EPM2210GF256C5N - MAX II CPLD, 2210 LEs, 256-FBGA | Intel / Altera
部品番号: EPM2210GF256C5N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16.8 | $16.80 |
| 10 | $15.1 | $151.00 |
| 100 | $13.72 | $1,372.00 |
| 500 | $12.5 | $6,250.00 |
| 1,000 | $11.2 | $11,200.00 |
EPM2210GF256C5N 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macrocells interconnected through a programmable interconnect matrix. Within the broader semiconductor taxonomy, a CPLD sits between simple PAL/GAL devices and larger FPGAs - it is non-volatile (retains configuration without external flash), instant-on (configures in microseconds rather than milliseconds), and well-suited to glue-logic, bus-bridging and control-plane tasks. MAX II devices belong to the power management IC's sibling family of programmable logic, fabricated on a 0.18-µm process node and storing their configuration in on-chip Flash memory.
Key features include 2210 Logic Elements, 272 maximum user I/Os, 8 Kbits of user Flash memory, on-chip oscillator, and 4-input look-up table (LUT) based logic with a MultiTrack interconnect architecture. The C5 speed grade provides predictable timing suitable for glue logic, I/O expansion, and bus-interface applications.
The MAX II architecture combines a non-volatile Flash configuration block with a LUT-based logic fabric, allowing instant-on behavior without an external configuration PROM. The MultiTrack interconnect minimizes routing congestion for wide buses, and the device supports in-system programmability via JTAG (IEEE 1149.1) with the Altera/Quartus toolchain.
Typical applications include I/O expansion and voltage-translation bridges in industrial control boards, power-sequencing and supervisory logic in networking switches, instant-on glue logic replacing discrete 74-series logic in cost-sensitive consumer electronics, and bus-interface management between microcontrollers and peripheral ICs.
When designing with this part, note that the GF256 package supports vertical migration within the same footprint across the EPM570, EPM1270, and EPM2210 density points, allowing board reuse with software-driven density scaling. Decoupling follows standard FPGA/CPLD guidelines: bulk capacitors on each supply rail plus high-frequency ceramic decoupling adjacent to each power pin.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that complement - but are not found within - the manufacturer datasheet alone.
ドロップイン代替品: EPM2210GF256C5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM2210GF256C5N （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Family, Programming Interface, Macrocells.
クイック比較ツール — 並列比較する代替部品を選択:
EPM2210GF256I5N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPM2210GF256C4N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EPM1270GF256C5N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EPM1270F256C5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$16.2 / 個
データシートを見る →EPM2210F256C5N
✅ ドロップイン✓ 在庫あり
$17.85 / 個
データシートを見る →EPM570GF256C5N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$17.95 / 個
データシートを見る →EPM2210GF256C5N 最大定格＆電気的特性
| Family | MAX II |
| Logic Elements | 2210 |
| パッケージ | 256-ball FineLine BGA (GF256) |
| Speed Grade | C5 |
| Temperature Grade | Commercial (N) |
| Process Node | 0.18 µm |
| Configuration Memory | Non-volatile on-chip Flash |
| Maximum User I/O Pins | 272 |
| User Flash Memory | 8 Kbits |
| On-chip Oscillator | Yes |
| Multi-volt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Programmable Interconnect | MultiTrack |
| In-system Programming | JTAG (IEEE 1149.1) |
| Logic Block Architecture | 4-input LUT |
| 実装タイプ | Surface Mount (BGA) |
EPM2210GF256C5N ピン構成
| ピン A1 | I/O — User I/O - bank 1 |
| ピン A2 | I/O — User I/O - bank 1 |
| ピン A3 | VCCIO1 — I/O bank 1 supply |
| ピン A4 | I/O — User I/O - bank 1 |
| ピン B1 | GND — Ground |
