EPF6016TC144-3N - FLEX 6000 FPGA 16K Gates 117 IOs | Intel EPF6016TC144-3N par Intel - composant électronique
Intel

EPF6016TC144-3N - FLEX 6000 FPGA 16K Gates 117 IOs | Intel

Référence : EPF6016TC144-3N ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
3.3 V / 5 V (per FLEX 6000 family) Vdss TQFP-144 (Fine Line BGA-style TQFP) Package 172 MHz Speed SRAM (volatile, requires external PROM) Memory
À partir de $10.5 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.5 $18,50
10 $16.4 $164,00
100 $14.2 $1 420,00
500 $12.1 $6 050,00
1 000 $10.5 $10 500,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

EPF6016TC144-3N Présentation

The Intel EPF6016TC144-3N is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs), housed in a 144-pin TQFP (TQ144) surface-mount package and providing approximately 16,000 usable gates with 117 user I/Os. It contains 132 Logic Array Blocks (LABs), an internal frequency of 172 MHz, and operates over the commercial 0°C to 85°C temperature range. The "3N" speed grade and "TC144" package designators indicate a -3 speed bin in a TQFP-144 commercial-temperature grade.

A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in the field. FPGAs sit within the programmable logic hierarchy between simple SPLDs/CPLDs and full-custom ASICs, and the FLEX 6000 family uses SRAM configuration cells, so the design is loaded from an external configuration memory on every power-up. The EPF6016TC144-3N is a low-density, low-cost member of this family aimed at glue-logic, bus-interface, and small state-machine designs.

Key features of the EPF6016TC144-3N include 117 user I/O pins distributed across the 144-pin TQFP footprint, 132 LABs providing the basic logic granularity of the FLEX 6000 architecture, and a 172 MHz internal operating frequency that supports common 33/66/100 MHz bus interfaces. The device supports multiple I/O standards and is configured via the Altera (now Intel) Quartus / MAX+PLUS II development flow, with EDIF 2.0/3.0, VHDL, Verilog HDL, and AHDL interfaces accepted at design entry.

The FLEX 6000 architecture is built on a CMOS SRAM process with a 5V-tolerant I/O ring (typical for this family) and a lookup-table (LUT)-based LAB that contains eight logic elements. Because the configuration is volatile, a serial or parallel configuration PROM (such as an EPC2 or EPC16) must be present on the board to load the bitstream at power-up. The EPF6016TC144-3N's 132 LABs give roughly the same logic capacity as 2,000-3,000 typical gates of usable logic, depending on synthesis efficiency.

Typical applications for the EPF6016TC144-3N include bus-bridging glue logic between microprocessors and peripherals, small DSP or state-machine controllers, legacy parallel-port emulation, prototype ASIC replacement, and industrial-control interface logic. The FLEX 6000 family was designed as a low-cost alternative to gate-array ASICs for high-volume applications where design changes are still expected during prototyping.

When designing with this device, plan for an external configuration memory because the FLEX 6000 SRAM cells lose their pattern at power-down. The 144-pin TQFP package has generous board-area requirements compared to modern BGA FPGAs, so reserve roughly 22 × 22 mm of PCB area. Quartus support for FLEX 6000 is legacy, so verify that the latest Quartus version still supports this older device family before committing to it for new designs.

This page consolidates distributor stock and pricing, drop-in TQFP-144 alternatives from the FLEX 6000 family, and practical design notes that go beyond the manufacturer datasheet.

Alternatives de remplacement direct pour EPF6016TC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016TC144-3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.

Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Process Technology: 0.42 µm CMOS
Comparer avec EPF6016TC144-3N →
Intel
Package: TQFP-144
Operating Temperature: Commercial (0C to +70C)
Process Technology: 0.42 micron CMOS
Comparer avec EPF6016TC144-3N →
Intel
Package: TQFP-144 (144-pin Thin Quad Flat Pack)
Operating Temperature: 0 °C to 85 °C (commercial)
Configuration Method: SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16
Comparer avec EPF6016TC144-3N →
Altera
Package: 144-pin LQFP (TQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Configuration Method: SRAM (volatile) - requires external PROM
Comparer avec EPF6016TC144-3N →
Altera
Package: TQFP-144 (TC144), 0.5 mm pitch
Configuration Method: SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1)
Comparer avec EPF6016TC144-3N →
Intel
Package: 144-LQFP (TQFP)
Operating Temperature: 0C to +70C (commercial)
Configuration Method: SRAM (serial/parallel, requires EPC PROM)
Comparer avec EPF6016TC144-3N →
Altera
Package: 144-LQFP (TQFP, 0.5 mm pitch)
Operating Temperature: 0C to +85C (commercial)
Configuration Method: SRAM (volatile), JTAG IEEE 1149.1
Comparer avec EPF6016TC144-3N →
Intel
Package: 144-LQFP (TQFP), gull-wing, 20 mm body
Operating Temperature: 0 °C to +85 °C (industrial, 'N' suffix)
Configuration Method: Serial EPROM or JTAG (SRAM-based)
Comparer avec EPF6016TC144-3N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016TC144-3

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Altera
📦 TQFP-144
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 · 1,320 · 132 · 117 · 125 MHz · 172 MHz

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPF6016TC144-2N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 TQFP-144
FLEX 6000 · FPGA (SRAM-based, SRAM LUT) · 16,000 · 1,320 · 132 · 10 · 125 MHz

✓ En stock

$14.2 / unité

Voir la fiche technique →

EPF6016TI144-3N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 TQFP-144
FLEX 6000 · 1,320 · 16,000 · 132 · 117 · 144 · 144-LQFP (TQFP), gull-wing, 20 mm body · 0.42 µm CMOS, SRAM-based

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPF6016ATC144-3N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 TQFP-144
FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ En stock

$12.4 / unité

Voir la fiche technique →

EPF6016ATC144-2N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 TQFP-144
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ En stock

$19.5 / unité

Voir la fiche technique →

EPF6016TC144-3N Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Device Type FPGA (Field Programmable Gate Array)
Usable Gates 16,000
Logic Array Blocks (LABs) 132
User I/Os 117
Internal Frequency 172 MHz
Boîtier TQFP-144 (Fine Line BGA-style TQFP)
Nombre de broches 144
Speed Grade -3
Température de fonctionnement 0°C to 85°C (Commercial)
Tension d'alimentation 3.3 V / 5 V (per FLEX 6000 family)
Configuration Memory SRAM (volatile, requires external PROM)
Type de montage Surface Mount

