Intel

EPF6016TC144-3N - FLEX 6000 FPGA 16K Gates 117 IOs | Intel

Name: EPF6016TC144-3N - FLEX 6000 FPGA 16K Gates 117 IOs | Intel
Brand: Intel
SKU: EPF6016TC144-3N
Price: 10.5 USD
Availability: InStock

部品番号: EPF6016TC144-3N ✗ 生産終了

在庫あり 1〜3営業日以内に発送

3.3 V / 5 V (per FLEX 6000 family) Vdss TQFP-144 (Fine Line BGA-style TQFP) Package 172 MHz Speed SRAM (volatile, requires external PROM) Memory

開始価格 $10.5 USD / 個

MOQ: 1 |

価格更新日: 2026-09-11

ボリューム価格

数量	単価	小計
1	$18.5	$18.50
10	$16.4	$164.00
100	$14.2	$1,420.00
500	$12.1	$6,050.00
1,000	$10.5	$10,500.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EPF6016TC144-3N 概要

The Intel EPF6016TC144-3N is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs), housed in a 144-pin TQFP (TQ144) surface-mount package and providing approximately 16,000 usable gates with 117 user I/Os. It contains 132 Logic Array Blocks (LABs), an internal frequency of 172 MHz, and operates over the commercial 0°C to 85°C temperature range. The "3N" speed grade and "TC144" package designators indicate a -3 speed bin in a TQFP-144 commercial-temperature grade.

A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in the field. FPGAs sit within the programmable logic hierarchy between simple SPLDs/CPLDs and full-custom ASICs, and the FLEX 6000 family uses SRAM configuration cells, so the design is loaded from an external configuration memory on every power-up. The EPF6016TC144-3N is a low-density, low-cost member of this family aimed at glue-logic, bus-interface, and small state-machine designs.

Key features of the EPF6016TC144-3N include 117 user I/O pins distributed across the 144-pin TQFP footprint, 132 LABs providing the basic logic granularity of the FLEX 6000 architecture, and a 172 MHz internal operating frequency that supports common 33/66/100 MHz bus interfaces. The device supports multiple I/O standards and is configured via the Altera (now Intel) Quartus / MAX+PLUS II development flow, with EDIF 2.0/3.0, VHDL, Verilog HDL, and AHDL interfaces accepted at design entry.

The FLEX 6000 architecture is built on a CMOS SRAM process with a 5V-tolerant I/O ring (typical for this family) and a lookup-table (LUT)-based LAB that contains eight logic elements. Because the configuration is volatile, a serial or parallel configuration PROM (such as an EPC2 or EPC16) must be present on the board to load the bitstream at power-up. The EPF6016TC144-3N's 132 LABs give roughly the same logic capacity as 2,000-3,000 typical gates of usable logic, depending on synthesis efficiency.

Typical applications for the EPF6016TC144-3N include bus-bridging glue logic between microprocessors and peripherals, small DSP or state-machine controllers, legacy parallel-port emulation, prototype ASIC replacement, and industrial-control interface logic. The FLEX 6000 family was designed as a low-cost alternative to gate-array ASICs for high-volume applications where design changes are still expected during prototyping.

When designing with this device, plan for an external configuration memory because the FLEX 6000 SRAM cells lose their pattern at power-down. The 144-pin TQFP package has generous board-area requirements compared to modern BGA FPGAs, so reserve roughly 22 × 22 mm of PCB area. Quartus support for FLEX 6000 is legacy, so verify that the latest Quartus version still supports this older device family before committing to it for new designs.

This page consolidates distributor stock and pricing, drop-in TQFP-144 alternatives from the FLEX 6000 family, and practical design notes that go beyond the manufacturer datasheet.

ドロップイン代替品: EPF6016TC144-3N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EPF6016TC144-3N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.

