EPM2210GF256C5N - MAX II CPLD, 2210 LEs, 256-FBGA | Intel / Altera
MPN: EPM2210GF256C5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.8 | $16.80 |
| 10 | $15.1 | $151.00 |
| 100 | $13.72 | $1,372.00 |
| 500 | $12.5 | $6,250.00 |
| 1,000 | $11.2 | $11,200.00 |
Drop-in alternatives for EPM2210GF256C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM2210GF256I5N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210GF256C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM1270GF256C5N
β Drop-Inπ Reference alternative (not in catalog)
EPM1270F256C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$16.2 / Unit
View Datasheet βEPM2210F256C5N
β Drop-Inβ In Stock
$17.85 / Unit
View Datasheet βEPM570GF256C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM2210GF256C5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 2210 |
| Package | 256-ball FineLine BGA (GF256) |
| Speed Grade | C5 |
| Temperature Grade | Commercial (N) |
| Process Node | 0.18 Β΅m |
| Configuration Memory | Non-volatile on-chip Flash |
| Maximum User I/O Pins | 272 |
| User Flash Memory | 8 Kbits |
| On-chip Oscillator | Yes |
| Multi-volt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Programmable Interconnect | MultiTrack |
| In-system Programming | JTAG (IEEE 1149.1) |
| Logic Block Architecture | 4-input LUT |
| Mounting Type | Surface Mount (BGA) |
EPM2210GF256C5N Pin Configuration
| Pin A1 | I/O β User I/O - bank 1 |
| Pin A2 | I/O β User I/O - bank 1 |
| Pin A3 | VCCIO1 β I/O bank 1 supply |
| Pin A4 | I/O β User I/O - bank 1 |
| Pin B1 | GND β Ground |
| Pin B2 | I/O β User I/O - bank 1 |
| Pin B3 | I/O β User I/O - bank 1 |
| Pin B4 | GND β Ground |
| Pin C1 | I/O β User I/O - bank 2 |
| Pin C2 | I/O β User I/O - bank 2 |
| Pin C3 | VCCIO2 β I/O bank 2 supply |
| Pin C4 | I/O β User I/O - bank 2 |
| Pin D1 | GND β Ground |
| Pin D2 | TDI β JTAG test data in |
| Pin D3 | TCK β JTAG test clock |
| Pin D4 | TMS β JTAG test mode select |
| Pin E1 | I/O β User I/O - bank 3 |
| Pin E2 | TDO β JTAG test data out |
| Pin E3 | GND β Ground |
| Pin E4 | I/O β User I/O - bank 3 |
| Pin F1 | VCCINT β Core supply (1.8V) |
| Pin F2 | I/O β User I/O - bank 3 |
| Pin F3 | I/O β User I/O - bank 3 |
| Pin F4 | VCCIO3 β I/O bank 3 supply |
| Pin G1 | I/O β User I/O - bank 4 |
| Pin G2 | I/O β User I/O - bank 4 |
| Pin G3 | GND β Ground |
| Pin G4 | I/O β User I/O - bank 4 |
| Pin H1 | VCCIO4 β I/O bank 4 supply |
| Pin H2 | I/O β User I/O - bank 4 |
| Pin H3 | I/O β User I/O - bank 4 |
| Pin H4 | GND β Ground |
| Pin J1 | I/O β User I/O - bank 5 |
| Pin J2 | GND β Ground |
| Pin J3 | I/O β User I/O - bank 5 |
| Pin J4 | VCCIO5 β I/O bank 5 supply |
| Pin K1 | I/O β User I/O - bank 5 |
| Pin K2 | I/O β User I/O - bank 5 |
| Pin K3 | I/O β User I/O - bank 5 |
| Pin K4 | I/O β User I/O - bank 5 |
| Pin L1 | nCONFIG β Configuration control (active low) |
| Pin L2 | nSTATUS β Configuration status (active low) |
| Pin L3 | CONF_DONE β Configuration done indicator |
| Pin L4 | I/O β User I/O - bank 6 |
| Pin M1 | I/O β User I/O - bank 6 |
| Pin M2 | VCCIO6 β I/O bank 6 supply |
| Pin M3 | I/O β User I/O - bank 6 |
| Pin M4 | GND β Ground |
| Pin N1 | I/O β User I/O - bank 7 |
| Pin N2 | I/O β User I/O - bank 7 |
| Pin N3 | I/O β User I/O - bank 7 |
| Pin N4 | VCCIO7 β I/O bank 7 supply |
| Pin P1 | GND β Ground |
| Pin P2 | I/O β User I/O - bank 7 |
