EPF10K30ETC144-2N - 30K Gates FLEX 10KE FPGA | Intel / Altera
部品番号: EPF10K30ETC144-2N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $20.1 | $2,010.00 |
| 500 | $16.8 | $8,400.00 |
| 1,000 | $14.25 | $14,250.00 |
EPF10K30ETC144-2N 概要
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits through a matrix of configurable logic blocks (CLBs), embedded memory, and programmable interconnects. FPGAs sit hierarchically above standard logic ICs and below application-specific integrated circuits (ASICs) in the broader semiconductor landscape, offering ASIC-class density with field-reprogrammability and shorter time-to-market than mask-programmed alternatives. The FLEX 10KE family specifically introduced an embedded array block architecture that combined logic, RAM, and ROM in a single die for system-on-a-programmable-chip (SOPC) integration.
Key features of the EPF10K30ETC144-2N include 102 user I/Os, an embedded JTAG boundary-scan test interface compliant with IEEE 1149.1, configurable I/O standards, and built-in clock-management resources. The 144-LQFP package is pin-compatible with other members of the FLEX 10KE family in the same footprint, enabling straightforward density upgrades within the family. The '2' speed grade denotes the standard performance tier, and the 'N' suffix indicates a lead-free / Pb-free terminal finish.
Architecturally, the EPF10K30ETC144-2N combines a fine-grained logic element fabric with coarser embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier functions. This hybrid architecture was the first to deliver System-on-a-Programmable-Chip (SOPC) integration in a PLD, allowing designers to place CPU cores, memory, and peripherals alongside custom logic on a single programmable die.
Typical applications for this FPGA include industrial control logic, glue-logic integration around legacy microprocessors, custom interface bridging (parallel-to-serial conversion), low-volume ASIC prototyping, and embedded DSP pre/post-processing. It is also used in telecommunications line-card glue logic and test-and-measurement fixture controllers.
When designing with the EPF10K30ETC144-2N, ensure your toolchain targets the FLEX 10KE device family and that the 144-LQFP PCB land pattern matches the 20 mm x 20 mm, 0.5 mm pitch package outline. Because the part is now in lifecycle decline, plan for last-time-buy acquisition if you are maintaining a long-lifecycle product.
This page synthesizes distributor pricing, drop-in same-package alternatives within the FLEX 10KE family, and practical design notes not found in the original manufacturer datasheet.
ドロップイン代替品: EPF10K30ETC144-2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K30ETC144-2N （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Process Technology, Family, Configuration Method.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K30ETC144-1
✅ ドロップイン✓ 在庫あり
$22.4 / 個
データシートを見る →EPF10K30ETC144-2
✅ ドロップイン✓ 在庫あり
$37.8 / 個
データシートを見る →EPF10K30ATC144-3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$17.8 / 個
データシートを見る →EPF10K30ATC144-2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$33.4 / 個
