EPF8820ABC225-3 - FLEX 8000 FPGA 672 LEs 8K Gates BGA-225 | Altera
MPN: EPF8820ABC225-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38 | $380.00 |
| 100 | $30 | $3,000.00 |
| 500 | $24 | $12,000.00 |
| 1,000 | $20 | $20,000.00 |
Drop-in alternatives for EPF8820ABC225-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPF8820ABC225-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements | 672 |
| Usable Gates | 8,000 (up to 16,000 maximum) |
| Registers | 1,500 |
| Maximum Internal Frequency | 125 MHz |
| Maximum Clock Frequency | 385 MHz (per Microchip USA listing) |
| Process Technology | 0.42 micron CMOS |
| Supply Voltage | 5 V (core); 3.3 V or 5 V I/O |
| Speed Grade | -3 |
| Package | 225-Ball BGA |
| Mounting Type | Surface Mount |
| Configuration Method | In-Circuit Reconfigurability (ICR) via external devices or intelligent controllers |
| Boundary Scan | JTAG IEEE 1149.1 compliant |
EPF8820ABC225-3 225-ball bga Pin Configuration Guide
Complete pinout information for EPF8820ABC225-3 (225-ball bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ABC225-3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ABC225-3 is suitable for 6 applications: Legacy Telecommunications Line Cards, Industrial Control and Glue Logic, ASIC Prototyping and Emulation, Data Acquisition Backplanes, FIFO Controllers and Memory Bridges, Protocol Converter and Bus Bridge.
Legacy Telecommunications Line Cards
The EPF8820ABC225-3 fits legacy telecom line card designs where the high register count (1,500 flip-flops) and 672 logic elements handle wide datapath operations like TDM bus multiplexing and framing. With 125 MHz internal frequency and 5V tolerant I/O, it bridges 5V TTL peripherals to lower-voltage backplanes. The 225-BGA footprint supports the high pin count required for parallel bus interfaces and protocol glue logic in central-office equipment. Power consumption at 5V is approximately 1-2W typical, acceptable for telecom chassis with forced-air cooling.
Recommended
Industrial Control and Glue Logic
The EPF8820ABC225-3 excels as glue logic in industrial control systems where it interfaces disparate bus standards (ISA, VME, PC/104) and implements custom state machines for motor control loops. Its in-circuit reconfigurability enables field firmware updates via JTAG without board removal, critical for installed industrial equipment. The 5V core supply is compatible with legacy industrial sensors and actuators, eliminating level-shifters. With 8K usable gates, a single EPF8820ABC225-3 can replace dozens of 74-series TTL chips, simplifying BOM and PCB layout.
Recommended
ASIC Prototyping and Emulation
The EPF8820ABC225-3 was widely used as an ASIC prototype and emulator in the late 1990s, where designers mapped gate-level netlists onto the 672 logic elements before committing to silicon. With 8K usable gates and 1,500 registers, it can emulate medium-complexity ASICs including peripheral controllers, custom microsequencers, and DSP datapaths. The in-circuit reconfigurability enables rapid design iteration cycles. Engineers targeting FLEX 8000 for prototyping today should consider Cyclone IV or Cyclone 10 LP for new emulations due to better tool support and 100x higher logic density per dollar.
Recommended
Data Acquisition Backplanes
The EPF8820ABC225-3 serves as a timing controller and bus arbiter in legacy data acquisition backplanes where it generates sample clocks, controls multiplexer switching, and buffers high-speed ADC/DAC data. Its 125 MHz internal frequency and configurable 3.3V/5V I/O support direct interface to parallel ADC/DAC converters without external glue logic. The 225-BGA package provides ample I/O for 16-32 channel simultaneous sampling systems. Combined with on-chip JTAG, the device enables production test via boundary scan for backplane testability.
Recommended
FIFO Controllers and Memory Bridges
The EPF8820ABC225-3 implements high-performance FIFO controllers and memory bridge logic between disparate bus widths and clock domains. The 1,500 registers provide ample storage for deep FIFO implementations (typically 256-1024 words deep), while 672 logic elements handle pointer arithmetic and flag generation. With dual-port RAM inference capability, the device can implement true dual-clock FIFOs without external SRAM. The 5V tolerant I/O directly interfaces SRAM and DRAM memories common in 1990s-era designs.
