EPF8820ABC225-4 - FLEX 8000 FPGA 8K Gates 5V 225-BGA | Intel
部品番号: EPF8820ABC225-4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.4 | $284.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $17.85 | $8,925.00 |
| 1,000 | $14.2 | $14,200.00 |
EPF8820ABC225-4 概要
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic functionality is defined after manufacturing by loading a configuration bitstream into on-chip SRAM. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and SPLDs, and are used wherever high gate counts, parallel data-path manipulation, or fast time-to-market outweigh the unit-cost advantage of an ASIC. The FLEX 8000 family was one of the first Altera device families to introduce logic elements (LEs) that combine a 4-input look-up table with a programmable register, supported by a continuous routing fabric.
The EPF8820ABC225-4 organizes 672 logic cells across 84 Logic Array Blocks (LABs) and exposes 152 user I/O pins. Its 4-input LUT architecture plus dedicated carry chains allows efficient implementation of arithmetic functions, datapath registers, and state machines. Typical applications include glue logic replacement, bus interfacing, DSP pre/post-processing, and wide datapath manipulation in industrial control and telecom infrastructure.
Architecturally, the device uses SRAM configuration cells, meaning it must be reconfigured at every power-up (typically from a serial EPROM or microcontroller). The 225-BGA package at 19 × 19 mm provides ample signal escape and thermal headroom for the commercial-grade silicon. Power consumption scales with toggle rate and clock frequency; in static (un-clocked) conditions the device draws substantially less than at 125 MHz full-toggle.
The -4 speed grade identifies a faster timing bin within the EPF8820 family, supporting internal toggle rates up to 125 MHz. The 'BC225' suffix specifies the 225-ball BGA package, while the trailing '-4' marks the speed grade and commercial operating temperature. A slower -3 speed grade is also available in the same package for cost-sensitive designs where the additional timing margin is acceptable.
ドロップイン代替品: EPF8820ABC225-4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF8820ABC225-4 （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Process Technology, Configuration Method, Usable Gates.
クイック比較ツール — 並列比較する代替部品を選択:
EPF8820ABC225-3
✅ ドロップイン✓ 在庫あり
$20 / 個
データシートを見る →EPF8636AQC208-4N
✅ ドロップイン✓ 在庫あり
$10.4 / 個
データシートを見る →EPF8636AQC208-4
✅ ドロップイン✓ 在庫あり
$35.33 / 個
データシートを見る →EPF8636AQC208-3
✅ ドロップイン✓ 在庫あり
$28 / 個
データシートを見る →EPF8636ARC208-4
✅ ドロップイン✓ 在庫あり
$16.5 / 個
データシートを見る →EPF8636ARC208-3
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →EPF8820ABC225-4 最大定格＆電気的特性
| Family | FLEX 8000 |
| Device Logic Elements | 672 cells |
| Typical Gates | 8,000 |
| Logic Array Blocks (LABs) | 84 |
| User I/Os | 152 |
| Process Technology | 0.42 µm CMOS |
| 電源電圧 | 4.75 V to 5.25 V (5 V nominal) |
| Operating Frequency | 125 MHz |
| Speed Grade | -4 |
| パッケージ | 225-ball BGA (BC225), 19 x 19 mm |
| Package Type | Surface-mount BGA, ball grid array |
| 動作温度 | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM (volatile, reconfigure at power-up) |
| LUT Architecture | 4-input look-up table with programmable register |
| RoHS ステータス | unknown |
| Lead-Free | unknown |
EPF8820ABC225-4 surface-mount bga, ball grid array ピン配置ガイド
EPF8820ABC225-4 (surface-mount bga, ball grid array パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF8820ABC225-4.
詳細は データシート をご参照ください。
主な用途
EPF8820ABC225-4 の用途: 6 件s: Industrial Control & Glue Logic, Telecom Backplane Interface, DSP Pre/Post-Processing, Legacy Bus Bridging & Protocol Conversion, Test & Measurement Instrumentation, Wide-Datapath Manipulation.
Industrial Control & Glue Logic
The EPF8820ABC225-4 fits industrial control applications because its 152 user I/Os and 672 logic cells provide the glue-logic density needed to bridge legacy 5 V parallel buses (ISA, PC/104, VME) to modern processors. Its 125 MHz -4 speed grade handles real-time encoder decoding and PWM generation at typical 10-50 kHz loop rates with abundant timing margin. Placed on the backplane between a CPU module and opto-isolated I/O, it replaces dozens of 74-series TTL parts, reducing board area and BOM count. The 5 V tolerance matches the bus voltage of legacy industrial PLCs and motor-drive controllers without level-shifters, simplifying integration.
おすすめ
Telecom Backplane Interface
Telecom backplanes benefit from the EPF8820ABC225-4's 152 I/Os because the high pin count accommodates 8-16 parallel data buses plus framing, clock, and overhead signals on a single device. The 5 V supply rails match the legacy -48 V telecom bus-derived 5 V rails used in central-office equipment, and the 125 MHz toggle rate is more than sufficient for E1/T1 framing (2.048 MHz / 1.544 MHz) with generous margin. With 84 LABs, the device implements HDLC controllers, framer/deframer state machines, and alarm-monitoring logic on one chip, replacing an entire line-card ASIC's worth of discrete logic.
おすすめ
DSP Pre/Post-Processing
The EPF8820ABC225-4 is well-suited to DSP pre- and post-processing because its 4-input LUTs plus dedicated carry chains implement fast 8-16 bit adders and multipliers, while 84 LABs can hold the coefficient buffers and FIR filter datapaths needed around a DSP chip. The 125 MHz -4 speed grade supports sample rates up to ~30 MSPS at 8 bits, ideal for audio-bandwidth or baseband signal conditioning. Placed between an ADC/DAC and a dedicated DSP (e.g., TMS320 family), the FPGA handles gain, mixing, and decimation in the 5 V analog domain's digital companion, eliminating an extra ASIC.
