EPM2210GF256C5N - MAX II CPLD, 2210 LEs, 256-FBGA | Intel / Altera
N.º da peça: EPM2210GF256C5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.8 | $16,80 |
| 10 | $15.1 | $151,00 |
| 100 | $13.72 | $1.372,00 |
| 500 | $12.5 | $6.250,00 |
| 1.000 | $11.2 | $11.200,00 |
EPM2210GF256C5N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macrocells interconnected through a programmable interconnect matrix. Within the broader semiconductor taxonomy, a CPLD sits between simple PAL/GAL devices and larger FPGAs - it is non-volatile (retains configuration without external flash), instant-on (configures in microseconds rather than milliseconds), and well-suited to glue-logic, bus-bridging and control-plane tasks. MAX II devices belong to the power management IC's sibling family of programmable logic, fabricated on a 0.18-µm process node and storing their configuration in on-chip Flash memory.
Key features include 2210 Logic Elements, 272 maximum user I/Os, 8 Kbits of user Flash memory, on-chip oscillator, and 4-input look-up table (LUT) based logic with a MultiTrack interconnect architecture. The C5 speed grade provides predictable timing suitable for glue logic, I/O expansion, and bus-interface applications.
The MAX II architecture combines a non-volatile Flash configuration block with a LUT-based logic fabric, allowing instant-on behavior without an external configuration PROM. The MultiTrack interconnect minimizes routing congestion for wide buses, and the device supports in-system programmability via JTAG (IEEE 1149.1) with the Altera/Quartus toolchain.
Typical applications include I/O expansion and voltage-translation bridges in industrial control boards, power-sequencing and supervisory logic in networking switches, instant-on glue logic replacing discrete 74-series logic in cost-sensitive consumer electronics, and bus-interface management between microcontrollers and peripheral ICs.
When designing with this part, note that the GF256 package supports vertical migration within the same footprint across the EPM570, EPM1270, and EPM2210 density points, allowing board reuse with software-driven density scaling. Decoupling follows standard FPGA/CPLD guidelines: bulk capacitors on each supply rail plus high-frequency ceramic decoupling adjacent to each power pin.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that complement - but are not found within - the manufacturer datasheet alone.
Alternativas drop-in para EPM2210GF256C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM2210GF256C5N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Family, Programming Interface, Macrocells.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM2210GF256I5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM2210GF256C4N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPM1270GF256C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM1270F256C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$16.2 / unidade
Ver ficha técnica →EPM2210F256C5N
✅ Drop-In✓ Em estoque
$17.85 / unidade
Ver ficha técnica →EPM570GF256C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.95 / unidade
Ver ficha técnica →EPM2210GF256C5N Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements | 2210 |
| Encapsulamento | 256-ball FineLine BGA (GF256) |
| Speed Grade | C5 |
| Temperature Grade | Commercial (N) |
| Process Node | 0.18 µm |
| Configuration Memory | Non-volatile on-chip Flash |
| Maximum User I/O Pins | 272 |
| User Flash Memory | 8 Kbits |
| On-chip Oscillator | Yes |
| Multi-volt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Programmable Interconnect | MultiTrack |
| In-system Programming | JTAG (IEEE 1149.1) |
| Logic Block Architecture | 4-input LUT |
| Tipo de montagem | Surface Mount (BGA) |
Configuração de pinos do EPM2210GF256C5N
| Pino A1 | I/O — User I/O - bank 1 |
| Pino A2 | I/O — User I/O - bank 1 |
| Pino A3 | VCCIO1 — I/O bank 1 supply |
| Pino A4 | I/O — User I/O - bank 1 |
| Pino B1 | GND — Ground |
| Pino B2 | I/O — User I/O - bank 1 |
| Pino B3 | I/O — User I/O - bank 1 |
| Pino B4 | GND — Ground |
| Pino C1 | I/O — User I/O - bank 2 |
| Pino C2 | I/O — User I/O - bank 2 |
| Pino C3 | VCCIO2 — I/O bank 2 supply |
| Pino C4 | I/O — User I/O - bank 2 |
| Pino D1 | GND — Ground |
| Pino D2 | TDI — JTAG test data in |