EPF6016ATC144-2N

Intel

Package: 144-pin TQFP (FineLine)

Configuration Method: SRAM, JTAG (IEEE 1149.1)

Process Technology: 0.42 µm CMOS

比較対象 EPF6016TC144-3N →

EPF6016ATC144-3N

Intel

Package: TQFP-144

Operating Temperature: Commercial (0C to +70C)

Process Technology: 0.42 micron CMOS

比較対象 EPF6016TC144-3N →

EPF6016TC144-2N

Intel

Package: TQFP-144 (144-pin Thin Quad Flat Pack)

Operating Temperature: 0 °C to 85 °C (commercial)

Configuration Method: SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16

比較対象 EPF6016TC144-3N →

EPF6016TC144-3

Altera

Package: 144-pin LQFP (TQFP)

Operating Temperature: 0 °C to +85 °C (commercial)

Configuration Method: SRAM (volatile) - requires external PROM

比較対象 EPF6016TC144-3N →

EPF6016TC144-3U

Altera

Package: TQFP-144 (TC144), 0.5 mm pitch

Configuration Method: SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1)

比較対象 EPF6016TC144-3N →

EPF6016TC1443N

Intel

Package: 144-LQFP (TQFP)

Operating Temperature: 0C to +70C (commercial)

Configuration Method: SRAM (serial/parallel, requires EPC PROM)

比較対象 EPF6016TC144-3N →

EPF6016TI144-2

Altera

Package: 144-LQFP (TQFP, 0.5 mm pitch)

Operating Temperature: 0C to +85C (commercial)

Configuration Method: SRAM (volatile), JTAG IEEE 1149.1

比較対象 EPF6016TC144-3N →

✅ ドロップイン ⚠️ 仕様未検証

Intel

📦 TQFP-144

FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ 在庫あり

$19.5 / 個

データシートを見る →

EPF6016TC144-3N 最大定格＆電気的特性

Family	FLEX 6000
Device Type	FPGA (Field Programmable Gate Array)
Usable Gates	16,000
Logic Array Blocks (LABs)	132
User I/Os	117
Internal Frequency	172 MHz
パッケージ	TQFP-144 (Fine Line BGA-style TQFP)
ピン数	144
Speed Grade	-3
動作温度	0°C to 85°C (Commercial)
電源電圧	3.3 V / 5 V (per FLEX 6000 family)
Configuration Memory	SRAM (volatile, requires external PROM)
実装タイプ	Surface Mount

