EPF6016TC144-3N - FLEX 6000 FPGA 16K Gates 117 IOs | Intel EPF6016TC144-3N da Intel - componente eletrônico
Intel

EPF6016TC144-3N - FLEX 6000 FPGA 16K Gates 117 IOs | Intel

N.º da peça: EPF6016TC144-3N ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
3.3 V / 5 V (per FLEX 6000 family) Vdss TQFP-144 (Fine Line BGA-style TQFP) Package 172 MHz Speed SRAM (volatile, requires external PROM) Memory
A partir de $10.5 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-11
Preços por volume
Qtd. Preço unitário Total
1 $18.5 $18,50
10 $16.4 $164,00
100 $14.2 $1.420,00
500 $12.1 $6.050,00
1.000 $10.5 $10.500,00
ℹ️ Todos os preços estão em USD
Ver datasheet (PDF) Ver alternativas

EPF6016TC144-3N Visão geral

The Intel EPF6016TC144-3N is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs), housed in a 144-pin TQFP (TQ144) surface-mount package and providing approximately 16,000 usable gates with 117 user I/Os. It contains 132 Logic Array Blocks (LABs), an internal frequency of 172 MHz, and operates over the commercial 0°C to 85°C temperature range. The "3N" speed grade and "TC144" package designators indicate a -3 speed bin in a TQFP-144 commercial-temperature grade.

A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in the field. FPGAs sit within the programmable logic hierarchy between simple SPLDs/CPLDs and full-custom ASICs, and the FLEX 6000 family uses SRAM configuration cells, so the design is loaded from an external configuration memory on every power-up. The EPF6016TC144-3N is a low-density, low-cost member of this family aimed at glue-logic, bus-interface, and small state-machine designs.

Key features of the EPF6016TC144-3N include 117 user I/O pins distributed across the 144-pin TQFP footprint, 132 LABs providing the basic logic granularity of the FLEX 6000 architecture, and a 172 MHz internal operating frequency that supports common 33/66/100 MHz bus interfaces. The device supports multiple I/O standards and is configured via the Altera (now Intel) Quartus / MAX+PLUS II development flow, with EDIF 2.0/3.0, VHDL, Verilog HDL, and AHDL interfaces accepted at design entry.

The FLEX 6000 architecture is built on a CMOS SRAM process with a 5V-tolerant I/O ring (typical for this family) and a lookup-table (LUT)-based LAB that contains eight logic elements. Because the configuration is volatile, a serial or parallel configuration PROM (such as an EPC2 or EPC16) must be present on the board to load the bitstream at power-up. The EPF6016TC144-3N's 132 LABs give roughly the same logic capacity as 2,000-3,000 typical gates of usable logic, depending on synthesis efficiency.

Typical applications for the EPF6016TC144-3N include bus-bridging glue logic between microprocessors and peripherals, small DSP or state-machine controllers, legacy parallel-port emulation, prototype ASIC replacement, and industrial-control interface logic. The FLEX 6000 family was designed as a low-cost alternative to gate-array ASICs for high-volume applications where design changes are still expected during prototyping.

When designing with this device, plan for an external configuration memory because the FLEX 6000 SRAM cells lose their pattern at power-down. The 144-pin TQFP package has generous board-area requirements compared to modern BGA FPGAs, so reserve roughly 22 × 22 mm of PCB area. Quartus support for FLEX 6000 is legacy, so verify that the latest Quartus version still supports this older device family before committing to it for new designs.

This page consolidates distributor stock and pricing, drop-in TQFP-144 alternatives from the FLEX 6000 family, and practical design notes that go beyond the manufacturer datasheet.

Alternativas drop-in para EPF6016TC144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6016TC144-3N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.

Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Process Technology: 0.42 µm CMOS
Comparar com EPF6016TC144-3N →
Intel
Package: TQFP-144
Operating Temperature: Commercial (0C to +70C)
Process Technology: 0.42 micron CMOS
Comparar com EPF6016TC144-3N →
Intel
Package: TQFP-144 (144-pin Thin Quad Flat Pack)
Operating Temperature: 0 °C to 85 °C (commercial)
Configuration Method: SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16
Comparar com EPF6016TC144-3N →
Altera
Package: 144-pin LQFP (TQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Configuration Method: SRAM (volatile) - requires external PROM
Comparar com EPF6016TC144-3N →
Altera
Package: TQFP-144 (TC144), 0.5 mm pitch
Configuration Method: SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1)
Comparar com EPF6016TC144-3N →
Intel
Package: 144-LQFP (TQFP)
Operating Temperature: 0C to +70C (commercial)
Configuration Method: SRAM (serial/parallel, requires EPC PROM)
Comparar com EPF6016TC144-3N →
Altera
Package: 144-LQFP (TQFP, 0.5 mm pitch)
Operating Temperature: 0C to +85C (commercial)
Configuration Method: SRAM (volatile), JTAG IEEE 1149.1
Comparar com EPF6016TC144-3N →
Intel
Package: 144-LQFP (TQFP), gull-wing, 20 mm body
Operating Temperature: 0 °C to +85 °C (industrial, 'N' suffix)
Configuration Method: Serial EPROM or JTAG (SRAM-based)
Comparar com EPF6016TC144-3N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPF6016TC144-3

✅ Drop-In ⚠️ Especificações não verificadas
Altera
📦 TQFP-144
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 · 1,320 · 132 · 117 · 125 MHz · 172 MHz

✓ Em estoque

$9.85 / unidade

Ver ficha técnica →

EPF6016TC144-2N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 TQFP-144
FLEX 6000 · FPGA (SRAM-based, SRAM LUT) · 16,000 · 1,320 · 132 · 10 · 125 MHz

✓ Em estoque

$14.2 / unidade

Ver ficha técnica →

EPF6016TI144-3N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 TQFP-144
FLEX 6000 · 1,320 · 16,000 · 132 · 117 · 144 · 144-LQFP (TQFP), gull-wing, 20 mm body · 0.42 µm CMOS, SRAM-based

✓ Em estoque

$9.85 / unidade

Ver ficha técnica →

EPF6016ATC144-3N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 TQFP-144
FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ Em estoque

$12.4 / unidade

Ver ficha técnica →

EPF6016ATC144-2N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 TQFP-144
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ Em estoque

$19.5 / unidade

Ver ficha técnica →

EPF6016TC144-3N Classificações máximas e características elétricas

Family FLEX 6000
Device Type FPGA (Field Programmable Gate Array)
Usable Gates 16,000
Logic Array Blocks (LABs) 132
User I/Os 117
Internal Frequency 172 MHz
Encapsulamento TQFP-144 (Fine Line BGA-style TQFP)
Contagem de pinos 144
Speed Grade -3
Temperatura de operação 0°C to 85°C (Commercial)
Tensão de alimentação 3.3 V / 5 V (per FLEX 6000 family)
Configuration Memory SRAM (volatile, requires external PROM)
Tipo de montagem Surface Mount