Recommended
Protocol Converter and Bus Bridge
The EPF8820ABC225-3 was the de-facto choice for protocol converter and bus bridge designs in the 1990s, where it implemented bridges between PCI, VME, ISA, and proprietary backplanes. With 8K usable gates and 5V I/O tolerance, the device handles bus arbitration, address decoding, and data path switching in a single chip. Engineers designing modern protocol bridges should target Cyclone IV or Cyclone 10 LP with their integrated transceivers and hard IP for PCI Express, but the EPF8820ABC225-3 remains relevant for legacy bus bridging in industrial and military systems.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ABC225-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820AQC208-3 | EPF8820AQC160-3 | EPF8636AQC208-3 | EPF8636ARC208-3 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | BGA-225 | PQFP-208 | PQFP-160 | PQFP-208 | PQFP-208 | PQFP-160 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Logic Elements | 672 | 672 | 672 | 144 | 144 | 336 |
| Usable Gates | 8,000 | 8,000 | 8,000 | 2,000 | 2,000 | 4,000 |
| Speed Grade | -3 | -3 | -3 | -3 | -3 | -3 |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher logic density than lower-tier FLEX 8000 variants (vs EPF8636AQC208-3)
- BGA-225 package offers highest I/O count in FLEX 8000 family (vs EPF8820AQC208-3)
- More than twice the registers of mid-density FLEX 8000 (vs EPF8452AQC160-3)
Design Notes
Estimated: The EPF8820ABC225-3 at 5V core and typical 50% toggle rate dissipates approximately 1.5W. The 225-BGA package theta_JA is approximately 15 C/W with a standard 4-layer JEDEC test board, giving a junction-to-ambient rise of 22C. Forced-air cooling (200 LFM) reduces theta_JA to ~8 C/W. For enclosed industrial chassis without airflow, derate by 30% and ensure ambient stays below 70C. The thermal pad of the 225-BGA must be soldered to the PCB thermal land for proper heat spreading.
Decouple every VCC pin with a 0.1uF ceramic capacitor placed within 3mm of the ball, plus a single 10uF tantalum bulk capacitor near the package. The 225-BGA requires a 1.27mm pitch land pattern with non-solder-mask-defined (NSMD) pads for reliable assembly per IPC-7351. For JTAG programming, route TMS, TDI, TDO, TCK as a 4-wire chain with 10K pull-ups on TMS and TDI to VCC. Add a 4.7K series resistor on TCK near the FPGA to dampen reflections.
Critical: The EPF8820ABC225-3 uses 5V core supply - connecting 3.3V peripherals directly to its I/O without level shifters is fine (input is 5V tolerant), but DO NOT apply 5V output to a 3.3V-only device. Configuration memory is volatile SRAM - the device must be configured on every power-up via the EPC configuration ROM or JTAG. For in-circuit reconfigurability, connect MSEL pins correctly for the chosen configuration mode (AS, AP, PS, JTAG). Leave nCONFIG, nSTATUS, and CONF_DONE unbypassed.
Route all clock signals on inner layers with continuous ground reference and length-match within 100 mils across the bus. Use 50 ohm characteristic impedance for high-speed clocks exceeding 50 MHz. The 225-BGA fanout should escape on at least 4 routing layers to break out the inner balls - signal layers should alternate with ground planes to maintain controlled impedance. Place the EPC configuration EPROM within 50mm of the FPGA for reliable PS configuration mode.
Compliance Information
EPF8820ABC225-3 is a legacy mid-1990s Altera FLEX 8000 part. RoHS/REACH compliance status not stated in Verified Web Data; pre-RoHS-era parts typically use SnPb solder. AEC-Q100 not applicable (FPGA logic device, not automotive-qualified). Customers requiring RoHS compliance should request RoHS-convertible variants from secondary distributors.