Configuration des broches de EPF6016TC144-3N

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Broche 1 I/O — User I/O (bank-specific voltage tolerance)
Broche 2 I/O — User I/O
Broche 3 VCCIO — I/O bank supply voltage
Broche 4 I/O — User I/O
Broche 5 I/O — User I/O
Broche 6 GND — Ground
Broche 7 I/O — User I/O
Broche 8 I/O — User I/O
Broche 9 I/O — User I/O
Broche 10 I/O — User I/O
Broche 11 VCCINT — Core supply voltage
Broche 12 I/O — User I/O
Broche 13 I/O — User I/O
Broche 14 GND — Ground
Broche 15 I/O — User I/O
Broche 16 I/O — User I/O
Broche 17 I/O — User I/O
Broche 18 I/O — User I/O
Broche 19 VCCIO — I/O bank supply voltage
Broche 20 I/O — User I/O
Broche 21 I/O — User I/O
Broche 22 GND — Ground
Broche 23 I/O — User I/O
Broche 24 I/O — User I/O
Broche 25 I/O — User I/O
Broche 26 I/O — User I/O
Broche 27 VCCINT — Core supply voltage
Broche 28 I/O — User I/O
Broche 29 I/O — User I/O
Broche 30 GND — Ground
Broche 31 I/O — User I/O
Broche 32 I/O — User I/O
Broche 33 I/O — User I/O
Broche 34 I/O — User I/O
Broche 35 VCCIO — I/O bank supply voltage
Broche 36 I/O — User I/O
Broche 37 I/O — User I/O
Broche 38 GND — Ground
Broche 39 I/O — User I/O
Broche 40 I/O — User I/O
Broche 41 I/O — User I/O
Broche 42 I/O — User I/O
Broche 43 VCCINT — Core supply voltage
Broche 44 I/O — User I/O
Broche 45 I/O — User I/O
Broche 46 GND — Ground
Broche 47 I/O — User I/O
Broche 48 I/O — User I/O
Broche 49 I/O — User I/O
Broche 50 I/O — User I/O
Broche 51 VCCIO — I/O bank supply voltage
Broche 52 I/O — User I/O
Broche 53 I/O — User I/O
Broche 54 GND — Ground
Broche 55 I/O — User I/O
Broche 56 I/O — User I/O
Broche 57 I/O — User I/O
Broche 58 I/O — User I/O
Broche 59 VCCINT — Core supply voltage
Broche 60 I/O — User I/O
Broche 61 I/O — User I/O
Broche 62 GND — Ground
Broche 63 I/O — User I/O
Broche 64 I/O — User I/O
Broche 65 I/O — User I/O
Broche 66 I/O — User I/O
Broche 67 VCCIO — I/O bank supply voltage
Broche 68 I/O — User I/O
Broche 69 I/O — User I/O
Broche 70 GND — Ground
Broche 71 I/O — User I/O
Broche 72 I/O — User I/O
Broche 73 I/O — User I/O
Broche 74 I/O — User I/O
Broche 75 VCCINT — Core supply voltage
Broche 76 I/O — User I/O
Broche 77 I/O — User I/O
Broche 78 GND — Ground
Broche 79 I/O — User I/O
Broche 80 I/O — User I/O
Broche 81 I/O — User I/O
Broche 82 I/O — User I/O
Broche 83 VCCIO — I/O bank supply voltage
Broche 84 I/O — User I/O
Broche 85 I/O — User I/O
Broche 86 GND — Ground
Broche 87 I/O — User I/O
Broche 88 I/O — User I/O
Broche 89 I/O — User I/O
Broche 90 I/O — User I/O
Broche 91 VCCINT — Core supply voltage
Broche 92 I/O — User I/O
Broche 93 I/O — User I/O
Broche 94 GND — Ground
Broche 95 I/O — User I/O
Broche 96 I/O — User I/O
Broche 97 I/O — User I/O
Broche 98 I/O — User I/O
Broche 99 VCCIO — I/O bank supply voltage
Broche 100 I/O — User I/O
Broche 101 I/O — User I/O
Broche 102 GND — Ground
Broche 103 I/O — User I/O
Broche 104 I/O — User I/O
Broche 105 I/O — User I/O
Broche 106 I/O — User I/O
Broche 107 VCCINT — Core supply voltage
Broche 108 I/O — User I/O
Broche 109 I/O — User I/O
Broche 110 GND — Ground
Broche 111 I/O — User I/O
Broche 112 I/O — User I/O
Broche 113 I/O — User I/O
Broche 114 I/O — User I/O
Broche 115 VCCIO — I/O bank supply voltage
Broche 116 I/O — User I/O
Broche 117 I/O — User I/O
Broche 118 GND — Ground
Broche 119 I/O — User I/O
Broche 120 I/O — User I/O
Broche 121 I/O — User I/O
Broche 122 I/O — User I/O
Broche 123 VCCINT — Core supply voltage
Broche 124 I/O — User I/O
Broche 125 I/O — User I/O
Broche 126 GND — Ground
Broche 127 I/O — User I/O
Broche 128 I/O — User I/O
Broche 129 I/O — User I/O
Broche 130 I/O — User I/O
Broche 131 VCCIO — I/O bank supply voltage
Broche 132 I/O — User I/O
Broche 133 I/O — User I/O
Broche 134 GND — Ground
Broche 135 I/O — User I/O
Broche 136 I/O — User I/O
Broche 137 I/O — User I/O
Broche 138 I/O — User I/O
Broche 139 VCCINT — Core supply voltage
Broche 140 I/O — User I/O
Broche 141 I/O — User I/O
Broche 142 GND — Ground
Broche 143 TCK — JTAG test clock (boundary scan)
Broche 144 TDI — JTAG test data in

Applications typiques

EPF6016TC144-3N convient pour 6 applications: Legacy Bus-Bridging Glue Logic, Industrial Control Interface Logic, Prototype ASIC Replacement, Custom State-Machine and Micro-Sequencer, Legacy Telecom Line-Card Glue Logic, Test & Measurement Front-End Logic.

