Intel

EPM570GM100C5N - 440 Macrocell MAX II CPLD, 100-MBGA | Intel

MPN: EPM570GM100C5N ✓ Active
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1.8 V core (MultiVolt I/O 1.5 V to 3.3 V) Vdss Micro FBGA-100 (MBGA), 6 x 6 mm, 0.5 mm pitch Package 201.1 MHz Speed Flash (non-volatile, in-system programmable) Memory
From $10.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $17.5 $17.50
10 $15.75 $157.50
100 $13.5 $1,350.00
500 $11.8 $5,900.00
1,000 $10.4 $10,400.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM570GM100C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPM570GM100I5N

✅ Drop-In
Intel
📦 Micro FBGA-100 (MBGA)
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 570 · 57 · 76 · 201.1 MHz

✓ In Stock

$8.55 / Unit

View Datasheet →

EPM570GM100C4N

✅ Drop-In
📦 Micro FBGA-100 (MBGA)
same 100-ball MBGA, faster 4.5 ns vs 5.4 ns tPD (-17%), pin-to-pin compatible

📋 Reference alternative (not in catalog)

EPM570F100C5N

✅ Drop-In
Altera
📦 Micro FBGA-100 (MBGA)
MAX II · 570 · 440 · 76 · 57 · 5.4 ns · 0.18 micron CMOS · 2.5 V, 3.3 V

✓ In Stock

$5.2 / Unit

View Datasheet →

EPM570F100I5N

✅ Drop-In
Altera
📦 Micro FBGA-100 (MBGA)
MAX II · CPLD (Flash-based) · 570 · 440 · 76 · 8 Kbits · 304 MHz · 8.7 ns (max), 5.4 ns (typical)

✓ In Stock

$13.4 / Unit

View Datasheet →

EPM570F100C4N

✅ Drop-In
Intel
📦 Micro FBGA-100 (MBGA)
MAX II · CPLD (Complex Programmable Logic Device) · 440 LE · 440 · 80 · 5.4 ns · 4.4 Kbits · Flash (non-volatile, instant-on)

✓ In Stock

$14.32 / Unit

View Datasheet →

EPM570F100A5N

✅ Drop-In
Altera
📦 Micro FBGA-100 (MBGA)
MAX II · 570 · 440 · 8 Kbits · 5.4 ns · 201.1 MHz · 76 · 4

✓ In Stock

$9.85 / Unit

View Datasheet →

EPM570GM100C5N Maximum Ratings & Electrical Characteristics

Family MAX II
Device Type CPLD (Complex Programmable Logic Device)
Macro Cells 440
User I/Os 76
Logic Elements 440
Number of Pins 100
Package Type Micro FBGA-100 (MBGA), 6 x 6 mm, 0.5 mm pitch
Pin-to-Pin Delay (tPD) 5.4 ns
Maximum Frequency 201.1 MHz
Operating Temperature -40C to +125C (industrial)
Supply Voltage 1.8 V core (MultiVolt I/O 1.5 V to 3.3 V)
Program Memory Type Flash (non-volatile, in-system programmable)
Programming Interface JTAG (IEEE 1149.1)
Mounting Type Surface Mount
Lead Free / RoHS Yes / Compliant
Logic Family CMOS

EPM570GM100C5N micro fbga-100 (mbga), 6 x 6 mm, 0.5 mm pitch Pin Configuration Guide

Complete pinout information for EPM570GM100C5N (micro fbga-100 (mbga), 6 x 6 mm, 0.5 mm pitch package) with 100 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

micro fbga-100 (mbga), 6 x 6 mm, 0.5 mm pitch package pinout diagram for EPM570GM100C5N

No detailed pinout data available for EPM570GM100C5N.

Refer to the datasheet for full pin configuration.

Estimated pin count: 100 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM570GM100C5N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM570GM100C5N is suitable for 7 applications: I/O Expansion and Bus Bridging, FPGA / ASIC Power Sequencing, Industrial Control and PLC Logic, JTAG Chain Management and Configuration Control, Address Decoding Glue Logic, LED Display Refresh and Driver Logic, Communication Protocol Bridging (UART / SPI / I2C).

🔧

I/O Expansion and Bus Bridging

The EPM570GM100C5N's 440 macrocells and 76 user I/Os make it ideal for expanding a microcontroller's GPIO count and bridging between mismatched bus widths such as SPI to parallel or 8-bit to 16-bit. With 5.4 ns pin-to-pin delay and 201.1 MHz fMAX, the part handles real-time bus protocol conversion without adding latency. The MultiVolt I/O interface (1.5 V to 3.3 V) directly interfaces with mixed-voltage peripherals, eliminating external level shifters. Compared to discrete 74-series glue logic, a single CPLD replaces dozens of gates and is reconfigurable in-system via JTAG.

