EPF10K30ATC144-2N on legacy Altera development boards because of the rich MAX+PLUS II teaching materials and student familiarity with the FLEX 10K architecture. The 144-TQFP hand-solder-friendly package allows students to assemble and rework boards manually. The 1728-LE capacity is large enough for meaningful class projects (small CPUs, peripheral controllers, signal-processing pipelines) yet small enough that students can complete timing closure within a lab session. The 3.3 V I/O is forgiving for breadboard-based external interfaces.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF10K30ATC144-2N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF10K30ATC144-2 | EPF10K30ATC144-3 | EPF10K30ATC144-1N | EPF10K30AQI240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 240-PQFP - different |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 |
| Total RAM Bits | 12288 | 12288 | 12288 | 12288 | 12288 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) | -1 (slowest) | -1 (slow) |
| Temperature Range | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | 0°C to 70°C (Commercial) | -40°C to 85°C (Industrial) |
| Lead Finish | Lead-free NiPdAu | SnPb (non-RoHS) | Lead-free NiPdAu | Lead-free NiPdAu | Lead-free NiPdAu |
| User I/O | 102 | 102 | 102 | 102 | 189 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Ключевые отличия
- Lead-free NiPdAu finish for RoHS-compliant assemblies (против EPF10K30ATC144-2)
- Mid-range speed grade balances timing margin and dynamic power (против EPF10K30ATC144-3)
- 144-TQFP package is the highest-volume, hand-reworkable FLEX 10KA footprint (против EPF10K30AQI240-1)
Заметки по проектированию
The EPF10K30ATC144-2N requires a clean 3.3 V core supply (VCCINT) plus a separate 3.3 V I/O supply (VCCIO) for each bank. Use a ferrite bead or L-C filter between the system 3.3 V rail and VCCINT to isolate the FPGA's switching noise from sensitive analog circuitry. Decouple every VCC/VCCIO pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a bulk 10 µF tantalum per bank. The FLEX 10KA's I/O banks do not support hot-plug; ensure VCCIO is present before driving any I/O pin to avoid latch-up.
Route all four global clock inputs (GCLK0-GCLK3) on the inner PCB layers with controlled impedance (50 Ω to ground), and keep them away from I/O switching lines to avoid crosstalk. The JTAG chain (TCK, TMS, TDI, TDO, TRST) requires 10 kΩ pull-ups on TMS, TDI, and TRST per Altera's FLEX 10KA JTAG specification - omitting these pull-ups causes unreliable configuration. Reserve room on the board for a 2x5 pin JTAG header even if not populated, to allow post-assembly programming and boundary-scan testing.
The 144-TQFP package has exposed paddle area under the package that must NOT be soldered to the board - it is a thermal pad with no electrical connection on this package variant. Confusing the EPF10K30ATC144 with the 144-pin BGA-356 EPF10K30ABI356 will result in PCB rework, as the BGA footprint is incompatible. According to Altera FLEX 10KA configuration guidelines, the nSTATUS pin must be pulled up to VCCIO with a 10 kΩ resistor; otherwise the FPGA will fail to enter configuration mode after power-up. Lastly, do not use the Quartus Prime (modern) toolchain - it dropped FLEX 10K support after version 13.0; use Quartus II 13.0 or MAX+PLUS II instead.
Информация о соответствии
Lead-free NiPdAu finish ('-N' suffix) supports RoHS / REACH compliance per Altera product documentation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC; FLEX 10KA was never AEC-qualified). Halogen-free and conflict-mineral declarations not found in verified web data and marked unknown.