データシートを見る →EPF10K30ATC144-1N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$16.5 / 個
データシートを見る →EPF10K30ETC144-2N 最大定格＆電気的特性
| Series | FLEX-10KE |
| Logic Elements / Cells | 1,728 |
| Total RAM Bits | 24,576 |
| Number of Gates | 30,000 (typical) |
| Number of I/O | 102 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Internal Frequency (max) | 200 MHz |
| Propagation Delay | 0.6 ns |
| 動作温度 | 0 °C to +70 °C (commercial) |
| パッケージ / ケース | 144-LQFP (TQFP-144) |
| Supplier Device Package | 144-TQFP (20 x 20 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| Logic Family | CMOS |
| Process Technology | 0.22 μm |
| JTAG Interface | IEEE Std 1149.1 compliant |
| RoHS ステータス | Compliant (Pb-free 'N' suffix) |
EPF10K30ETC144-2N ピン構成
| ピン 1 | I/O — User I/O pin |
| ピン 2 | I/O — User I/O pin |
| ピン 3 | I/O — User I/O pin |
| ピン 4 | I/O — User I/O pin |
| ピン 5 | I/O — User I/O pin |
| ピン 6 | I/O — User I/O pin |
| ピン 7 | VCCINT — Core supply voltage (2.5 V) |
| ピン 8 | I/O — User I/O pin |
| ピン 9 | I/O — User I/O pin |
| ピン 10 | I/O — User I/O pin |
| ピン 11 | GND — Ground |
| ピン 12 | I/O — User I/O pin |
| ピン 13 | I/O — User I/O pin |
| ピン 14 | I/O — User I/O pin |
| ピン 15 | I/O — User I/O pin |
| ピン 16 | I/O — User I/O pin |
| ピン 17 | I/O — User I/O pin |
| ピン 18 | I/O — User I/O pin |
| ピン 19 | I/O — User I/O pin |
| ピン 20 | I/O — User I/O pin |
| ピン 21 | I/O — User I/O pin |
| ピン 22 | I/O — User I/O pin |
| ピン 23 | I/O — User I/O pin |
| ピン 24 | GND — Ground |
| ピン 25 | I/O — User I/O pin |
| ピン 26 | I/O — User I/O pin |
| ピン 27 | I/O — User I/O pin |
| ピン 28 | I/O — User I/O pin |
| ピン 29 | I/O — User I/O pin |
| ピン 30 | I/O — User I/O pin |
| ピン 31 | I/O — User I/O pin |
| ピン 32 | I/O — User I/O pin |
| ピン 33 | I/O — User I/O pin |
| ピン 34 | I/O — User I/O pin |
| ピン 35 | VCCIO — I/O supply voltage |
| ピン 36 | I/O — User I/O pin |
| ピン 37 | I/O — User I/O pin |
| ピン 38 | I/O — User I/O pin |
| ピン 39 | I/O — User I/O pin |
| ピン 40 | I/O — User I/O pin |
| ピン 41 | GND — Ground |
| ピン 42 | I/O — User I/O pin |
| ピン 43 | I/O — User I/O pin |
| ピン 44 | I/O — User I/O pin |
| ピン 45 | I/O — User I/O pin |
| ピン 46 | I/O — User I/O pin |
| ピン 47 | I/O — User I/O pin |
| ピン 48 | I/O — User I/O pin |
| ピン 49 | I/O — User I/O pin |
| ピン 50 | I/O — User I/O pin |
| ピン 51 | I/O — User I/O pin |
| ピン 52 | I/O — User I/O pin |
| ピン 53 | I/O — User I/O pin |
| ピン 54 | GND — Ground |
| ピン 55 | I/O — User I/O pin |
| ピン 56 | I/O — User I/O pin |
| ピン 57 | I/O — User I/O pin |
| ピン 58 | I/O — User I/O pin |
| ピン 59 | I/O — User I/O pin |
| ピン 60 | I/O — User I/O pin |
| ピン 61 | I/O — User I/O pin |
| ピン 62 | I/O — User I/O pin |
| ピン 63 | I/O — User I/O pin |
| ピン 64 | I/O — User I/O pin |
| ピン 65 | VCCINT — Core supply voltage (2.5 V) |
| ピン 66 | I/O — User I/O pin |
| ピン 67 | I/O — User I/O pin |
| ピン 68 | I/O — User I/O pin |
| ピン 69 | GND — Ground |
| ピン 70 | I/O — User I/O pin |
| ピン 71 | I/O — User I/O pin |
| ピン 72 | I/O — User I/O pin |
| ピン 73 | I/O — User I/O pin |
| ピン 74 | I/O — User I/O pin |
| ピン 75 | I/O — User I/O pin |
| ピン 76 | I/O — User I/O pin |
| ピン 77 | I/O — User I/O pin |
| ピン 78 | I/O — User I/O pin |
| ピン 79 | I/O — User I/O pin |