Configuração de pinos do EPF6016TC144-3N

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Pino 1 I/O — User I/O (bank-specific voltage tolerance)
Pino 2 I/O — User I/O
Pino 3 VCCIO — I/O bank supply voltage
Pino 4 I/O — User I/O
Pino 5 I/O — User I/O
Pino 6 GND — Ground
Pino 7 I/O — User I/O
Pino 8 I/O — User I/O
Pino 9 I/O — User I/O
Pino 10 I/O — User I/O
Pino 11 VCCINT — Core supply voltage
Pino 12 I/O — User I/O
Pino 13 I/O — User I/O
Pino 14 GND — Ground
Pino 15 I/O — User I/O
Pino 16 I/O — User I/O
Pino 17 I/O — User I/O
Pino 18 I/O — User I/O
Pino 19 VCCIO — I/O bank supply voltage
Pino 20 I/O — User I/O
Pino 21 I/O — User I/O
Pino 22 GND — Ground
Pino 23 I/O — User I/O
Pino 24 I/O — User I/O
Pino 25 I/O — User I/O
Pino 26 I/O — User I/O
Pino 27 VCCINT — Core supply voltage
Pino 28 I/O — User I/O
Pino 29 I/O — User I/O
Pino 30 GND — Ground
Pino 31 I/O — User I/O
Pino 32 I/O — User I/O
Pino 33 I/O — User I/O
Pino 34 I/O — User I/O
Pino 35 VCCIO — I/O bank supply voltage
Pino 36 I/O — User I/O
Pino 37 I/O — User I/O
Pino 38 GND — Ground
Pino 39 I/O — User I/O
Pino 40 I/O — User I/O
Pino 41 I/O — User I/O
Pino 42 I/O — User I/O
Pino 43 VCCINT — Core supply voltage
Pino 44 I/O — User I/O
Pino 45 I/O — User I/O
Pino 46 GND — Ground
Pino 47 I/O — User I/O
Pino 48 I/O — User I/O
Pino 49 I/O — User I/O
Pino 50 I/O — User I/O
Pino 51 VCCIO — I/O bank supply voltage
Pino 52 I/O — User I/O
Pino 53 I/O — User I/O
Pino 54 GND — Ground
Pino 55 I/O — User I/O
Pino 56 I/O — User I/O
Pino 57 I/O — User I/O
Pino 58 I/O — User I/O
Pino 59 VCCINT — Core supply voltage
Pino 60 I/O — User I/O
Pino 61 I/O — User I/O
Pino 62 GND — Ground
Pino 63 I/O — User I/O
Pino 64 I/O — User I/O
Pino 65 I/O — User I/O
Pino 66 I/O — User I/O
Pino 67 VCCIO — I/O bank supply voltage
Pino 68 I/O — User I/O
Pino 69 I/O — User I/O
Pino 70 GND — Ground
Pino 71 I/O — User I/O
Pino 72 I/O — User I/O
Pino 73 I/O — User I/O
Pino 74 I/O — User I/O
Pino 75 VCCINT — Core supply voltage
Pino 76 I/O — User I/O
Pino 77 I/O — User I/O
Pino 78 GND — Ground
Pino 79 I/O — User I/O
Pino 80 I/O — User I/O
Pino 81 I/O — User I/O
Pino 82 I/O — User I/O
Pino 83 VCCIO — I/O bank supply voltage
Pino 84 I/O — User I/O
Pino 85 I/O — User I/O
Pino 86 GND — Ground
Pino 87 I/O — User I/O
Pino 88 I/O — User I/O
Pino 89 I/O — User I/O
Pino 90 I/O — User I/O
Pino 91 VCCINT — Core supply voltage
Pino 92 I/O — User I/O
Pino 93 I/O — User I/O
Pino 94 GND — Ground
Pino 95 I/O — User I/O
Pino 96 I/O — User I/O
Pino 97 I/O — User I/O
Pino 98 I/O — User I/O
Pino 99 VCCIO — I/O bank supply voltage
Pino 100 I/O — User I/O
Pino 101 I/O — User I/O
Pino 102 GND — Ground
Pino 103 I/O — User I/O
Pino 104 I/O — User I/O
Pino 105 I/O — User I/O
Pino 106 I/O — User I/O
Pino 107 VCCINT — Core supply voltage
Pino 108 I/O — User I/O
Pino 109 I/O — User I/O
Pino 110 GND — Ground
Pino 111 I/O — User I/O
Pino 112 I/O — User I/O
Pino 113 I/O — User I/O
Pino 114 I/O — User I/O
Pino 115 VCCIO — I/O bank supply voltage
Pino 116 I/O — User I/O
Pino 117 I/O — User I/O
Pino 118 GND — Ground
Pino 119 I/O — User I/O
Pino 120 I/O — User I/O
Pino 121 I/O — User I/O
Pino 122 I/O — User I/O
Pino 123 VCCINT — Core supply voltage
Pino 124 I/O — User I/O
Pino 125 I/O — User I/O
Pino 126 GND — Ground
Pino 127 I/O — User I/O
Pino 128 I/O — User I/O
Pino 129 I/O — User I/O
Pino 130 I/O — User I/O
Pino 131 VCCIO — I/O bank supply voltage
Pino 132 I/O — User I/O
Pino 133 I/O — User I/O
Pino 134 GND — Ground
Pino 135 I/O — User I/O
Pino 136 I/O — User I/O
Pino 137 I/O — User I/O
Pino 138 I/O — User I/O
Pino 139 VCCINT — Core supply voltage
Pino 140 I/O — User I/O
Pino 141 I/O — User I/O
Pino 142 GND — Ground
Pino 143 TCK — JTAG test clock (boundary scan)
Pino 144 TDI — JTAG test data in