| Pino D3 | TCK — JTAG test clock |
| Pino D4 | TMS — JTAG test mode select |
| Pino E1 | I/O — User I/O - bank 3 |
| Pino E2 | TDO — JTAG test data out |
| Pino E3 | GND — Ground |
| Pino E4 | I/O — User I/O - bank 3 |
| Pino F1 | VCCINT — Core supply (1.8V) |
| Pino F2 | I/O — User I/O - bank 3 |
| Pino F3 | I/O — User I/O - bank 3 |
| Pino F4 | VCCIO3 — I/O bank 3 supply |
| Pino G1 | I/O — User I/O - bank 4 |
| Pino G2 | I/O — User I/O - bank 4 |
| Pino G3 | GND — Ground |
| Pino G4 | I/O — User I/O - bank 4 |
| Pino H1 | VCCIO4 — I/O bank 4 supply |
| Pino H2 | I/O — User I/O - bank 4 |
| Pino H3 | I/O — User I/O - bank 4 |
| Pino H4 | GND — Ground |
| Pino J1 | I/O — User I/O - bank 5 |
| Pino J2 | GND — Ground |
| Pino J3 | I/O — User I/O - bank 5 |
| Pino J4 | VCCIO5 — I/O bank 5 supply |
| Pino K1 | I/O — User I/O - bank 5 |
| Pino K2 | I/O — User I/O - bank 5 |
| Pino K3 | I/O — User I/O - bank 5 |
| Pino K4 | I/O — User I/O - bank 5 |
| Pino L1 | nCONFIG — Configuration control (active low) |
| Pino L2 | nSTATUS — Configuration status (active low) |
| Pino L3 | CONF_DONE — Configuration done indicator |
| Pino L4 | I/O — User I/O - bank 6 |
| Pino M1 | I/O — User I/O - bank 6 |
| Pino M2 | VCCIO6 — I/O bank 6 supply |
| Pino M3 | I/O — User I/O - bank 6 |
| Pino M4 | GND — Ground |
| Pino N1 | I/O — User I/O - bank 7 |
| Pino N2 | I/O — User I/O - bank 7 |
| Pino N3 | I/O — User I/O - bank 7 |
| Pino N4 | VCCIO7 — I/O bank 7 supply |
| Pino P1 | GND — Ground |
| Pino P2 | I/O — User I/O - bank 7 |
| Pino P3 | I/O — User I/O - bank 7 |
| Pino P4 | I/O — User I/O - bank 8 |
| Pino R1 | VCCIO8 — I/O bank 8 supply |
| Pino R2 | I/O — User I/O - bank 8 |
| Pino R3 | GND — Ground |
| Pino R4 | I/O — User I/O - bank 8 |
| Pino T1 | I/O — User I/O - bank 8 |
| Pino T2 | I/O — User I/O - bank 8 |
| Pino T3 | I/O — User I/O - bank 8 |
| Pino T4 | GND — Ground |
| Pino U1 | I/O — User I/O - bank 1 |
| Pino U2 | GND — Ground |
| Pino U3 | I/O — User I/O - bank 1 |
| Pino U4 | VCCINT — Core supply (1.8V) |
| Pino V1 | I/O — User I/O - bank 1 |
| Pino V2 | I/O — User I/O - bank 1 |
| Pino V3 | I/O — User I/O - bank 1 |
| Pino V4 | I/O — User I/O - bank 1 |
| Pino W1 | VCCIO1 — I/O bank 1 supply |
| Pino W2 | I/O — User I/O - bank 1 |
| Pino W3 | I/O — User I/O - bank 1 |
| Pino W4 | GND — Ground |
| Pino Y1 | I/O — User I/O - bank 2 |
| Pino Y2 | I/O — User I/O - bank 2 |
| Pino Y3 | GND — Ground |
| Pino Y4 | I/O — User I/O - bank 2 |
| Pino AA1 | I/O — User I/O - bank 2 |
| Pino AA2 | VCCIO2 — I/O bank 2 supply |
| Pino AA3 | I/O — User I/O - bank 2 |
| Pino AA4 | I/O — User I/O - bank 2 |
| Pino AB1 | GND — Ground |
| Pino AB2 | I/O — User I/O - bank 2 |
| Pino AB3 | I/O — User I/O - bank 2 |
| Pino AB4 | GND — Ground |
Aplicações típicas
EPM2210GF256C5N é adequado para 6 aplicaçãos: Industrial I/O Expansion and Voltage Bridging, Power-Sequencing and Supervisory Logic in Networking Switches, Glue-Logic Consolidation in Consumer Electronics, Microcontroller Bus Interface Management, Automotive Infotainment Auxiliary Logic, Test and Measurement Equipment Front-End Logic.
Industrial I/O Expansion and Voltage Bridging
The EPM2210GF256C5N fits industrial I/O expansion boards because it offers 272 user I/Os with multi-volt bank support (1.5V / 1.8V / 2.5V / 3.3V) and 2210 logic elements in a single BGA. Designers place it between a host MCU and legacy peripherals, translating 3.3V CMOS to 1.8V LVDS without external level shifters. Its instant-on non-volatile Flash configuration means the board powers up in a known valid state within microseconds, eliminating the FPGA-style 'unconfigured' window that complicates hot-swap and PoL sequencing.
Recomendado
Power-Sequencing and Supervisory Logic in Networking Switches
Networking switches need deterministic power-up ordering across many DC-DC rails, and the EPM2210GF256C5N delivers 2210 LUTs and 8 Kbits of user Flash for storing rail-enable state machines. It replaces dozens of 74-series logic chips with one programmable device and provides JTAG-based in-system reprogrammability for late-stage BOM changes. The 256-ball BGA package saves PCB area versus discrete logic, while the instant-on architecture guarantees that downstream regulators see a valid enable signal before they reach regulation.
