EPM570ZM100C6N - 570 LEs, 76 I/O MAX II CPLD | Altera (Intel)
部品番号: EPM570ZM100C6N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $24.97 | $24.97 |
| 10 | $22.47 | $224.70 |
| 100 | $19.97 | $1,997.00 |
| 500 | $17.48 | $8,740.00 |
| 1,000 | $14.98 | $14,980.00 |
EPM570ZM100C6N 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that retains its configuration without external memory, offers deterministic pin-to-pin propagation delays, and is typically used for glue logic, bus bridging, and I/O expansion. Within the broader hierarchy, a CPLD sits under programmable logic -> logic IC -> semiconductor. MAX II CPLDs specifically target low-power, low-cost replacement of discrete logic and small FPGAs, integrating an 8-Kbit User Flash Memory (UFM) block alongside the logic array.
Key features include 76 user I/Os, propagation delay of 9 ns pin-to-pin, 4-input look-up tables (LUTs), MultiVolt core, on-chip UFM with internal oscillator, JTAG-based IEEE 1532 in-system programmability, and commercial-to-industrial operating temperature support. The 100-ball FineLine BGA at 6x6 mm with 0.5 mm pitch provides high I/O density in a small footprint suitable for handheld and space-constrained designs.
The MAX II architecture uses a non-volatile flash-based fabric, eliminating the external boot PROM required by SRAM FPGAs. This delivers instant-on behavior at < 1 ms and removes boot-related inrush current. The 8-Kbit UFM can store project parameters, serial numbers, or firmware versions - reducing BOM cost versus an external EEPROM.
Typical applications include I/O expansion for microcontrollers, bus interface bridging (e.g., 8-bit to 16-bit or 3.3 V to 1.8 V), LED driving and display control, glue logic replacement for ASIC/SoC designs, and configuration storage. The wide MultiVolt I/O range allows direct connection to legacy 5 V tolerant, 3.3 V, and modern 1.8 V SoCs without level shifters.
When designing with this device, ensure that all VCCIO banks are properly powered and decoupled; an unpowered bank will float inputs and risk back-powering through I/O pins. The JTAG chain must include proper TCK pull-down and TMS pull-up resistors per IEEE 1149.1. Quartus II software is required for design entry - older MAX+PLUS II designs will need migration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EPM570ZM100C6N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM570ZM100C6N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Mounting Type, Logic Elements, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EPM570GM100C5N
✅ ドロップイン✓ 在庫あり
$10.4 / 個
データシートを見る →EPM570M100C5N
✅ ドロップイン✓ 在庫あり
$11.85 / 個
データシートを見る →EPM570GT100C5N
✅ ドロップイン✓ 在庫あり
$11.05 / 個
データシートを見る →EPM570GT100I5N
✅ ドロップイン✓ 在庫あり
$16.5 / 個
データシートを見る →EPM570GM100I5N
✅ ドロップイン✓ 在庫あり
$8.55 / 個
データシートを見る →EPM570F100C5N
✅ ドロップイン✓ 在庫あり
$5.2 / 個
データシートを見る →EPM570GT100C4N
✅ ドロップイン✓ 在庫あり
$9.85 / 個
データシートを見る →EPM570ZM100C6N 最大定格＆電気的特性
| Series | MAX II |
| Device Family | EPM570 (MAX II Z) |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 9 ns |
| Internal Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In System Programmable (Flash) |
| Process Technology | 0.18 µm 6-layer-metal flash |
| 動作温度 | -40 °C to +125 °C (industrial) |
| パッケージ | 100-ball FineLine BGA (6x6 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 |
| Lead Free / RoHS | Lead Free, RoHS Compliant |
| Design Software | Altera Quartus II |
| JTAG Standard | IEEE Std 1149.1 / IEEE 1532 |
EPM570ZM100C6N 100-ball fineline bga (6x6 mm, 0.5 mm pitch) ピン配置ガイド
EPM570ZM100C6N (100-ball fineline bga (6x6 mm, 0.5 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPM570ZM100C6N.
詳細は データシート をご参照ください。
主な用途
EPM570ZM100C6N の用途: 6 件s: Microcontroller I/O Expansion, Bus Interface Bridging, LED Display and Lighting Control, ASIC/SoC Glue Logic Replacement, Industrial Control and Sensor Aggregation, Configuration and Parameter Storage.
Microcontroller I/O Expansion
The EPM570ZM100C6N's 76 user I/Os and instant-on non-volatile configuration make it ideal for expanding microcontroller GPIO counts. When a design exceeds the MCU's native I/O (e.g., needing 30+ LEDs, keypad scanning, or sensor multiplexing), the CPLD provides deterministic 9 ns propagation delay for real-time I/O control without the boot latency of an FPGA. The MAX II Z variant's low static power suits battery-powered and always-on applications. Connected to the MCU via a parallel bus (8-bit data + 6-bit address + CS + WR), it adds 76 outputs with latching, PWM generation, or debouncing - all without external configuration memory.
おすすめ
Bus Interface Bridging
Bus voltage translation and protocol bridging are core MAX II use cases. The EPM570ZM100C6N's MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on a per-bank basis, allowing a single chip to bridge between a 1.8 V mobile SoC and a 3.3 V peripheral. With 440 macrocells of combinational and sequential logic, it can implement glue logic for 8-bit/16-bit/32-bit address/data multiplexing, chip-select decoding, and wait-state insertion. The 9 ns tPD supports 50-100 MHz bus operation typical in embedded designs.