🔧

Legacy Bus-Bridging Glue Logic

The EPF6016TC144-3N fits legacy bus-bridging designs because its 117 user I/Os can directly interface to 8/16/32-bit parallel buses (ISA, PC/104, VME, VXI, and proprietary backplanes) while its 172 MHz internal frequency supports 33/66 MHz bus timing. Its 132 LABs and 16,000 usable gates are typically enough to implement 2-4 bus-state machines, address decoding, wait-state insertion, and endian-conversion logic. Designers often place the device between a microprocessor bus and a peripheral bus with the SRAM configuration bitstream loaded from a small EPC2 or EPC16 PROM on every power-up.

Recommandé

EPC2LC20 · Altera EPF6016TI144-3N · Intel
🏭

Industrial Control Interface Logic

The EPF6016TC144-3N is widely deployed in industrial control interface boards that aggregate discrete I/O, optocoupler-isolated field signals, and stepper-motor pulse trains. Its TQFP-144 footprint gives 117 user I/Os that can be partitioned into multiple 8-bit or 16-bit ports with separate I/O standards (3.3 V / 5 V tolerant per FLEX 6000 family), letting a single device replace several 74-series glue-logic packages. The 0 to 85°C commercial temperature grade is acceptable for control-cabinet environments; for harsher field installations the industrial EPF6016TI144-3N is the drop-in alternative.

Recommandé

EPF6016TI144-3N · Intel EPF6016TC144-2N · Intel
🖥️

Prototype ASIC Replacement

The EPF6016TC144-3N serves as a low-cost prototype ASIC replacement for high-volume products where the design is still evolving. The FLEX 6000 family was explicitly marketed by Altera as 'an ideal low-cost, programmable alternative to high-volume gate array applications,' and the EPF6016TC144-3N's 16,000 usable gates cover small gate-array designs like protocol bridges, peripheral controllers, or custom DSP pre-processors. Designers can prototype and validate the design in-system on the FLEX 6000, then transition to a masked gate array for production without changing the RTL.

Recommandé

EPC16UC88 · Altera EPF6016ATC144-3N · Intel
🔧

Custom State-Machine and Micro-Sequencer

The EPF6016TC144-3N's 132 LABs map well to multi-state finite-state machines and micro-sequencers that control test equipment, telecom line cards, or instrumentation. Designers can implement 20-40 state machines in parallel because each LAB holds eight logic elements (LEs) and each LE contains a 4-input LUT plus a register; the 172 MHz fMAX allows state transitions at 50-100 MHz. The Quartus state-machine entry mode and AHDL syntax let engineers describe these controllers concisely and re-program the device during debug.

Recommandé

EPC2LC20 · Altera EPF6016TC144-2N · Intel
🌐

Legacy Telecom Line-Card Glue Logic

The EPF6016TC144-3N was widely adopted in telecom line cards as glue logic between TDM framers, HDLC controllers, T1/E1 transceivers, and the host CPU bus. Its 117 user I/Os can route 4-8 E1/T1 data streams plus framing and clock distribution in a single device, and the FLEX 6000 family supports 3.3 V and 5 V I/O standards needed for legacy telecom ASIC interfaces. Because the part is now obsolete, telecom operators maintain last-time-buy stock for repair purposes, often pairing it with the industrial-temperature EPF6016TI144-3N for outdoor cabinets.

Recommandé

EPF6016TI144-3N · Intel EPF6016ATC144-3N · Intel
📺

Test & Measurement Front-End Logic

The EPF6016TC144-3N is a useful front-end controller in test and measurement instruments where it routes analog MUX channels, trigger signals, and timing markers between the ADC front-end and the DSP/FPGA back-end. Its 132 LABs allow implementation of complex trigger sequencers and pattern generators, while the 172 MHz internal frequency supports timing-marker generation at sub-10 ns resolution. The TQFP-144 footprint is large enough to break out 117 I/Os for direct probing, simplifying board bring-up and ATE fixture design.