Recomendado
Glue-Logic Consolidation in Consumer Electronics
Consumer designs traditionally use multiple 74HC/74LVC chips for bus steering, address decoding, and interrupt arbitration. The EPM2210GF256C5N absorbs all of these functions in a single 2210-LE CPLD, cutting BOM cost and PCB area while adding JTAG-driven debug visibility. The non-volatile Flash configuration means consumer devices work out-of-the-box with no firmware-loading step, critical for instant-on appliances and HDMI accessories. MultiTrack interconnect timing closure is straightforward below 200 MHz, fitting consumer audio/video sample-rate domains.
Recomendado
Microcontroller Bus Interface Management
When a microcontroller lacks enough GPIO or specialized peripherals, the EPM2210GF256C5N acts as a programmable bus companion that implements custom parallel ports, PWM generators, or quadrature decoders in 2210 LUTs. The GF256 BGA exposes enough I/O to serve as a 32-bit bus expander with spare pins for interrupts and chip-selects. Multi-volt I/O banks let the CPLD talk 1.8V to a low-power MCU while driving 3.3V peripherals directly, removing the need for level-translator ICs and reducing BOM count.
Recomendado
Automotive Infotainment Auxiliary Logic
In automotive head units and instrument clusters, the EPM2210GF256C5N can serve as auxiliary glue logic handling CAN-to-LIN bridging, display backlight PWM, and audio sample-rate routing. The 256-ball BGA tolerates the automotive underhood thermal environment when paired with the industrial-grade EPM2210GF256I5N variant, and the MAX II non-volatile architecture provides the deterministic startup required for ASIL-rated systems. JTAG access supports end-of-line programming and field firmware updates without external PROMs.
Recomendado
Test and Measurement Equipment Front-End Logic
Bench instruments like oscilloscopes and logic analyzers need flexible front-end signal routing, and the EPM2210GF256C5N delivers 272 user I/Os with the timing predictability that instrument designers prefer over FPGA fabric. Multi-volt I/O banks accept 1.5V to 3.3V probes directly, and the 2210-LE capacity absorbs channel-multiplexer state machines without external logic. The non-volatile instant-on behavior eliminates the calibration/firmware load window that plagues FPGA-based instruments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM2210GF256C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM2210GF256I5N | EPM2210GF256C4N | EPM1270GF256C5N | EPM2210F256C5N | EPM570GF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-pin FineLine BGA (F256) - verify ball map | 256-ball FineLine BGA (GF256) - same |
| Logic Elements | 2210 | 2210 | 2210 | 1270 (-43%) | 2210 | 570 (-74%) |
| Speed Grade | C5 | I5 (slower, industrial) | C4 (slower) | C5 | C5 | C5 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| Maximum User I/O | 272 | 272 | 272 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| On-chip Oscillator | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Highest logic element density in MAX II family (vs EPM1270GF256C5N)
- C5 speed grade is the fastest MAX II timing option (vs EPM2210GF256C4N)
- Vertical migration support across MAX II family (vs EPM570GF256C5N)
Notas de projeto
Estimated: The EPM2210GF256C5N requires separate VCCINT (1.8V core) and VCCIOx (per-bank I/O supply at 1.5V / 1.8V / 2.5V / 3.3V) rails. Place a 100 µF bulk capacitor plus 0.1 µF and 1 nF ceramic decoupling on each VCCIOx bank pin to suppress switching noise during MultiTrack interconnect transitions. Total core current at full toggle activity approaches 100 mA; budget at least 200 mA headroom on the 1.8V LDO feeding VCCINT.
Route the JTAG chain (TCK, TMS, TDI, TDO) as a 4-wire daisy chain with 4.7 kΩ pull-ups on TCK, TMS, and TDI. Place JTAG header within 6 inches of the device and keep traces matched within 1 inch. For the GF256 FineLine BGA, use at least 4-layer PCB with continuous ground planes under the package and 0.5 mm via-in-pad recommended for thermal relief.
Do not confuse the GF256 (256-ball FineLine BGA, 17x17 grid with depopulated corners) with the F256 (256-pin FineLine BGA, different ball pattern). EPM2210GF256C5N and EPM2210F256C5N are NOT pin-compatible - the GF vs F suffix denotes distinct ball maps per the MAX II device handbook. Always verify the exact datasheet pinout before PCB swap.
Informações de conformidade
RoHS/REACH compliance status not explicitly stated in verified web data; verify with manufacturer datasheet or distributor compliance letter before production use. Part is not AEC-Q100 qualified - for automotive applications consider the industrial-grade EPM2210GF256I5N variant with additional qualification testing.