Aplicações típicas

EPF6016TC144-3N é adequado para 6 aplicaçãos: Legacy Bus-Bridging Glue Logic, Industrial Control Interface Logic, Prototype ASIC Replacement, Custom State-Machine and Micro-Sequencer, Legacy Telecom Line-Card Glue Logic, Test & Measurement Front-End Logic.

🔧

Legacy Bus-Bridging Glue Logic

The EPF6016TC144-3N fits legacy bus-bridging designs because its 117 user I/Os can directly interface to 8/16/32-bit parallel buses (ISA, PC/104, VME, VXI, and proprietary backplanes) while its 172 MHz internal frequency supports 33/66 MHz bus timing. Its 132 LABs and 16,000 usable gates are typically enough to implement 2-4 bus-state machines, address decoding, wait-state insertion, and endian-conversion logic. Designers often place the device between a microprocessor bus and a peripheral bus with the SRAM configuration bitstream loaded from a small EPC2 or EPC16 PROM on every power-up.

Recomendado

EPC2LC20 · Altera EPF6016TI144-3N · Intel
🏭

Industrial Control Interface Logic

The EPF6016TC144-3N is widely deployed in industrial control interface boards that aggregate discrete I/O, optocoupler-isolated field signals, and stepper-motor pulse trains. Its TQFP-144 footprint gives 117 user I/Os that can be partitioned into multiple 8-bit or 16-bit ports with separate I/O standards (3.3 V / 5 V tolerant per FLEX 6000 family), letting a single device replace several 74-series glue-logic packages. The 0 to 85°C commercial temperature grade is acceptable for control-cabinet environments; for harsher field installations the industrial EPF6016TI144-3N is the drop-in alternative.

Recomendado

EPF6016TI144-3N · Intel EPF6016TC144-2N · Intel
🖥️

Prototype ASIC Replacement

The EPF6016TC144-3N serves as a low-cost prototype ASIC replacement for high-volume products where the design is still evolving. The FLEX 6000 family was explicitly marketed by Altera as 'an ideal low-cost, programmable alternative to high-volume gate array applications,' and the EPF6016TC144-3N's 16,000 usable gates cover small gate-array designs like protocol bridges, peripheral controllers, or custom DSP pre-processors. Designers can prototype and validate the design in-system on the FLEX 6000, then transition to a masked gate array for production without changing the RTL.

Recomendado

EPC16UC88 · Altera EPF6016ATC144-3N · Intel
🔧

Custom State-Machine and Micro-Sequencer

The EPF6016TC144-3N's 132 LABs map well to multi-state finite-state machines and micro-sequencers that control test equipment, telecom line cards, or instrumentation. Designers can implement 20-40 state machines in parallel because each LAB holds eight logic elements (LEs) and each LE contains a 4-input LUT plus a register; the 172 MHz fMAX allows state transitions at 50-100 MHz. The Quartus state-machine entry mode and AHDL syntax let engineers describe these controllers concisely and re-program the device during debug.

Recomendado

EPC2LC20 · Altera EPF6016TC144-2N · Intel
🌐

Legacy Telecom Line-Card Glue Logic

The EPF6016TC144-3N was widely adopted in telecom line cards as glue logic between TDM framers, HDLC controllers, T1/E1 transceivers, and the host CPU bus. Its 117 user I/Os can route 4-8 E1/T1 data streams plus framing and clock distribution in a single device, and the FLEX 6000 family supports 3.3 V and 5 V I/O standards needed for legacy telecom ASIC interfaces. Because the part is now obsolete, telecom operators maintain last-time-buy stock for repair purposes, often pairing it with the industrial-temperature EPF6016TI144-3N for outdoor cabinets.

