EPM570ZM100C6N - 570 LEs, 76 I/O MAX II CPLD | Altera (Intel)
MPN: EPM570ZM100C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.97 | $24.97 |
| 10 | $22.47 | $224.70 |
| 100 | $19.97 | $1,997.00 |
| 500 | $17.48 | $8,740.00 |
| 1,000 | $14.98 | $14,980.00 |
Drop-in alternatives for EPM570ZM100C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM570ZM100C6N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Device Family | EPM570 (MAX II Z) |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 9 ns |
| Internal Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In System Programmable (Flash) |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Operating Temperature | -40 °C to +125 °C (industrial) |
| Package | 100-ball FineLine BGA (6x6 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Lead Free / RoHS | Lead Free, RoHS Compliant |
| Design Software | Altera Quartus II |
| JTAG Standard | IEEE Std 1149.1 / IEEE 1532 |
EPM570ZM100C6N 100-ball fineline bga (6x6 mm, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for EPM570ZM100C6N (100-ball fineline bga (6x6 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570ZM100C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570ZM100C6N is suitable for 6 applications: Microcontroller I/O Expansion, Bus Interface Bridging, LED Display and Lighting Control, ASIC/SoC Glue Logic Replacement, Industrial Control and Sensor Aggregation, Configuration and Parameter Storage.
Microcontroller I/O Expansion
The EPM570ZM100C6N's 76 user I/Os and instant-on non-volatile configuration make it ideal for expanding microcontroller GPIO counts. When a design exceeds the MCU's native I/O (e.g., needing 30+ LEDs, keypad scanning, or sensor multiplexing), the CPLD provides deterministic 9 ns propagation delay for real-time I/O control without the boot latency of an FPGA. The MAX II Z variant's low static power suits battery-powered and always-on applications. Connected to the MCU via a parallel bus (8-bit data + 6-bit address + CS + WR), it adds 76 outputs with latching, PWM generation, or debouncing - all without external configuration memory.
Recommended
Bus Interface Bridging
Bus voltage translation and protocol bridging are core MAX II use cases. The EPM570ZM100C6N's MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on a per-bank basis, allowing a single chip to bridge between a 1.8 V mobile SoC and a 3.3 V peripheral. With 440 macrocells of combinational and sequential logic, it can implement glue logic for 8-bit/16-bit/32-bit address/data multiplexing, chip-select decoding, and wait-state insertion. The 9 ns tPD supports 50-100 MHz bus operation typical in embedded designs.
Recommended
LED Display and Lighting Control
The EPM570ZM100C6N drives large LED matrices and Charlieplexed displays via its 76 high-drive I/Os and integrated 8-Kbit User Flash Memory for storing display patterns. With per-pin current drive up to 25 mA (per MAX II datasheet) and 9 ns propagation delay, it supports multiplexing of up to 64x16 LED arrays at high refresh rates. The non-volatile UFM stores font tables, animation sequences, or gamma correction coefficients without external EEPROM, reducing BOM cost. Typical in signage, instrumentation panels, and consumer appliance displays.
Recommended
ASIC/SoC Glue Logic Replacement
When discrete 74-series logic would consume excessive PCB area, the EPM570ZM100C6N replaces dozens of gates, muxes, latches, and decoders in a single 6x6 mm BGA. With 570 logic elements (equivalent to ~570 4-input LUTs), it integrates what would be 20-30 discrete SSI/MSI packages. Designers describe glue logic in VHDL/Verilog/Schematic entry in Quartus II and the device is JTAG-programmed in-system. The non-volatile configuration ensures zero boot latency - critical for system controllers that must respond at power-on.
Recommended
Industrial Control and Sensor Aggregation
Industrial controllers leverage the EPM570ZM100C6N's -40 °C to +125 °C industrial temperature range and 8-Kbit UFM for sensor multiplexing, encoder interfacing, and PWM generation. The deterministic 9 ns delay ensures repeatable response times for servo loops and safety interlocks. The UFM stores calibration coefficients and configuration parameters that survive power cycling - eliminating external EEPROM. Pin-compatible industrial-grade alternates like EPM570GM100I5N extend supply for harsh-environment designs.