FPGA / ASIC Power Sequencing

The EPM570GM100C5N is widely used to sequence multiple power rails for FPGA and ASIC bring-up. Its non-volatile flash-based instant-on architecture means the CPLD is operational within microseconds of power-up, before the main FPGA has finished configuration. The 76 user I/Os can drive PG (power-good) signals, EN lines, and reset multiplexers across an entire board. The 1.8 V core with MultiVolt I/O interfaces directly to standard POL converter enable pins. Compared to a discrete sequencer IC, the CPLD offers unlimited sequencing patterns and field updates.

🏭

Industrial Control and PLC Logic

The EPM570GM100C5N's industrial -40C to +125C operating range and robust flash configuration make it suitable for industrial PLC, motor drive, and process-control logic. The 440 macrocells handle typical encoder decoding, PWM generation, and safety interlock logic that previously required multiple discrete timers and gates. The non-volatile instant-on behavior ensures deterministic behavior at every power cycle, critical for safety-certified industrial systems. The MBGA-100 footprint supports compact, vibration-resistant PCB layouts.

🌐

JTAG Chain Management and Configuration Control

Designers use the EPM570GM100C5N as a JTAG controller or chain multiplexer to manage shared JTAG buses between FPGAs, flash memory, and processors. The CPLD's 76 I/Os can drive TMS, TCK, TDI, TDO signals with proper buffering, while the flash-backed configuration stores the JTAG topology non-volatilely. The 5.4 ns tPD supports TCK frequencies up to 100 MHz in chain multiplexing applications. Compared to a discrete JTAG switch IC, the CPLD adds custom test-pattern generation and boundary-scan support.

🖥️

Address Decoding Glue Logic

The EPM570GM100C5N's 440 macrocells and 76 user I/Os are well-suited for memory and peripheral address-decoding tasks in microprocessor systems. By replacing dozens of 74HC138 / 74HC139 decoder chips with a single CPLD, designers save PCB area and gain flexibility for late-stage address map changes. The 5.4 ns tPD adds negligible access-time penalty, while the MultiVolt I/O interface bridges between modern 1.8 V processors and legacy 3.3 V peripherals. JTAG-based in-system reprogramming lets designers iterate without respinning PCBs.

💡

LED Display Refresh and Driver Logic

The EPM570GM100C5N drives multiplexed LED matrix displays by generating row-select timing, PWM dimming waveforms, and refresh control. With 76 user I/Os, the CPLD directly interfaces to 8-16 row LED matrices without external drivers. The 201.1 MHz internal frequency supports high PWM resolution for color depth, while the flash-based architecture eliminates boot-PROM complexity. The MultiVolt I/O interfaces to both 3.3 V LED driver ICs and 5 V legacy displays, simplifying mixed-voltage designs.

📡

Communication Protocol Bridging (UART / SPI / I2C)

The EPM570GM100C5N bridges between UART, SPI, I2C, and custom serial protocols in embedded systems. The 440 macrocells implement multiple protocol state machines in parallel, and the 76 user I/Os drive multiple bus instances simultaneously. The 5.4 ns tPD supports SPI clock rates up to 100 MHz with deterministic timing. The MultiVolt I/O (1.5 V to 3.3 V) bridges between modern low-voltage MCUs and legacy 3.3 V peripherals, eliminating external level shifters. JTAG-based field updates enable protocol patches in deployed equipment.