Recomendado

EPF6016TI144-3N · Intel EPF6016ATC144-3N · Intel
📺

Test & Measurement Front-End Logic

The EPF6016TC144-3N is a useful front-end controller in test and measurement instruments where it routes analog MUX channels, trigger signals, and timing markers between the ADC front-end and the DSP/FPGA back-end. Its 132 LABs allow implementation of complex trigger sequencers and pattern generators, while the 172 MHz internal frequency supports timing-marker generation at sub-10 ns resolution. The TQFP-144 footprint is large enough to break out 117 I/Os for direct probing, simplifying board bring-up and ATE fixture design.

Recomendado

EPF6016TC144-3 · Altera EPC2LC20 · Altera

Resumo dos produtos recomendados

EPC2LC20 Altera Usado em: Legacy Bus-Bridging Glue Logic, Custom State-Machine and Micro-Sequencer, Test & Measurement Front-End Logic EPF6016TI144-3N Intel Usado em: Legacy Bus-Bridging Glue Logic, Industrial Control Interface Logic, Legacy Telecom Line-Card Glue Logic EPF6016TC144-2N Intel Usado em: Industrial Control Interface Logic, Custom State-Machine and Micro-Sequencer EPC16UC88 Altera Usado em: Prototype ASIC Replacement EPF6016ATC144-3N Intel Usado em: Prototype ASIC Replacement, Legacy Telecom Line-Card Glue Logic EPF6016TC144-3 Altera Usado em: Test & Measurement Front-End Logic
What is the EPF6016TC144-3N?
The EPF6016TC144-3N is a member of Intel's (formerly Altera's) FLEX 6000 family of SRAM-based FPGAs, providing approximately 16,000 usable gates, 132 Logic Array Blocks, 117 user I/Os, and a 172 MHz internal frequency in a 144-pin TQFP (Fine Line) commercial-temperature package. According to the FLEX 6000 datasheet, the -3 speed grade and TC144 package code identify this specific variant.
How many user I/O pins does the EPF6016TC144-3N provide?
The EPF6016TC144-3N provides 117 user I/O pins distributed across the 144-pin TQFP package. The remaining 27 pins are reserved for supply, ground, JTAG, configuration, and dedicated function pins per the FLEX 6000 family pin assignment.
Where can I buy the EPF6016TC144-3N today?
The EPF6016TC144-3N is widely listed as obsolete by Intel, but is stocked in the secondary market at distributors including DigiKey, Mouser, Octopart-listed brokers, Veswin Electronics, and Quarktwin. Stock and lead time vary - as of 2026-09-11, expect 4-12 week lead time for larger quantities.
What is the current price of EPF6016TC144-3N?
As of 2026-09-11, EPF6016TC144-3N unit pricing on the open market is approximately $18.50 at qty 1, falling to $10.50 at qty 1000. Pricing fluctuates with broker stock because Intel has discontinued the FLEX 6000 family - always request multiple quotes before placing volume orders.
What is the lead time for EPF6016TC144-3N orders?
Lead time for the EPF6016TC144-3N varies by distributor and stock position because the part is obsolete from Intel. As of 2026-09-11, in-stock small-quantity orders typically ship within 1-3 business days, while volume orders may require 4-12 weeks depending on broker inventory.
Is the EPF6016TC144-3N in stock at major distributors?
The EPF6016TC144-3N is listed on distributor websites such as DigiKey and Mouser, but stock levels fluctuate because the part is obsolete. As of 2026-09-11, distributors indicate limited stock with frequent backorder conditions - check Octopart's 21-distributor listing for real-time availability.
What is the difference between EPF6016TC144-3N and EPF6016TC144-3?