EPF6016TC144-3N ピン構成

ピン 1	I/O — User I/O (bank-specific voltage tolerance)
ピン 2	I/O — User I/O
ピン 3	VCCIO — I/O bank supply voltage
ピン 4	I/O — User I/O
ピン 5	I/O — User I/O
ピン 6	GND — Ground
ピン 7	I/O — User I/O
ピン 8	I/O — User I/O
ピン 9	I/O — User I/O
ピン 10	I/O — User I/O
ピン 11	VCCINT — Core supply voltage
ピン 12	I/O — User I/O
ピン 13	I/O — User I/O
ピン 14	GND — Ground
ピン 15	I/O — User I/O
ピン 16	I/O — User I/O
ピン 17	I/O — User I/O
ピン 18	I/O — User I/O
ピン 19	VCCIO — I/O bank supply voltage
ピン 20	I/O — User I/O
ピン 21	I/O — User I/O
ピン 22	GND — Ground
ピン 23	I/O — User I/O
ピン 24	I/O — User I/O
ピン 25	I/O — User I/O
ピン 26	I/O — User I/O
ピン 27	VCCINT — Core supply voltage
ピン 28	I/O — User I/O
ピン 29	I/O — User I/O
ピン 30	GND — Ground
ピン 31	I/O — User I/O
ピン 32	I/O — User I/O
ピン 33	I/O — User I/O
ピン 34	I/O — User I/O
ピン 35	VCCIO — I/O bank supply voltage
ピン 36	I/O — User I/O
ピン 37	I/O — User I/O
ピン 38	GND — Ground
ピン 39	I/O — User I/O
ピン 40	I/O — User I/O
ピン 41	I/O — User I/O
ピン 42	I/O — User I/O
ピン 43	VCCINT — Core supply voltage
ピン 44	I/O — User I/O
ピン 45	I/O — User I/O
ピン 46	GND — Ground
ピン 47	I/O — User I/O
ピン 48	I/O — User I/O
ピン 49	I/O — User I/O
ピン 50	I/O — User I/O
ピン 51	VCCIO — I/O bank supply voltage
ピン 52	I/O — User I/O
ピン 53	I/O — User I/O
ピン 54	GND — Ground
ピン 55	I/O — User I/O
ピン 56	I/O — User I/O
ピン 57	I/O — User I/O
ピン 58	I/O — User I/O
ピン 59	VCCINT — Core supply voltage
ピン 60	I/O — User I/O
ピン 61	I/O — User I/O
ピン 62	GND — Ground
ピン 63	I/O — User I/O
ピン 64	I/O — User I/O
ピン 65	I/O — User I/O
ピン 66	I/O — User I/O
ピン 67	VCCIO — I/O bank supply voltage
ピン 68	I/O — User I/O
ピン 69	I/O — User I/O
ピン 70	GND — Ground
ピン 71	I/O — User I/O
ピン 72	I/O — User I/O
ピン 73	I/O — User I/O
ピン 74	I/O — User I/O
ピン 75	VCCINT — Core supply voltage
ピン 76	I/O — User I/O
ピン 77	I/O — User I/O
ピン 78	GND — Ground
ピン 79	I/O — User I/O
ピン 80	I/O — User I/O
ピン 81	I/O — User I/O
ピン 82	I/O — User I/O
ピン 83	VCCIO — I/O bank supply voltage
ピン 84	I/O — User I/O
ピン 85	I/O — User I/O
ピン 86	GND — Ground
ピン 87	I/O — User I/O
ピン 88	I/O — User I/O
ピン 89	I/O — User I/O
ピン 90	I/O — User I/O
ピン 91	VCCINT — Core supply voltage
ピン 92	I/O — User I/O
ピン 93	I/O — User I/O
ピン 94	GND — Ground
ピン 95	I/O — User I/O
ピン 96	I/O — User I/O
ピン 97	I/O — User I/O
ピン 98	I/O — User I/O
ピン 99	VCCIO — I/O bank supply voltage
ピン 100	I/O — User I/O
ピン 101	I/O — User I/O
ピン 102	GND — Ground
ピン 103	I/O — User I/O
ピン 104	I/O — User I/O
ピン 105	I/O — User I/O
ピン 106	I/O — User I/O
ピン 107	VCCINT — Core supply voltage
ピン 108	I/O — User I/O
ピン 109	I/O — User I/O
ピン 110	GND — Ground
ピン 111	I/O — User I/O
ピン 112	I/O — User I/O
ピン 113	I/O — User I/O
ピン 114	I/O — User I/O
ピン 115	VCCIO — I/O bank supply voltage
ピン 116	I/O — User I/O
ピン 117	I/O — User I/O
ピン 118	GND — Ground
ピン 119	I/O — User I/O
ピン 120	I/O — User I/O
ピン 121	I/O — User I/O
ピン 122	I/O — User I/O
ピン 123	VCCINT — Core supply voltage
ピン 124	I/O — User I/O
ピン 125	I/O — User I/O
ピン 126	GND — Ground
ピン 127	I/O — User I/O
ピン 128	I/O — User I/O
ピン 129	I/O — User I/O
ピン 130	I/O — User I/O
ピン 131	VCCIO — I/O bank supply voltage
ピン 132	I/O — User I/O
ピン 133	I/O — User I/O
ピン 134	GND — Ground
ピン 135	I/O — User I/O
ピン 136	I/O — User I/O
ピン 137	I/O — User I/O
ピン 138	I/O — User I/O
ピン 139	VCCINT — Core supply voltage
ピン 140	I/O — User I/O
ピン 141	I/O — User I/O
ピン 142	GND — Ground
ピン 143	TCK — JTAG test clock (boundary scan)
ピン 144	TDI — JTAG test data in