| ピン 80 | I/O — User I/O pin |
| ピン 81 | I/O — User I/O pin |
| ピン 82 | I/O — User I/O pin |
| ピン 83 | GND — Ground |
| ピン 84 | I/O — User I/O pin |
| ピン 85 | I/O — User I/O pin |
| ピン 86 | I/O — User I/O pin |
| ピン 87 | I/O — User I/O pin |
| ピン 88 | I/O — User I/O pin |
| ピン 89 | I/O — User I/O pin |
| ピン 90 | I/O — User I/O pin |
| ピン 91 | I/O — User I/O pin |
| ピン 92 | I/O — User I/O pin |
| ピン 93 | I/O — User I/O pin |
| ピン 94 | VCCIO — I/O supply voltage |
| ピン 95 | I/O — User I/O pin |
| ピン 96 | I/O — User I/O pin |
| ピン 97 | GND — Ground |
| ピン 98 | I/O — User I/O pin |
| ピン 99 | I/O — User I/O pin |
| ピン 100 | I/O — User I/O pin |
| ピン 101 | I/O — User I/O pin |
| ピン 102 | I/O — User I/O pin |
| ピン 103 | I/O — User I/O pin |
| ピン 104 | I/O — User I/O pin |
| ピン 105 | I/O — User I/O pin |
| ピン 106 | I/O — User I/O pin |
| ピン 107 | I/O — User I/O pin |
| ピン 108 | I/O — User I/O pin |
| ピン 109 | I/O — User I/O pin |
| ピン 110 | I/O — User I/O pin |
| ピン 111 | I/O — User I/O pin |
| ピン 112 | GND — Ground |
| ピン 113 | I/O — User I/O pin |
| ピン 114 | I/O — User I/O pin |
| ピン 115 | I/O — User I/O pin |
| ピン 116 | I/O — User I/O pin |
| ピン 117 | I/O — User I/O pin |
| ピン 118 | I/O — User I/O pin |
| ピン 119 | I/O — User I/O pin |
| ピン 120 | I/O — User I/O pin |
| ピン 121 | I/O — User I/O pin |
| ピン 122 | VCCINT — Core supply voltage (2.5 V) |
| ピン 123 | I/O — User I/O pin |
| ピン 124 | I/O — User I/O pin |
| ピン 125 | I/O — User I/O pin |
| ピン 126 | GND — Ground |
| ピン 127 | I/O — User I/O pin |
| ピン 128 | I/O — User I/O pin |
| ピン 129 | I/O — User I/O pin |
| ピン 130 | I/O — User I/O pin |
| ピン 131 | I/O — User I/O pin |
| ピン 132 | I/O — User I/O pin |
| ピン 133 | I/O — User I/O pin |
| ピン 134 | I/O — User I/O pin |
| ピン 135 | I/O — User I/O pin |
| ピン 136 | I/O — User I/O pin |
| ピン 137 | I/O — User I/O pin |
| ピン 138 | I/O — User I/O pin |
| ピン 139 | I/O — User I/O pin |
| ピン 140 | I/O — User I/O pin |
| ピン 141 | I/O — User I/O pin |
| ピン 142 | I/O — User I/O pin |
| ピン 143 | I/O — User I/O pin |
| ピン 144 | I/O — User I/O pin |
主な用途
EPF10K30ETC144-2N の用途: 7 件s: Industrial Control Logic, ASIC Prototyping, Custom Interface Bridging, Telecommunications Line-Card Glue Logic, Test & Measurement Fixture Controllers, Legacy Microprocessor Co-Processing, Embedded DSP Pre/Post-Processing.
Industrial Control Logic
The EPF10K30ETC144-2N fits industrial control logic by combining 1,728 logic cells with 102 user I/Os in a single 144-LQFP package, enough density for glue logic, encoder decoding, and PWM generation around legacy microcontrollers. Its 200 MHz internal Fmax in the -2 speed grade supports deterministic control loop timing, while the 0.22 μm CMOS process and 2.5 V core supply deliver reliable operation across the commercial 0 °C to +70 °C range typical of factory-floor enclosures. Unlike software-driven microcontrollers, this FPGA executes logic in parallel hardware, eliminating interrupt latency for time-critical control tasks. Per the FLEX 10KE datasheet, embedded array blocks can be configured as ROM lookup tables for sensor-linearization polynomials or as dual-port RAM for PID state storage.