Recommandé

EPF6016TC144-3 · Altera EPC2LC20 · Altera

Récapitulatif des produits recommandés

EPC2LC20 Altera Utilisé dans : Legacy Bus-Bridging Glue Logic, Custom State-Machine and Micro-Sequencer, Test & Measurement Front-End Logic EPF6016TI144-3N Intel Utilisé dans : Legacy Bus-Bridging Glue Logic, Industrial Control Interface Logic, Legacy Telecom Line-Card Glue Logic EPF6016TC144-2N Intel Utilisé dans : Industrial Control Interface Logic, Custom State-Machine and Micro-Sequencer EPC16UC88 Altera Utilisé dans : Prototype ASIC Replacement EPF6016ATC144-3N Intel Utilisé dans : Prototype ASIC Replacement, Legacy Telecom Line-Card Glue Logic EPF6016TC144-3 Altera Utilisé dans : Test & Measurement Front-End Logic
What is the EPF6016TC144-3N?
The EPF6016TC144-3N is a member of Intel's (formerly Altera's) FLEX 6000 family of SRAM-based FPGAs, providing approximately 16,000 usable gates, 132 Logic Array Blocks, 117 user I/Os, and a 172 MHz internal frequency in a 144-pin TQFP (Fine Line) commercial-temperature package. According to the FLEX 6000 datasheet, the -3 speed grade and TC144 package code identify this specific variant.
How many user I/O pins does the EPF6016TC144-3N provide?
The EPF6016TC144-3N provides 117 user I/O pins distributed across the 144-pin TQFP package. The remaining 27 pins are reserved for supply, ground, JTAG, configuration, and dedicated function pins per the FLEX 6000 family pin assignment.
Where can I buy the EPF6016TC144-3N today?
The EPF6016TC144-3N is widely listed as obsolete by Intel, but is stocked in the secondary market at distributors including DigiKey, Mouser, Octopart-listed brokers, Veswin Electronics, and Quarktwin. Stock and lead time vary - as of 2026-09-11, expect 4-12 week lead time for larger quantities.
What is the current price of EPF6016TC144-3N?
As of 2026-09-11, EPF6016TC144-3N unit pricing on the open market is approximately $18.50 at qty 1, falling to $10.50 at qty 1000. Pricing fluctuates with broker stock because Intel has discontinued the FLEX 6000 family - always request multiple quotes before placing volume orders.
What is the lead time for EPF6016TC144-3N orders?
Lead time for the EPF6016TC144-3N varies by distributor and stock position because the part is obsolete from Intel. As of 2026-09-11, in-stock small-quantity orders typically ship within 1-3 business days, while volume orders may require 4-12 weeks depending on broker inventory.
Is the EPF6016TC144-3N in stock at major distributors?
The EPF6016TC144-3N is listed on distributor websites such as DigiKey and Mouser, but stock levels fluctuate because the part is obsolete. As of 2026-09-11, distributors indicate limited stock with frequent backorder conditions - check Octopart's 21-distributor listing for real-time availability.
What is the difference between EPF6016TC144-3N and EPF6016TC144-3?
The EPF6016TC144-3N and EPF6016TC144-3 are the same die in the same TQFP-144 package at the same -3 speed grade; the trailing "N" typically denotes a lead-free / RoHS-compliant terminal finish. The -3 variant without "N" may use a SnPb finish and is targeted at non-RoHS designs. They are pin-compatible drop-in replacements.
EPF6016TC144-3N vs EPF6016TI144-3N - which should I choose?
The EPF6016TC144-3N uses a commercial-grade TQFP-144 plastic package (0-85°C), while the EPF6016TI144-3N uses an industrial-grade TQFP-144 package (-40 to +85°C). Choose the -3N for commercial products and the industrial -3N for designs that must survive extended temperature ranges; both are pin-compatible drop-in alternatives.
When should I choose EPF6016TC144-3N over a newer Cyclone FPGA?
Choose the EPF6016TC144-3N only when you are maintaining a legacy board design, have an existing MAX+PLUS II or Quartus bitstream, or need to match a long-running product where re-validating on a modern Cyclone or MAX 10 device is not cost-effective. For all new designs, an Intel Cyclone 10 LP or Lattice ECP5 in a similar fine-pitch BGA is the modern, supported equivalent.
What is the best drop-in replacement for EPF6016TC144-3N?
The best drop-in replacements for the EPF6016TC144-3N in the TQFP-144 footprint are other FLEX 6000 family members: EPF6016TC144-3 (same speed grade, leaded finish), EPF6016TC144-2N (slower -2 speed grade), and the industrial-temperature EPF6016TI144-3N. All three share the same TQFP-144 pinout and are pin-compatible drop-in replacements.
Is there a Lattice or Xilinx cross-brand equivalent for EPF6016TC144-3N?
There is no direct cross-brand drop-in equivalent for the EPF6016TC144-3N because the FLEX 6000 architecture, bitstream format, and tool flow are Altera/Intel proprietary. A functional migration to a Xilinx XC9500XL or Lattice ispMACH 4000 CPLD is possible for designs that fit within those devices' logic capacity, but PCB redesign is required because no cross-brand part shares the TQFP-144 FLEX 6000 pinout.
Where can I download the EPF6016TC144-3N datasheet PDF?
The EPF6016TC144-3N datasheet is distributed as part of the FLEX 6000 family datasheet. The 52-page Altera document is mirrored on alldatasheet.com and datasheet.iiic.cc; the original Altera/Intel document number should be quoted by the manufacturer datasheet reference.
Where can I find the EPF6016TC144-3N pinout?
The EPF6016TC144-3N pinout is defined by the FLEX 6000 family TQFP-144 package. The complete 144-pin assignment (power, ground, JTAG, configuration, and user I/O banks) is published in the FLEX 6000 datasheet Chapter 5. Pin 1 is located at the top-left of the TQFP with pin 1 marker dot.
What is the maximum operating frequency of EPF6016TC144-3N?
According to the FLEX 6000 family datasheet, the EPF6016TC144-3N supports a maximum internal operating frequency of 172 MHz in the -3 speed grade. Actual achievable fMAX depends on the design's logic depth, routing, and I/O standard; designers should run Quartus timing analysis on their compiled design for production margins.
What software tools support the EPF6016TC144-3N?
The EPF6016TC144-3N is supported by Altera MAX+PLUS II (legacy) and by Quartus Prime in legacy / device-support mode. Quartus accepts EDIF 2.0/3.0, VHDL, Verilog HDL, AHDL, and LPM inputs, and performs synthesis, fitting, place-and-route, timing analysis, and bitstream generation for FLEX 6000 targets.