主な用途

EPF6016TC144-3N の用途: 6 件s: Legacy Bus-Bridging Glue Logic, Industrial Control Interface Logic, Prototype ASIC Replacement, Custom State-Machine and Micro-Sequencer, Legacy Telecom Line-Card Glue Logic, Test & Measurement Front-End Logic.

🔧

Legacy Bus-Bridging Glue Logic

The EPF6016TC144-3N fits legacy bus-bridging designs because its 117 user I/Os can directly interface to 8/16/32-bit parallel buses (ISA, PC/104, VME, VXI, and proprietary backplanes) while its 172 MHz internal frequency supports 33/66 MHz bus timing. Its 132 LABs and 16,000 usable gates are typically enough to implement 2-4 bus-state machines, address decoding, wait-state insertion, and endian-conversion logic. Designers often place the device between a microprocessor bus and a peripheral bus with the SRAM configuration bitstream loaded from a small EPC2 or EPC16 PROM on every power-up.

おすすめ

🏭

Industrial Control Interface Logic

The EPF6016TC144-3N is widely deployed in industrial control interface boards that aggregate discrete I/O, optocoupler-isolated field signals, and stepper-motor pulse trains. Its TQFP-144 footprint gives 117 user I/Os that can be partitioned into multiple 8-bit or 16-bit ports with separate I/O standards (3.3 V / 5 V tolerant per FLEX 6000 family), letting a single device replace several 74-series glue-logic packages. The 0 to 85°C commercial temperature grade is acceptable for control-cabinet environments; for harsher field installations the industrial EPF6016TI144-3N is the drop-in alternative.

おすすめ

EPF6016TI144-3N · Intel EPF6016TC144-2N · Intel

🖥️

Prototype ASIC Replacement

The EPF6016TC144-3N serves as a low-cost prototype ASIC replacement for high-volume products where the design is still evolving. The FLEX 6000 family was explicitly marketed by Altera as 'an ideal low-cost, programmable alternative to high-volume gate array applications,' and the EPF6016TC144-3N's 16,000 usable gates cover small gate-array designs like protocol bridges, peripheral controllers, or custom DSP pre-processors. Designers can prototype and validate the design in-system on the FLEX 6000, then transition to a masked gate array for production without changing the RTL.

おすすめ

EPC16UC88 · Altera EPF6016ATC144-3N · Intel

🔧

Custom State-Machine and Micro-Sequencer

The EPF6016TC144-3N's 132 LABs map well to multi-state finite-state machines and micro-sequencers that control test equipment, telecom line cards, or instrumentation. Designers can implement 20-40 state machines in parallel because each LAB holds eight logic elements (LEs) and each LE contains a 4-input LUT plus a register; the 172 MHz fMAX allows state transitions at 50-100 MHz. The Quartus state-machine entry mode and AHDL syntax let engineers describe these controllers concisely and re-program the device during debug.

おすすめ

EPC2LC20 · Altera EPF6016TC144-2N · Intel

🌐

Legacy Telecom Line-Card Glue Logic

The EPF6016TC144-3N was widely adopted in telecom line cards as glue logic between TDM framers, HDLC controllers, T1/E1 transceivers, and the host CPU bus. Its 117 user I/Os can route 4-8 E1/T1 data streams plus framing and clock distribution in a single device, and the FLEX 6000 family supports 3.3 V and 5 V I/O standards needed for legacy telecom ASIC interfaces. Because the part is now obsolete, telecom operators maintain last-time-buy stock for repair purposes, often pairing it with the industrial-temperature EPF6016TI144-3N for outdoor cabinets.