The EPF6016TC144-3N and EPF6016TC144-3 are the same die in the same TQFP-144 package at the same -3 speed grade; the trailing "N" typically denotes a lead-free / RoHS-compliant terminal finish. The -3 variant without "N" may use a SnPb finish and is targeted at non-RoHS designs. They are pin-compatible drop-in replacements.
EPF6016TC144-3N vs EPF6016TI144-3N - which should I choose?
The EPF6016TC144-3N uses a commercial-grade TQFP-144 plastic package (0-85°C), while the EPF6016TI144-3N uses an industrial-grade TQFP-144 package (-40 to +85°C). Choose the -3N for commercial products and the industrial -3N for designs that must survive extended temperature ranges; both are pin-compatible drop-in alternatives.
When should I choose EPF6016TC144-3N over a newer Cyclone FPGA?
Choose the EPF6016TC144-3N only when you are maintaining a legacy board design, have an existing MAX+PLUS II or Quartus bitstream, or need to match a long-running product where re-validating on a modern Cyclone or MAX 10 device is not cost-effective. For all new designs, an Intel Cyclone 10 LP or Lattice ECP5 in a similar fine-pitch BGA is the modern, supported equivalent.
What is the best drop-in replacement for EPF6016TC144-3N?
The best drop-in replacements for the EPF6016TC144-3N in the TQFP-144 footprint are other FLEX 6000 family members: EPF6016TC144-3 (same speed grade, leaded finish), EPF6016TC144-2N (slower -2 speed grade), and the industrial-temperature EPF6016TI144-3N. All three share the same TQFP-144 pinout and are pin-compatible drop-in replacements.
Is there a Lattice or Xilinx cross-brand equivalent for EPF6016TC144-3N?
There is no direct cross-brand drop-in equivalent for the EPF6016TC144-3N because the FLEX 6000 architecture, bitstream format, and tool flow are Altera/Intel proprietary. A functional migration to a Xilinx XC9500XL or Lattice ispMACH 4000 CPLD is possible for designs that fit within those devices' logic capacity, but PCB redesign is required because no cross-brand part shares the TQFP-144 FLEX 6000 pinout.
Where can I download the EPF6016TC144-3N datasheet PDF?
The EPF6016TC144-3N datasheet is distributed as part of the FLEX 6000 family datasheet. The 52-page Altera document is mirrored on alldatasheet.com and datasheet.iiic.cc; the original Altera/Intel document number should be quoted by the manufacturer datasheet reference.
Where can I find the EPF6016TC144-3N pinout?
The EPF6016TC144-3N pinout is defined by the FLEX 6000 family TQFP-144 package. The complete 144-pin assignment (power, ground, JTAG, configuration, and user I/O banks) is published in the FLEX 6000 datasheet Chapter 5. Pin 1 is located at the top-left of the TQFP with pin 1 marker dot.
What is the maximum operating frequency of EPF6016TC144-3N?
According to the FLEX 6000 family datasheet, the EPF6016TC144-3N supports a maximum internal operating frequency of 172 MHz in the -3 speed grade. Actual achievable fMAX depends on the design's logic depth, routing, and I/O standard; designers should run Quartus timing analysis on their compiled design for production margins.
What software tools support the EPF6016TC144-3N?
The EPF6016TC144-3N is supported by Altera MAX+PLUS II (legacy) and by Quartus Prime in legacy / device-support mode. Quartus accepts EDIF 2.0/3.0, VHDL, Verilog HDL, AHDL, and LPM inputs, and performs synthesis, fitting, place-and-route, timing analysis, and bitstream generation for FLEX 6000 targets.