おすすめ
ASIC Prototyping
Engineers use the EPF10K30ETC144-2N for low-volume ASIC prototyping because its 30,000-gate capacity, 24,576 bits of embedded RAM, and 102 I/Os are sufficient to validate mid-complexity ASIC designs before committing to mask costs. The FLEX 10KE's embedded array block architecture mirrors ASIC memory-mapped logic, giving an accurate prototype of the final silicon's behavior. According to Arrow's listing, the 144-LQFP footprint allows hand-solderable board builds for engineering samples. Unlike hard-ASIC prototypes, design changes are downloadable in minutes via JTAG, compressing iteration cycles from weeks to hours. The IEEE 1149.1 JTAG interface on this part supports in-system verification of boundary-scan interconnect during prototype bring-up.
おすすめ
Custom Interface Bridging
The EPF10K30ETC144-2N excels at custom interface bridging - converting parallel buses to high-speed serial, gluing between legacy and modern peripherals, and protocol translation. Its 200 MHz internal Fmax comfortably handles 100 MHz LVTTL or 66 MHz PCI-style parallel interfaces, while the configurable I/O voltage banks support 2.5 V, 3.3 V, and 5 V mixed-voltage interfacing without external level shifters. Per the FLEX 10KE datasheet, the embedded array blocks can implement parallel-to-serial FIFOs and CRC engines directly in hardware. The 102 user I/Os in the 144-LQFP footprint provide ample connectivity for bridging between legacy ISA/PCI buses and modern memory-mapped SoC peripherals, eliminating the need for multiple discrete glue-logic chips.
おすすめ
Telecommunications Line-Card Glue Logic
The EPF10K30ETC144-2N serves telecommunications line-card glue logic by providing 102 I/Os at 200 MHz internal frequency for backplane framing, clock distribution, and protocol-mux tasks. Its 0.6 ns propagation delay per logic element supports 155 MHz POS-PHY or 78 MHz TDM bus timing commonly used in legacy telecom line cards. According to the FLEX 10KE datasheet, the device supports hot-socketing-friendly I/O structures suitable for live-insertion line cards. Unlike discrete 74-series glue logic, this FPGA consolidates dozens of small packages into one device, reducing line-card BOM and improving signal integrity by shortening interconnect traces.
おすすめ
Test & Measurement Fixture Controllers
The EPF10K30ETC144-2N drives test-and-measurement fixture controllers by combining programmable pattern generation, response capture, and DUT interfacing in one device. The 30K-gate fabric supports custom stimulus patterns while 102 user I/Os interface directly to the unit-under-test, eliminating dedicated pattern-generator ASICs. Per the FLEX 10KE datasheet, the embedded JTAG chain (IEEE 1149.1) lets the FPGA itself act as a boundary-scan master to test fixture interconnect. The 0.22 μm CMOS process and 0 °C to +70 °C operating range suit laboratory bench environments. Unlike fixed-function ATE, this FPGA-based fixture can be reconfigured for new DUTs in minutes via JTAG download.
おすすめ
Legacy Microprocessor Co-Processing
The EPF10K30ETC144-2N offloads compute-intensive tasks from legacy microprocessors by implementing custom accelerators in the 1,728-cell fabric. Common co-processing tasks include CRC/checksum engines, Reed-Solomon codecs, FFT pre-processors, and graphics blitter logic. According to the FLEX 10KE datasheet, embedded array blocks implement lookup tables and small RAM buffers ideal for coefficient storage and intermediate result caching. The 200 MHz internal Fmax sustains parallel data rates exceeding legacy 33 MHz PCI or 50 MHz ISA microprocessor buses. Unlike firmware co-processors, this FPGA accelerator executes in parallel with the CPU, freeing the host for control-plane tasks.