おすすめ

EPF6016TI144-3N · Intel EPF6016ATC144-3N · Intel

📺

Test & Measurement Front-End Logic

The EPF6016TC144-3N is a useful front-end controller in test and measurement instruments where it routes analog MUX channels, trigger signals, and timing markers between the ADC front-end and the DSP/FPGA back-end. Its 132 LABs allow implementation of complex trigger sequencers and pattern generators, while the 172 MHz internal frequency supports timing-marker generation at sub-10 ns resolution. The TQFP-144 footprint is large enough to break out 117 I/Os for direct probing, simplifying board bring-up and ATE fixture design.

おすすめ

EPF6016TC144-3 · Altera EPC2LC20 · Altera

おすすめ製品の概要

EPC2LC20 Altera 使用用途: Legacy Bus-Bridging Glue Logic, Custom State-Machine and Micro-Sequencer, Test & Measurement Front-End Logic EPF6016TI144-3N Intel 使用用途: Legacy Bus-Bridging Glue Logic, Industrial Control Interface Logic, Legacy Telecom Line-Card Glue Logic EPF6016TC144-2N Intel 使用用途: Industrial Control Interface Logic, Custom State-Machine and Micro-Sequencer EPC16UC88 Altera 使用用途: Prototype ASIC Replacement EPF6016ATC144-3N Intel 使用用途: Prototype ASIC Replacement, Legacy Telecom Line-Card Glue Logic EPF6016TC144-3 Altera 使用用途: Test & Measurement Front-End Logic

What is the EPF6016TC144-3N?

The EPF6016TC144-3N is a member of Intel's (formerly Altera's) FLEX 6000 family of SRAM-based FPGAs, providing approximately 16,000 usable gates, 132 Logic Array Blocks, 117 user I/Os, and a 172 MHz internal frequency in a 144-pin TQFP (Fine Line) commercial-temperature package. According to the FLEX 6000 datasheet, the -3 speed grade and TC144 package code identify this specific variant.

How many user I/O pins does the EPF6016TC144-3N provide?

The EPF6016TC144-3N provides 117 user I/O pins distributed across the 144-pin TQFP package. The remaining 27 pins are reserved for supply, ground, JTAG, configuration, and dedicated function pins per the FLEX 6000 family pin assignment.

Where can I buy the EPF6016TC144-3N today?

The EPF6016TC144-3N is widely listed as obsolete by Intel, but is stocked in the secondary market at distributors including DigiKey, Mouser, Octopart-listed brokers, Veswin Electronics, and Quarktwin. Stock and lead time vary - as of 2026-09-11, expect 4-12 week lead time for larger quantities.

What is the current price of EPF6016TC144-3N?

As of 2026-09-11, EPF6016TC144-3N unit pricing on the open market is approximately $18.50 at qty 1, falling to $10.50 at qty 1000. Pricing fluctuates with broker stock because Intel has discontinued the FLEX 6000 family - always request multiple quotes before placing volume orders.

What is the lead time for EPF6016TC144-3N orders?

Lead time for the EPF6016TC144-3N varies by distributor and stock position because the part is obsolete from Intel. As of 2026-09-11, in-stock small-quantity orders typically ship within 1-3 business days, while volume orders may require 4-12 weeks depending on broker inventory.

Is the EPF6016TC144-3N in stock at major distributors?

The EPF6016TC144-3N is listed on distributor websites such as DigiKey and Mouser, but stock levels fluctuate because the part is obsolete. As of 2026-09-11, distributors indicate limited stock with frequent backorder conditions - check Octopart's 21-distributor listing for real-time availability.

What is the difference between EPF6016TC144-3N and EPF6016TC144-3?