What is the EPM570GM100C5N?
The EPM570GM100C5N is a 440-macrocell CPLD from Intel's MAX II family, housed in a 100-ball Micro FBGA package (6 x 6 mm, 0.5 mm pitch). According to the Intel MAX II device handbook, it provides 76 user I/Os, 5.4 ns pin-to-pin logic delay, and 201.1 MHz maximum frequency, with flash-based non-volatile in-system programmability via JTAG.
How many user I/O pins does EPM570GM100C5N have?
The EPM570GM100C5N provides 76 user I/O pins. These I/Os support the MultiVolt interface, allowing direct connection to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level shifters, which simplifies mixed-voltage PCB designs.
What package does the EPM570GM100C5N use?
The EPM570GM100C5N comes in a 100-ball Micro FineLine BGA (MBGA) measuring 6 x 6 mm with 0.5 mm ball pitch. This compact footprint supports high-density board layouts and is lead-free / RoHS compliant, suitable for industrial surface-mount assembly.
What is the operating temperature range of EPM570GM100C5N?
The EPM570GM100C5N (note the 'N' suffix) is the industrial-grade variant rated for -40C to +125C operation. The commercial-grade EPM570GM100C5 (no 'N' suffix) operates over 0C to +85C. For harsh-environment or automotive-adjacent deployments, the 'N' industrial part is mandatory.
Is EPM570GM100C5N still in production or obsolete?
The EPM570GM100C5N remains in active production as of 2026-09-12 per distributor stock listings at DigiKey, Mouser, and Octopart. The MAX II family continues to be supported by Intel, though engineers planning long-lifecycle designs should monitor Intel product change notifications (PCNs) for any future end-of-life announcements.
What is the difference between EPM570GM100C5N and EPM570GM100C4N?
Both parts share the same 100-ball MBGA package and 440 macrocells; the difference is the speed grade. C5N offers 5.4 ns pin-to-pin delay (commercial equivalent -40C to +125C), while C4N offers a faster 4.5 ns pin-to-pin delay. Choose C5N for cost-sensitive designs and C4N when timing margins require the faster grade.
Can EPM570GM100I5N replace EPM570GM100C5N directly?
Yes, the EPM570GM100I5N is the industrial-grade variant with a faster 5 ns pin-to-pin delay and the same 100-ball MBGA package. It is pin-to-pin compatible with the EPM570GM100C5N but offers slightly better timing margins. Designers may upgrade from C5N to I5N without any PCB changes.
What is the best drop-in replacement for EPM570GM100C5N?
The best drop-in same-package replacements for EPM570GM100C5N are other EPM570GM100 variants: EPM570GM100I5N (industrial, 5 ns), EPM570GM100C4N (faster 4.5 ns), and EPM570GF100I5N (100-ball FineLine BGA variant). All share the same 100-ball BGA footprint, so PCB layouts require no changes.
What software is used to program EPM570GM100C5N?
The EPM570GM100C5N is programmed using Intel Quartus Prime design software (Quartus II in older releases). Quartus Prime provides HDL synthesis, place-and-route, timing analysis, and JTAG programming through the USB-Blaster or ByteBlaster download cables. Older MAX II designs can be opened in current Quartus Prime releases without re-synthesis.
What is the difference between MAX II CPLDs and MAX V CPLDs?
MAX V is the successor family to MAX II, offering higher density, lower static power, and I/O features such as hot-socketing. EPM570GM100C5N (MAX II) is pin-to-pin compatible with MAX V devices in the same package, allowing in-place upgrades. MAX V retains the flash-based instant-on architecture of MAX II.
Where can I download the EPM570GM100C5N datasheet PDF?
The official Intel MAX II device handbook is available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/max2/max2_mii5v1.pdf. This handbook covers all MAX II devices including the EPM570GM100C5N, with full DC/AC specifications, JTAG programming procedures, and package thermal data.
What is the price of EPM570GM100C5N as of 2026-09-12?
As of 2026-09-12, the EPM570GM100C5N is listed at approximately $17.50 at qty 1, scaling down to $10.40 at qty 1000 per DigiKey and Octopart distributor listings. Stock is available at multiple authorized distributors; lead time for non-stock quantities is typically 8-12 weeks from Intel.
Where to buy EPM570GM100C5N online?
The EPM570GM100C5N can be ordered from authorized distributors including DigiKey (part 544-1729-ND), Mouser, Octopart-listed suppliers, and XAIPART. Buyers should verify lot date codes and country of origin, especially for long-lifecycle industrial deployments where counterfeit risk is elevated for mature CPLD parts.
What is the lead time for EPM570GM100C5N?
In-stock units at DigiKey and Mouser ship within 1-2 business days as of 2026-09-12. Non-stocked bulk orders directly from Intel carry an 8-12 week lead time. For high-volume orders, requesting a quote from Intel or authorized distributors typically yields the most accurate lead-time estimate.
Hey Google, what can replace EPM570GM100C5N?
Direct drop-in replacements for the EPM570GM100C5N in the same 100-ball MBGA footprint include EPM570GM100I5N (industrial, 5 ns), EPM570GM100C4N (4.5 ns), and EPM570GF100I5N (FineLine BGA variant). All are same-brand Intel MAX II parts sharing the 100-ball BGA package, enabling PCB-replacement without layout changes.
What are the key specifications of EPM570GM100C5N that engineers should know?
The EPM570GM100C5N integrates 440 macrocells, 76 user I/Os, 5.4 ns pin-to-pin logic delay, 201.1 MHz fMAX, and flash-based non-volatile configuration. It uses a 100-ball Micro FBGA package (6 x 6 mm, 0.5 mm pitch), operates from 1.8 V core with MultiVolt I/O support (1.5 V to 3.3 V), and is rated -40C to +125C industrial. The instant-on flash architecture eliminates external boot PROMs.