おすすめ
LED Display and Lighting Control
The EPM570ZM100C6N drives large LED matrices and Charlieplexed displays via its 76 high-drive I/Os and integrated 8-Kbit User Flash Memory for storing display patterns. With per-pin current drive up to 25 mA (per MAX II datasheet) and 9 ns propagation delay, it supports multiplexing of up to 64x16 LED arrays at high refresh rates. The non-volatile UFM stores font tables, animation sequences, or gamma correction coefficients without external EEPROM, reducing BOM cost. Typical in signage, instrumentation panels, and consumer appliance displays.
おすすめ
ASIC/SoC Glue Logic Replacement
When discrete 74-series logic would consume excessive PCB area, the EPM570ZM100C6N replaces dozens of gates, muxes, latches, and decoders in a single 6x6 mm BGA. With 570 logic elements (equivalent to ~570 4-input LUTs), it integrates what would be 20-30 discrete SSI/MSI packages. Designers describe glue logic in VHDL/Verilog/Schematic entry in Quartus II and the device is JTAG-programmed in-system. The non-volatile configuration ensures zero boot latency - critical for system controllers that must respond at power-on.
おすすめ
Industrial Control and Sensor Aggregation
Industrial controllers leverage the EPM570ZM100C6N's -40 °C to +125 °C industrial temperature range and 8-Kbit UFM for sensor multiplexing, encoder interfacing, and PWM generation. The deterministic 9 ns delay ensures repeatable response times for servo loops and safety interlocks. The UFM stores calibration coefficients and configuration parameters that survive power cycling - eliminating external EEPROM. Pin-compatible industrial-grade alternates like EPM570GM100I5N extend supply for harsh-environment designs.
おすすめ
Configuration and Parameter Storage
Beyond logic, the EPM570ZM100C6N's 8-Kbit User Flash Memory (UFM) provides non-volatile storage for product parameters, serial numbers, firmware versions, and calibration data. The UFM block supports 100K+ erase/write cycles per the MAX II handbook, suitable for field-updateable parameters in IoT devices and industrial sensors. A single CPLD replaces a discrete logic array plus external EEPROM, simplifying the BOM and reducing board area. JTAG access to UFM allows in-system updates without separate SPI/I2C buses.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM570ZM100C6N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM570GM100C5N | EPM570M100C5N | EPM570GT100C5N | EPM570GT100I5N | EPM570GT100C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-ball FineLine BGA (6x6 mm) | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Propagation Delay | 9 ns (Z variant) | 9 ns (standard MAX II) | 9 ns | 9 ns | 9 ns | ~7 ns (faster speed grade) |
| Static Power | Low (Z variant) | Standard (higher than Z) | Standard | Standard | Standard | Standard |
| Operating Temperature | -40 °C to +125 °C (industrial) | -40 °C to +125 °C | 0 °C to +85 °C (commercial) | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Approx. Unit Price (qty 100) | $19.97 | $19.97 | $17.97 | $21.97 | $24.97 | $29.97 |
主な差別化要因
- Lowest static power in the MAX II 100-ball BGA family （vs EPM570GT100C5N)
- Pin-compatible upgrade path to faster speed grade （vs EPM570GT100C4N)
- Industrial temperature range in standard Z power envelope （vs EPM570M100C5N)
設計ノート
The MAX II Z variant (EPM570ZM100C6N) consumes roughly 50% less static current than the standard MAX II (EPM570GT100C5N) at equivalent junction temperatures, per the MAX II device handbook. Designers targeting battery-powered or energy-harvesting applications should prefer the Z variant. Estimate: at VCCINT=1.8 V and ICC=15 mA typical, core power is ~27 mW. Unused I/O banks still require VCCIO to prevent input float and back-powering through I/O ESD diodes.
The 100-ball FineLine BGA uses 0.5 mm pitch, which requires laser-drilled microvias and a controlled-impedance stackup. Per Altera AN 114 (BGA PCB Layout), place 0.1 µF X7R decoupling capacitors within 100 mils of every VCCINT and VCCIO pin. Use 4-layer stackup minimum with continuous ground plane beneath the BGA for thermal spreading and signal reference. Avoid routing signals through the BGA shadow - escape routing must use the perimeter ball rows.
A common mistake is leaving unused JTAG pins floating - per IEEE 1149.1, TCK must have a 1 kΩ pull-down to ground and TMS a 1 kΩ pull-up to VCCIO to avoid spurious JTAG state transitions during power-up. Another pitfall: do not hot-swap the device with signals driven into I/O pins before VCCIO ramps - this can trigger latch-up. The Quartus II fitter may warn about unconstrained pins - explicitly assign unused pins to 'As input tri-stated' to avoid contention.
Estimated: at 25 mA per output driving 76 I/Os simultaneously with VCCIO=3.3 V, worst-case switching power is approximately 76 x 25 mA x 3.3 V = 6.27 W if all outputs are at full DC load (impractical). In typical AC switching with 10 pF loads and 50 MHz toggle, dynamic power is ~0.5 W. The 100-ball BGA has θJA ≈ 38 °C/W on a JEDEC 4-layer board, yielding ~19 °C rise at 0.5 W - well within safe limits.
コンプライアンス情報
Lead-free and RoHS compliant per Altera product page. Not AEC-Q100 qualified; for automotive applications consult Intel/Altera automotive-grade CPLD families. Halogen-free status not explicitly stated in available data.