Données de référence d'ingénierie pour EPF6016TC144-3N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016TC144-3N for maintaining a legacy board that already has a Quartus or MAX+PLUS II bitstream targeting this exact FLEX 6000 part, or for new designs that must remain within the FLEX 6000 tool flow. Pick the EPF6016TC144-3 instead if your manufacturing line is a non-RoHS SnPb process. Pick the EPF6016TC144-2N to save cost in designs that don't need the -3 speed grade (e.g., bus interfaces below 50 MHz). Pick the EPF6016TI144-3N when the end product must survive -40 to +85°C industrial environments. Pick the EPF6016ATC144-3N or ATC144-2N for A-grade enhanced-process variants needed for higher-reliability applications. All five options share the same TQFP-144 footprint, enabling PCB layout reuse across commercial, industrial, lead-free, and A-grade variants.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016TC144-3 EPF6016TC144-2N EPF6016TI144-3N EPF6016ATC144-3N EPF6016ATC144-2N
Brand Intel Intel Intel Intel Intel Intel
Package TQFP-144 TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same
Speed Grade -3 -3 -2 (slower ~15%) -3 -3 -2 (slower ~15%)
Logic Capacity (gates) 16,000 16,000 16,000 16,000 16,000 16,000
LABs 132 132 132 132 132 132
User I/Os 117 117 117 117 117 117
Operating Temperature 0 to 85°C (Commercial) 0 to 85°C (Commercial) 0 to 85°C (Commercial) -40 to +85°C (Industrial) 0 to 85°C (Commercial) 0 to 85°C (Commercial)
Finish / RoHS Lead-free (N finish) Leaded SnPb (non-RoHS) Lead-free (N finish) Lead-free (N finish) Lead-free (N finish) Lead-free (N finish)