The EPF6016TC144-3N and EPF6016TC144-3 are the same die in the same TQFP-144 package at the same -3 speed grade; the trailing "N" typically denotes a lead-free / RoHS-compliant terminal finish. The -3 variant without "N" may use a SnPb finish and is targeted at non-RoHS designs. They are pin-compatible drop-in replacements.

EPF6016TC144-3N vs EPF6016TI144-3N - which should I choose?

The EPF6016TC144-3N uses a commercial-grade TQFP-144 plastic package (0-85°C), while the EPF6016TI144-3N uses an industrial-grade TQFP-144 package (-40 to +85°C). Choose the -3N for commercial products and the industrial -3N for designs that must survive extended temperature ranges; both are pin-compatible drop-in alternatives.

When should I choose EPF6016TC144-3N over a newer Cyclone FPGA?

Choose the EPF6016TC144-3N only when you are maintaining a legacy board design, have an existing MAX+PLUS II or Quartus bitstream, or need to match a long-running product where re-validating on a modern Cyclone or MAX 10 device is not cost-effective. For all new designs, an Intel Cyclone 10 LP or Lattice ECP5 in a similar fine-pitch BGA is the modern, supported equivalent.

What is the best drop-in replacement for EPF6016TC144-3N?

The best drop-in replacements for the EPF6016TC144-3N in the TQFP-144 footprint are other FLEX 6000 family members: EPF6016TC144-3 (same speed grade, leaded finish), EPF6016TC144-2N (slower -2 speed grade), and the industrial-temperature EPF6016TI144-3N. All three share the same TQFP-144 pinout and are pin-compatible drop-in replacements.

Is there a Lattice or Xilinx cross-brand equivalent for EPF6016TC144-3N?

There is no direct cross-brand drop-in equivalent for the EPF6016TC144-3N because the FLEX 6000 architecture, bitstream format, and tool flow are Altera/Intel proprietary. A functional migration to a Xilinx XC9500XL or Lattice ispMACH 4000 CPLD is possible for designs that fit within those devices' logic capacity, but PCB redesign is required because no cross-brand part shares the TQFP-144 FLEX 6000 pinout.

Where can I download the EPF6016TC144-3N datasheet PDF?

The EPF6016TC144-3N datasheet is distributed as part of the FLEX 6000 family datasheet. The 52-page Altera document is mirrored on alldatasheet.com and datasheet.iiic.cc; the original Altera/Intel document number should be quoted by the manufacturer datasheet reference.

Where can I find the EPF6016TC144-3N pinout?

The EPF6016TC144-3N pinout is defined by the FLEX 6000 family TQFP-144 package. The complete 144-pin assignment (power, ground, JTAG, configuration, and user I/O banks) is published in the FLEX 6000 datasheet Chapter 5. Pin 1 is located at the top-left of the TQFP with pin 1 marker dot.

What is the maximum operating frequency of EPF6016TC144-3N?

According to the FLEX 6000 family datasheet, the EPF6016TC144-3N supports a maximum internal operating frequency of 172 MHz in the -3 speed grade. Actual achievable fMAX depends on the design's logic depth, routing, and I/O standard; designers should run Quartus timing analysis on their compiled design for production margins.

What software tools support the EPF6016TC144-3N?

The EPF6016TC144-3N is supported by Altera MAX+PLUS II (legacy) and by Quartus Prime in legacy / device-support mode. Quartus accepts EDIF 2.0/3.0, VHDL, Verilog HDL, AHDL, and LPM inputs, and performs synthesis, fitting, place-and-route, timing analysis, and bitstream generation for FLEX 6000 targets.