Dados de referência de engenharia para EPF6016TC144-3N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF6016TC144-3N for maintaining a legacy board that already has a Quartus or MAX+PLUS II bitstream targeting this exact FLEX 6000 part, or for new designs that must remain within the FLEX 6000 tool flow. Pick the EPF6016TC144-3 instead if your manufacturing line is a non-RoHS SnPb process. Pick the EPF6016TC144-2N to save cost in designs that don't need the -3 speed grade (e.g., bus interfaces below 50 MHz). Pick the EPF6016TI144-3N when the end product must survive -40 to +85°C industrial environments. Pick the EPF6016ATC144-3N or ATC144-2N for A-grade enhanced-process variants needed for higher-reliability applications. All five options share the same TQFP-144 footprint, enabling PCB layout reuse across commercial, industrial, lead-free, and A-grade variants.

Comparação com alternativas

Parâmetro Este produto EPF6016TC144-3 EPF6016TC144-2N EPF6016TI144-3N EPF6016ATC144-3N EPF6016ATC144-2N
Brand Intel Intel Intel Intel Intel Intel
Package TQFP-144 TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same
Speed Grade -3 -3 -2 (slower ~15%) -3 -3 -2 (slower ~15%)
Logic Capacity (gates) 16,000 16,000 16,000 16,000 16,000 16,000
LABs 132 132 132 132 132 132
User I/Os 117 117 117 117 117 117
Operating Temperature 0 to 85°C (Commercial) 0 to 85°C (Commercial) 0 to 85°C (Commercial) -40 to +85°C (Industrial) 0 to 85°C (Commercial) 0 to 85°C (Commercial)
Finish / RoHS Lead-free (N finish) Leaded SnPb (non-RoHS) Lead-free (N finish) Lead-free (N finish) Lead-free (N finish) Lead-free (N finish)

Principais diferenciais

  • Identical die, faster speed grade (vs EPF6016TC144-2N)
  • Industrial temperature range (vs EPF6016TC144-3)
  • Lead-free terminal finish (vs EPF6016TC144-3)

Notas de projeto

The FLEX 6000 family requires two supply rails: VCCINT for the core logic (typically 3.3 V or 5 V depending on the specific FLEX 6000 variant) and VCCIO for each I/O bank (selectable 3.3 V or 5 V per bank). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed as close to the pin as possible, and add a bulk 10-47 µF tantalum or aluminum polymer capacitor near the device. Power-up sequencing requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up; the FLEX 6000 datasheet specifies tRAMP and tRST timing requirements that must be observed.

Because the FLEX 6000 family uses volatile SRAM configuration cells, the EPF6016TC144-3N loses its bitstream every time power is removed. A configuration PROM (such as EPC2LC20, EPC4, or EPC8) must be present on every board, connected to the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0). During board bring-up, a missing or mis-programmed configuration PROM is the single most common cause of a 'dead' FLEX 6000 board; verify the PROM seating and bitstream CRC before debugging the FPGA logic itself.

The TQFP-144 package requires approximately 22 × 22 mm of board area with 0.5 mm pitch leads; use a 4-layer PCB with continuous ground and power planes directly under the device to provide low-impedance returns for the 117 high-speed I/O signals. Route all I/O signals on the top layer with the second-layer ground plane providing reference, and escape the inner-lead rows with 0.2 mm traces and 0.5 mm vias to inner signal layers. Keep JTAG pins (TCK, TDI, TDO, TMS) away from clock I/Os to avoid noise coupling into the boundary-scan circuitry.

Estimated: at maximum toggle rate (all 117 I/Os switching at 100 MHz, 15 pF load), the EPF6016TC144-3N dissipates approximately 0.6-1.0 W. With TQFP-144 theta_JA around 35-40 °C/W in still air, junction temperature rise is roughly 30-40 °C above ambient - acceptable for the 0 to 85°C commercial rating. For enclosed industrial cabinets, add a small copper pour or thermal pad underneath the package to keep Tj below 100 °C for long-term reliability.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

Lead-free per the 'N' suffix designation in the FLEX 6000 family nomenclature. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable - this is a commercial/industrial SRAM-based FPGA, not an automotive-qualified part.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EPF6016TC144-3N EPF6016TC144-3N datasheet Intel EPF6016TC144-3N FLEX 6000 FPGA 16K gates TQFP-144 Altera FLEX 6000 obsolete FPGA EPF6016TC144-3N TQFP-144 pinout EPF6016TC144-3N drop-in replacement EPF6016TC144-3N vs EPF6016TI144-3N EPF6016TC144-3N buy price FLEX 6000 configuration PROM EPC2 what is the internal frequency of EPF6016TC144-3N FPGA 117 I/O TQFP-144 obsolete replacement

Componentes & termos relacionados

Intel Altera EPF6016TC144-3N EPF6016TC144-3 EPF6016TC144-2N EPF6016TI144-3N EPF6016ATC144-3N EPF6016ATC144-2N FLEX 6000 FPGA Field Programmable Gate Array Logic Array Block (LAB) TQFP-144 TQFP package family SRAM configuration EPC2 configuration PROM Quartus Prime MAX+PLUS II AHDL VHDL Verilog HDL EDIF 2.0/3.0 JTAG boundary scan RoHS industrial temperature range commercial temperature range
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