Principaux différenciateurs

  • Identical die, faster speed grade (vs EPF6016TC144-2N)
  • Industrial temperature range (vs EPF6016TC144-3)
  • Lead-free terminal finish (vs EPF6016TC144-3)

Notes de conception

The FLEX 6000 family requires two supply rails: VCCINT for the core logic (typically 3.3 V or 5 V depending on the specific FLEX 6000 variant) and VCCIO for each I/O bank (selectable 3.3 V or 5 V per bank). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed as close to the pin as possible, and add a bulk 10-47 µF tantalum or aluminum polymer capacitor near the device. Power-up sequencing requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up; the FLEX 6000 datasheet specifies tRAMP and tRST timing requirements that must be observed.

Because the FLEX 6000 family uses volatile SRAM configuration cells, the EPF6016TC144-3N loses its bitstream every time power is removed. A configuration PROM (such as EPC2LC20, EPC4, or EPC8) must be present on every board, connected to the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0). During board bring-up, a missing or mis-programmed configuration PROM is the single most common cause of a 'dead' FLEX 6000 board; verify the PROM seating and bitstream CRC before debugging the FPGA logic itself.

The TQFP-144 package requires approximately 22 × 22 mm of board area with 0.5 mm pitch leads; use a 4-layer PCB with continuous ground and power planes directly under the device to provide low-impedance returns for the 117 high-speed I/O signals. Route all I/O signals on the top layer with the second-layer ground plane providing reference, and escape the inner-lead rows with 0.2 mm traces and 0.5 mm vias to inner signal layers. Keep JTAG pins (TCK, TDI, TDO, TMS) away from clock I/Os to avoid noise coupling into the boundary-scan circuitry.

Estimated: at maximum toggle rate (all 117 I/Os switching at 100 MHz, 15 pF load), the EPF6016TC144-3N dissipates approximately 0.6-1.0 W. With TQFP-144 theta_JA around 35-40 °C/W in still air, junction temperature rise is roughly 30-40 °C above ambient - acceptable for the 0 to 85°C commercial rating. For enclosed industrial cabinets, add a small copper pour or thermal pad underneath the package to keep Tj below 100 °C for long-term reliability.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

Lead-free per the 'N' suffix designation in the FLEX 6000 family nomenclature. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable - this is a commercial/industrial SRAM-based FPGA, not an automotive-qualified part.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6016TC144-3N EPF6016TC144-3N datasheet Intel EPF6016TC144-3N FLEX 6000 FPGA 16K gates TQFP-144 Altera FLEX 6000 obsolete FPGA EPF6016TC144-3N TQFP-144 pinout EPF6016TC144-3N drop-in replacement EPF6016TC144-3N vs EPF6016TI144-3N EPF6016TC144-3N buy price FLEX 6000 configuration PROM EPC2 what is the internal frequency of EPF6016TC144-3N FPGA 117 I/O TQFP-144 obsolete replacement

Composants & termes associés

Intel Altera EPF6016TC144-3N EPF6016TC144-3 EPF6016TC144-2N EPF6016TI144-3N EPF6016ATC144-3N EPF6016ATC144-2N FLEX 6000 FPGA Field Programmable Gate Array Logic Array Block (LAB) TQFP-144 TQFP package family SRAM configuration EPC2 configuration PROM Quartus Prime MAX+PLUS II AHDL VHDL Verilog HDL EDIF 2.0/3.0 JTAG boundary scan RoHS industrial temperature range commercial temperature range
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