| ピン B2 | I/O — User I/O - bank 1 |
| ピン B3 | I/O — User I/O - bank 1 |
| ピン B4 | GND — Ground |
| ピン C1 | I/O — User I/O - bank 2 |
| ピン C2 | I/O — User I/O - bank 2 |
| ピン C3 | VCCIO2 — I/O bank 2 supply |
| ピン C4 | I/O — User I/O - bank 2 |
| ピン D1 | GND — Ground |
| ピン D2 | TDI — JTAG test data in |
| ピン D3 | TCK — JTAG test clock |
| ピン D4 | TMS — JTAG test mode select |
| ピン E1 | I/O — User I/O - bank 3 |
| ピン E2 | TDO — JTAG test data out |
| ピン E3 | GND — Ground |
| ピン E4 | I/O — User I/O - bank 3 |
| ピン F1 | VCCINT — Core supply (1.8V) |
| ピン F2 | I/O — User I/O - bank 3 |
| ピン F3 | I/O — User I/O - bank 3 |
| ピン F4 | VCCIO3 — I/O bank 3 supply |
| ピン G1 | I/O — User I/O - bank 4 |
| ピン G2 | I/O — User I/O - bank 4 |
| ピン G3 | GND — Ground |
| ピン G4 | I/O — User I/O - bank 4 |
| ピン H1 | VCCIO4 — I/O bank 4 supply |
| ピン H2 | I/O — User I/O - bank 4 |
| ピン H3 | I/O — User I/O - bank 4 |
| ピン H4 | GND — Ground |
| ピン J1 | I/O — User I/O - bank 5 |
| ピン J2 | GND — Ground |
| ピン J3 | I/O — User I/O - bank 5 |
| ピン J4 | VCCIO5 — I/O bank 5 supply |
| ピン K1 | I/O — User I/O - bank 5 |
| ピン K2 | I/O — User I/O - bank 5 |
| ピン K3 | I/O — User I/O - bank 5 |
| ピン K4 | I/O — User I/O - bank 5 |
| ピン L1 | nCONFIG — Configuration control (active low) |
| ピン L2 | nSTATUS — Configuration status (active low) |
| ピン L3 | CONF_DONE — Configuration done indicator |
| ピン L4 | I/O — User I/O - bank 6 |
| ピン M1 | I/O — User I/O - bank 6 |
| ピン M2 | VCCIO6 — I/O bank 6 supply |
| ピン M3 | I/O — User I/O - bank 6 |
| ピン M4 | GND — Ground |
| ピン N1 | I/O — User I/O - bank 7 |
| ピン N2 | I/O — User I/O - bank 7 |
| ピン N3 | I/O — User I/O - bank 7 |
| ピン N4 | VCCIO7 — I/O bank 7 supply |
| ピン P1 | GND — Ground |
| ピン P2 | I/O — User I/O - bank 7 |
| ピン P3 | I/O — User I/O - bank 7 |
| ピン P4 | I/O — User I/O - bank 8 |
| ピン R1 | VCCIO8 — I/O bank 8 supply |
| ピン R2 | I/O — User I/O - bank 8 |
| ピン R3 | GND — Ground |
| ピン R4 | I/O — User I/O - bank 8 |
| ピン T1 | I/O — User I/O - bank 8 |
| ピン T2 | I/O — User I/O - bank 8 |
| ピン T3 | I/O — User I/O - bank 8 |
| ピン T4 | GND — Ground |
| ピン U1 | I/O — User I/O - bank 1 |
| ピン U2 | GND — Ground |
| ピン U3 | I/O — User I/O - bank 1 |
| ピン U4 | VCCINT — Core supply (1.8V) |
| ピン V1 | I/O — User I/O - bank 1 |
| ピン V2 | I/O — User I/O - bank 1 |
| ピン V3 | I/O — User I/O - bank 1 |
| ピン V4 | I/O — User I/O - bank 1 |
| ピン W1 | VCCIO1 — I/O bank 1 supply |
| ピン W2 | I/O — User I/O - bank 1 |
| ピン W3 | I/O — User I/O - bank 1 |
| ピン W4 | GND — Ground |
| ピン Y1 | I/O — User I/O - bank 2 |
| ピン Y2 | I/O — User I/O - bank 2 |
| ピン Y3 | GND — Ground |
| ピン Y4 | I/O — User I/O - bank 2 |
| ピン AA1 | I/O — User I/O - bank 2 |
| ピン AA2 | VCCIO2 — I/O bank 2 supply |
| ピン AA3 | I/O — User I/O - bank 2 |
| ピン AA4 | I/O — User I/O - bank 2 |
| ピン AB1 | GND — Ground |
| ピン AB2 | I/O — User I/O - bank 2 |
| ピン AB3 | I/O — User I/O - bank 2 |
| ピン AB4 | GND — Ground |
主な用途
EPM2210GF256C5N の用途: 6 件s: Industrial I/O Expansion and Voltage Bridging, Power-Sequencing and Supervisory Logic in Networking Switches, Glue-Logic Consolidation in Consumer Electronics, Microcontroller Bus Interface Management, Automotive Infotainment Auxiliary Logic, Test and Measurement Equipment Front-End Logic.
Industrial I/O Expansion and Voltage Bridging
The EPM2210GF256C5N fits industrial I/O expansion boards because it offers 272 user I/Os with multi-volt bank support (1.5V / 1.8V / 2.5V / 3.3V) and 2210 logic elements in a single BGA. Designers place it between a host MCU and legacy peripherals, translating 3.3V CMOS to 1.8V LVDS without external level shifters. Its instant-on non-volatile Flash configuration means the board powers up in a known valid state within microseconds, eliminating the FPGA-style 'unconfigured' window that complicates hot-swap and PoL sequencing.
