EPF8820ABC225-4 - FLEX 8000 FPGA 8K Gates 5V 225-BGA | Intel
N.º de pieza: EPF8820ABC225-4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.4 | $284,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $17.85 | $8.925,00 |
| 1.000 | $14.2 | $14.200,00 |
EPF8820ABC225-4 Descripción general
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic functionality is defined after manufacturing by loading a configuration bitstream into on-chip SRAM. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and SPLDs, and are used wherever high gate counts, parallel data-path manipulation, or fast time-to-market outweigh the unit-cost advantage of an ASIC. The FLEX 8000 family was one of the first Altera device families to introduce logic elements (LEs) that combine a 4-input look-up table with a programmable register, supported by a continuous routing fabric.
The EPF8820ABC225-4 organizes 672 logic cells across 84 Logic Array Blocks (LABs) and exposes 152 user I/O pins. Its 4-input LUT architecture plus dedicated carry chains allows efficient implementation of arithmetic functions, datapath registers, and state machines. Typical applications include glue logic replacement, bus interfacing, DSP pre/post-processing, and wide datapath manipulation in industrial control and telecom infrastructure.
Architecturally, the device uses SRAM configuration cells, meaning it must be reconfigured at every power-up (typically from a serial EPROM or microcontroller). The 225-BGA package at 19 × 19 mm provides ample signal escape and thermal headroom for the commercial-grade silicon. Power consumption scales with toggle rate and clock frequency; in static (un-clocked) conditions the device draws substantially less than at 125 MHz full-toggle.
The -4 speed grade identifies a faster timing bin within the EPF8820 family, supporting internal toggle rates up to 125 MHz. The 'BC225' suffix specifies the 225-ball BGA package, while the trailing '-4' marks the speed grade and commercial operating temperature. A slower -3 speed grade is also available in the same package for cost-sensitive designs where the additional timing margin is acceptable.
Alternativas directas para EPF8820ABC225-4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF8820ABC225-4 (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Process Technology, Configuration Method, Usable Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF8820ABC225-3
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Ver hoja de datos →EPF8820ABC225-4 Valores máximos y características eléctricas
| Family | FLEX 8000 |
| Device Logic Elements | 672 cells |
| Typical Gates | 8,000 |
| Logic Array Blocks (LABs) | 84 |
| User I/Os | 152 |
| Process Technology | 0.42 µm CMOS |
| Tensión de alimentación | 4.75 V to 5.25 V (5 V nominal) |
| Operating Frequency | 125 MHz |
| Speed Grade | -4 |
| Encapsulado | 225-ball BGA (BC225), 19 x 19 mm |
| Package Type | Surface-mount BGA, ball grid array |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM (volatile, reconfigure at power-up) |
| LUT Architecture | 4-input look-up table with programmable register |
| Estado RoHS | unknown |
| Lead-Free | unknown |
Guía de configuración de pines de EPF8820ABC225-4 surface-mount bga, ball grid array
Configuración de pines para EPF8820ABC225-4 (encapsulado surface-mount bga, ball grid array). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF8820ABC225-4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF8820ABC225-4 es adecuado para 6 aplicacións: Industrial Control & Glue Logic, Telecom Backplane Interface, DSP Pre/Post-Processing, Legacy Bus Bridging & Protocol Conversion, Test & Measurement Instrumentation, Wide-Datapath Manipulation.
Industrial Control & Glue Logic
The EPF8820ABC225-4 fits industrial control applications because its 152 user I/Os and 672 logic cells provide the glue-logic density needed to bridge legacy 5 V parallel buses (ISA, PC/104, VME) to modern processors. Its 125 MHz -4 speed grade handles real-time encoder decoding and PWM generation at typical 10-50 kHz loop rates with abundant timing margin. Placed on the backplane between a CPU module and opto-isolated I/O, it replaces dozens of 74-series TTL parts, reducing board area and BOM count. The 5 V tolerance matches the bus voltage of legacy industrial PLCs and motor-drive controllers without level-shifters, simplifying integration.
Recomendado
Telecom Backplane Interface
Telecom backplanes benefit from the EPF8820ABC225-4's 152 I/Os because the high pin count accommodates 8-16 parallel data buses plus framing, clock, and overhead signals on a single device. The 5 V supply rails match the legacy -48 V telecom bus-derived 5 V rails used in central-office equipment, and the 125 MHz toggle rate is more than sufficient for E1/T1 framing (2.048 MHz / 1.544 MHz) with generous margin. With 84 LABs, the device implements HDLC controllers, framer/deframer state machines, and alarm-monitoring logic on one chip, replacing an entire line-card ASIC's worth of discrete logic.
Recomendado
DSP Pre/Post-Processing
The EPF8820ABC225-4 is well-suited to DSP pre- and post-processing because its 4-input LUTs plus dedicated carry chains implement fast 8-16 bit adders and multipliers, while 84 LABs can hold the coefficient buffers and FIR filter datapaths needed around a DSP chip. The 125 MHz -4 speed grade supports sample rates up to ~30 MSPS at 8 bits, ideal for audio-bandwidth or baseband signal conditioning. Placed between an ADC/DAC and a dedicated DSP (e.g., TMS320 family), the FPGA handles gain, mixing, and decimation in the 5 V analog domain's digital companion, eliminating an extra ASIC.