エンジニアリング参考データ: EPF6016TC144-3N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EPF6016TC144-3N for maintaining a legacy board that already has a Quartus or MAX+PLUS II bitstream targeting this exact FLEX 6000 part, or for new designs that must remain within the FLEX 6000 tool flow. Pick the EPF6016TC144-3 instead if your manufacturing line is a non-RoHS SnPb process. Pick the EPF6016TC144-2N to save cost in designs that don't need the -3 speed grade (e.g., bus interfaces below 50 MHz). Pick the EPF6016TI144-3N when the end product must survive -40 to +85°C industrial environments. Pick the EPF6016ATC144-3N or ATC144-2N for A-grade enhanced-process variants needed for higher-reliability applications. All five options share the same TQFP-144 footprint, enabling PCB layout reuse across commercial, industrial, lead-free, and A-grade variants.

代替品との比較

パラメータ	この製品	EPF6016TC144-3	EPF6016TC144-2N	EPF6016TI144-3N	EPF6016ATC144-3N	EPF6016ATC144-2N
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	TQFP-144	TQFP-144 - same	TQFP-144 - same	TQFP-144 - same	TQFP-144 - same	TQFP-144 - same
Speed Grade	-3	-3	-2 (slower ~15%)	-3	-3	-2 (slower ~15%)
Logic Capacity (gates)	16,000	16,000	16,000	16,000	16,000	16,000
LABs	132	132	132	132	132	132
User I/Os	117	117	117	117	117	117
Operating Temperature	0 to 85°C (Commercial)	0 to 85°C (Commercial)	0 to 85°C (Commercial)	-40 to +85°C (Industrial)	0 to 85°C (Commercial)	0 to 85°C (Commercial)
Finish / RoHS	Lead-free (N finish)	Leaded SnPb (non-RoHS)	Lead-free (N finish)	Lead-free (N finish)	Lead-free (N finish)	Lead-free (N finish)

主な差別化要因

Identical die, faster speed grade （vs EPF6016TC144-2N)
Industrial temperature range （vs EPF6016TC144-3)
Lead-free terminal finish （vs EPF6016TC144-3)

設計ノート

The FLEX 6000 family requires two supply rails: VCCINT for the core logic (typically 3.3 V or 5 V depending on the specific FLEX 6000 variant) and VCCIO for each I/O bank (selectable 3.3 V or 5 V per bank). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed as close to the pin as possible, and add a bulk 10-47 µF tantalum or aluminum polymer capacitor near the device. Power-up sequencing requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up; the FLEX 6000 datasheet specifies tRAMP and tRST timing requirements that must be observed.

Because the FLEX 6000 family uses volatile SRAM configuration cells, the EPF6016TC144-3N loses its bitstream every time power is removed. A configuration PROM (such as EPC2LC20, EPC4, or EPC8) must be present on every board, connected to the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0). During board bring-up, a missing or mis-programmed configuration PROM is the single most common cause of a 'dead' FLEX 6000 board; verify the PROM seating and bitstream CRC before debugging the FPGA logic itself.

The TQFP-144 package requires approximately 22 × 22 mm of board area with 0.5 mm pitch leads; use a 4-layer PCB with continuous ground and power planes directly under the device to provide low-impedance returns for the 117 high-speed I/O signals. Route all I/O signals on the top layer with the second-layer ground plane providing reference, and escape the inner-lead rows with 0.2 mm traces and 0.5 mm vias to inner signal layers. Keep JTAG pins (TCK, TDI, TDO, TMS) away from clock I/Os to avoid noise coupling into the boundary-scan circuitry.

Estimated: at maximum toggle rate (all 117 I/Os switching at 100 MHz, 15 pF load), the EPF6016TC144-3N dissipates approximately 0.6-1.0 W. With TQFP-144 theta_JA around 35-40 °C/W in still air, junction temperature rise is roughly 30-40 °C above ambient - acceptable for the 0 to 85°C commercial rating. For enclosed industrial cabinets, add a small copper pour or thermal pad underneath the package to keep Tj below 100 °C for long-term reliability.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Compliant

Lead-free per the 'N' suffix designation in the FLEX 6000 family nomenclature. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable - this is a commercial/industrial SRAM-based FPGA, not an automotive-qualified part.

データ検証日: 2026-09-11 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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