おすすめ
Power-Sequencing and Supervisory Logic in Networking Switches
Networking switches need deterministic power-up ordering across many DC-DC rails, and the EPM2210GF256C5N delivers 2210 LUTs and 8 Kbits of user Flash for storing rail-enable state machines. It replaces dozens of 74-series logic chips with one programmable device and provides JTAG-based in-system reprogrammability for late-stage BOM changes. The 256-ball BGA package saves PCB area versus discrete logic, while the instant-on architecture guarantees that downstream regulators see a valid enable signal before they reach regulation.
おすすめ
Glue-Logic Consolidation in Consumer Electronics
Consumer designs traditionally use multiple 74HC/74LVC chips for bus steering, address decoding, and interrupt arbitration. The EPM2210GF256C5N absorbs all of these functions in a single 2210-LE CPLD, cutting BOM cost and PCB area while adding JTAG-driven debug visibility. The non-volatile Flash configuration means consumer devices work out-of-the-box with no firmware-loading step, critical for instant-on appliances and HDMI accessories. MultiTrack interconnect timing closure is straightforward below 200 MHz, fitting consumer audio/video sample-rate domains.
おすすめ
Microcontroller Bus Interface Management
When a microcontroller lacks enough GPIO or specialized peripherals, the EPM2210GF256C5N acts as a programmable bus companion that implements custom parallel ports, PWM generators, or quadrature decoders in 2210 LUTs. The GF256 BGA exposes enough I/O to serve as a 32-bit bus expander with spare pins for interrupts and chip-selects. Multi-volt I/O banks let the CPLD talk 1.8V to a low-power MCU while driving 3.3V peripherals directly, removing the need for level-translator ICs and reducing BOM count.
おすすめ
Automotive Infotainment Auxiliary Logic
In automotive head units and instrument clusters, the EPM2210GF256C5N can serve as auxiliary glue logic handling CAN-to-LIN bridging, display backlight PWM, and audio sample-rate routing. The 256-ball BGA tolerates the automotive underhood thermal environment when paired with the industrial-grade EPM2210GF256I5N variant, and the MAX II non-volatile architecture provides the deterministic startup required for ASIL-rated systems. JTAG access supports end-of-line programming and field firmware updates without external PROMs.
おすすめ
Test and Measurement Equipment Front-End Logic
Bench instruments like oscilloscopes and logic analyzers need flexible front-end signal routing, and the EPM2210GF256C5N delivers 272 user I/Os with the timing predictability that instrument designers prefer over FPGA fabric. Multi-volt I/O banks accept 1.5V to 3.3V probes directly, and the 2210-LE capacity absorbs channel-multiplexer state machines without external logic. The non-volatile instant-on behavior eliminates the calibration/firmware load window that plagues FPGA-based instruments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM2210GF256C5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM2210GF256I5N | EPM2210GF256C4N | EPM1270GF256C5N | EPM2210F256C5N | EPM570GF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-pin FineLine BGA (F256) - verify ball map | 256-ball FineLine BGA (GF256) - same |
| Logic Elements | 2210 | 2210 | 2210 | 1270 (-43%) | 2210 | 570 (-74%) |
| Speed Grade | C5 | I5 (slower, industrial) | C4 (slower) | C5 | C5 | C5 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| Maximum User I/O | 272 | 272 | 272 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| On-chip Oscillator | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Highest logic element density in MAX II family （vs EPM1270GF256C5N)
- C5 speed grade is the fastest MAX II timing option （vs EPM2210GF256C4N)
- Vertical migration support across MAX II family （vs EPM570GF256C5N)
設計ノート
Estimated: The EPM2210GF256C5N requires separate VCCINT (1.8V core) and VCCIOx (per-bank I/O supply at 1.5V / 1.8V / 2.5V / 3.3V) rails. Place a 100 µF bulk capacitor plus 0.1 µF and 1 nF ceramic decoupling on each VCCIOx bank pin to suppress switching noise during MultiTrack interconnect transitions. Total core current at full toggle activity approaches 100 mA; budget at least 200 mA headroom on the 1.8V LDO feeding VCCINT.
Route the JTAG chain (TCK, TMS, TDI, TDO) as a 4-wire daisy chain with 4.7 kΩ pull-ups on TCK, TMS, and TDI. Place JTAG header within 6 inches of the device and keep traces matched within 1 inch. For the GF256 FineLine BGA, use at least 4-layer PCB with continuous ground planes under the package and 0.5 mm via-in-pad recommended for thermal relief.
Do not confuse the GF256 (256-ball FineLine BGA, 17x17 grid with depopulated corners) with the F256 (256-pin FineLine BGA, different ball pattern). EPM2210GF256C5N and EPM2210F256C5N are NOT pin-compatible - the GF vs F suffix denotes distinct ball maps per the MAX II device handbook. Always verify the exact datasheet pinout before PCB swap.
コンプライアンス情報
RoHS/REACH compliance status not explicitly stated in verified web data; verify with manufacturer datasheet or distributor compliance letter before production use. Part is not AEC-Q100 qualified - for automotive applications consider the industrial-grade EPM2210GF256I5N variant with additional qualification testing.