Recommended
Configuration and Parameter Storage
Beyond logic, the EPM570ZM100C6N's 8-Kbit User Flash Memory (UFM) provides non-volatile storage for product parameters, serial numbers, firmware versions, and calibration data. The UFM block supports 100K+ erase/write cycles per the MAX II handbook, suitable for field-updateable parameters in IoT devices and industrial sensors. A single CPLD replaces a discrete logic array plus external EEPROM, simplifying the BOM and reducing board area. JTAG access to UFM allows in-system updates without separate SPI/I2C buses.
Recommended
Recommended Products Summary
Engineering reference data for EPM570ZM100C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GM100C5N | EPM570M100C5N | EPM570GT100C5N | EPM570GT100I5N | EPM570GT100C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-ball FineLine BGA (6x6 mm) | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same | 100-ball FineLine BGA (6x6 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Propagation Delay | 9 ns (Z variant) | 9 ns (standard MAX II) | 9 ns | 9 ns | 9 ns | ~7 ns (faster speed grade) |
| Static Power | Low (Z variant) | Standard (higher than Z) | Standard | Standard | Standard | Standard |
| Operating Temperature | -40 °C to +125 °C (industrial) | -40 °C to +125 °C | 0 °C to +85 °C (commercial) | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Approx. Unit Price (qty 100) | $19.97 | $19.97 | $17.97 | $21.97 | $24.97 | $29.97 |
Key Differentiators
- Lowest static power in the MAX II 100-ball BGA family (vs EPM570GT100C5N)
- Pin-compatible upgrade path to faster speed grade (vs EPM570GT100C4N)
- Industrial temperature range in standard Z power envelope (vs EPM570M100C5N)
Design Notes
The MAX II Z variant (EPM570ZM100C6N) consumes roughly 50% less static current than the standard MAX II (EPM570GT100C5N) at equivalent junction temperatures, per the MAX II device handbook. Designers targeting battery-powered or energy-harvesting applications should prefer the Z variant. Estimate: at VCCINT=1.8 V and ICC=15 mA typical, core power is ~27 mW. Unused I/O banks still require VCCIO to prevent input float and back-powering through I/O ESD diodes.
The 100-ball FineLine BGA uses 0.5 mm pitch, which requires laser-drilled microvias and a controlled-impedance stackup. Per Altera AN 114 (BGA PCB Layout), place 0.1 µF X7R decoupling capacitors within 100 mils of every VCCINT and VCCIO pin. Use 4-layer stackup minimum with continuous ground plane beneath the BGA for thermal spreading and signal reference. Avoid routing signals through the BGA shadow - escape routing must use the perimeter ball rows.
A common mistake is leaving unused JTAG pins floating - per IEEE 1149.1, TCK must have a 1 kΩ pull-down to ground and TMS a 1 kΩ pull-up to VCCIO to avoid spurious JTAG state transitions during power-up. Another pitfall: do not hot-swap the device with signals driven into I/O pins before VCCIO ramps - this can trigger latch-up. The Quartus II fitter may warn about unconstrained pins - explicitly assign unused pins to 'As input tri-stated' to avoid contention.
Estimated: at 25 mA per output driving 76 I/Os simultaneously with VCCIO=3.3 V, worst-case switching power is approximately 76 x 25 mA x 3.3 V = 6.27 W if all outputs are at full DC load (impractical). In typical AC switching with 10 pF loads and 50 MHz toggle, dynamic power is ~0.5 W. The 100-ball BGA has θJA ≈ 38 °C/W on a JEDEC 4-layer board, yielding ~19 °C rise at 0.5 W - well within safe limits.
Compliance Information
Lead-free and RoHS compliant per Altera product page. Not AEC-Q100 qualified; for automotive applications consult Intel/Altera automotive-grade CPLD families. Halogen-free status not explicitly stated in available data.