Recomendado
Legacy Bus Bridging & Protocol Conversion
Protocol conversion between legacy buses (VME, Multibus, ISA) and modern serial interfaces (UART, SPI, I2C) is a strong fit for the EPF8820ABC225-4 because the 152 I/Os can sink the wide parallel bus, while 672 logic cells implement stateful protocol engines. The 5 V I/O tolerance directly matches VME's 5 V signalling without external buffers. The 125 MHz operation leaves timing margin even for complex multi-state protocol stacks like MIL-STD-1553 or ARINC 429. Typical use: replace aging CPU boards with a modern MCU + FLEX 8000 pair, keeping the legacy backplane intact.
Recomendado
Test & Measurement Instrumentation
The EPF8820ABC225-4 is used in test and measurement equipment because its 152 I/Os handle the wide stimulus/response buses of bench-top instruments (logic analyzers, pattern generators, ATE). The 125 MHz -4 speed grade allows synthesis of arbitrary waveforms at up to 100 MSPS through on-chip phase accumulators, and 672 logic cells accommodate pattern-sequencer state machines. The 5 V tolerance integrates directly with legacy test fixtures built around TTL/CMOS. Quoted from the Altera FLEX 8000 datasheet, the high I/O count also enables direct interfacing to 32-channel logic-analyzer probes.
Recomendado
Wide-Datapath Manipulation
Wide-datapath manipulation (32/64-bit shift registers, FIFOs, barrel shifters) is one of the EPF8820ABC225-4's core strengths because 672 logic cells in 84 LABs can implement 16-32 bit datapaths with single-cycle latency. The 125 MHz -4 speed grade sustains multi-megabyte-per-second data throughput, sufficient for image preprocessing, CRC engines, and packet-header manipulation. The 225-BGA package's short trace lengths support the wide buses needed for parallel data movement without signal-integrity issues. Per the FLEX 8000 datasheet, dedicated carry chains deliver arithmetic throughput for counters and accumulators at no extra LUT cost.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF8820ABC225-4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF8820ABC225-3 | EPF8636AQC208-4N | EPF8636AQC208-4 | EPF8636AQC208-3 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 225-ball BGA (BC225) | 225-ball BGA - same | 225-ball BGA - same | 225-ball BGA - same | 225-ball BGA - same |
| Typical Gates | 8,000 | 8,000 | 3,600 (-55 %) | 3,600 (-55 %) | 3,600 (-55 %) |
| Logic Cells | 672 | 672 | 336 (-50 %) | 336 (-50 %) | 336 (-50 %) |
| Speed Grade | -4 (125 MHz) | -3 (slower) | -4 | -4 | -3 (slower) |
| User I/Os | 152 | 152 | 136 (-11 %) | 136 (-11 %) | 136 (-11 %) |
| Supply Voltage | 5 V (4.75 V to 5.25 V) | 5 V - same | 5 V - same | 5 V - same | 5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Qty-1 Price (USD) | 32.50 | ~28.00 (-14 %) | ~22.00 (-32 %) | ~21.50 (-34 %) | ~19.00 (-42 %) |
Diferenciadores clave
- Highest density in the FLEX 8000 225-BGA family (frente a EPF8636AQC208-4N)
- Faster -4 speed grade vs -3 siblings (frente a EPF8820ABC225-3)
- Same-package migration path within the FLEX 8000 family (frente a EPF8636 family)
Notas de diseño
The EPF8820ABC225-4 requires a tightly regulated 5 V supply between 4.75 V and 5.25 V; use a low-dropout regulator with at least 200 mA headroom for the core plus I/O switching transients. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC pin (typically 8-12 power pins on the 225-BGA), and add bulk 10-47 µF tantalum or polymer capacitors near the package to absorb simultaneous-switching noise (SSN) on the 152 I/O banks.
The 225-ball BGA uses a 1.27 mm pitch and 19 x 19 mm body; route escape traces on internal layers using micro-via-in-pad (8-mil pad, 4-mil via) and 4/4 mil trace/spacing to fan out the inner balls. Matched-length traces within ±50 mil are required only for source-synchronous buses (e.g., external memory); static control signals tolerate standard 8-mil routing. Expose the BGA's thermal pad to an inner ground plane with a 4 x 4 thermal via array under the die to keep junction temperature below 100 °C at full toggle.
Because FLEX 8000 configuration SRAM is volatile, the bitstream must be reloaded at every power-up from an external EPC1, EPC2, or EPC16 configuration EPROM via the serial passive-serial (PS) or passive-parallel asynchronous (PPA) modes. A common pitfall is omitting the nCONFIG pull-up or leaving nSTATUS floating, which prevents reliable configuration. Verify the configuration clock (DCLK) is 10 MHz or below for EPC compatibility. For in-system reprogramming without powering down, use JTAG (IEEE 1149.1) boundary-scan via the TCK/TMS/TDI/TDO pins.
When driving long external buses (>50 mm) from the EPF8820ABC225-4's 5 V I/O, add 22-33 Ω series source termination at the FPGA output to dampen reflections. The 152 user I/Os are arranged in 4-8 I/O banks; assign fast-switching buses (clock, strobe) to the bank nearest the package edge and slower control signals to interior banks to minimize SSN coupling. Keep differential pairs (if used) matched within ±25 mil over the entire length.
Información de cumplimiento
Compliance data not present in verified distributor listings. The EPF8820ABC225-4 predates widespread RoHS adoption; original parts likely contain lead-bearing solder balls. Industrial/aerospace-grade RoHS conversion may be available through authorized brokers such as Rochester Electronics - request CoC at order time.