| Pin P3 | I/O β User I/O - bank 7 |
| Pin P4 | I/O β User I/O - bank 8 |
| Pin R1 | VCCIO8 β I/O bank 8 supply |
| Pin R2 | I/O β User I/O - bank 8 |
| Pin R3 | GND β Ground |
| Pin R4 | I/O β User I/O - bank 8 |
| Pin T1 | I/O β User I/O - bank 8 |
| Pin T2 | I/O β User I/O - bank 8 |
| Pin T3 | I/O β User I/O - bank 8 |
| Pin T4 | GND β Ground |
| Pin U1 | I/O β User I/O - bank 1 |
| Pin U2 | GND β Ground |
| Pin U3 | I/O β User I/O - bank 1 |
| Pin U4 | VCCINT β Core supply (1.8V) |
| Pin V1 | I/O β User I/O - bank 1 |
| Pin V2 | I/O β User I/O - bank 1 |
| Pin V3 | I/O β User I/O - bank 1 |
| Pin V4 | I/O β User I/O - bank 1 |
| Pin W1 | VCCIO1 β I/O bank 1 supply |
| Pin W2 | I/O β User I/O - bank 1 |
| Pin W3 | I/O β User I/O - bank 1 |
| Pin W4 | GND β Ground |
| Pin Y1 | I/O β User I/O - bank 2 |
| Pin Y2 | I/O β User I/O - bank 2 |
| Pin Y3 | GND β Ground |
| Pin Y4 | I/O β User I/O - bank 2 |
| Pin AA1 | I/O β User I/O - bank 2 |
| Pin AA2 | VCCIO2 β I/O bank 2 supply |
| Pin AA3 | I/O β User I/O - bank 2 |
| Pin AA4 | I/O β User I/O - bank 2 |
| Pin AB1 | GND β Ground |
| Pin AB2 | I/O β User I/O - bank 2 |
| Pin AB3 | I/O β User I/O - bank 2 |
| Pin AB4 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210GF256C5N is suitable for 6 applications: Industrial I/O Expansion and Voltage Bridging, Power-Sequencing and Supervisory Logic in Networking Switches, Glue-Logic Consolidation in Consumer Electronics, Microcontroller Bus Interface Management, Automotive Infotainment Auxiliary Logic, Test and Measurement Equipment Front-End Logic.
Industrial I/O Expansion and Voltage Bridging
The EPM2210GF256C5N fits industrial I/O expansion boards because it offers 272 user I/Os with multi-volt bank support (1.5V / 1.8V / 2.5V / 3.3V) and 2210 logic elements in a single BGA. Designers place it between a host MCU and legacy peripherals, translating 3.3V CMOS to 1.8V LVDS without external level shifters. Its instant-on non-volatile Flash configuration means the board powers up in a known valid state within microseconds, eliminating the FPGA-style 'unconfigured' window that complicates hot-swap and PoL sequencing.
Recommended
Power-Sequencing and Supervisory Logic in Networking Switches
Networking switches need deterministic power-up ordering across many DC-DC rails, and the EPM2210GF256C5N delivers 2210 LUTs and 8 Kbits of user Flash for storing rail-enable state machines. It replaces dozens of 74-series logic chips with one programmable device and provides JTAG-based in-system reprogrammability for late-stage BOM changes. The 256-ball BGA package saves PCB area versus discrete logic, while the instant-on architecture guarantees that downstream regulators see a valid enable signal before they reach regulation.
Recommended
Glue-Logic Consolidation in Consumer Electronics
Consumer designs traditionally use multiple 74HC/74LVC chips for bus steering, address decoding, and interrupt arbitration. The EPM2210GF256C5N absorbs all of these functions in a single 2210-LE CPLD, cutting BOM cost and PCB area while adding JTAG-driven debug visibility. The non-volatile Flash configuration means consumer devices work out-of-the-box with no firmware-loading step, critical for instant-on appliances and HDMI accessories. MultiTrack interconnect timing closure is straightforward below 200 MHz, fitting consumer audio/video sample-rate domains.