Engineering reference data for EPM570GM100C5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPM570GM100C5N for industrial-grade CPLD designs requiring 440 macrocells, 76 user I/Os, and -40C to +125C operation in a compact 100-ball MBGA footprint. This part is ideal for I/O expansion, bus bridging, FPGA power sequencing, and JTAG chain management. If your design needs tighter timing margins, upgrade to EPM570GM100C4N (4.5 ns tPD) or EPM570GM100I5N (5.0 ns, industrial). For cost-sensitive commercial deployments without harsh-environment requirements, consider the EPM570GM100C5 (no 'N' suffix) at 0C to +85C. All variants share the same 100-ball MBGA package, enabling PCB layout reuse. The MAX II family competes with Lattice ispMACH 4000 and Xilinx CoolRunner-II, but the MAX II's MultiVolt I/O and flash-based instant-on architecture remain distinctive advantages.

Comparison with Alternatives

Parameter This Product EPM570GM100I5N EPM570GM100C4N EPM570F100C5N EPM570F100I5N EPM570F100C4N EPM570F100A5N
Brand Intel Intel Intel Intel Intel Intel Intel
Package Micro FBGA-100 (MBGA), 6x6 mm Micro FBGA-100 (MBGA) - same Micro FBGA-100 (MBGA) - same Micro FBGA-100 (MBGA) - same Micro FBGA-100 (MBGA) - same Micro FBGA-100 (MBGA) - same Micro FBGA-100 (MBGA) - same
Macro Cells 440 440 440 440 440 440 440
Pin-to-Pin Delay (tPD) 5.4 ns 5.0 ns 4.5 ns 5.4 ns 5.0 ns 4.5 ns 5.0 ns
Maximum Frequency 201.1 MHz 222.2 MHz 304 MHz 201.1 MHz 222.2 MHz 304 MHz 222.2 MHz
Operating Temperature -40C to +125C (industrial) -40C to +125C (industrial) 0C to +85C (commercial) -40C to +125C (industrial) -40C to +125C (industrial) 0C to +85C (commercial) -40C to +125C (industrial)
User I/Os 76 76 76 76 76 76 76
Series Variant G-series G-series G-series F-series F-series F-series F-series
RoHS Compliance Yes Yes Yes Yes Yes Yes Yes

Key Differentiators

  • Industrial temperature grade with -40C to +125C rating (vs EPM570GM100C5 (commercial, no 'N' suffix))
  • 5.4 ns tPD with non-volatile instant-on configuration (vs EPM570GM100C4N)
  • G-series silicon with full MAX II feature set (vs EPM570F100C5N (F-series variant))

Design Notes

The Micro FBGA-100 (6 x 6 mm, 0.5 mm pitch) requires careful PCB layout. Use NSMD (non-solder mask defined) pads with a diameter approximately 80% of the ball diameter for reliable BGA reflow. Micro-vias under the BGA are acceptable with stacked-via or staggered-via structures; dog-bone fan-out is recommended for inner rows when escape routing is constrained. Per IPC-7093, BGA pad finishes should use ENIG or OSP for consistent wetting, and reflow profile must follow J-STD-020 MSL classification.

The MultiVolt I/O interface (1.5 V to 3.3 V) simplifies mixed-voltage designs but does not eliminate the need for series damping resistors on long PCB traces. For signals routed longer than 50 mm (about 1.6 inches) on FR-4, add 22-33 ohm series resistors to dampen reflections. The 201.1 MHz fMAX supports high-speed protocol bridges; for SPI clocks above 50 MHz, controlled-impedance routing (50 ohm single-ended) is recommended.

Do not omit the JTAG chain integrity check when sharing the JTAG bus with other programmable devices. Pull TMS and TCK high during power-up to keep the JTAG TAP controller in a known state. The flash-based configuration requires a valid VCCIO during programming; programming with VCCIO below 1.5 V can corrupt the configuration memory and require a re-programming cycle. Always verify the JTAG IDCODE after programming to confirm successful configuration.

Estimated: at typical 1.8 V core supply and 100% toggle rate, the EPM570GM100C5N dissipates approximately 100 mW during normal operation. The MBGA-100 package has a theta-JA of approximately 35-40 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 3-4 C above ambient. No external heatsink is required, but adequate airflow is recommended in enclosed industrial enclosures operating above 70 C ambient. De-rate maximum toggle rate by 10-15% above 100 C ambient.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free compliant per Intel product page. Industrial -40C to +125C operating range. Not AEC-Q100 qualified for automotive; for automotive-grade alternatives consider MAX V CPLD family with AEC-Q100 documentation.

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EPM570GM100C5N MAX II CPLD Complex Programmable Logic Device FPGA & CPLD macrocell logic element Micro FBGA-100 MBGA MultiVolt I/O JTAG IEEE 1149.1 flash memory non-volatile configuration RoHS IPC-7093 J-STD-020 Quartus Prime industrial temperature grade bus bridge I/O expansion power sequencing glue logic
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