おすすめ
Legacy Bus Bridging & Protocol Conversion
Protocol conversion between legacy buses (VME, Multibus, ISA) and modern serial interfaces (UART, SPI, I2C) is a strong fit for the EPF8820ABC225-4 because the 152 I/Os can sink the wide parallel bus, while 672 logic cells implement stateful protocol engines. The 5 V I/O tolerance directly matches VME's 5 V signalling without external buffers. The 125 MHz operation leaves timing margin even for complex multi-state protocol stacks like MIL-STD-1553 or ARINC 429. Typical use: replace aging CPU boards with a modern MCU + FLEX 8000 pair, keeping the legacy backplane intact.
おすすめ
Test & Measurement Instrumentation
The EPF8820ABC225-4 is used in test and measurement equipment because its 152 I/Os handle the wide stimulus/response buses of bench-top instruments (logic analyzers, pattern generators, ATE). The 125 MHz -4 speed grade allows synthesis of arbitrary waveforms at up to 100 MSPS through on-chip phase accumulators, and 672 logic cells accommodate pattern-sequencer state machines. The 5 V tolerance integrates directly with legacy test fixtures built around TTL/CMOS. Quoted from the Altera FLEX 8000 datasheet, the high I/O count also enables direct interfacing to 32-channel logic-analyzer probes.
おすすめ
Wide-Datapath Manipulation
Wide-datapath manipulation (32/64-bit shift registers, FIFOs, barrel shifters) is one of the EPF8820ABC225-4's core strengths because 672 logic cells in 84 LABs can implement 16-32 bit datapaths with single-cycle latency. The 125 MHz -4 speed grade sustains multi-megabyte-per-second data throughput, sufficient for image preprocessing, CRC engines, and packet-header manipulation. The 225-BGA package's short trace lengths support the wide buses needed for parallel data movement without signal-integrity issues. Per the FLEX 8000 datasheet, dedicated carry chains deliver arithmetic throughput for counters and accumulators at no extra LUT cost.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF8820ABC225-4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF8820ABC225-3 | EPF8636AQC208-4N | EPF8636AQC208-4 | EPF8636AQC208-3 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 225-ball BGA (BC225) | 225-ball BGA - same | 225-ball BGA - same | 225-ball BGA - same | 225-ball BGA - same |
| Typical Gates | 8,000 | 8,000 | 3,600 (-55 %) | 3,600 (-55 %) | 3,600 (-55 %) |
| Logic Cells | 672 | 672 | 336 (-50 %) | 336 (-50 %) | 336 (-50 %) |
| Speed Grade | -4 (125 MHz) | -3 (slower) | -4 | -4 | -3 (slower) |
| User I/Os | 152 | 152 | 136 (-11 %) | 136 (-11 %) | 136 (-11 %) |
| Supply Voltage | 5 V (4.75 V to 5.25 V) | 5 V - same | 5 V - same | 5 V - same | 5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Qty-1 Price (USD) | 32.50 | ~28.00 (-14 %) | ~22.00 (-32 %) | ~21.50 (-34 %) | ~19.00 (-42 %) |
主な差別化要因
- Highest density in the FLEX 8000 225-BGA family （vs EPF8636AQC208-4N)
- Faster -4 speed grade vs -3 siblings （vs EPF8820ABC225-3)
- Same-package migration path within the FLEX 8000 family （vs EPF8636 family)
設計ノート
The EPF8820ABC225-4 requires a tightly regulated 5 V supply between 4.75 V and 5.25 V; use a low-dropout regulator with at least 200 mA headroom for the core plus I/O switching transients. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC pin (typically 8-12 power pins on the 225-BGA), and add bulk 10-47 µF tantalum or polymer capacitors near the package to absorb simultaneous-switching noise (SSN) on the 152 I/O banks.
The 225-ball BGA uses a 1.27 mm pitch and 19 x 19 mm body; route escape traces on internal layers using micro-via-in-pad (8-mil pad, 4-mil via) and 4/4 mil trace/spacing to fan out the inner balls. Matched-length traces within ±50 mil are required only for source-synchronous buses (e.g., external memory); static control signals tolerate standard 8-mil routing. Expose the BGA's thermal pad to an inner ground plane with a 4 x 4 thermal via array under the die to keep junction temperature below 100 °C at full toggle.
Because FLEX 8000 configuration SRAM is volatile, the bitstream must be reloaded at every power-up from an external EPC1, EPC2, or EPC16 configuration EPROM via the serial passive-serial (PS) or passive-parallel asynchronous (PPA) modes. A common pitfall is omitting the nCONFIG pull-up or leaving nSTATUS floating, which prevents reliable configuration. Verify the configuration clock (DCLK) is 10 MHz or below for EPC compatibility. For in-system reprogramming without powering down, use JTAG (IEEE 1149.1) boundary-scan via the TCK/TMS/TDI/TDO pins.
When driving long external buses (>50 mm) from the EPF8820ABC225-4's 5 V I/O, add 22-33 Ω series source termination at the FPGA output to dampen reflections. The 152 user I/Os are arranged in 4-8 I/O banks; assign fast-switching buses (clock, strobe) to the bank nearest the package edge and slower control signals to interior banks to minimize SSN coupling. Keep differential pairs (if used) matched within ±25 mil over the entire length.
コンプライアンス情報
Compliance data not present in verified distributor listings. The EPF8820ABC225-4 predates widespread RoHS adoption; original parts likely contain lead-bearing solder balls. Industrial/aerospace-grade RoHS conversion may be available through authorized brokers such as Rochester Electronics - request CoC at order time.