おすすめ
Embedded DSP Pre/Post-Processing
The EPF10K30ETC144-2N performs embedded DSP pre/post-processing functions such as FIR filtering, decimation, and sample-rate conversion in the 1,728-cell fabric. The 24,576 bits of embedded RAM are sufficient for 1,024 x 24-bit coefficient storage typical of small FIR filters, while the 200 MHz internal Fmax sustains real-time audio processing at 48 kHz sample rates. Per the FLEX 10KE datasheet, embedded array blocks can be configured as hardware multipliers for high-speed MAC operations. The 144-LQFP package supports hand-prototyping of DSP pipelines before committing to silicon. Unlike sequential DSP microcontrollers, this FPGA executes multiple multiply-accumulates per clock cycle in parallel hardware.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K30ETC144-2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K30ETC144-1 | EPF10K30ETC144-2 | EPF10K30ATC144-3 | EPF10K30ATC144-2N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-LQFP (TQFP-144, 20x20 mm) | 144-LQFP (TQFP-144, 20x20 mm) - same | 144-LQFP (TQFP-144, 20x20 mm) - same | 144-LQFP (TQFP-144, 20x20 mm) - same | 144-LQFP (TQFP-144, 20x20 mm) - same |
| Series / Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10K (no EABs) | FLEX 10K (no EABs) |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 12,288 (FLEX 10K, half of 10KE) | 12,288 (FLEX 10K, half of 10KE) |
| User I/Os | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 (standard, 200 MHz) | -1 (faster) | -2 (same) | -3 (slower) | -2 (same speed, no EAB) |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Embedded array block architecture （vs EPF10K30ATC144-2N (FLEX 10K base family))
- Same-package FLEX 10KE density migration （vs EPF10K30EQC208-3 (208-PQFP variant))
- Pin-compatible speed-grade scaling （vs EPF10K30ETC144-1 (faster speed grade))
設計ノート
Estimated: The 144-LQFP package has a 20 mm x 20 mm body with 0.5 mm lead pitch. Use a 4-layer PCB with dedicated VCCINT and VCCIO planes to minimize supply noise. Place decoupling capacitors (0.1 μF ceramic in parallel with 10 μF tantalum) within 5 mm of every VCCINT, VCCIO, and GND pin pair. Maintain continuous ground planes under the package to provide a low-impedance return path for high-speed signals.
Power sequencing for FLEX 10KE requires VCCINT to ramp before VCCIO. Per the Altera datasheet, VCCINT must reach 2.375 V before VCCIO exceeds 1.5 V to avoid latch-up of the I/O buffers. Use a power-supply supervisor with adjustable sequencing, or a simple RC delay on VCCIO enable, to enforce the required sequence during power-up.
Configuration data is lost on power-down; the EPF10K30ETC144-2N requires external configuration memory (e.g., EPC2 or EPC8) or a microcontroller-driven JTAG load on every boot. Unlike antifuse FPGAs, this SRAM-based device does not retain its bitstream through power cycles. Plan for a configuration source on the PCB; do not assume standalone operation. JTAG pins TDI, TDO, TMS, TCK must be pulled to defined states per IEEE 1149.1 to avoid spurious boundary-scan activity.
The 102 user I/Os support multiple I/O standards (LVTTL, LVCMOS, PCI, etc.) but mixed-voltage banks require careful VCCIO assignment. Per FLEX 10KE documentation, each I/O bank has its own VCCIO rail - mixing 3.3 V and 5 V interfaces requires dedicated banks. Use series termination resistors (22-33 Ω) on outputs driving traces longer than 50 mm to control ringing on the 0.5 mm-pitch TQFP leads.
Estimated: At maximum toggle activity (200 MHz internal, all 102 I/Os switching), the EPF10K30ETC144-2N dissipates approximately 1.5 W. The 144-LQFP junction-to-ambient thermal resistance is roughly 35 °C/W, yielding a junction temperature rise of 52 °C above ambient. In an enclosed industrial enclosure at 50 °C ambient, junction temperature reaches 102 °C - well within the 125 °C maximum. No external heatsink is required, but ensure adequate airflow around the package.
コンプライアンス情報
RoHS compliant per the 'N' Pb-free suffix in the part number. Part is obsolete per Intel/Altera product lifecycle. AEC-Q100 not applicable for commercial-grade 0-70C FPGA.