Recommended
Microcontroller Bus Interface Management
When a microcontroller lacks enough GPIO or specialized peripherals, the EPM2210GF256C5N acts as a programmable bus companion that implements custom parallel ports, PWM generators, or quadrature decoders in 2210 LUTs. The GF256 BGA exposes enough I/O to serve as a 32-bit bus expander with spare pins for interrupts and chip-selects. Multi-volt I/O banks let the CPLD talk 1.8V to a low-power MCU while driving 3.3V peripherals directly, removing the need for level-translator ICs and reducing BOM count.
Recommended
Automotive Infotainment Auxiliary Logic
In automotive head units and instrument clusters, the EPM2210GF256C5N can serve as auxiliary glue logic handling CAN-to-LIN bridging, display backlight PWM, and audio sample-rate routing. The 256-ball BGA tolerates the automotive underhood thermal environment when paired with the industrial-grade EPM2210GF256I5N variant, and the MAX II non-volatile architecture provides the deterministic startup required for ASIL-rated systems. JTAG access supports end-of-line programming and field firmware updates without external PROMs.
Recommended
Test and Measurement Equipment Front-End Logic
Bench instruments like oscilloscopes and logic analyzers need flexible front-end signal routing, and the EPM2210GF256C5N delivers 272 user I/Os with the timing predictability that instrument designers prefer over FPGA fabric. Multi-volt I/O banks accept 1.5V to 3.3V probes directly, and the 2210-LE capacity absorbs channel-multiplexer state machines without external logic. The non-volatile instant-on behavior eliminates the calibration/firmware load window that plagues FPGA-based instruments.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210GF256C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210GF256I5N | EPM2210GF256C4N | EPM1270GF256C5N | EPM2210F256C5N | EPM570GF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-pin FineLine BGA (F256) - verify ball map | 256-ball FineLine BGA (GF256) - same |
| Logic Elements | 2210 | 2210 | 2210 | 1270 (-43%) | 2210 | 570 (-74%) |
| Speed Grade | C5 | I5 (slower, industrial) | C4 (slower) | C5 | C5 | C5 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| Maximum User I/O | 272 | 272 | 272 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| On-chip Oscillator | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (qty 100) | $13.72 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic element density in MAX II family (vs EPM1270GF256C5N)
- C5 speed grade is the fastest MAX II timing option (vs EPM2210GF256C4N)
- Vertical migration support across MAX II family (vs EPM570GF256C5N)
Design Notes
Estimated: The EPM2210GF256C5N requires separate VCCINT (1.8V core) and VCCIOx (per-bank I/O supply at 1.5V / 1.8V / 2.5V / 3.3V) rails. Place a 100 Β΅F bulk capacitor plus 0.1 Β΅F and 1 nF ceramic decoupling on each VCCIOx bank pin to suppress switching noise during MultiTrack interconnect transitions. Total core current at full toggle activity approaches 100 mA; budget at least 200 mA headroom on the 1.8V LDO feeding VCCINT.
Route the JTAG chain (TCK, TMS, TDI, TDO) as a 4-wire daisy chain with 4.7 kΞ© pull-ups on TCK, TMS, and TDI. Place JTAG header within 6 inches of the device and keep traces matched within 1 inch. For the GF256 FineLine BGA, use at least 4-layer PCB with continuous ground planes under the package and 0.5 mm via-in-pad recommended for thermal relief.
Do not confuse the GF256 (256-ball FineLine BGA, 17x17 grid with depopulated corners) with the F256 (256-pin FineLine BGA, different ball pattern). EPM2210GF256C5N and EPM2210F256C5N are NOT pin-compatible - the GF vs F suffix denotes distinct ball maps per the MAX II device handbook. Always verify the exact datasheet pinout before PCB swap.
Compliance Information
RoHS/REACH compliance status not explicitly stated in verified web data; verify with manufacturer datasheet or distributor compliance letter before production use. Part is not AEC-Q100 qualified - for automotive applications consider the industrial-grade EPM2210GF256I5N variant with additional qualification testing.
